CN216182201U

CN216182201U - Plastic packaging device for lead frame

Info

Publication number: CN216182201U
Application number: CN202122576481.9U
Authority: CN
Inventors: 张轩
Original assignee: Taizhou Yourun Electronic Technologies Co ltd
Current assignee: Taizhou Yourun Electronic Technologies Co ltd
Priority date: 2021-10-26
Filing date: 2021-10-26
Publication date: 2022-04-05
Anticipated expiration: 2031-10-26

Abstract

The utility model discloses a plastic package device for a lead frame, which comprises a working substrate, wherein a working cavity is formed in the working substrate, a lower die is slidably mounted in the working cavity, a plastic package groove is formed in the lower die, a heater is embedded in the lower die and is positioned below the plastic package groove, two groups of supporting columns are fixedly mounted at the upper end of the working substrate, an adsorption groove is formed in the lower end of the upper die, a plurality of groups of vacuum suction heads are arranged in an equidistant array, a vacuum generator is fixedly mounted on one side of the upper die, the vacuum suction heads are communicated with the vacuum generator, air channels are formed in two side walls of the working cavity, fans are fixedly embedded in the air channels, and cooling fins are fixedly mounted at the lower end of the lower die. The utility model adopts an immersion method for plastic package, avoids the lead frame damage caused by high pressure, and can quickly cool and improve the efficiency.

Description

Plastic packaging device for lead frame

Technical Field

The utility model relates to the technical field of circuit board processing equipment, in particular to a plastic packaging device for a lead frame.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.

The existing lead frame is inconvenient to connect an outer lead, an insulating layer is arranged on the outer layer, if the insulating layer is damaged, electric leakage can occur, the use of the lead frame is influenced, the plastic packaging method of the existing lead frame mostly adopts a pressurization injection molding method, high pressure can cause the problem that the lead frame is knocked down or a welding circuit is broken, and the existing lead frame cannot be cooled quickly after injection molding when being subjected to plastic packaging, so that the plastic packaging time is too long, the processing efficiency is influenced, and therefore a plastic packaging device for the lead frame needs to be provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a plastic packaging device for a lead frame, which adopts an immersion method for plastic packaging, avoids the lead frame from being damaged due to high pressure, can be quickly cooled, and improves the efficiency so as to solve the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: a plastic package device for a lead frame comprises a working substrate, a working cavity is arranged on the working substrate, a lower die is slidably arranged in the working cavity, a plastic packaging groove is arranged on the lower die, a heater is embedded on the lower die, the heater is positioned below the plastic packaging groove, two groups of supporting columns are fixedly arranged at the upper end of the working substrate, a hanging plate is arranged between the two groups of supporting columns in a sliding manner, the lower end of the hanging plate is fixedly provided with an upper die, the lower end of the upper die is provided with an adsorption groove, a plurality of groups of vacuum suction heads are arranged in the adsorption tank, the vacuum suction heads are arranged in an equidistant array, a vacuum generator is fixedly arranged on one side of the upper die, the vacuum suction head is communicated with the vacuum generator, the air duct has all been seted up to the both sides wall of working chamber, the wind duct inlays to be adorned fixedly with the fan, the lower extreme fixed mounting of bed die has the fin.

Preferably, two sets of first spouts have all been seted up to the relative lateral wall of support column, slidable mounting has first slider in the first spout, the one end fixed mounting of hanger plate is between two sets of first sliders.

Preferably, a motor is fixedly mounted at the upper end of the working substrate, a screw rod is fixedly mounted at one end of an output shaft of the motor, a threaded hole is formed in the hanger plate, and the screw rod is inserted in the threaded hole in a threaded manner.

Preferably, two sets of second chutes are respectively formed in two side walls of the working cavity, second sliding blocks are slidably mounted in the second chutes, and two sides of the lower die are respectively connected with the working cavity in a sliding mode through the second sliding blocks.

