CN214275382U

CN214275382U - LED ceramic package with high heat dissipation performance

Info

Publication number: CN214275382U
Application number: CN202120473823.1U
Authority: CN
Inventors: 林宏填
Original assignee: Guangzhou Qiansheng Photoelectric Technology Co ltd
Current assignee: Guangzhou Qiansheng Photoelectric Technology Co ltd
Priority date: 2021-03-04
Filing date: 2021-03-04
Publication date: 2021-09-24
Anticipated expiration: 2031-03-04

Abstract

The utility model discloses a high heat dissipation LED ceramic package, which belongs to the technical field of LED and comprises a base, wherein a heat dissipation layer is fixedly embedded at the bottom of the inner side of the base, a heat conduction silicone grease is adhered at the top of the heat dissipation layer, a main heat conduction layer is fixedly embedded at the top of the heat conduction silicone grease, a heat conduction silica gel is adhered at the top of the main heat conduction layer, an auxiliary heat conduction layer is fixedly embedded at the top of the heat conduction silica gel, a fixed groove is arranged at the center of the top of the base, a fixed plate is fixedly connected at the center of the top of the auxiliary heat conduction layer and is positioned at the inner side of the fixed groove, heat generated when the LED chip is used can be transferred out through the mutual cooperation of the auxiliary heat conduction layer, the heat is dissipated into the atmosphere through the mutual cooperation of the heat conduction silicone grease and the heat dissipation layer, the temperature of the LED chip when in use is effectively controlled, and high-efficiency heat dissipation is realized, avoid local high temperature, increase product life and stability.

Description

LED ceramic package with high heat dissipation performance

Technical Field

The utility model relates to a LED technical field, more specifically say, relate to a LED ceramic package of high heat dissipating.

Background

The LED product has the advantages of energy conservation, electricity saving, high efficiency, quick reaction time, long service life, no mercury, environmental protection benefit and the like, has good development prospect and continuously expands the application field.

In the present LED encapsulation, there is the PCB that adopts as the base plate, with LED chip snap-on welding on the base plate, but this kind of packaging method is not very good to the radiating effect of LED chip, LED high power product input power only has about 15% electric energy conversion to light energy usually, remaining 85% electric energy all converts heat energy into, produced heat energy when LED is luminous if can't derive, will make LED local high temperature, and then influence the product life cycle, luminous efficiency, stability, a lot of adoption ceramic substrate encapsulates simultaneously, all with chip snap-on the base plate, when the LED chip damages, need change whole device, and maintenance cost is high, and waste resources.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a LED ceramic package of high heat dissipating, it can realize carrying out high-efficient heat dissipation to the LED chip, avoids local high temperature, increases product life and stability, can realize that quick replacement has destroyed the LED chip simultaneously, reduces the wasting of resources, practices thrift the cost.

2. Technical scheme

In order to solve the above problem, the utility model adopts the following technical scheme:

an LED ceramic package with high heat dissipation performance comprises a base, wherein a heat dissipation layer is fixedly embedded at the bottom of the inner side of the base, the top of the heat dissipation layer is bonded with heat-conducting silicone grease, the top of the heat-conducting silicone grease is fixedly embedded with a main heat-conducting layer, the top of the main heat conducting layer is bonded with heat conducting silica gel, an auxiliary heat conducting layer is fixedly embedded at the top of the heat conducting silica gel, a fixed groove is arranged at the center of the top of the base, a fixed plate is fixedly connected at the center of the top of the auxiliary heat conduction layer, the fixing plate is positioned at the inner side of the fixing groove, the top of the fixing plate is fixedly connected with an LED chip, a lampshade is embedded in the inner side of the fixing groove in a sliding manner, a fixing ring is fixedly connected with the bottom of the inner side of the lampshade, the lamp shade is characterized in that clamping grooves are formed in the front side and the rear side of the inside of the lamp shade, clamping buckles are fixedly connected to the front side and the rear side of the inside of the fixing groove, and the clamping grooves are clamped with the clamping buckles.

As a preferred scheme of the utility model, two symmetric distribution, two around the draw-in groove is the buckle is symmetric distribution, the lamp shade is the hemisphere type, the draw-in groove is the type of falling L.

As a preferred scheme of the utility model, a plurality of louvres have been seted up at the top of main thermal conductive layer, and a plurality of louvres are circumference evenly distributed.

As a preferred scheme of the utility model, the top left and right sides of LED chip all has the electrode slice through tin soldering, the standing groove has all been seted up to the top left and right sides of fixed plate, and the standing groove is bilateral symmetry and distributes.

As a preferred scheme of the utility model, the outside left and right sides of base all inlays and is equipped with the welding dish, and the welding dish one side that is close to each other runs through to the inboard of fixed slot, two the top of welding dish is passed through the wire and is connected with adjacent electrode slice electricity.

As an optimized scheme of the utility model, the mounting hole has all been seted up to the top four corners department of base, the bottom of lamp shade is binded and is provided with the sealing washer.

3. Advantageous effects

Compared with the prior art, the utility model provides a LED ceramic package of high heat dissipating. Has the following beneficial effects:

(1) this LED ceramic package of high heat dissipating compares in the LED ceramic package of general high heat dissipating, can come out through the heat transfer that produces when assisting heat conduction layer, heat conduction silica gel and main heat conduction layer mutually support and use the LED chip, mutually support through heat conduction silica gel and heat dissipation layer and give off the heat to the atmosphere, carry out effective control to the temperature when using the LED chip, realize high-efficient heat dissipation, avoid local high temperature, increase product life and stability.

(2) This high thermal diffusivity's LED ceramic package, compare in general high thermal diffusivity's LED ceramic package, can utilize the draw-in groove on the lamp shade, carry out the joint with the inboard buckle of fixed slot, realize the fixed to the lamp shade, can realize dismantling the effect of LED chip fast, reduce the wasting of resources, practice thrift the cost.

Drawings

Fig. 1 is a front view structural section of the present invention;

fig. 2 is a schematic perspective view of the present invention;

fig. 3 is a schematic view of the overlooking structure of the utility model with the lampshade taken down.

The reference numbers in the figures illustrate: 1. a base; 2. heat conducting silica gel; 3. leading the thermal layer; 4. heat dissipation holes; 5. heat-conducting silicone grease; 6. a heat dissipation layer; 7. fixing grooves; 8. a fixing plate; 9. an LED chip; 10. an electrode sheet; 11. a placement groove; 12. a lamp shade; 13. a card slot; 14. buckling; 15. a fixing ring; 16. a seal ring; 17. welding a disc; 18. mounting holes; 19. and (4) assisting the heat conducting layer.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, a high heat dissipation LED ceramic package includes a base 1, a heat dissipation layer 6 is fixedly embedded at the bottom of the inner side of the base 1, a heat conductive silicone grease 5 is adhered to the top of the heat dissipation layer 6, a main heat conductive layer 3 is fixedly embedded at the top of the heat conductive silicone grease 5, a heat conductive silicone 2 is adhered to the top of the main heat conductive layer 3, an auxiliary heat conductive layer 19 is fixedly embedded at the top of the heat conductive silicone 2, a fixing groove 7 is formed at the center of the top of the base 1, a fixing plate 8 is fixedly connected to the center of the top of the auxiliary heat conductive layer 19, the fixing plate 8 is located at the inner side of the fixing groove 7, an LED chip 9 is fixedly connected to the top of the fixing plate 8, a lampshade 12 is slidably embedded at the inner side of the fixing groove 7, a fixing ring 15 is fixedly connected to the bottom of the inner side of the lampshade 12, clamping grooves 13 are formed at the front and rear sides of the inner part of the lampshade 12, and the front and rear sides of the inner part of the fixing groove 7 are fixedly connected with buckles 14, the card slot 13 and the card buckle 14 are mutually clamped.

The utility model discloses an in the embodiment, heat dissipation layer 6 adopts the aluminium material, aluminium has the hot effect of efficient, can carry out high-efficient heat dissipation with the heat of heat conduction silicone grease 5, heat conduction silicone grease 5 possesses superior heat conductivity, can effectively absorb the heat of the leading heat conduction layer 3 of heat conduction silicone grease 5 top, leading heat conduction layer 3 adopts the copper product, the copper product has fine heat conductivity, can effectively absorb the heat of the heat conduction silica gel 2 inside of leading heat conduction layer 3 top, it adopts heat conduction insulating silica gel sheet material to assist heat conduction layer 19, play the heat effective absorption with the top fast, play the insulating action simultaneously, draw-in groove 13 carries out the joint with buckle 14, can fix lamp shade 12, avoid lamp shade 12 to drop, gu fixed ring 15 simultaneously, when lamp shade 12 is fixed, can carry out the fixed action to fixed plate 8.

Specifically, two draw-in grooves 13 are front and back symmetric distribution, and two buckles 14 are front and back symmetric distribution, and lamp shade 12 is the hemisphere type, and draw-in groove 13 is the type of falling L.

In this embodiment, the reverse L-shaped slot 13 can be engaged with the buckle 14 and will not fall off.

Specifically, a plurality of heat dissipation holes 4 are formed in the top of the main heat conduction layer 3, and the plurality of heat dissipation holes 4 are circumferentially and uniformly distributed.

In this embodiment, a plurality of heat dissipation holes 4 are formed through the top of the main heat conduction layer 3, so as to perform a function of quickly dissipating heat from the main heat conduction layer 3.

Specifically, the left side and the right side of the top of the LED chip 9 are all soldered with electrode plates 10, the left side and the right side of the top of the fixing plate 8 are both provided with placing grooves 11, and the placing grooves 11 are distributed in bilateral symmetry.

In this embodiment, can avoid using the wire for a long time to be worn and torn by fixed plate 8 through standing groove 11, play the guard action.

Specifically, the welding discs 17 are embedded in the left side and the right side of the outer portion of the base 1, one side, close to each other, of each welding disc 17 penetrates through the inner side of the fixing groove 7, and the tops of the two welding discs 17 are electrically connected with the adjacent electrode plates 10 through wires.

