CN213366583U - Special chip packaging structure of stack formula TSSOP type - Google Patents
Special chip packaging structure of stack formula TSSOP type Download PDFInfo
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- CN213366583U CN213366583U CN202022804010.4U CN202022804010U CN213366583U CN 213366583 U CN213366583 U CN 213366583U CN 202022804010 U CN202022804010 U CN 202022804010U CN 213366583 U CN213366583 U CN 213366583U
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Abstract
The utility model discloses a special chip package structure of stack formula TSSOP type, including the plastic envelope shell, the setting is in inboard base plate, silver thick liquid layer, lower floor's chip, insulating layer, heat conduction support, conducting strip, glue film, upper chip of plastic envelope shell, the heat that lower floor's chip work produced is transmitted for the base plate through silver thick liquid layer, the heat that upper chip work produced is transmitted for the heat conduction support through the glue film, the conducting strip is transmitted in some transmissions of heat conduction support, the heat transmission of another part is for the base plate, through such design, make lower floor's chip and upper chip be in the radiating position of relative independence, radiating effect and security performance are improved. The device simple structure through keeping apart the heat dissipation design, has improved radiating effect and security performance, realizes long-time reliable work.
Description
Technical Field
The utility model relates to a chip package structure especially relates to a special chip package structure of stack formula TSSOP type.
Background
The SOP packaging technology is an advanced microelectronic assembly and packaging technology, and uses plastic to package the chip and the substrate. With the increasing progress of science and technology, the SOP packaging technology derives a plurality of packaging forms, such as TSSOP type packaging technology, when traditional SOP chips are stacked, an upper chip is directly bonded on the top of a lower chip, and heat generated by the upper chip and the lower chip is too concentrated during working, so that the reliability of the stacked TSSOP type chip is reduced during use. In view of the above drawbacks, it is actually necessary to design a stacked TSSOP type special chip package structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a special chip packaging structure of stack formula TSSOP type, this special chip packaging structure of stack formula TSSOP type have improved radiating effect and security performance through keeping apart the heat dissipation design.
In order to solve the technical problem, the technical scheme of the utility model is that: a stacked chip packaging structure special for a TSSOP type comprises a plastic package shell, a substrate, a silver paste layer, a lower chip, an insulating layer, a heat conducting support, a heat conducting sheet, an adhesive layer and an upper chip, wherein the substrate, the silver paste layer, the lower chip, the insulating layer, the heat conducting support, the heat conducting sheet, the adhesive layer and the upper chip are arranged on the inner side of the plastic package shell, the substrate is arranged at the bottom of the inner side of the plastic package shell, the silver paste layer is arranged at the upper end of the substrate, the silver paste layer is connected with the substrate in an adhesive mode, the lower chip is arranged at the upper end of the silver paste layer, the lower chip is connected with the silver paste layer in an adhesive mode, the insulating layer is arranged at the top end of the lower chip in an adhesive mode, the heat conducting support is arranged at the upper end of the insulating layer and is arranged at the upper end of the substrate in an adhesive, the glue film and the heat conduction support bond and link to each other, the upper chip be located the glue film upper end, the upper chip bond with the glue film and link to each other with lower floor's chip electricity, the plastic envelope shell still be equipped with the pin, the pin be located the base plate outside and run through the plastic envelope shell, pin and lower floor's chip electricity link to each other.
The utility model discloses further improvement as follows:
furthermore, the heat conduction support is made of red copper.
Furthermore, the number of the heat conducting fins is 2, and the heat conducting fins are symmetrically arranged along the left and right directions of the heat conducting support.
Furthermore, the base plate still be equipped with first shock attenuation glue film, first shock attenuation glue film be located the base plate bottom, first shock attenuation glue film and base plate bonding link to each other.
Further, the insulating layer still be equipped with second shock-absorbing glue layer, second shock-absorbing glue layer be located between insulating layer and the lower floor chip, second shock-absorbing glue layer bond with insulating layer and lower floor chip respectively and link to each other, set up and can play the shock attenuation guard action to lower floor chip at the first shock-absorbing glue layer of base plate lower extreme and set up the second shock-absorbing glue layer in lower floor chip upper end, improve operational reliability and life.
Furthermore, the heat-conducting fin is also provided with a heat-radiating groove, the heat-radiating groove is positioned at the top of the heat-conducting fin, the heat-radiating groove does not penetrate through the main body of the heat-conducting fin, and the heat-radiating groove is used for increasing the heat-radiating area of the heat-conducting fin and improving the heat-radiating effect.
Compared with the prior art, this special chip packaging structure of stack TSSOP type, add heat conduction support and insulating layer between lower floor's chip and upper chip, on the one hand, the insulating effect has been improved, on the other hand keeps apart lower floor's chip and upper chip, the heat that lower floor's chip work produced transmits the base plate through silver thick liquid layer, the heat that upper chip work produced transmits the heat conduction support through the glue film, the heat is transmitted for the conducting strip to some of heat conduction support, the heat transmission of another part is for the base plate, through such design, make lower floor's chip and upper chip be in the radiating position of relative independence, radiating effect and security performance are improved, the pin is used for electrical connection. The device simple structure through keeping apart the heat dissipation design, has improved radiating effect and security performance, realizes long-time reliable work.
Drawings
FIG. 1 shows the structure of the present invention
In the figure: the plastic package casing 1, base plate 2, silver thick liquid layer 3, lower floor's chip 4, insulating layer 5, heat conduction support 6, conducting strip 7, glue film 8, upper chip 9, pin 10, first shock attenuation glue film 201, second shock attenuation glue film 501, radiating groove 701.
Detailed Description
As shown in fig. 1, a stacked TSSOP type chip package structure comprises a plastic package housing 1, a substrate 2, a silver paste layer 3, a lower chip 4, an insulating layer 5, a heat conducting support 6, a heat conducting fin 7, an adhesive layer 8 and an upper chip 9, wherein the substrate 2 is arranged at the inner side of the plastic package housing 1, the silver paste layer 3 is arranged at the inner bottom of the plastic package housing 1, the silver paste layer 3 is arranged at the upper end of the substrate 2, the silver paste layer 3 is connected with the substrate 2 in an adhesive manner, the lower chip 4 is arranged at the upper end of the silver paste layer 3, the lower chip 4 is connected with the silver paste layer 3 in an adhesive manner, the insulating layer 5 is arranged at the top end of the lower chip 4, the insulating layer 5 is connected with the lower chip 4 in an adhesive manner, the heat conducting support 6 is arranged at the upper end of the insulating layer 5 and at the upper end of the substrate 2, the heat conducting support 6 is connected with the insulating layer 5 in an adhesive manner and is connected, the heat conducting fins 7 are welded with the insulating support 6, the glue layer 8 is positioned at the upper end of the heat conducting support 6, the glue layer 8 is connected with the heat conducting support 6 in an adhering mode, the upper chip 9 is positioned at the upper end of the glue layer 8, the upper chip 9 is connected with the glue layer 8 in an adhering mode and is electrically connected with the lower chip 4, the plastic package shell 5 is further provided with pins 10, the pins 10 are positioned on the outer side of the base plate 2 and penetrate through the plastic package shell 1, the pins 10 are electrically connected with the lower chip 4, the heat conducting support 6 is made of red copper, the heat conducting coefficient of the red copper is high, rapid heat transfer is achieved, the number of the heat conducting fins 7 is 2, the heat conducting fins are symmetrically arranged along the left-right direction of the heat conducting support 6, the base plate 2 is further provided with a first damping glue layer 201, the first damping glue layer 201 is positioned at the bottom of the base plate 2, and the first damping glue layer 201, the insulating layer 5 is also provided with a second shock absorption glue layer 501, the second shock absorption glue layer 501 is positioned between the insulating layer 5 and the lower chip 4, the second shock absorption glue layer 501 is respectively connected with the insulating layer 5 and the lower chip 4 in an adhesive way, the first shock absorption glue layer 201 arranged at the lower end of the substrate 2 and the second shock absorption glue layer 501 arranged at the upper end of the lower chip 4 can play a shock absorption protection role on the lower chip 4, the working reliability and the service life are improved, the heat conducting sheet 7 is also provided with a heat radiating groove 701, the heat radiating groove 701 is positioned at the top of the heat conducting sheet 7, the heat radiating groove 701 does not penetrate through the main body of the heat conducting sheet 7, the heat radiating groove 701 is used for increasing the heat radiating area of the heat conducting sheet and improving the heat radiating effect, the heat conducting support 6 and the insulating layer 5 are additionally arranged between the lower chip 4 and the upper chip 9, on one hand, the insulating effect is, on the other hand keeps apart lower floor's chip 4 and upper chip 9, the heat that lower floor's chip 4 work produced transmits for base plate 2 through silver thick liquid layer 3, the heat that upper chip 9 work produced transmits for heat conduction support 6 through glue film 8, the heat of heat conduction support 6 is partly transmitted for conducting strip 7, the heat transmission of another part is for base plate 2, through such design, make lower floor's chip 4 and upper chip 9 be in the radiating position of relative independence, radiating effect and security performance are improved, pin 10 is used for electrical connection. The device simple structure through keeping apart the heat dissipation design, has improved radiating effect and security performance, realizes long-time reliable work.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without creative labor from the above conception, and all the changes fall within the protection scope of the present invention.
Claims (6)
1. A stacked chip packaging structure special for a TSSOP type is characterized by comprising a plastic package shell, a substrate, a silver paste layer, a lower chip layer, an insulating layer, a heat conducting support, a heat conducting fin, an adhesive layer and an upper chip layer, wherein the substrate, the silver paste layer, the lower chip layer, the insulating layer, the heat conducting support, the heat conducting fin, the adhesive layer and the upper chip layer are arranged on the inner side of the plastic package shell, the substrate is arranged at the bottom of the inner side of the plastic package shell, the silver paste layer is arranged at the upper end of the substrate, the silver paste layer is connected with the substrate in an adhesive mode, the lower chip layer is arranged at the upper end of the silver paste layer in an adhesive mode, the insulating layer is arranged at the top end of the lower chip layer in an adhesive mode, the heat conducting support is arranged at the upper end of the insulating layer and is arranged at the upper end of the substrate, the glue film be located heat conduction support upper end, glue film and heat conduction support bond and link to each other, upper chip be located the glue film upper end, upper chip and glue film bond and link to each other with lower floor's chip electricity, the plastic envelope shell still be equipped with the pin, the pin be located the base plate outside and run through the plastic envelope shell, pin and lower floor's chip electricity link to each other.
2. The stacked TSSOP type special chip package structure of claim 1, wherein the heat conducting support is made of red copper.
3. The stacked TSSOP type application specific chip package structure of claim 2, wherein the number of the thermal conductive sheets is 2, and the thermal conductive sheets are symmetrically arranged along the left and right direction of the thermal conductive support.
4. The stacked TSSOP type special chip package structure of claim 1, wherein the substrate is further provided with a first shock absorbing glue layer, the first shock absorbing glue layer is located at the bottom of the substrate, and the first shock absorbing glue layer is bonded to the substrate.
5. The stacked TSSOP type special chip package structure of claim 1, wherein the insulating layer is further provided with a second shock absorbing adhesive layer, the second shock absorbing adhesive layer is located between the insulating layer and the lower chip, and the second shock absorbing adhesive layer is respectively connected to the insulating layer and the lower chip in an adhesive manner.
6. The stacked TSSOP specific chip package structure of claim 1, wherein the heat spreader further comprises a heat sink, the heat sink is disposed on top of the heat spreader, and the heat sink does not penetrate through the body of the heat spreader.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022804010.4U CN213366583U (en) | 2020-11-29 | 2020-11-29 | Special chip packaging structure of stack formula TSSOP type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022804010.4U CN213366583U (en) | 2020-11-29 | 2020-11-29 | Special chip packaging structure of stack formula TSSOP type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213366583U true CN213366583U (en) | 2021-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022804010.4U Active CN213366583U (en) | 2020-11-29 | 2020-11-29 | Special chip packaging structure of stack formula TSSOP type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213366583U (en) |
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2020
- 2020-11-29 CN CN202022804010.4U patent/CN213366583U/en active Active
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Denomination of utility model: A superimposed TSSOP type special chip package structure Effective date of registration: 20220916 Granted publication date: 20210604 Pledgee: China Co. truction Bank Corp Chizhou branch Pledgor: Chizhou Huayu Electronic Technology Co.,Ltd. Registration number: Y2022980015312 |