CN207217579U - A kind of long package structure for LED of service life - Google Patents
A kind of long package structure for LED of service life Download PDFInfo
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- CN207217579U CN207217579U CN201721093020.3U CN201721093020U CN207217579U CN 207217579 U CN207217579 U CN 207217579U CN 201721093020 U CN201721093020 U CN 201721093020U CN 207217579 U CN207217579 U CN 207217579U
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- fixedly connected
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- ceramic substrate
- service life
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Abstract
The utility model discloses the package structure for LED that a kind of service life is long, including ceramic substrate, opened up at the top of the ceramic substrate fluted, and the both sides of ceramic substrate have been fixedly connected with heat-conducting plate, the side of the heat-conducting plate is fixedly connected with heat abstractor, and the bottom of groove inner wall is fixedly connected with collets, diode chip for backlight unit is fixedly connected with the top of the collets, and the surrounding on diode chip for backlight unit surface has been fixedly connected with fluorescence offset plate, the both sides of the groove inner wall have been fixedly connected with heat transfer plate, and the inside of ceramic substrate is fixedly connected with the first heat-conducting block, it the utility model is related to diode technologies field.The long package structure for LED of the service life, heat caused by high power is changed to concentrate in small-sized crystal grain, once temperature raises, the problem of having a strong impact on light emitting diode service life, the radiating efficiency of diode is improved, is advantageous to the normal work of diode.
Description
Technical field
It the utility model is related to field of photoelectric technology, the long package structure for LED of specially a kind of service life.
Background technology
The earth is faced with the challenge of energy shortage and environmental pollution, promotes energy-conservation to be considered as important development plan by various countries with environmental protection
One of slightly, although LED technology invention is in energy abundance various countries largely exploitation and environmental pollution not yet serious epoch,
But as the problem of energy and environment is on the rise, light emitting diode becomes the star of the energy-conserving and environment-protective to attract the attention of millions of people no matter
The light emitting diode product for the development diversification that dealer or scholar rack one's brains invariably, there is provided masses are in daily use.
Diode, among electronic component, a kind of device with two electrodes, only an electric current is allowed to be flowed through by single direction,
Many uses are the functions using its rectification, and varactor is then used for the adjustable condenser as electronic type, most of
The diode possessed sense of current we be normally referred to as rectification function.
Light emitting diode develops in the process of evolution towards high power technology, produces enough brightness using high power to take
For existing illumination, heat caused by high power is concentrated in small-sized crystal grain, once temperature raises, and it is related to cause junction
Temperature rise, fluorescent material lasing efficiency decline, and finally not only accelerate crystal grain in itself and the deterioration of encapsulating material, and cause luminous effect
Rate declines, and has a strong impact on the service life of light emitting diode.
Utility model content
In view of the shortcomings of the prior art, the utility model provides a kind of long LED package knot of service life
Structure, solve heat caused by high power and concentrate in small-sized crystal grain, once temperature raises, have a strong impact on light-emitting diodes
The problem of pipe service life.
To realize object above, the utility model is achieved by the following technical programs：A kind of long hair of service life
Optical diode package structure, including ceramic substrate, fluted, and both sides of ceramic substrate are opened up at the top of the ceramic substrate
Heat-conducting plate is fixedly connected with, the side of the heat-conducting plate is fixedly connected with heat abstractor, and the bottom of groove inner wall is fixed
Collets are connected with, diode chip for backlight unit are fixedly connected with the top of the collets, and the surrounding on diode chip for backlight unit surface is equal
Fluorescence offset plate is fixedly connected with, the both sides of the groove inner wall have been fixedly connected with heat transfer plate, and the inside of ceramic substrate is consolidated
Surely the first heat-conducting block is connected with, the side of first heat-conducting block is fixedly connected with the side of heat transfer plate, and the first heat-conducting block
Opposite side be fixedly connected with the side of heat-conducting plate.