Preferably, a return spring is fixedly mounted in the second sliding groove, and one end of the return spring is fixedly connected with the second sliding block.

Preferably, a wind-shielding sheet is fixedly installed between the two groups of second sliding blocks located on the same side wall through a connecting rod, and the wind-shielding sheet is close to the air duct opening.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, through the design that the upper die is provided with the adsorption groove and the lower die is provided with the plastic packaging groove, the upper die can adsorb the lead frame, plastic powder can be heated to fluid in the plastic packaging groove of the lower die, and then the upper die drives the lead frame to be pressed downwards and immersed in the plastic packaging groove, so that plastic packaging is realized, the purpose of avoiding the lead frame from being damaged due to high pressure is achieved, and the plastic packaging device is simple to use and convenient to operate;

2. according to the utility model, through the design that the air channels are formed on the two side walls of the working cavity, the fans are fixedly embedded in the air channels, and the radiating fins are fixedly arranged at the lower end of the lower die, the graves in the air channels can blow the radiating fins, so that the radiating of the lower die is accelerated, the lead frame can be rapidly cooled after being immersed in the plastic packaging groove, the fluid plastic packaging material can be shaped, and the purpose of improving the production efficiency is achieved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a screw according to the present invention;

FIG. 3 is a schematic view of the return spring of the present invention;

fig. 4 is a schematic view of the windshield of the present invention.

In the figure: 1. a working substrate; 2. a lower die; 3. a support pillar; 4. a hanger plate; 5. an upper die; 6. a vacuum suction head; 7. a vacuum generator; 8. a heater; 9. a fan; 10. a first slider; 11. a motor; 12. a screw; 13. a second slider; 14. a return spring; 15. a wind-shielding sheet; 16. a heat sink; 17. a connecting rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a plastic package device for a lead frame comprises a working substrate 1, wherein a working cavity is formed in the working substrate 1, a lower die 2 is slidably mounted in the working cavity, two groups of second sliding grooves are formed in two side walls of the working cavity, second sliding blocks 13 are slidably mounted in the second sliding grooves, two sides of the lower die 2 are slidably connected with the working cavity through the second sliding blocks 13, return springs 14 are fixedly mounted in the second sliding grooves, and one ends of the return springs 14 are fixedly connected with the second sliding blocks 13;

the second slider 13 can be automatically reset after sliding down by the return spring 14, so that the lower die 2 can be automatically reset to the initial position after each processing.

A plastic packaging groove is formed in the lower die 2, a heater 8 is embedded in the lower die 2, the heater 8 is located below the plastic packaging groove, two groups of supporting columns 3 are fixedly mounted at the upper end of the working substrate 1, a hanging plate 4 is slidably mounted between the two groups of supporting columns 3, first sliding grooves are formed in opposite side walls of the two groups of supporting columns 3, first sliding blocks 10 are slidably mounted in the first sliding grooves, and one end of the hanging plate 4 is fixedly mounted between the two groups of first sliding blocks 10; a motor 11 is fixedly installed at the upper end of the working substrate 1, a screw rod 12 is fixedly installed at one end of an output shaft of the motor 11, a threaded hole is formed in the hanger plate 4, and the screw rod 12 is inserted in the threaded hole in a threaded manner;

the lower extreme fixed mounting of hanger plate 4 has last mould 5, the adsorption tank has been seted up to the lower extreme of going up mould 5, be provided with multiunit vacuum suction head 6 in the adsorption tank, multiunit vacuum suction head 6 is the equidistance array setting, one side fixed mounting of going up mould 5 has vacuum generator 7, vacuum suction head 6 and vacuum generator 7 intercommunication, the wind channel has all been seted up to the both sides wall of working chamber, the wind channel inlays to be adorned and is fixed with fan 9, the lower extreme fixed mounting of bed die 2 has fin 16, there is wind blocking piece 15 through connecting rod 17 fixed mounting between two sets of second sliders 13 that are located same lateral wall, wind blocking piece 15 is close to the wind channel mouth, make the plastic envelope groove push down after the lead frame gets into the plastic envelope groove, thereby make second slider 13 glide, drive wind blocking piece 15 and descend, make the wind channel open, make fan 9 carry out the heat dissipation of blowing to fin 16, thereby the heat dissipation of bed die 2 accelerates.

