CN216302083U - Embedded chip packaging assembly - Google Patents
Embedded chip packaging assembly Download PDFInfo
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- CN216302083U CN216302083U CN202122714039.8U CN202122714039U CN216302083U CN 216302083 U CN216302083 U CN 216302083U CN 202122714039 U CN202122714039 U CN 202122714039U CN 216302083 U CN216302083 U CN 216302083U
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Abstract
The utility model discloses an embedded chip packaging assembly, and relates to the technical field of chip packaging. The utility model comprises an installation frame, a fixed frame and a bottom plate, wherein the installation frame is arranged on the upper surface of the bottom plate, a fixed box is arranged on the outer surface of the installation frame, a fixed groove is formed in the inner surface of the fixed box, a fixed spring is arranged on the inner surface of the fixed groove, and a first fixed plate is arranged on the outer surface of the fixed spring. According to the utility model, through the fixing box arranged on the outer surface of the installation frame and the installation box arranged on the outer surface of the fixing frame, the baffle plate arranged on the inner surface of the fixing box and the fixing block arranged on the inner surface of the installation box are used for driving the positioning block arranged on the inner surface of the fixing frame and the protective cushion pad arranged on the outer surface of the positioning block to fix the chip by utilizing the connection between the outer surface of the fixing block and the outer surface of the baffle plate, so that the pins on the chip can not be deformed and damaged due to transportation, thereby being incapable of being normally used, and further bringing economic loss to merchants.
Description
Technical Field
The utility model belongs to the technical field of chip packaging, and particularly relates to an embedded chip packaging assembly.
Background
The package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit. On one hand, the chip can be isolated from the outside, and the electric performance reduction caused by the corrosion of the impurities in the air to the chip circuit is prevented; on the other hand, the packaged chip is more convenient to mount and transport.
The existing chip packaging can not well protect the chip, jolt can be generated in the transportation process, the jolt can drive the radiator to shake, the radiator can take part of pins of the chip out of the base in the shaking process due to the fact that the radiator is tightly attached to the integrated circuit, and the pins on the chip are deformed and damaged to cause abnormal use, so that economic loss is brought to a merchant.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an embedded chip packaging assembly, which solves the existing problems.
In order to solve the technical problems, the utility model is realized by the following technical scheme:
the utility model relates to an embedded chip packaging assembly, which comprises an installation frame, a fixed frame and a bottom plate, wherein the installation frame is arranged on the upper surface of the bottom plate, a fixed box is arranged on the outer surface of the installation frame, a fixed groove is arranged on the inner surface of the fixed box, a fixed spring is arranged on the inner surface of the fixed groove, a first fixed plate is arranged on the outer surface of the fixed spring, a push rod is arranged on the outer surface of the first fixed plate, a baffle is arranged on the inner surface of the fixed box, an installation box is arranged on the outer surface of the fixed frame, an installation spring is arranged on the inner surface of the installation box, a fixed block is arranged on the outer surface of the installation spring, the outer surface of the fixed block is connected with the outer surface of the baffle, the fixed box is arranged on the outer surface of the installation frame, and the fixed block is arranged on the inner surface of the installation box through the baffle arranged on the inner surface of the fixed box, utilize being connected between fixed block surface and the baffle surface, drive fixed frame surface mounting's locating piece and locating piece surface mounting's protection blotter to fix the chip, can guarantee that the stitch on the chip can not produce the deformation because of the transportation and damage to lead to can not normal use, thereby bring economic loss for the trade company.
Preferably, surface mounting has the installation piece on the bottom plate, installation piece surface mounting has the installation axle, installation axle surface mounting has the installation fixed plate, fixed frame installs at the installation fixed plate surface.
Preferably, the installation frame internal surface is provided with the standing groove, standing groove internal surface mounting has the backing plate, the fixed frame surface and backing plate surface connection, the installation frame internal surface is provided with the mounting groove, fixed frame internal surface mounting has the locating piece, locating piece external surface mounting has the protection blotter.