Preferably, the heat abstractor includes heat transfer block, and the side of heat transfer block is fixedly connected with the side of heat-conducting plate,
The top and bottom of the heat transfer block has been respectively fixedly connected with radiating block, and the surface of radiating block offers the first radiating groove,
The surface of the radiating block and heat emission hole is offered positioned at the both sides of the first radiating groove, the side of the heat transfer block is fixedly connected
There is fin, and the side of fin offers the second radiating groove.
Preferably, the surface of the heat transfer plate is fixedly connected with reflector, and fixed between the both sides of groove inner wall
It is connected with protective cover.
Preferably, the inside of the ceramic substrate is fixedly connected with the second heat-conducting block, and the top of the second heat-conducting block with
The bottom of collets is fixedly connected, and the bottom of second heat-conducting block is fixedly connected with heat sink, and the bottom of heat sink is consolidated
Surely it is connected with radiation tooth.
Preferably, the inside of the ceramic substrate is fixedly connected with first polar body and second polar body, and the first pole respectively
The top of body and the top of second polar body are fixedly connected with the surface of diode chip for backlight unit.
Preferably, the inside of the ceramic substrate is fixedly connected with support block, and ceramic base is run through in the bottom of the support block
Plate and the outside for extending to ceramic substrate, the surface of the support block and offer fixing hole positioned at the outside of ceramic substrate.
Compared with prior art, the beneficial effects of the utility model are：
（1）, the long package structure for LED of the service life, consolidated by the side of heat transfer block and the side of heat-conducting plate
Fixed connection, the top and bottom of heat transfer block has been respectively fixedly connected with radiating block, and the surface of radiating block offers the first radiating
Groove, the surface of radiating block and offers heat emission hole positioned at the both sides of the first radiating groove, and the side of heat transfer block is fixedly connected with scattered
Backing, and the side of fin offers the second radiating groove, change heat caused by high power concentrate on it is small-sized
In crystal grain, once temperature raises, the problem of having a strong impact on light emitting diode service life, the radiating efficiency of diode is improved,
Be advantageous to the normal work of diode.
（2）, the long package structure for LED of the service life, be fixedly connected with and led by the both sides of ceramic substrate
Hot plate, the side of heat-conducting plate is fixedly connected with heat abstractor, and the bottom of groove inner wall is fixedly connected with collets, collets
Top be fixedly connected with diode chip for backlight unit, and the surrounding on diode chip for backlight unit surface has been fixedly connected with fluorescence offset plate, groove
The both sides of inwall have been fixedly connected with heat transfer plate, and the inside of ceramic substrate is fixedly connected with the first heat-conducting block, the first heat conduction
The side of block is fixedly connected with the side of heat transfer plate, and the opposite side of the first heat-conducting block is fixedly connected with the side of heat-conducting plate,
The single structure of in the market diode package structure is changed, considerably increases its feature, whole operation process is simple and convenient.
（3）, the long package structure for LED of the service life, be fixedly connected with second by the inside of ceramic substrate
Heat-conducting block, and the top of the second heat-conducting block is fixedly connected with the bottom of collets, and the bottom of the second heat-conducting block is fixedly connected with
Heat sink, and the bottom of heat sink is fixedly connected with radiation tooth, adds area of dissipation, enhances radiating effect.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the structural representation of the utility model heat abstractor.