When the device is used, the back of a lead frame provided with a semiconductor chip is attached to the upper end face of an adsorption groove, the lead frame is adsorbed in the adsorption groove under the action of a vacuum generator 7 and a vacuum suction head 6, plastic package powder is added into a plastic package groove of a lower die, the powder is heated to be molten through a heater 8, a screw 12 is driven to rotate through a motor 11, the upper die drives the lead frame to descend and dip into the plastic package groove, plastic package is achieved, the plastic package groove is pressed downwards after the lead frame enters the plastic package groove, a second sliding block 13 slides downwards to drive a wind blocking sheet 15 to descend, an air channel is opened, air is blown to a cooling fin 16 by a fan 9 to dissipate heat, heat dissipation of the lower die 2 is accelerated, the fluid plastic package material can be rapidly cooled to be shaped after the lead frame dips into the plastic package groove, and the purpose of improving production efficiency is achieved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a plastic envelope device for lead frame, includes work base plate (1), its characterized in that: the vacuum sucking head structure is characterized in that a working cavity is formed in the working substrate (1), a lower die (2) is arranged in the working cavity in a sliding mode, a plastic packaging groove is formed in the lower die (2), a heater (8) is embedded in the lower die (2), the heater (8) is located below the plastic packaging groove, two groups of supporting columns (3) are fixedly arranged at the upper end of the working substrate (1), a hanging plate (4) is arranged between the two groups of supporting columns (3) in a sliding mode, an upper die (5) is fixedly arranged at the lower end of the hanging plate (4), an adsorption groove is formed in the lower end of the upper die (5), a plurality of groups of vacuum sucking heads (6) are arranged in the adsorption groove, the plurality of groups of vacuum sucking heads (6) are arranged in an equidistant array mode, a vacuum generator (7) is fixedly arranged at one side of the upper die (5), and the vacuum sucking heads (6) are communicated with the vacuum generator (7), the air ducts are formed in two side walls of the working cavity, the fans (9) are fixedly embedded in the air ducts, and the radiating fins (16) are fixedly mounted at the lower end of the lower die (2).

2. The plastic packaging device for the lead frame according to claim 1, wherein: first chutes are formed in opposite side walls of the two groups of supporting columns (3), first sliding blocks (10) are arranged in the first chutes in a sliding mode, and one end of the hanging plate (4) is fixedly arranged between the two groups of first sliding blocks (10).

3. The plastic packaging device for the lead frame according to claim 2, characterized in that: the upper end of the working substrate (1) is fixedly provided with a motor (11), one end of an output shaft of the motor (11) is fixedly provided with a screw rod (12), the hanger plate (4) is provided with a threaded hole, and the screw rod (12) is inserted in the threaded hole in a threaded manner.

4. The plastic packaging device for the lead frame according to claim 1, wherein: two sets of second spouts have all been seted up to the both sides wall of working chamber, slidable mounting has second slider (13) in the second spout, the both sides of bed die (2) all are through second slider (13) and working chamber sliding connection.

5. The plastic packaging device for the lead frame according to claim 4, wherein: and a return spring (14) is fixedly installed in the second sliding groove, and one end of the return spring (14) is fixedly connected with the second sliding block (13).

6. The plastic packaging device for the lead frame according to claim 4, wherein: and two groups of second sliding blocks (13) positioned on the same side wall are fixedly provided with wind-blocking sheets (15) through connecting rods (17), and the wind-blocking sheets (15) are close to the air duct opening.