CN220189640U - High-protection chip packaging frame - Google Patents
High-protection chip packaging frame Download PDFInfo
- Publication number
- CN220189640U CN220189640U CN202321807393.8U CN202321807393U CN220189640U CN 220189640 U CN220189640 U CN 220189640U CN 202321807393 U CN202321807393 U CN 202321807393U CN 220189640 U CN220189640 U CN 220189640U
- Authority
- CN
- China
- Prior art keywords
- unit
- chip
- groove
- frame
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 238000005192 partition Methods 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims description 38
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 238000009423 ventilation Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims 3
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-protection chip packaging frame, which relates to the technical field of chip packaging frames and comprises a frame unit, a positioning unit arranged on the side part of the frame unit, a clamping and mounting unit, a wire harness fixing unit and a heat radiating unit, wherein the clamping and mounting unit, the wire harness fixing unit and the heat radiating unit are arranged in the frame unit; the wire harness fixing unit comprises a wire guiding groove formed in the inner bottom wall of the frame unit, a plurality of partition plates formed on the side walls of the wire guiding groove opposite to the groove, a movable groove formed in the end portion of the partition plate on one side of the wire guiding groove, a clamping plate movably mounted in the movable groove, and a clamping groove formed in the end portion of the partition plate on the other side of the wire guiding groove. The utility model relates to a high-protection chip packaging frame, which effectively prevents a wire from curling before packaging by a wire harness fixing unit; through the radiating unit that sets up, the timely discharge of chip during operation production heat has been realized.
Description
Technical Field
The utility model relates to the technical field of chip packaging frames, in particular to a high-protection chip packaging frame.
Background
The chip package, i.e. the package for mounting semiconductor integrated circuit chips, plays the roles of placing, fixing, sealing, protecting chips and enhancing electrothermal performance, and can be used as a lead frame, i.e. a bridge for communicating the world inside the chip with external circuits, wherein the contacts on the chip are led to the pins of the package by leads, and the pins are connected with other devices by leads on a printed board.
Retrieved under publication (bulletin) number: CN212434612U, discloses a lead frame structure and a chip package structure, comprising: a bonding region for providing a bonding region to the bonding layer; the bonding area is provided with a rough area, a plurality of concave parts which are arranged at intervals are arranged in the rough area, and the concave parts are used for providing filling space for bonding materials of the bonding layer; a bonding wire region for metal wire electrical connection; the chip packaging structure comprises the lead frame structure and further comprises: a chip; the chip is fixed on the bonding area through the bonding layer; the bonding material of the bonding layer is filled in the concave part; one end of the metal wire is welded to the chip, and the other end of the metal wire is welded to the welding wire area; when in use, the precipitate of the bonding layer can be prevented from adhering to the bonding wire area; the adhesion of the bond layer precipitate to the wire bonding region can be avoided to improve the bonding quality of the wire.
Although the above scheme avoids the adhesion of the precipitate on the bonding layer to the bonding wire area, the problem that the external portion is curled easily occurs due to lack of constraint of the wire in the process of leading out the wire on the chip, and the heat generated during the operation of the chip is not discharged in time, so that the performance of the chip can be affected.
Disclosure of Invention
The utility model mainly aims to provide a chip packaging frame with high protection, which solves the problems that the outer side part is easy to curl due to lack of constraint of wires in the process of leading out the wires on a chip through a wire harness fixing unit and a heat radiating unit, and the performance of the chip is influenced due to untimely discharge of heat generated by the chip during operation.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the high-protection chip packaging frame comprises a frame unit, a positioning unit arranged on the side part of the frame unit, a clamping and mounting unit, a wire harness fixing unit and a heat radiating unit, wherein the clamping and mounting unit, the wire harness fixing unit and the heat radiating unit are arranged in the frame unit;
the wire harness fixing unit comprises a wire guiding groove formed in the inner bottom wall of the frame unit, a plurality of partition plates formed on the side walls of the wire guiding groove opposite to the groove, a movable groove formed at the end part of the partition plate on one side of the wire guiding groove, a clamping plate movably mounted in the movable groove, and a clamping groove formed at the end part of the partition plate on the other side of the wire guiding groove;
the heat dissipation unit comprises a mounting seat arranged on the inner top wall of the frame unit, a fan arranged on the inner top wall of the mounting seat, a first heat dissipation hole formed in the side wall of the frame unit, and a second heat dissipation hole formed in the inner bottom wall of the frame unit.