In figure：1 ceramic substrate, 2 grooves, 3 heat-conducting plates, 4 heat abstractors, 41 heat transfer blocks, 42 radiating blocks, 43 first radiatings
Groove, 44 heat emission holes, 45 fin, 46 second radiating grooves, 5 collets, 6 diode chip for backlight unit, 7 fluorescence offset plates, 8 heat transfer plates, 9 first
Heat-conducting block, 10 reflectors, 11 protective covers, 12 second heat-conducting blocks, 13 heat sinks, 14 radiation tooths, 15 first polar bodies, 16 second poles
Body, 17 support blocks, 18 fixing holes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme：A kind of long LED package of service life
Structure, including ceramic substrate 1, ceramic substrate 1 are ceramic material, and there is insulation and heat sinking function, the top of ceramic substrate 1 to open up
Fluted 2, and the both sides of ceramic substrate 1 have been fixedly connected with heat-conducting plate 3, the effect of transferring heat energy, and the side of heat-conducting plate 3 is consolidated
Surely heat abstractor 4 is connected with, and the bottom of the inwall of groove 2 is fixedly connected with collets 5, and collets 5 are insulating materials, are had
Insulation function, the top of collets 5 are fixedly connected with diode chip for backlight unit 6, and the fixed company of the surrounding on the surface of diode chip for backlight unit 6
Fluorescence offset plate 7 is connected to, the material of fluorescence offset plate 7 is elargol, and the thermal conductivity of elargol is good, can extend the life-span of diode chip for backlight unit 6,
The both sides of the inwall of groove 2 have been fixedly connected with heat transfer plate 8, the effect of transferring heat energy, and the inside of ceramic substrate 1 is fixed and connected
The first heat-conducting block 9 is connected to, the side of the first heat-conducting block 9 is fixedly connected with the side of heat transfer plate 8, and the first heat-conducting block 9 is another
Side is fixedly connected with the transmission for accelerating heat with the side of heat-conducting plate 3, is advantageous to radiate, heat abstractor includes heat transfer block 41, passes
The effect of heat energy is passed, and the side of heat transfer block 41 is fixedly connected with the side of heat-conducting plate 3, the top and bottom point of heat transfer block 41
Radiating block 42 is not fixedly connected with, adds the contact area with air, is advantageous to radiate, and the surface of radiating block 42 opens up
There is the first radiating groove 43, be advantageous to air and take away unnecessary heat, accelerate radiating, the surface of radiating block 42 and positioned at the first radiating
The both sides of groove 43 offer heat emission hole 44, accelerate transmission of the air to heat, be advantageous to radiate, the side of heat transfer block 41 is consolidated
Surely fin 45 is connected with, and the side of fin 45 offers the second radiating groove 46, considerably increases the contact with air
Area, improves radiating efficiency, and the surface of heat transfer plate 8 is fixedly connected with reflector 10, by the condenser effect of reflector 10, carried
The brightness of high light source, and protective cover 11 has been fixedly connected between the both sides of the inwall of groove 2, protective cover 11 be by material,
Play a part of protection, the inside of ceramic substrate 1 is fixedly connected with the second heat-conducting block 12, and the top of the second heat-conducting block 12 with
The bottom of collets 5 is fixedly connected, and the bottom of the second heat-conducting block 12 is fixedly connected with heat sink 13, and the bottom of heat sink 13
Radiation tooth 14 is fixedly connected with, considerably increases the contact area with air, improves radiating efficiency, the inside of ceramic substrate 1
First polar body 15 and second polar body 16 are respectively fixedly connected with, and the top of first polar body 15 and the top of second polar body 16 are equal
It is fixedly connected with the surface of diode chip for backlight unit 6, the inside of ceramic substrate 1 is fixedly connected with support block 17, the bottom of support block 17
Through ceramic substrate 1 and extend to the outside of ceramic substrate 1, the surface of support block 17 and opened up positioned at the outside of ceramic substrate 1
There is fixing hole 18, serve the effect of fixed support.
During work, diode chip for backlight unit 6 excites fluorescence offset plate 7 luminous and produces heat, and heat is led by heat transfer plate 8 and first
Hot block 9 is delivered to heat-conducting plate 3 and heat transfer block 41, and heat transfer block 41 adds the contact area with air by radiating block 42, accelerates
Radiating rate, then by the radiating groove 43 of heat emission hole 44 and first on radiating block 42, accelerate transmission of the air to heat, favorably
In radiating, then by the radiating groove 46 of fin 45 and second, the contact area with air is added, raising radiating efficiency is unnecessary
Heat heat sink 13 is delivered to by the second heat-conducting block 12 again, heat sink 13 is radiated with radiation tooth 14, thus improved
The radiating efficiency of diode, extend the service life of diode.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of long package structure for LED of service life, including ceramic substrate（1）, it is characterised in that：The ceramics
Substrate（1）Top open up it is fluted（2）, and ceramic substrate（1）Both sides be fixedly connected with heat-conducting plate（3）, it is described to lead
Hot plate（3）Side be fixedly connected with heat abstractor（4）, and groove（2）The bottom of inwall is fixedly connected with collets（5）,
The collets（5）Top be fixedly connected with diode chip for backlight unit（6）, and diode chip for backlight unit（6）The surrounding on surface is fixed
It is connected with fluorescence offset plate（7）, the groove（2）The both sides of inwall have been fixedly connected with heat transfer plate（8）, and ceramic substrate（1）
Inside be fixedly connected with the first heat-conducting block（9）, first heat-conducting block（9）Side and heat transfer plate（8）Side fix connect
Connect, and the first heat-conducting block（9）Opposite side and heat-conducting plate（3）Side be fixedly connected.