In this embodiment, the soldering land 17 is made of a copper material, and plays a role in facilitating connection of the LED chip 9 with an external device.

Specifically, the four corners of the top of the base 1 are all provided with mounting holes 18, and the bottom of the lampshade 12 is provided with a sealing ring 16 in an adhering manner.

In this embodiment, the four mounting holes 18 can facilitate mounting, and the sealing ring 16 is made of rubber to seal.

The working principle is as follows: when the LED lamp is used, the LED ceramic with high heat dissipation performance is packaged and installed at a required position through the installation hole 18, the clamping groove 13 of the lampshade 12 is aligned to the buckle 14, the lampshade 12 is pressed downwards and rotates clockwise to fix, a power supply is connected, the LED chip 9 generates heat while emitting light and forms temperature difference with the auxiliary heat conduction layer 19 at the lower layer, as long as the temperature difference exists, the heat can be spontaneously transmitted from the high-temperature position to the low-temperature position, the heat is firstly absorbed by the auxiliary heat conduction layer 19 and then transmitted to the heat conduction silica gel 2, the heat is transmitted to the main heat conduction layer 3 by the heat conduction silica gel 2 and is dissipated through the heat dissipation holes 4, the heat is absorbed and transmitted to the heat dissipation layer 6 by the heat conduction silica gel 5, finally the heat is dissipated into the atmosphere through the heat dissipation layer 6, when the LED chip 9 is damaged, the lampshade 12 rotates anticlockwise, the lampshade 12 is pulled upwards to be taken down, and the electrode slice 10 and a lead on the welding disc 17 are disconnected, the fixing plate 8 and the LED chip 9 are taken down, the fixing plate 8 and the LED chip 9 are replaced with new ones, wires on the electrode plate 10 and the welding disc 17 are welded, the clamping groove 13 of the lampshade 12 is aligned to the buckle 14, the lampshade 12 is pressed downwards and rotated clockwise, the lampshade 12 is fixed, the LED chip 9 selects a proper specification according to actual use requirements, the specification is a part which is widely used, and the description is omitted.

The above description is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the improvement concept of the present invention within the technical scope disclosed in the present invention.

Claims

1. A high heat dissipating's LED ceramic package, includes base (1), its characterized in that: the heat dissipation structure is characterized in that a heat dissipation layer (6) is fixedly embedded at the bottom of the inner side of the base (1), a heat conduction silicone grease (5) is bonded and arranged at the top of the heat dissipation layer (6), a main heat conduction layer (3) is fixedly embedded at the top of the heat conduction silicone grease (5), a heat conduction silica gel (2) is bonded and arranged at the top of the main heat conduction layer (3), an auxiliary heat conduction layer (19) is fixedly embedded at the top of the heat conduction silica gel (2), a fixing groove (7) is formed in the center of the top of the base (1), a fixing plate (8) is fixedly connected to the center of the top of the auxiliary heat conduction layer (19), the fixing plate (8) is located on the inner side of the fixing groove (7), an LED chip (9) is fixedly connected to the top of the fixing plate (8), a lampshade (12) is embedded in the inner side of the fixing groove (7) in a sliding manner, and a fixing ring (15) is fixedly connected to the bottom of the inner side of the lampshade (12), draw-in groove (13) have all been seted up to both sides around the inside of lamp shade (12), the equal fixedly connected with buckle (14) in both sides around the inside of fixed slot (7), draw-in groove (13) and buckle (14) joint each other.

2. The ceramic package for LED with high heat dissipation property as set forth in claim 1, wherein: two draw-in groove (13) are front and back symmetric distribution, two buckle (14) are front and back symmetric distribution, lamp shade (12) are the hemisphere type, draw-in groove (13) are the type of falling L.

3. The ceramic package for LED with high heat dissipation property as set forth in claim 1, wherein: a plurality of heat dissipation holes (4) are formed in the top of the main heat conduction layer (3), and the heat dissipation holes (4) are circularly and uniformly distributed.

4. The ceramic package for LED with high heat dissipation property as set forth in claim 1, wherein: the LED lamp is characterized in that electrode plates (10) are welded to the left side and the right side of the top of the LED chip (9) through tin, placing grooves (11) are formed in the left side and the right side of the top of the fixing plate (8), and the placing grooves (11) are distributed in a bilateral symmetry mode.

5. The ceramic package for LED with high heat dissipation property as set forth in claim 1, wherein: the welding plate is characterized in that welding plates (17) are embedded in the left side and the right side of the outer portion of the base (1), one side, close to each other, of each welding plate (17) penetrates through the inner side of each fixing groove (7), and the tops of the welding plates (17) are electrically connected with the adjacent electrode plates (10) through wires.

6. The ceramic package for LED with high heat dissipation property as set forth in claim 1, wherein: the lamp shade is characterized in that mounting holes (18) are formed in four corners of the top of the base (1), and sealing rings (16) are bonded to the bottom of the lamp shade (12).