CN211743130U

CN211743130U - Semiconductor packaging structure

Info

Publication number: CN211743130U
Application number: CN202020909758.8U
Authority: CN
Inventors: 于暄宁; 邓沛轩; 张一凡; 晁越超
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2020-10-23
Anticipated expiration: 2030-05-26

Abstract

The utility model discloses a semiconductor packaging structure, which comprises a substrate, wherein the top of the substrate is provided with a mounting groove, the top of the mounting groove is fixedly connected with a welding area, the outer side of the welding area is provided with a through hole, the through hole is positioned on the four walls of the substrate, one side of the through hole is provided with a micro fixing buckle, the micro fixing buckle is fixedly connected with the outer side of the substrate, a connecting groove is arranged below the micro fixing buckle, the connecting groove is embedded in the outer side of the substrate, an independent connecting plate is arranged in the connecting groove, the two sides of the independent connecting plate are fixedly connected with a micro sucker, the inner part of the substrate is fixedly connected with a radiating fin, and the four walls of the substrate are provided with radiating holes, the structure is simple, and the flexible combination of the single packaging structures can be realized to, in addition, heat dissipation can be effectively carried out, and the service life is prolonged.

Description

Semiconductor packaging structure

Technical Field

The utility model relates to a semiconductor package technical field specifically is a semiconductor packaging structure.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip, and the packaging process is as follows: a wafer from a wafer previous process is cut into small chips (Die) through a scribing process, then the cut chips are pasted on a small island of a corresponding substrate frame (Lead frame) through glue, and then a bonding Pad (Bond Pad) of the chip is connected to a corresponding pin (Lead) of the substrate through an ultrafine metal (gold tin copper aluminum) wire or conductive resin to form a required circuit; then, the independent wafer is packaged and protected by the plastic shell, but most of the existing products are fixed structures when in use, the requirements of different products cannot be met, in addition, the heat dissipation performance is poor, the service life of the wafer is influenced, and the metal wires for welding cannot be effectively summarized, so that how to design a semiconductor packaging structure becomes a problem to be solved currently.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor packaging structure, through setting up spread groove and independent connecting plate, can carry out free equipment between the solitary packaging structure, can satisfy the user demand of different products, through setting up through hole and miniature fixed buckle, can conclude and arrange the metal wire that welds the dress, fix it in the outside of base plate through miniature fixed buckle, make the welding more convenient, through setting up louvre and fin, can carry out effectual heat dissipation, and prolonged service life, in order to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor packaging structure, includes the base plate, the mounting groove has been seted up at the top of base plate, the top fixedly connected with weld zone of mounting groove, the outside of weld zone is equipped with the through hole, just the through hole is located the four walls of base plate, one side of through hole is equipped with miniature fixed buckle, just miniature fixed buckle fixed connection is in the outside of base plate, the below of miniature fixed buckle is equipped with the spread groove, just the spread groove is embedded in the outside of base plate, the inside of spread groove is equipped with independent connecting plate, just the miniature sucking disc of both sides fixedly connected with of independent connecting plate, the inside fixedly connected with fin of base plate, just the louvre has been seted up to the four walls.

Further, a wafer is bonded on top of the bonding pad.

Furthermore, an adsorption film matched with the sucking disc is fixedly connected to the inner wall of the connecting groove.

Further, the top of the substrate is fixedly connected with a packaging layer.

Further, the width of the independent connecting plate is twice the depth of the connecting groove.

Compared with the prior art, the beneficial effects of the utility model are that: this kind of semiconductor package structure, through setting up spread groove and independent connecting plate, can carry out free equipment between the single packaging structure, can satisfy the user demand of different products, through setting up through hole and miniature fixed buckle, can conclude and arrange the metal wire that welds the dress, fix its outside at the base plate through miniature fixed buckle for it is more convenient to weld, through setting up louvre and fin, can carry out effectual heat dissipation, increase of service life.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic view of the structure of part A of the present invention;

reference numbers in the figures: 1. a substrate; 2. mounting grooves; 3. a welding zone; 4. a through hole; 5. a miniature fixing buckle; 6. connecting grooves; 7. an independent connection plate; 8. a micro-sucker; 9. a heat sink; 10. heat dissipation holes; 11. a wafer; 12. adsorbing the film; 13. and (7) packaging the layer.

Detailed Description

The present invention will be further described with reference to the following embodiments, wherein the drawings are for illustrative purposes only and are not intended to be limiting, and in order to better illustrate the embodiments of the present invention, some components of the drawings may be omitted, enlarged or reduced and do not represent the size of an actual product.

Referring to fig. 1-3, the present invention provides a technical solution: a semiconductor packaging structure comprises a substrate 1 for mounting various working parts, wherein the top of the substrate 1 is provided with a mounting groove 2 for mounting a welding area 3, the top of the mounting groove 2 is fixedly connected with the welding area 3 for welding a wafer 11, the outer side of the welding area 3 is provided with a through hole 4 for passing a metal wire for welding, the through hole 4 is positioned on the four walls of the substrate 1, one side of the through hole 4 is provided with a micro fixing buckle 5 for fixing the metal wire, the micro fixing buckle 5 is fixedly connected with the outer side of the substrate 1, a connecting groove 6 is arranged below the micro fixing buckle 5 and is matched with an independent connecting plate 7 to complete the assembly of various packaging structures, the connecting groove 6 is embedded in the outer side of the substrate 1, the inside of the connecting groove 6 is provided with an independent connecting plate 7 which is matched with the connecting groove 6, the assembling among the packaging structures is completed, the two sides of the independent connecting plate 7 are fixedly connected with the miniature suckers 8 for fixing the independent connecting plate 7, the inside of the base plate 1 is fixedly connected with the radiating fins 9 for radiating, and the four walls of the base plate 1 are provided with radiating holes 10 for radiating.

More specifically, the top of the welding area 3 is welded with a wafer 11, which is a working part, the inner wall of the connecting groove 6 is fixedly connected with an adhesive sheet 12 matched with a suction cup for fixing the independent connecting plate 7, the top of the substrate 1 is fixedly connected with an encapsulation layer 13 for encapsulation, and the width of the independent connecting plate 7 is twice the depth of the connecting groove 6.

The utility model discloses improve in: when the semiconductor packaging structure is used, the single packaging structure is firstly assembled according to the specification of a product, in assembly, with the four opposing attachment slots 6 on the outside of the package, the individual attachment plate 7 is first placed in the first package in a suitable position, the micro-suction cup 8 and the adsorption film 12 are mutually adsorbed and fixed, then the proper connecting groove 6 in the second packaging structure is arranged in the independent connecting plate 7, the micro-sucking disc 8 and the adsorption film 12 are mutually adsorbed and fixed, the assembly is finished by the same way, the wafer 11 is welded after the assembly is finished, in the welding process, redundant metal wires penetrate through the four walls of the substrate 1 through the through holes 4 and are fixed on the outer side of the substrate 1 through the micro fixing buckles 5, the substrate is packaged by the packaging layer 13 after the fixing is completed, and the heat radiating fins 9 can radiate heat in the using process.

Although particular embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor package structure comprising a substrate (1), characterized in that: the top of the substrate (1) is provided with an installation groove (2), the top of the installation groove (2) is fixedly connected with a welding area (3), the outer side of the welding area (3) is provided with a through hole (4), the through holes (4) are positioned on the four walls of the substrate (1), one side of each through hole (4) is provided with a micro fixing buckle (5), the miniature fixing buckle (5) is fixedly connected with the outer side of the substrate (1), a connecting groove (6) is arranged below the miniature fixing buckle (5), the connecting grooves (6) are embedded in the outer side of the base plate (1), the inside of the connecting grooves (6) is provided with an independent connecting plate (7), and the two sides of the independent connecting plate (7) are fixedly connected with a miniature sucking disc (8), the heat dissipation device is characterized in that heat dissipation fins (9) are fixedly connected to the inside of the base plate (1), and heat dissipation holes (10) are formed in the four walls of the base plate (1).

2. The semiconductor package structure of claim 1, wherein: the top of the welding area (3) is welded with a wafer (11).

3. The semiconductor package structure of claim 1, wherein: and the inner wall of the connecting groove (6) is fixedly connected with an adsorption film (12) matched with the sucking disc.

4. The semiconductor package structure of claim 1, wherein: the top of the substrate (1) is fixedly connected with a packaging layer (13).

5. The semiconductor package structure of claim 1, wherein: the width of the independent connecting plate (7) is twice of the depth of the connecting groove (6).