A kind of 2. long package structure for LED of service life according to claim 1, it is characterised in that：It is described to dissipate
Thermal includes heat transfer block（41）, and heat transfer block（41）Side and heat-conducting plate（3）Side be fixedly connected, the heat transfer block
（41）Top and bottom be respectively fixedly connected with radiating block（42）, and radiating block（42）Surface offer the first radiating groove
（43）, the radiating block（42）Surface and be located at the first radiating groove（43）Both sides offer heat emission hole（44）, the biography
Hot block（41）Side be fixedly connected with fin（45）, and fin（45）Side offer the second radiating groove（46）.
A kind of 3. long package structure for LED of service life according to claim 1, it is characterised in that：The biography
Hot plate（8）Surface be fixedly connected with reflector（10）, and groove（2）Protective cover has been fixedly connected between the both sides of inwall
（11）.
A kind of 4. long package structure for LED of service life according to claim 1, it is characterised in that：The pottery
Porcelain substrate（1）Inside be fixedly connected with the second heat-conducting block（12）, and the second heat-conducting block（12）Top and collets（5）'s
Bottom is fixedly connected, second heat-conducting block（12）Bottom be fixedly connected with heat sink（13）, and heat sink（13）Bottom
Portion is fixedly connected with radiation tooth（14）.
A kind of 5. long package structure for LED of service life according to claim 1, it is characterised in that：The pottery
Porcelain substrate（1）Inside be fixedly connected with first polar body respectively（15）And second polar body（16）, and first polar body（15）Top
Portion and second polar body（16）Top and diode chip for backlight unit（6）Surface be fixedly connected.
A kind of 6. long package structure for LED of service life according to claim 1, it is characterised in that：The pottery
Porcelain substrate（1）Inside be fixedly connected with support block（17）, the support block（17）Bottom run through ceramic substrate（1）And extend
To ceramic substrate（1）Outside, the support block（17）Surface and be located at ceramic substrate（1）Outside offer fixing hole
（18）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093020.3U CN207217579U (en) | 2017-08-30 | 2017-08-30 | A kind of long package structure for LED of service life |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721093020.3U CN207217579U (en) | 2017-08-30 | 2017-08-30 | A kind of long package structure for LED of service life |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217579U true CN207217579U (en) | 2018-04-10 |
Family
ID=61825673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721093020.3U Expired - Fee Related CN207217579U (en) | 2017-08-30 | 2017-08-30 | A kind of long package structure for LED of service life |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326707A (en) * | 2018-10-18 | 2019-02-12 | 王祥圈 | A kind of light emitting diode of high efficiency and heat radiation |
-
2017
- 2017-08-30 CN CN201721093020.3U patent/CN207217579U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326707A (en) * | 2018-10-18 | 2019-02-12 | 王祥圈 | A kind of light emitting diode of high efficiency and heat radiation |
| CN109326707B (en) * | 2018-10-18 | 2020-06-05 | 扬州港信光电科技有限公司 | High-efficient radiating LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191217 Address after: No. 88, Zhabei Road, Tianxing village, Binjiang Town, Taixing City, Taizhou City, Jiangsu Province Patentee after: Taixing Yunxiang Electronic Technology Co., Ltd Address before: 363299, Zhangzhou, Fujian province Zhangpu County Industrial Development Zone, Sui An Industrial Park Patentee before: ZHANGPU BISU LIGHTING TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20200830 |