CN210743930U - Novel fast recovery diode - Google Patents
Novel fast recovery diode Download PDFInfo
- Publication number
- CN210743930U CN210743930U CN201922092859.0U CN201922092859U CN210743930U CN 210743930 U CN210743930 U CN 210743930U CN 201922092859 U CN201922092859 U CN 201922092859U CN 210743930 U CN210743930 U CN 210743930U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- protective strip
- piece
- diode
- fast recovery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel restore diode fast, including the encapsulation piece, the inboard of encapsulation piece is provided with the chip, and the surface connection of chip has the welding piece, and the side symmetry of encapsulation piece is provided with the protective strip, and the inboard of protective strip is pegged graft and is had the welding piece. According to the novel fast recovery diode, the joint of the welding piece and the packaging block is protected through the protective strip, when the welding piece is bent, the buffer cushion between the welding piece and the protective strip during bending is relieved through the buffer cushion in the mounting groove, and the protective strip can be cut off through scissors after the welding piece on the outer side of the protective strip is broken, so that the welding piece on the inner side of the protective strip is exposed for continuous use; the heat generated by the diode is absorbed by the heat dissipation frame, and the absorbed heat is dissipated by the heat dissipation holes and the heat dissipation fins.
Description
Technical Field
The utility model relates to a diode technical field specifically is a novel fast recovery diode.
Background
The fast recovery diode (FRD for short) is a semiconductor diode with good switching characteristic and short reverse recovery time, and is mainly applied to electronic circuits such as a switching power supply, a PWM (pulse width modulation) and a frequency converter, and used as a high-frequency rectifier diode, a freewheeling diode or a damping diode. The internal structure of the fast recovery diode is different from that of a common PN junction diode, and the fast recovery diode belongs to a PIN junction diode, namely, a base region I is added between a P-type silicon material and an N-type silicon material to form a PIN silicon chip. Because the base region is very thin and the reverse recovery charge is very small, the reverse recovery time of the fast recovery diode is short, the forward voltage drop is low, and the reverse breakdown voltage (withstand voltage) is high.
The welding sheet is bent and easily broken from the root of the diode in the use process of the existing diode, so that the use of the diode is influenced, and the diode is lack of a corresponding heat dissipation structure in use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel fast recovery diode to solve the problem of easy rupture when welding the piece is crooked.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel fast recovery diode, includes the encapsulation piece, the inboard of encapsulation piece is provided with the chip, the surface connection of chip has the welding piece, the side symmetry of encapsulation piece is provided with the protecting strip, it has the welding piece to peg graft in the inboard of protecting strip.
Preferably, the one end of protection strip is provided with the mounting groove, and the inboard of mounting groove is provided with the blotter, and the inboard of blotter is pegged graft and is had the welding piece.
Preferably, the inner side of the packaging block is provided with a heat dissipation frame, the lower end of the heat dissipation frame is abutted to the lower surface of the packaging block, and the surface of the heat dissipation frame is provided with heat dissipation holes.
Preferably, the lower end of the heat dissipation frame is bonded with a heat dissipation sheet.
Compared with the prior art, the beneficial effects of the utility model are that: the novel fast recovery diode comprises a protection strip, wherein a joint of a welding sheet and a packaging block is protected through the protection strip, when the welding sheet is bent, the buffer cushion is relieved through a buffer cushion in a mounting groove when the welding sheet is bent and the protection strip is bent due to hard contact between the welding sheet and the protection strip, and the protection strip can be cut off through scissors after the welding sheet on the outer side of the protection strip is broken, so that the welding sheet on the inner side of the protection strip is exposed for continuous use; and secondly, absorbing the heat generated by the diode through the heat dissipation frame and dissipating the absorbed heat through the heat dissipation holes and the heat dissipation fins.
Drawings
FIG. 1 is a sectional view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall structure of the present invention;
fig. 3 is a schematic view of the heat dissipation frame of the present invention.
In the figure: 1 encapsulation piece, 2 chips, 3 welding pieces, 4 protective strips, 5 mounting grooves, 6 buffer pads, 7 radiating fins, 8 radiating frames and 9 radiating holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1 and 2, a novel fast recovery diode, including the encapsulation piece 1, the inboard of encapsulation piece 1 is provided with chip 2, the surface of chip 2 is connected with soldering lug 3, the side symmetry of encapsulation piece 1 is provided with protective strip 4, encapsulation piece 1 sets up with protective strip 4 an organic whole, the inboard of protective strip 4 is pegged graft and is had soldering lug 3, protect soldering lug 3 through protective strip 4, when the soldering lug 3 rupture in the protective strip 4 outside simultaneously, can cut off protective strip 4 on the surface of soldering lug 3 and make soldering lug 3 continue to use.
Referring to fig. 1, one end of the protection strip 4 is provided with a mounting groove 5, a buffer pad 6 is arranged on the inner side of the mounting groove 5, a welding sheet 3 is inserted into the inner side of the buffer pad 6, and when the welding sheet 3 is bent along one end of the protection strip 4, the hard contact between the bent welding sheet 3 and the protection strip 4 can be reduced through the buffer pad 6, and the buffer pad 6 can buffer the bent welding sheet.