Preferably, fixed frame internally surface mounting has a plurality of boards of placing, place the board upper surface mounting and have the shock attenuation to place the case, the shock attenuation is placed incasement surface mounting and is had damping spring, damping spring surface mounting has the connecting rod, connecting rod surface mounting has the mounting panel, mounting panel surface mounting has the blotter, and it is the installation to place the case through the shock attenuation, and simultaneously, utilize the shock attenuation to place incasement surface mounting's damping spring, carry out fixed protection to the chip.
The utility model has the following beneficial effects:
according to the chip fixing device, the fixing box is arranged on the outer surface of the mounting frame, the mounting box is arranged on the outer surface of the fixing frame, the baffle plate arranged on the inner surface of the fixing box and the fixing block arranged on the inner surface of the mounting box are connected with each other through the outer surface of the fixing block and the outer surface of the baffle plate, and the positioning block arranged on the inner surface of the fixing frame and the protective cushion arranged on the outer surface of the positioning block are driven to fix a chip; meanwhile, the box is placed through the shock absorption arranged on the inner surface of the fixed frame, the shock absorption springs inside the box are placed through the shock absorption, the chip is protected, and pins on the chip can be prevented from deforming and damaging due to transportation, so that the normal use can be avoided, and economic loss is brought to a merchant.
Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic view of the cross-sectional structure A-A of FIG. 2;
FIG. 4 is a left side view of the present invention;
fig. 5 is a schematic view of the cross-sectional structure B-B in fig. 4.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a mounting frame; 2. a fixed frame; 3. a placement groove; 4. a base plate; 5. a fixed box; 6. installing a box; 7. fixing grooves; 8. fixing the spring; 9. a first fixing plate; 10. a push rod; 11. a baffle plate; 12. installing a spring; 13. a fixed block; 14. mounting blocks; 15. installing a shaft; 16. mounting a fixed plate; 17. Mounting grooves; 18. positioning blocks; 19. protecting the cushion; 20. a shock-absorbing placing box; 21. a damping spring; 22. a connecting rod; 23. mounting a plate; 24. a cushion pad; 25. placing the plate; 26. a base plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate orientations or positional relationships, are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
As shown in the figures, the present invention is an embedded chip package assembly, including a mounting frame 1, a fixing frame 2 and a bottom plate 26, wherein the mounting frame 1 is mounted on the upper surface of the bottom plate 26, a fixing box 5 is mounted on the outer surface of the mounting frame 1, a fixing groove 7 is formed on the inner surface of the fixing box 5, a fixing spring 8 is mounted on the inner surface of the fixing groove 7, a first fixing plate 9 is mounted on the outer surface of the fixing spring 8, a push rod 10 is mounted on the outer surface of the first fixing plate 9, a baffle 11 is mounted on the inner surface of the fixing box 5, a mounting box 6 is mounted on the outer surface of the fixing frame 2, a mounting spring 12 is mounted on the inner surface of the mounting box 6, a fixing block 13 is mounted on the outer surface of the mounting spring 12, the outer surface of the fixing block 13 is connected with the outer surface of the baffle 11, the fixing box 5 mounted on the outer surface of the mounting frame 1 and the mounting box 6 mounted on the outer surface of the fixing frame 2 are connected with the fixing block 13 mounted on the inner surface of the mounting box 6 through the baffle 11 mounted on the inner surface of the fixing box 5, utilize being connected between fixed block 13 surface and the baffle 11 surface, drive the locating piece 18 of fixed frame 2 internal surface installation and the protection blotter 19 of locating piece 18 surface installation to fix the chip, can guarantee that the stitch on the chip can not produce the deformation because of the transportation and damage to lead to can not normal use, thereby bring economic loss for the trade company.
Wherein, the surface mounting has the installation piece 14 on the bottom plate 26, and installation axle 15 is installed to installation piece 14 surface, and installation fixed plate 16 is installed to installation axle 15 surface, and fixed frame 2 installs in the installation fixed plate 16 surface.
Wherein, installation frame 1 internal surface is provided with standing groove 3, and 3 internal surface mounting in standing groove has backing plate 4, and fixed frame 2 surface and 4 outer surface connections of backing plate, installation frame 1 internal surface are provided with mounting groove 17, and fixed frame 2 internal surface mounting has locating piece 18, and 18 outer surface mounting of locating piece has protection blotter 19.
Wherein, 2 internally surface mounting of fixed frame has a plurality of boards 25 of placing, place board 25 last surface mounting and place case 20 with the shock attenuation, the shock attenuation is placed 20 internally surface mounting of case and is had damping spring 21, damping spring 21 surface mounting has connecting rod 22, connecting rod 22 surface mounting has mounting panel 23, 23 externally surface mounting of mounting panel has blotter 24, place the installation of case 20 through the shock attenuation, simultaneously, utilize the shock attenuation to place 20 internally surface mounting's of case damping spring 21, carry out fixed protection to the chip.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims (7)
1. An embedded chip package assembly comprising a mounting frame (1), a fixed frame (2) and a base plate (26), characterized in that: install frame (1) at bottom plate (26) upper surface, installation frame (1) surface mounting has fixed case (5), fixed case (5) internal surface is provided with fixed slot (7), fixed slot (7) surface mounting has fixed spring (8), fixed spring (8) surface mounting has first fixed plate (9), first fixed plate (9) surface mounting has push rod (10), fixed case (5) surface mounting has baffle (11), fixed frame (2) surface mounting has install box (6), install box (6) surface mounting has installation spring (12), installation spring (12) surface mounting has fixed block (13), fixed block (13) surface and baffle (11) surface connection.
2. The embedded chip package assembly of claim 1, wherein the bottom plate (26) has a mounting block (14) mounted on an upper surface thereof, a mounting shaft (15) is mounted on an outer surface of the mounting block (14), a mounting fixing plate (16) is mounted on an outer surface of the mounting shaft (15), and the fixing frame (2) is mounted on an outer surface of the mounting fixing plate (16).
3. The embedded chip package assembly of claim 1, wherein a positioning block (18) is mounted on an inner surface of the fixing frame (2), and a protective cushion (19) is mounted on an outer surface of the positioning block (18).
4. The embedded chip package assembly of claim 1, wherein the mounting frame (1) is provided with a placement groove (3) on an inner surface thereof, a backing plate (4) is mounted on the inner surface of the placement groove (3), and the outer surface of the fixing frame (2) is connected to the outer surface of the backing plate (4).
5. The embedded chip package assembly of claim 1, wherein a plurality of placing plates (25) are mounted on the inner surface of the fixing frame (2), the shock absorbing placing box (20) is mounted on the upper surface of the placing plates (25), the shock absorbing spring (21) is mounted on the inner surface of the shock absorbing placing box (20), the connecting rod (22) is mounted on the outer surface of the shock absorbing spring (21), and the mounting plate (23) is mounted on the outer surface of the connecting rod (22).
6. The embedded chip package assembly of claim 5, wherein the mounting plate (23) is externally mounted with a cushion pad (24).
7. The embedded chip package assembly of claim 1, wherein the mounting frame (1) is provided with a mounting groove (17) on its inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122714039.8U CN216302083U (en) | 2021-11-08 | 2021-11-08 | Embedded chip packaging assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122714039.8U CN216302083U (en) | 2021-11-08 | 2021-11-08 | Embedded chip packaging assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216302083U true CN216302083U (en) | 2022-04-15 |
Family
ID=81119075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122714039.8U Active CN216302083U (en) | 2021-11-08 | 2021-11-08 | Embedded chip packaging assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216302083U (en) |
-
2021
- 2021-11-08 CN CN202122714039.8U patent/CN216302083U/en active Active
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