CN221805513U

CN221805513U - High-power device

Info

Publication number: CN221805513U
Application number: CN202420335649.8U
Authority: CN
Inventors: 张海龙; 孙家兴
Original assignee: Chizhou Yunsama Semiconductor Materials Co ltd
Current assignee: Chizhou Yunsama Semiconductor Materials Co ltd
Priority date: 2024-02-22
Filing date: 2024-02-22
Publication date: 2024-10-01
Anticipated expiration: 2034-02-22

Abstract

The utility model provides a high-power device, which is applied in the field of heat dissipation technology of high-power devices. The main points of the technical solution are: comprising a packaging body, a heat dissipation carrier embedded in one side of the packaging body; a heat sink embedded in the other side of the packaging body, the heat sink and the heat sink carrier being arranged opposite to each other; a chip structure arranged on the heat sink carrier, the chip structure being located between the heat sink carrier and the heat sink; the technical effect is: through secondary packaging, the original single-sided heat dissipation is changed to double-sided heat dissipation, which greatly improves the heat dissipation efficiency, thereby increasing the service life of the power device and improving the reliability of the power device.

Description

High-power device

Technical Field

The utility model relates to the technical field of heat dissipation of high-power devices, in particular to a high-power device.

Background

Packaging is mainly completed in the subsequent engineering of semiconductor manufacture; the method comprises the steps of arranging, fixing and connecting the semiconductor components and other components on a frame or a substrate by using a film technology and a micro-connection technology, leading out wiring terminals, and embedding and fixing the wiring terminals through a plastic insulating medium to form an integral main body structure;

At present, the high-power devices are mostly packaged in a semi-packaging mode, however, the high-power devices generate more heat during working, and the packaging mode only radiates heat on one side, so that the high-power devices are low in radiating speed and easy to age at high temperature, and the service life of the high-power devices is influenced.

Disclosure of utility model

The utility model aims to provide a high-power device, which has the advantages of greatly improving the heat dissipation efficiency of the high-power device, prolonging the service life of the high-power device and improving the reliability of the high-power device.

To achieve the above and other related objects, the present utility model provides the following technical solutions:

A high-power device comprises a package body,

A heat dissipation carrier embedded on one surface of the package body;

the radiating fin is embedded into the other surface of the packaging body, and the radiating fin and the radiating slide are arranged oppositely;

and the chip structure is arranged on the heat dissipation slide and is positioned between the heat dissipation slide and the heat dissipation fin.

Through the technical scheme, the heat dissipation slide plays a role in heat dissipation when bearing the chip structure, and double-sided heat dissipation is realized through the heat dissipation slide and the heat dissipation fins, so that the heat dissipation efficiency is greatly improved, and the service life of the power device is prolonged.

In an embodiment of the utility model, the heat dissipation carrier is embedded with a plurality of packaging columns, and the heat dissipation sheet is adhered to the tops of the plurality of packaging columns.

Through the technical scheme, the packaging column body is used for supporting the radiating fin, so that the radiating fin and the radiating slide are arranged oppositely, double-sided radiation is realized, and the radiating efficiency is improved.

In an embodiment of the utility model, the package body includes a filling portion filled between the heat sink and the heat sink, and a wrapping portion wrapping the package body and the heat sink.

Through the technical scheme, the sealing and protecting functions of the chip are achieved.

In an embodiment of the utility model, the heat dissipation carrier is embedded at the bottom of the package, and the heat dissipation fin is embedded at the top of the package;

the bottom of the heat dissipation slide is level with the bottom of the wrapping part;

The top of the radiating fin is flush with the top of the wrapping part.

Through above-mentioned technical scheme, the wholeness is strong and quickens the radiating efficiency of chip.

In an embodiment of the utility model, a connecting groove connected with the packaging column body is arranged at the upper part of the heat dissipation slide;

the lateral part of the heat dissipation slide glass is provided with a bonding groove connected with the wrapping part.

Through the technical scheme, the connecting groove is used for enhancing the connection strength of the heat dissipation slide and the packaging column body; the bonding groove is used for enhancing the connection strength of the heat dissipation slide and the wrapping part.

In an embodiment of the utility model, the bonding groove is a dovetail groove.

Through the technical scheme, the dovetail groove is used for increasing the binding force between the packaging body and the heat dissipation carrier plate, so that the packaging body and the heat dissipation carrier plate are connected more firmly.

In an embodiment of the utility model, the chip structure includes a chip fixed on a heat dissipation carrier, a metal wire with one end connected with the chip, and a lead frame connected with the other end of the metal wire;

The chip and the metal wires are wrapped in the packaging body, and the lead frame is partially embedded in the wrapping part.

Through the technical scheme, the chip is connected with the metal wire, the metal wire is connected with the lead frame, and the electric connection between the lead-out end of the internal circuit of the chip and the outer lead is realized, so that an electric loop is formed.

In an embodiment of the utility model, the heat sink is a ceramic plate.

Through the technical scheme, the ceramic plate has excellent heat conduction performance, and can meet the heat dissipation requirement of a high-power device.

As described above, the high-power device has the following beneficial effects:

Through the secondary packaging, original single-sided heat dissipation is changed into double-sided heat dissipation, and the heat dissipation efficiency is greatly improved, so that the service life of the power device is prolonged, and the reliability of the power device is improved.

Drawings

FIG. 1 is a cross-sectional view of the overall structure of an embodiment of the present utility model;

fig. 2 is a top view of the overall structure of an embodiment of the present utility model.

Reference numerals: 1. a package; 101. a filling part; 102. a wrapping portion; 4. a heat-dissipating slide; 5. a heat sink; 6. a chip structure; 7. packaging the column body; 8. a connecting groove; 9. a bonding groove; 61. a chip; 62. a wire; 63. a lead frame; 13. and a mounting groove.

Detailed Description

Further advantages and effects of the present utility model will become apparent to those skilled in the art from the disclosure of the present utility model, which is described by the following specific examples.

Please refer to fig. 1-2. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.

Referring to fig. 1 and 2, the present utility model provides a high-power device, which includes a heat dissipation carrier 4, a chip structure 6 and a heat sink 5;

The radiating fins 5 are arranged opposite to the radiating slide 4; the chip structure 6 is positioned between the heat dissipation slide 4 and the heat dissipation sheet 5; the heat dissipation slide 4 is of a rectangular structure, connecting grooves 8 are respectively formed in the upper part of the heat dissipation slide 4 near four right-angle positions, packaging columns 7 are respectively embedded in the four connecting grooves 8 through primary packaging, and mounting grooves 13 are respectively formed in the tops of the four packaging main bodies; the radiating fin 5 is of a rectangular structure, four right angles of the radiating fin 5 are respectively positioned in the four mounting grooves 13, and the radiating fin 5 is adhered to the packaging column 7; the heat dissipation plate 5 in the embodiment is a ceramic plate, and the ceramic plate has excellent heat conduction performance and can meet the heat dissipation requirement of a high-power device.

Referring to fig. 1 and 2, a package body 1 is formed by a second package; the package 1 includes a filling portion 101 filled between the heat sink 5 and the heat sink 4, and a wrapping portion 102 wrapping the package cylinder 7 and the wrapping portion of the heat sink 4 and the heat sink 5; the heat dissipation slide 4 is embedded at the bottom of the package body 1, and the heat dissipation fin 5 is embedded at the top of the package body 1; the bottom of the heat dissipation slide 4 is flush with the bottom of the wrapping part 102, and the top of the heat dissipation fin 5 is flush with the top of the wrapping part 102; the two side parts of the heat dissipation slide 4 are provided with bonding grooves 9, and the bonding grooves 9 are used for enhancing the connection strength of the heat dissipation slide 4 and the wrapping part 102; the bonding groove 9 in this embodiment may be a dovetail groove, where the dovetail groove is used to increase the bonding force between the package 1 and the heat dissipation carrier, so that the connection between the package 1 and the heat dissipation carrier is more firm.

Referring to fig. 1 and 2, the chip structure 6 includes a chip 61, a plurality of wires 62 and a plurality of lead frames 63, and the chip 61 is adhered to the upper portion of the heat dissipation carrier 4; a plurality of metal wires 62 are respectively welded at positions close to two sides of the upper part of the chip 61, and a plurality of lead frames 63 are respectively welded at the other ends of the metal wires 62; wherein the chip 61 and the wire 62 are both wrapped in the package 1, the lead frame 63 is partially wrapped in the wrapping portion 102, and the other portion is exposed outside the wrapping portion 102.

The use process is briefly described: the heat dissipation carrier 4 is arranged on a first forming die, molten plastic insulating medium is filled in the first forming die, and the molten plastic insulating medium is cooled and formed to form a packaging column 7 embedded on the heat dissipation carrier 4; the chip structure 6 is stuck on the heat dissipation slide 4, and then the heat dissipation sheet 5 is stuck on the top of the packaging column 7; however, the whole plastic insulating medium is arranged in a second forming die, molten plastic insulating medium is filled in the second forming die, and the molten plastic insulating medium is cooled and formed to form the high-power device with good heat dissipation function.

In summary, the utility model changes the original single-sided heat dissipation into double-sided heat dissipation through the secondary packaging, thereby greatly improving the heat dissipation efficiency, prolonging the service life of the power device and improving the reliability of the power device. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A high power device, characterized by: comprises a packaging body (1),

A heat dissipation carrier sheet (4) embedded on one surface of the packaging body (1);

A radiating fin (5) embedded on the other surface of the packaging body (1), wherein the radiating fin (5) is arranged opposite to the radiating slide (4);

And the chip structure (6) is arranged on the heat dissipation slide (4), and the chip structure (6) is positioned between the heat dissipation slide (4) and the heat dissipation sheet (5).

2. A high power device according to claim 1, wherein: the heat dissipation slide (4) is embedded with a plurality of encapsulation columns (7), and the heat dissipation sheet (5) is adhered to the tops of the encapsulation columns (7).

3. A high power device according to claim 2, wherein: the package body (1) comprises a filling part (101) filled between the radiating fin (5) and the radiating slide (4) and a wrapping part (102) wrapping the packaging column (7) and the part of the radiating slide (4) and the radiating fin (5).

4. A high power device according to claim 3, wherein: the heat dissipation slide (4) is embedded at the bottom of the packaging body (1), and the heat dissipation sheet (5) is embedded at the top of the packaging body (1);

the bottom of the heat dissipation slide glass (4) is flush with the bottom of the wrapping part (102);

the top of the radiating fin (5) is flush with the top of the wrapping part (102).

5. A high power device according to claim 3, wherein: a connecting groove (8) connected with the packaging column body (7) is formed in the upper part of the heat dissipation slide glass (4);

The side part of the heat dissipation slide glass (4) is provided with a bonding groove (9) connected with the wrapping part (102).

6. The high power device of claim 5, wherein: the bonding groove (9) is a dovetail groove.

7. A high power device according to claim 3, wherein: the chip structure (6) comprises a chip (61) fixed on the heat dissipation slide glass (4), a metal wire (62) with one end connected with the chip (61) and a lead frame (63) connected with the other end of the metal wire (62);

The chip (61) and the metal wire (62) are both wrapped in the package body (1), and the lead frame (63) is partially embedded in the wrapping part (102).

8. A high power device according to claim 1, wherein: the radiating fin (5) is a ceramic plate.