Referring to fig. 1, 2 and 3, a heat dissipation frame 8 is disposed inside the package block 1, the heat dissipation frame 8 is made of copper, and can rapidly transfer and dissipate heat, a lower end of the heat dissipation frame 8 abuts against a lower surface of the package block 1, and heat dissipation holes 9 are disposed on a surface of the heat dissipation frame 8, so that heat dissipation efficiency is improved through the heat dissipation holes 9.
Referring to fig. 2, the lower end of the heat dissipation frame 8 is bonded with a heat dissipation plate 7, and the heat dissipation plate 7 is made of ceramic material, so that the heat dissipation plate can quickly dissipate absorbed heat while being insulated.
The utility model discloses when concrete implementation: because the surface of the connecting part of the welding sheet 3 and the packaging block 1 is connected with the protective strip 4, the joint of the welding sheet 3 and the packaging block 1 is protected by the protective strip 4 to prevent the welding sheet 3 from being broken from the root of the packaging block 1 when the welding sheet 3 is bent, and when the welding sheet 3 is bent, because the inner side of the mounting groove 5 at one end of the protective strip 4 is provided with the buffer cushion 6 and the inner side of the buffer cushion 6 is inserted with the welding sheet 3, the buffer cushion 6 in the mounting groove 5 can reduce the hard contact between the welding sheet 3 and the protective strip 4 when the welding sheet 3 is bent to buffer the welding sheet 3 when the welding sheet 3 is bent, and after the welding sheet 3 at the outer side of the protective strip 4 is broken, the protective strip 4 on the surface of the welding sheet 3 can be cut off by scissors, so that the; because the heat dissipation frame 8 sets up in the inside of encapsulation piece 1, the upper surface and the lower surface of heat dissipation frame 8 are located the upper and lower end of chip 2, consequently can absorb the heat that chip 2 produced through heat dissipation frame 8, because the surface of heat dissipation frame 8 is provided with louvre 9 again, the lower extreme of heat dissipation frame 8 is connected with fin 7, consequently heat dissipation frame 8 absorbs the heat that chip 2 produced and can give off the heat that absorbs through louvre 9 and fin 7.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A novel fast recovery diode, including encapsulation piece (1), its characterized in that: the chip packaging structure is characterized in that a chip (2) is arranged on the inner side of the packaging block (1), welding sheets (3) are connected to the surface of the chip (2), protective strips (4) are symmetrically arranged on the side faces of the packaging block (1), and the welding sheets (3) are inserted into the inner side of the protective strips (4).
2. A novel fast recovery diode according to claim 1, characterized in that: one end of the protective strip (4) is provided with a mounting groove (5), the inner side of the mounting groove (5) is provided with a cushion pad (6), and the inner side of the cushion pad (6) is spliced with a welding sheet (3).
3. A novel fast recovery diode according to claim 1, characterized in that: the inner side of the packaging block (1) is provided with a heat dissipation frame (8), the lower end of the heat dissipation frame (8) is abutted to the lower surface of the packaging block (1), and the surface of the heat dissipation frame (8) is provided with heat dissipation holes (9).
4. A novel fast recovery diode as claimed in claim 3, wherein: and the lower end of the heat dissipation frame (8) is bonded with a heat dissipation sheet (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922092859.0U CN210743930U (en) | 2019-11-28 | 2019-11-28 | Novel fast recovery diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922092859.0U CN210743930U (en) | 2019-11-28 | 2019-11-28 | Novel fast recovery diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210743930U true CN210743930U (en) | 2020-06-12 |
Family
ID=71007558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922092859.0U Active CN210743930U (en) | 2019-11-28 | 2019-11-28 | Novel fast recovery diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210743930U (en) |
-
2019
- 2019-11-28 CN CN201922092859.0U patent/CN210743930U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106252320B (en) | Semiconductor device with a plurality of semiconductor chips | |
| JP5538653B2 (en) | Heat sink and semiconductor device including the heat sink | |
| WO2009076810A1 (en) | Semiconductor power module and heat radiating method thereof | |
| CN110707057B (en) | Packaging structure of SiC power device | |
| JP2008244394A (en) | Semiconductor device | |
| CN102446877A (en) | Semiconductor heat dissipation device | |
| WO2024178963A1 (en) | Power device and power module | |
| CN218769495U (en) | Packaging structure for improving reliability of SiC chip | |
| CN210743930U (en) | Novel fast recovery diode | |
| CN113937009A (en) | Packaging method of surface-mounted double-sided heat dissipation semiconductor power device | |
| CN217334062U (en) | Gallium nitride device convenient to high-efficient heat dissipation reverse conduction | |
| CN216054669U (en) | Gallium nitride power device convenient to heat dissipation | |
| CN213583756U (en) | Electronic chip packaging structure | |
| CN212230427U (en) | Fixed point cooling SiC mixed power module | |
| CN106876348A (en) | Chip-packaging structure and its manufacture method | |
| CN221805513U (en) | High-power device | |
| CN220963325U (en) | TVS overvoltage protection device | |
| CN111404133A (en) | Special protection circuit in silicon carbide diode chip | |
| CN212303652U (en) | Flip chip package structure | |
| CN211480022U (en) | Encapsulated inner protection silicon carbide diode | |
| CN104966713A (en) | Novel packaging structure for IGBT module | |
| CN220829954U (en) | Inverter fast recovery diode | |
| CN216133855U (en) | Compact structure's carborundum schottky diode | |
| CN211607193U (en) | Controller with heat dissipation power | |
| CN218385266U (en) | Diode packaging structure with uniform light emission |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |