CN218160342U - Fire-resistant heat dissipation type paster diode - Google Patents
Fire-resistant heat dissipation type paster diode Download PDFInfo
- Publication number
- CN218160342U CN218160342U CN202121817977.4U CN202121817977U CN218160342U CN 218160342 U CN218160342 U CN 218160342U CN 202121817977 U CN202121817977 U CN 202121817977U CN 218160342 U CN218160342 U CN 218160342U
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- CN
- China
- Prior art keywords
- heat dissipation
- fire
- packaging body
- diode
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 27
- 230000009970 fire resistant effect Effects 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 239000004593 Epoxy Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a fire-resistant heat dissipation type paster diode, include the epoxy packaging body, be located inside diode chip, the fixing of epoxy packaging body the negative pole leg, the positive pole leg of epoxy packaging body bottom, diode chip lower extreme with be connected with first electrically conductive heat dissipation glue between the negative pole leg, epoxy packaging body inboard still is equipped with the metal conducting strip, the metal conducting strip with be connected with the second conducting resin between the diode chip, the metal conducting strip with be connected with the third conducting resin between the positive pole leg, the epoxy packaging body outside still covers has fire-resistant glue layer, anti-oxidation rete upper end still is equipped with the aluminum plate fin. The utility model discloses a patch diode has excellent fire resistance and heat dispersion.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to fire-resistant heat dissipation type paster diode.
Background
The diode is also called as a crystal diode and is called as a diode for short. Among electronic components, a device having two electrodes allows current to flow only in a single direction, and many applications use the rectifying function thereof. The most common function of a diode is to allow current to pass in only one direction, known as forward bias, and to block in the reverse direction, known as reverse bias. Thus, the diode can be thought of as an electronic version of the check valve. In the semiconductor silicon or germanium, a part of the region is doped with a trace of trivalent element boron to form a P type semiconductor, and the other part of the region is doped with a trace of pentavalent element phosphorus to form an N type semiconductor. A PN junction is formed at the junction of the P-type and N-type semiconductors. A PN junction is a diode, a lead wire of a P area is called an anode, and a lead wire of an N area is called a cathode. The problems of poor fire resistance and insufficient heat dissipation performance of the patch diode in the prior art generally exist.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a fire-resistant heat dissipation type paster diode has excellent fire resistance and heat dispersion.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a fire-resistant heat dissipation type paster diode, includes the epoxy packaging body, is located the inside diode chip of epoxy packaging body, fixes negative pole leg, the positive pole leg in epoxy packaging body bottom, diode chip lower extreme with be connected with first electrically conductive heat dissipation glue between the negative pole leg, epoxy packaging body inboard still is equipped with the metal conducting strip, the metal conducting strip with be connected with the second electrically conductive glue between the diode chip, the metal conducting strip with be connected with the third electrically conductive glue between the positive pole leg, epoxy packaging body outside still covers has fire-resistant glue layer, anti-oxidation rete upper end still is equipped with the aluminum plate fin.
Specifically, a plurality of strip-shaped radiating grooves are formed in the aluminum plate radiating fins.
Specifically, a groove is formed in the cathode leg, and the first conductive heat dissipation adhesive is located on the inner side of the groove.
Specifically, the upper end face of the cathode leg extending to the outer side of the epoxy resin packaging body is provided with a first waterproof film layer.
Specifically, a second waterproof film layer is arranged on the upper end face of the anode leg extending to the outer side of the epoxy resin packaging body.
The utility model has the advantages that:
1. the utility model discloses a SMD diode, increased the fire-resistant glue film outside epoxy encapsulation body, promoted the fire resistance of SMD diode;
2. the chip-mounted diode is characterized in that a first conductive heat dissipation adhesive is connected between the lower end of the diode chip and the cathode welding leg, a second conductive adhesive is connected between the metal conducting strip and the diode chip, a third conductive adhesive is connected between the metal conducting strip and the anode welding leg, an aluminum plate radiating fin is further arranged at the upper end of the anti-oxidation film layer, and a plurality of strip-shaped radiating grooves are formed in the aluminum plate radiating fin, so that the chip-mounted diode has good heat dissipation performance.
Drawings
Fig. 1 is a schematic structural view of a fire-resistant heat dissipation type patch diode of the present invention.
The reference signs are: the LED chip comprises an epoxy resin packaging body 1, a diode chip 2, a cathode welding leg 3, an anode welding leg 4, a first conductive heat dissipation glue 5, a metal conducting strip 6, a second conductive glue 7, a third conductive glue 8, a fireproof glue layer 9, an anti-oxidation film layer 10, an aluminum plate radiating fin 11, a strip-shaped radiating groove 12, a groove 13, a first waterproof film layer 14 and a second waterproof film layer 15.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1:
the utility model provides a fire-resistant heat dissipation type paster diode, including epoxy packaging body 1, be located the inside diode chip 2 of epoxy packaging body 1, fix the cathode weld leg 3 in epoxy packaging body 1 bottom, anode weld leg 4, be connected with first electrically conductive heat dissipation glue 5 between 2 lower extremes of diode chip and the cathode weld leg 3, epoxy packaging body 1 inboard still is equipped with metal conducting strip 6, be connected with second electrically conductive glue 7 between metal conducting strip 6 and the diode chip 2, be connected with third electrically conductive glue 8 between metal conducting strip 6 and the anode weld leg 4, epoxy packaging body 1 outside has still covered fire-resistant glue film layer 9, anti-oxidation rete 10, fire-resistant glue film 9 is high temperature resistant fire-proof glue, be an excellent fire-proof material, can carry out high temperature resistant fire protection to epoxy packaging body 1, anti-oxidation rete 10 upper end still is equipped with aluminum plate fin 11, aluminum plate fin 11 is good heat conduction material, can derive the heat in the epoxy packaging body 1 fast, thereby promote paster diode's heat dispersion.
Preferably, in order to further improve the heat dissipation performance of the surface mount diode, the aluminum plate heat sink 11 is provided with a plurality of strip-shaped heat dissipation grooves 12.
Preferably, the cathode leg 3 is provided with a groove 13, and the first conductive heat dissipation paste 5 is located inside the groove 13.
Preferably, in order to improve the waterproof capability of the cathode fillet 3, the upper end surface of the cathode fillet 3 extending to the outside of the epoxy resin package 1 is provided with a first waterproof film layer 14.
Preferably, in order to improve the waterproof capability of the anodic bonding pad 4, the upper end surface of the anodic bonding pad 4 extending to the outside of the epoxy resin package 1 is provided with a second waterproof film layer 15.
The above embodiments only express 1 implementation manner of the present invention, and the description thereof is more specific and detailed, but not to be understood as the limitation of the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides a fire-resistant heat dissipation type paster diode, its characterized in that includes epoxy packaging body (1), is located diode chip (2) inside epoxy packaging body (1), fixes negative pole leg (3), positive pole leg (4) of epoxy packaging body (1) bottom, diode chip (2) lower extreme with be connected with first electrically conductive heat dissipation glue (5) between negative pole leg (3), epoxy packaging body (1) inboard still is equipped with metal conducting strip (6), metal conducting strip (6) with be connected with second electrically conductive glue (7) between diode chip (2), metal conducting strip (6) with be connected with third electrically conductive glue (8) between positive pole leg (4), epoxy packaging body (1) outside still covers has fire-resistant glue layer (9), anti-oxidation rete (10) upper end still is equipped with aluminum plate fin (11).
2. The fire-resistant heat dissipation type patch diode according to claim 1, wherein the aluminum plate heat sink (11) is provided with a plurality of strip-shaped heat dissipation grooves (12).
3. The fire-resistant heat dissipation type chip diode according to claim 1, wherein a groove (13) is formed in the cathode leg (3), and the first conductive heat dissipation adhesive (5) is located inside the groove (13).
4. The fire-resistant heat dissipation type chip diode according to claim 1, wherein the upper end surface of the cathode leg (3) extending to the outside of the epoxy resin package (1) is provided with a first waterproof film layer (14).
5. The fire-resistant heat dissipation type chip diode according to claim 1, wherein the upper end surface of the anode leg (4) extending to the outside of the epoxy resin package (1) is provided with a second waterproof film layer (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121817977.4U CN218160342U (en) | 2021-08-05 | 2021-08-05 | Fire-resistant heat dissipation type paster diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121817977.4U CN218160342U (en) | 2021-08-05 | 2021-08-05 | Fire-resistant heat dissipation type paster diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218160342U true CN218160342U (en) | 2022-12-27 |
Family
ID=84547878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121817977.4U Active CN218160342U (en) | 2021-08-05 | 2021-08-05 | Fire-resistant heat dissipation type paster diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218160342U (en) |
-
2021
- 2021-08-05 CN CN202121817977.4U patent/CN218160342U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231103 Address after: 523430 Building 1 and 2, No. 70, Liaobu Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee after: Xianzhike semiconductor technology (Dongguan) Co.,Ltd. Address before: 523430 Room 102, building 1, 76 Baiye Road, Liaobu Town, Dongguan City, Guangdong Province Patentee before: Mutual Creation (Dongguan) Electronic Technology Co.,Ltd. |