CN214043626U - Fixing part for chip packaging - Google Patents
Fixing part for chip packaging Download PDFInfo
- Publication number
- CN214043626U CN214043626U CN202022963506.6U CN202022963506U CN214043626U CN 214043626 U CN214043626 U CN 214043626U CN 202022963506 U CN202022963506 U CN 202022963506U CN 214043626 U CN214043626 U CN 214043626U
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- chip
- packaging shell
- packaging
- heat dissipation
- shell
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Abstract
The utility model relates to a chip package technical field especially relates to a mounting is used in chip package. The method comprises the following steps: the packaging structure comprises a packaging shell provided with a chip, a side baffle, a connecting fixed rod, a heat dissipation device and pins; the packaging shell is a hollow cubic shell with openings symmetrically arranged on two side surfaces; the upper surface of the packaging shell is provided with a heat dissipation device for absorbing the heat of the chip, and the lower surface is provided with a heat dissipation hole; a plurality of connecting fixing rods are symmetrically and fixedly arranged on the front surface and the rear surface of the packaging shell, one end of each connecting fixing rod is fixedly connected with the packaging shell, and the other end of each connecting fixing rod is provided with a pin which is connected with the chip; each corner of the side baffle is provided with a card installing mechanism, the packaging shell is provided with a slot corresponding to each card installing mechanism, one end of each slot is provided with a card hole, the side baffle is connected with the card holes in a clamping mode through the card installing mechanisms, and the side baffle is matched with openings on two sides of the packaging shell. The utility model provides a current chip plastic envelope shell structure comparatively fixed, be difficult to dismantle inner structure, cause to overhaul inconvenient problem.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to a mounting is used in chip package.
Background
The package form refers to a housing for mounting a semiconductor integrated circuit chip. It not only plays the role of installing, fixing, sealing and protecting the chip, but also connects with other devices through the wires connected to the printed circuit board by the connection points on the chip, thus realizing the connection of the internal chip and the external circuit. On one hand, the chip can be isolated from the outside, and the electric performance reduction caused by the corrosion of the impurities in the air to the chip circuit is prevented; on the other hand, the packaged chip is more convenient to mount and transport.
The existing chip plastic package shell structure is relatively fixed, so that the inner structure is difficult to disassemble, and the problem of inconvenient overhaul is caused. Therefore, it is necessary to provide a fixing member for chip packaging to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model provides a mounting for chip package has solved current chip plastic envelope shell structure comparatively fixed, leads to being difficult to dismantle inner structure, has caused the inconvenient problem of maintenance.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is: a die attach fixture, comprising: the packaging structure comprises a packaging shell provided with a chip, a side baffle, a connecting fixed rod, a heat dissipation device and pins;
the packaging shell is a hollow cubic shell with openings symmetrically arranged on two side surfaces; the upper surface of the packaging shell is provided with a heat dissipation device for absorbing the heat of the chip, and the lower surface is provided with a heat dissipation hole; a plurality of connecting fixing rods are symmetrically and fixedly arranged on the front surface and the rear surface of the packaging shell, one end of each connecting fixing rod is fixedly connected with the packaging shell, the other end of each connecting fixing rod is provided with a pin, and the pin is connected with a chip in the packaging shell;
all be equipped with dress card mechanism on each angle of side baffle, the encapsulation casing corresponds every dress card mechanism department and all is equipped with the slot, and the card hole has upwards been seted up to slot one end, the side baffle passes through dress card mechanism and blocks the hole joint, and the side baffle and the two sides opening looks adaptation of encapsulation casing.
The heat dissipation device is provided with a plurality of heat dissipation fins which are parallel to each other and vertically embedded into the upper surface of the packaging shell.
The two side baffles are equal to the two side surfaces of the packaging shell in size; one side of the side baffle is provided with a square table, and the square table of the side baffle is in clearance fit with the side opening of the packaging shell.
And a sealing ring is arranged on the square platform of the side baffle.
The dress card mechanism includes: the top of the insert block is hemispherical and is vertically arranged above the fixture block, and the fixture block and the insert block are of an integrated structure.
The connecting fixing rod is of a hollow structure, and the chip in the packaging shell penetrates through the connecting fixing rod to be connected with the pin.
Be equipped with dustproof ventilative net in the louvre, the lower surface symmetry of encapsulation casing is rotated and is connected with two L type pin, and offsets with dustproof ventilative net to support dustproof ventilative net and drop.
And the L-shaped stop lever is fixedly connected with a torsion spring between the packaging shell, and when external force is applied, the L-shaped stop lever rotates, and the original position can be rebounded after the external force is removed.
The side is put and is all symmetry fixed mounting have crashproof corner pad on the right angle arris of the encapsulation casing upper and lower surface that the baffle corresponds, crashproof corner pad cross-section is L type structure.
The lower surface symmetry fixed mounting of encapsulation casing has L type mounting panel, every all offer the fixed orifices that is used for fixed encapsulation casing on the L type mounting panel.
The utility model has the following beneficial effects and advantages:
1. the utility model discloses a with the ejecting card hole of fixture block, make the inserted block take place elastic bending slightly, can dismantle the side baffle from the encapsulation casing, solved current chip plastic envelope shell structure comparatively fixed, lead to being difficult to dismantle inner structure, caused the inconvenient problem of maintenance.
2. The utility model discloses be provided with heat radiation fins and louvre, can guarantee the heat-sinking capability of chip, through stirring L type pin, make the torsional spring take place elastic deformation, make L type pin break away from the restriction to dustproof ventilative net to convenient the dismantlement is cleaned, can not influence the radiating effect.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
FIG. 3 is an enlarged view of part A of the present invention;
fig. 4 is a partial enlarged view of part B of the present invention.
Wherein, 1 is a radiating fin; 2 is a sealing ring; 3 is a connecting fixing rod; 4 is a packaging shell; 5 is a side baffle; 6 is an L-shaped bracket plate; 7 is a fixing hole; 8 is a dustproof breathable net; 9 is an anti-collision corner pad; 10 is a pin; 11 is a slot; 12 is an insert block; 13 is a fixture block; 14 is a clamping hole; 15 is a heat dissipation hole; 16 is a torsion spring; and 17 is an L-shaped stop lever.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
The utility model relates to a mounting is used in chip package, include: the packaging structure comprises a packaging shell provided with a chip, a side baffle, a connecting fixed rod, a heat dissipation device and pins;
the packaging shell is a hollow cubic shell with openings symmetrically arranged on two side surfaces; the upper surface of the packaging shell 4 is provided with a heat dissipation device for absorbing the heat of the chip, and the lower surface is provided with a heat dissipation hole 15; a plurality of connecting fixing rods 3 are symmetrically and fixedly arranged on the front surface and the rear surface of the packaging shell 4, one end of each connecting fixing rod 3 is fixedly connected with the packaging shell 4, the other end of each connecting fixing rod is provided with a pin 10, and the pins are connected with a chip in the packaging shell 4;
all be equipped with dress card mechanism on 5 every angles of side baffle, encapsulation casing 4 corresponds every dress card mechanism department and all is equipped with slot 11, and slot 11 one end has upwards seted up card hole 14, side baffle 5 is through dress card mechanism and card hole 14 joint, and side baffle 5 and 4 two-sided openings looks adaptations of encapsulation casing. Enclosing a housing 4 and two side baffles 5.
The heat dissipation device is provided with a plurality of heat dissipation fins 1, and the heat dissipation fins 1 are parallel to each other and vertically embedded into the upper surface of the packaging shell 4.
Two side baffles 5 are arranged and have the same size with the two side surfaces of the packaging shell 4; one side of the side baffle 5 is provided with a square table, and the square table of the side baffle 5 is in clearance fit with the side opening of the packaging shell 4.
The square table of the side baffle 5 is provided with a sealing ring 2.
Dress card mechanism includes: the top of the insertion block 12 is hemispherical and is vertically arranged above the clamping block 13, and the clamping block 13 and the insertion block 12 are of an integrated structure.
The connecting fixing rod 3 is a hollow structure, and a chip in the packaging shell 4 penetrates through the connecting fixing rod 3 to be connected with the pin 10.
Be equipped with dustproof ventilative net 8 in the louvre 15, the lower surface symmetry of encapsulation casing 4 is rotated and is connected with two L type pin 17, and offsets with dustproof ventilative net 8 to support dustproof ventilative net 8 and drop.
The L-shaped stop levers 17 are fixedly connected with the packaging shell 4 through torsion springs 16, when external force is applied, the L-shaped stop levers 17 rotate, and the original position can be rebounded when the external force is removed.
The right-angle edges of the upper surface and the lower surface of the packaging shell 4 corresponding to the side baffles 5 are symmetrically and fixedly provided with anti-collision corner pads 9, and the cross sections of the anti-collision corner pads 9 are of L-shaped structures.
The lower surface symmetry fixed mounting of encapsulation casing 4 has L type mounting panel 6, every all offer the fixed orifices 7 that are used for fixed encapsulation casing 4 on the L type mounting panel 6.
The utility model discloses a theory of operation does:
when the heat dissipation structure works, heat generated by the chip is dissipated under the action of the heat dissipation fins 1 and the heat dissipation holes 15, and the phenomenon that the service life of the chip is affected due to overhigh heat is avoided. When the dustproof breathable net 8 is detached, the L-shaped stop lever 17 is shifted to enable the torsion spring 16 to elastically deform, one end of the L-shaped stop lever 17 is separated from the bottom of the dustproof breathable net 8, and the dustproof breathable net 8 is taken out from the inside of the heat dissipation hole 15. When the side baffle 5 is disassembled, the prefabricated ejector rod is adopted to eject the fixture block 13 out of the fixture hole 14, at the moment, the insertion block 12 is elastically deformed, then the side baffle 5 is taken down, and the insertion block 12 connected with the side baffle is separated from the inside of the slot 11.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (10)
1. A die attach fixture, comprising: the packaging structure comprises a packaging shell (4) provided with a chip, a side baffle (5), a connecting fixing rod (3), a heat dissipation device and pins (10);
the packaging shell (4) is a hollow cubic shell with openings symmetrically arranged on two side surfaces; the upper surface of the packaging shell (4) is provided with a heat dissipation device for absorbing the heat of the chip, and the lower surface is provided with a heat dissipation hole (15); a plurality of connecting fixing rods (3) are symmetrically and fixedly arranged on the front surface and the rear surface of the packaging shell (4), one end of each connecting fixing rod (3) is fixedly connected with the packaging shell (4), the other end of each connecting fixing rod is provided with a pin (10), and the pins are connected with a chip in the packaging shell (4);
all be equipped with dress card mechanism on each angle of side baffle (5), encapsulation casing (4) correspond every dress card mechanism department and all are equipped with slot (11), and card hole (14) have upwards been seted up to slot (11) one end, side baffle (5) are through dress card mechanism and card hole (14) joint, and side baffle (5) and encapsulation casing (4) two sides opening looks adaptation.
2. The chip packaging fixing member according to claim 1, wherein the heat dissipation device is a plurality of heat dissipation fins (1), and the plurality of heat dissipation fins (1) are parallel to each other and vertically embedded in the upper surface of the package housing (4).
3. The fixing member for chip packaging according to claim 1, wherein the number of the side baffles (5) is two, and the side baffles are equal to the size of the two side surfaces of the packaging shell (4); one side of the side baffle (5) is provided with a square platform, and the square platform of the side baffle (5) is in clearance fit with the side opening of the packaging shell (4).
4. The chip packaging fixing member according to claim 3, wherein the side baffle (5) is provided with a sealing ring (2) on a square table.
5. The die attach fixture of claim 1, wherein the clip attaching mechanism comprises: the clamping device comprises a clamping block (13) and an inserting block (12) arranged on the clamping block (13), wherein the top of the inserting block (12) is hemispherical and is vertically arranged above the clamping block (13), and the clamping block (13) and the inserting block (12) are of an integrated structure.
6. The fixing member for chip packaging according to claim 1, wherein the connecting fixing rod (3) is a hollow structure, and the chip in the package housing (4) passes through the connecting fixing rod (3) to be connected with the pin (10).
7. The fixing member for chip packaging according to claim 1, wherein a dust-proof air-permeable net (8) is disposed in the heat dissipation hole (15), and two L-shaped retaining rods (17) are symmetrically and rotatably connected to the lower surface of the package housing (4) and abut against the dust-proof air-permeable net (8) to support the dust-proof air-permeable net (8) to fall off.
8. The chip packaging fixing member according to claim 7, wherein a torsion spring (16) is fixedly connected between each L-shaped stop lever (17) and the packaging shell (4), and when an external force is applied, the L-shaped stop levers (17) rotate, and when the external force is removed, the L-shaped stop levers can rebound to the original positions.
9. The fixing member for chip packaging according to claim 1, wherein the right-angle edges of the upper and lower surfaces of the packaging shell (4) corresponding to the side baffles (5) are symmetrically and fixedly provided with anti-collision corner pads (9), and the cross sections of the anti-collision corner pads (9) are in L-shaped structures.
10. The fixing member for chip packaging according to claim 1, wherein L-shaped support plates (6) are symmetrically and fixedly mounted on the lower surface of the packaging shell (4), and each L-shaped support plate (6) is provided with a fixing hole (7) for fixing the packaging shell (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022963506.6U CN214043626U (en) | 2020-12-10 | 2020-12-10 | Fixing part for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022963506.6U CN214043626U (en) | 2020-12-10 | 2020-12-10 | Fixing part for chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214043626U true CN214043626U (en) | 2021-08-24 |
Family
ID=77334867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022963506.6U Active CN214043626U (en) | 2020-12-10 | 2020-12-10 | Fixing part for chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214043626U (en) |
-
2020
- 2020-12-10 CN CN202022963506.6U patent/CN214043626U/en active Active
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