Preferably, the frame unit includes a lower sealing plate and an upper sealing plate mounted on top of the lower sealing plate.
Preferably, the frame unit further includes pins mounted between adjacent partition plates.
Preferably, the clamping and mounting unit comprises a chip groove arranged at the center of the top of the lower sealing plate, and a chip clamping plate movably arranged in the chip groove, wherein one end of the chip clamping plate is fixedly connected with the chip clamping plate, and the other end of the chip clamping plate is fixedly connected with the side wall of the chip groove.
Preferably, the clamping and mounting unit further comprises a moving groove formed in the adjacent side wall of the chip groove and the chip clamping plate, and a moving plate mounted at the end of the chip clamping plate and located in the moving groove.
Preferably, the heat dissipation unit further comprises a ventilation screen installed in the installation seat, and the ventilation screen is located at the output end of the fan.
Preferably, the positioning unit comprises a positioning column arranged on the side wall of the lower sealing plate and a positioning groove arranged on the side wall of the upper sealing plate.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the wire harness fixing unit, in the process of leading out the chip wires, the wires can be clamped into the wire guide grooves in advance, then the clamping plates are turned over along the hinged positions of the wire guide grooves and the partition plates from inside to outside, so that the inner walls of the clamping plates can squeeze the outer walls of the wires, and then the outer walls of the front ends of the clamping plates are symmetrically arranged in the clamping grooves, so that the wires are pressed through the clamping plates to avoid curling, and the problem that the wires curl before packaging can be effectively prevented, and the wires and the pins can be fully contacted.
2. According to the utility model, through the arranged heat radiating unit, when the chip is installed, the chip clamping plate is pushed to extrude the spring, the chip can be easily placed into the chip groove at the moment, and then the chip is clamped and installed under the action of the elasticity of the spring; then the upper sealing plate is buckled above the lower sealing plate, so that after the chip is packaged, the generated heat is discharged to the outside through the first heat dissipation holes in one step in the working process of the chip, and part of the generated heat is discharged through the second heat dissipation holes, and the heat can be accelerated to be discharged from the second heat dissipation holes under the action of wind power of a fan; the chip can timely discharge heat generated during the operation of the chip, and the better performance of the chip is ensured.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic top view of the present utility model;
FIG. 3 is a schematic cross-sectional view of the structure of FIG. 2 at A-A in accordance with the present utility model;
FIG. 4 is an enlarged schematic view of the structure A of FIG. 3 according to the present utility model;
FIG. 5 is a schematic diagram of the cross-sectional structure of the utility model at B-B in FIG. 2.
In the figure:
1. a frame unit; 101. a lower sealing plate; 102. an upper sealing plate; 103. pins;
2. clamping the mounting unit; 201. a chip slot; 202. a chip clamping plate; 203. a spring; 204. a moving plate;
3. a harness fixing unit; 301. a movable groove; 302. a clamping plate; 303. a clamping groove;
4. a heat radiation unit; 401. a mounting base; 402. a fan; 403. a first heat radiation hole; 404. an air permeable barrier; 405. a second heat radiation hole;
5. a positioning unit; 501. positioning columns; 502. and a positioning groove.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Example 1
As shown in fig. 1, 3, 4 and 5, a highly protective chip package frame includes a frame unit 1, a positioning unit 5 disposed at a side of the frame unit 1, a clamping and mounting unit 2, a wire harness fixing unit 3 and a heat dissipating unit 4 disposed in the frame unit 1;
as shown in fig. 2, the wire harness fixing unit 3 includes a wire guiding groove formed in the inner bottom wall of the frame unit 1, a plurality of partition plates formed on the opposite side walls of the wire guiding groove, a movable groove 301 formed on the end of the partition plate on one side of the wire guiding groove, a clamping plate 302 movably mounted in the movable groove 301, and a clamping groove 303 formed on the end of the partition plate on the other side of the wire guiding groove, wherein the clamping plate 302 is buckled in the clamping groove 303, so that wires passing through the wire guiding groove can be bound;
as shown in fig. 5, the heat dissipation unit 4 includes a mounting seat 401 mounted on the inner top wall of the frame unit 1, a fan 402 mounted on the inner top wall of the mounting seat 401, a first heat dissipation hole 403 formed on the side wall of the frame unit 1, and a second heat dissipation hole 405 formed on the inner bottom wall of the frame unit 1, where the design of the first heat dissipation hole 403 and the second heat dissipation hole 405 facilitates rapid evaporation of heat generated during the operation of the chip.
As shown in fig. 1, the frame unit 1 includes a lower sealing plate 101, and an upper sealing plate 102 mounted on the top of the lower sealing plate 101, where the lower sealing plate 101 and the upper sealing plate 102 are fastened together, so as to play a role in packaging and protecting the chip.
As shown in fig. 1, the frame unit 1 further includes pins 103 mounted between adjacent partition plates, the pins 103 being connected to external devices so that instruction exchange between the chip and the external devices is enabled.
As shown in fig. 5, the heat dissipation unit 4 further includes a ventilation screen 404 installed in the mounting seat 401, and the ventilation screen 404 is located at an output end of the fan 402, so that the air flow generated by the operation of the fan 402 can be blown to the chip, and meanwhile, scratch and rubbing between the air flow and the surface of the chip during the operation of the fan 402 is avoided.
As shown in fig. 1, the positioning unit 5 includes a positioning column 501 mounted on a side wall of the lower sealing plate 101, and a positioning slot 502 formed on a side wall of the upper sealing plate 102, where the positioning column 501 and the positioning slot 502 are designed to facilitate the gluing and packaging between the upper sealing plate 102 and the lower sealing plate 101.
When the chip leads are led out, the leads can be clamped into the lead grooves in advance, then the clamping plate 302 is turned over along the hinged position of the lead grooves and the partition plate along the direction from inside to outside, the inner wall of the clamping plate is enabled to squeeze the outer wall of the leads, and then the outer wall of the front end of the clamping plate 302 is symmetrically provided with the clamping groove 303, so that the leads are pressed through the clamping plate 302 to be prevented from being curled, and the problem that the leads curl before packaging can be effectively prevented by the structure, so that the leads and the pins 103 can be fully contacted.
Example 2
As shown in fig. 1, 2, 3, 4 and 5, a highly protective chip package frame includes a frame unit 1, a positioning unit 5 disposed at a side of the frame unit 1, a clamping and mounting unit 2, a wire harness fixing unit 3 and a heat dissipating unit 4 disposed in the frame unit 1;
as shown in fig. 2, the wire harness fixing unit 3 includes a wire guiding groove formed in the inner bottom wall of the frame unit 1, a plurality of partition plates formed on the opposite side walls of the wire guiding groove, a movable groove 301 formed on the end of the partition plate on one side of the wire guiding groove, a clamping plate 302 movably mounted in the movable groove 301, and a clamping groove 303 formed on the end of the partition plate on the other side of the wire guiding groove, wherein the clamping plate 302 is buckled in the clamping groove 303, so that wires passing through the wire guiding groove can be bound;
as shown in fig. 5, the heat dissipation unit 4 includes a mounting seat 401 mounted on the inner top wall of the frame unit 1, a fan 402 mounted on the inner top wall of the mounting seat 401, a first heat dissipation hole 403 formed on the side wall of the frame unit 1, and a second heat dissipation hole 405 formed on the inner bottom wall of the frame unit 1, where the design of the first heat dissipation hole 403 and the second heat dissipation hole 405 facilitates rapid evaporation of heat generated during the operation of the chip.
As shown in fig. 1, the frame unit 1 includes a lower sealing plate 101, and an upper sealing plate 102 mounted on the top of the lower sealing plate 101, where the lower sealing plate 101 and the upper sealing plate 102 are fastened together, so as to play a role in packaging and protecting the chip.
As shown in fig. 1, the frame unit 1 further includes pins 103 mounted between adjacent partition plates, the pins 103 being connected to external devices so that instruction exchange between the chip and the external devices is enabled.
As shown in fig. 2, the clamping and mounting unit 2 includes a chip groove 201 mounted at the top center of the lower sealing plate 101, a chip clamping plate 202 movably disposed in the chip groove 201, a spring 203 with one end fixedly connected with the chip clamping plate 202 and the other end fixedly connected with the side wall of the chip groove 201, and the spring 203 is designed to provide elastic force for the chip clamping plate 202, so that the chip clamping plate 202 can better clamp a chip.
As shown in fig. 2, the clamping and mounting unit 2 further includes a moving slot formed on the adjacent side walls of the chip slot 201 and the chip clamping plate 202, and a moving plate 204 mounted on the end of the chip clamping plate 202 and located in the moving slot, where the moving plate 204 is designed to play a role in guiding and limiting the movement of the chip clamping plate 202.
As shown in fig. 5, the heat dissipation unit 4 further includes a ventilation screen 404 installed in the mounting seat 401, and the ventilation screen 404 is located at an output end of the fan 402, so that the air flow generated by the operation of the fan 402 can be blown to the chip, and meanwhile, scratch and rubbing between the air flow and the surface of the chip during the operation of the fan 402 is avoided.
As shown in fig. 1, the positioning unit 5 includes a positioning column 501 mounted on a side wall of the lower sealing plate 101, and a positioning slot 502 formed on a side wall of the upper sealing plate 102, where the positioning column 501 and the positioning slot 502 are designed to facilitate the gluing and packaging between the upper sealing plate 102 and the lower sealing plate 101.
When the chip is mounted, the chip clamping plate 202 is pushed to extrude the spring 203, the chip can be easily placed into the chip groove 201 at the moment, and then the chip is clamped and mounted under the action of the elastic force of the spring 203; then, the upper sealing plate 102 is buckled above the lower sealing plate 101, so that after the chip is packaged, in the process of working the chip, generated heat is discharged to the outside through the first heat dissipation holes 403 in one step, and part of the generated heat is discharged through the second heat dissipation holes 405, and under the action of wind power of the fan 402, the heat can be accelerated to be discharged from the second heat dissipation holes 405; the chip can timely discharge heat generated during the operation of the chip, and the better performance of the chip is ensured.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The high-protection chip packaging frame comprises a frame unit (1) and a positioning unit (5) arranged on the side part of the frame unit (1), and is characterized by further comprising a clamping and mounting unit (2), a wire harness fixing unit (3) and a heat radiating unit (4) which are arranged in the frame unit (1);
the wire harness fixing unit (3) comprises a wire guiding groove formed in the inner bottom wall of the frame unit (1), a plurality of separation plates formed on the side walls of the wire guiding groove opposite to the groove, a movable groove (301) formed at the end part of the separation plate on one side of the wire guiding groove, a clamping plate (302) movably mounted in the movable groove (301), and a clamping groove (303) formed at the end part of the separation plate on the other side of the wire guiding groove;
the heat dissipation unit (4) comprises a mounting seat (401) arranged on the inner top wall of the frame unit (1), a fan (402) arranged on the inner top wall of the mounting seat (401), a first heat dissipation hole (403) formed in the side wall of the frame unit (1), and a second heat dissipation hole (405) formed in the inner bottom wall of the frame unit (1).
2. The highly protected chip package frame of claim 1, wherein: the frame unit (1) comprises a lower sealing plate (101) and an upper sealing plate (102) arranged on the top of the lower sealing plate (101).
3. The highly protected chip package frame of claim 1, wherein: the frame unit (1) further comprises pins (103) mounted between adjacent partition plates.
4. The highly protected chip package frame of claim 2, wherein: the clamping and mounting unit (2) comprises a chip groove (201) arranged at the center of the top of the lower sealing plate (101), a chip clamping plate (202) movably arranged in the chip groove (201), a spring (203) with one end fixedly connected with the chip clamping plate (202) and the other end fixedly connected with the side wall of the chip groove (201).
5. The highly protected chip package frame of claim 1, wherein: the clamping and mounting unit (2) further comprises a moving groove formed in the adjacent side wall of the chip groove (201) and the chip clamping plate (202), and a moving plate (204) mounted at the end part of the chip clamping plate (202) and located in the moving groove.
6. The highly protected chip package frame of claim 1, wherein: the heat dissipation unit (4) further comprises a ventilation screen (404) arranged in the mounting seat (401), and the ventilation screen (404) is positioned at the output end of the fan (402).
7. The highly protected chip package frame of claim 2, wherein: the positioning unit (5) comprises a positioning column (501) arranged on the side wall of the lower sealing plate (101) and a positioning groove (502) arranged on the side wall of the upper sealing plate (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321807393.8U CN220189640U (en) | 2023-07-11 | 2023-07-11 | High-protection chip packaging frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321807393.8U CN220189640U (en) | 2023-07-11 | 2023-07-11 | High-protection chip packaging frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220189640U true CN220189640U (en) | 2023-12-15 |
Family
ID=89109432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321807393.8U Active CN220189640U (en) | 2023-07-11 | 2023-07-11 | High-protection chip packaging frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220189640U (en) |
-
2023
- 2023-07-11 CN CN202321807393.8U patent/CN220189640U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8106494B2 (en) | Leadframe for leadless package, structure and manufacturing method using the same | |
| TW510158B (en) | Heat dissipation structure for semiconductor device | |
| JP2017139290A (en) | Resin-sealed semiconductor device | |
| CN220189640U (en) | High-protection chip packaging frame | |
| US20090045493A1 (en) | Semiconductor component and method of producing | |
| KR20060027599A (en) | Semiconductor package having heat slug and method for manufacturing the same | |
| CN210897253U (en) | Semiconductor packaging structure | |
| CN110379784B (en) | Semiconductor packaging structure | |
| CN219778881U (en) | Substrate for high-power semiconductor packaging | |
| JP2002033345A (en) | Method for manufacturing resin-sealed semiconductor device | |
| CN217361559U (en) | Structure for packaging chip sealing cover | |
| CN214043626U (en) | Fixing part for chip packaging | |
| CN211743130U (en) | Semiconductor packaging structure | |
| CN219658701U (en) | Jumper wire connection frame of semiconductor device | |
| CN216288408U (en) | Novel packaging structure of high-voltage power semiconductor chip | |
| CN216354172U (en) | IC packaging support plate with accurate positioning | |
| CN220796716U (en) | Semiconductor packaging structure | |
| CN218274573U (en) | Semiconductor package having semiconductor chip | |
| CN212907721U (en) | Wireless lead packaging structure based on LTCC circuit | |
| JPH09289222A (en) | Heat dissipating support structure, plastic package for semiconductor device and manufacturing method thereof | |
| CN212991089U (en) | T0-263 frame | |
| CN209859938U (en) | COB packaging structure of no gold thread flip-chip bonding technique | |
| CN207834286U (en) | Chip-packaging structure and terminal device | |
| KR19990035569A (en) | package | |
| JPH08181266A (en) | Lead frame, and semiconductor device constituted, using it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |