CN216749861U - Integrated circuit SIP packaging structure - Google Patents
Integrated circuit SIP packaging structure Download PDFInfo
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- CN216749861U CN216749861U CN202122771483.3U CN202122771483U CN216749861U CN 216749861 U CN216749861 U CN 216749861U CN 202122771483 U CN202122771483 U CN 202122771483U CN 216749861 U CN216749861 U CN 216749861U
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Abstract
The utility model discloses an integrated circuit SIP packaging structure, the on-line screen storage device comprises a base, top one side of base is equipped with the fixed strip, and one side of fixed strip is equipped with the socket, and the inside of socket is equipped with the integrated circuit body, the top of base is equipped with the shell, and the top inner wall of shell is equipped with the depression bar, one side welding of shell has the second fixed strip, the welding of top one side of base has first fixed strip, the opposite side welding of shell has the fixed plate, and first through-hole has been seted up at the top of fixed plate. The utility model discloses a set up shell, fixed strip and screw, during the installation, insert the inside of fixed strip with one side of integrated circuit body golden finger to install the integrated circuit body, insert the bottom of first fixed strip with the second fixed strip of shell one side afterwards, make one side of shell fixed, twist the screw again among the screw thread section of thick bamboo, thereby fix the shell, the inside depression bar of shell can be pressed integrated circuit body fixed this moment, device easy dismounting.
Description
Technical Field
The utility model relates to an integrated circuit technical field especially relates to an integrated circuit SIP packaging structure.
Background
An integrated circuit is a miniature electronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function.
The existing integrated circuit SIP packaging structure is relatively complex and inconvenient in dismounting and mounting process, time and labor are wasted, convenience and efficiency of dismounting and mounting of the integrated circuit SIP packaging structure are affected, and meanwhile, the integrated circuit cannot be well protected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcomings existing in the prior art, and providing an integrated circuit SIP packaging structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an integrated circuit SIP packaging structure, includes the base, top one side of base is equipped with the fixed strip, and one side of fixed strip is equipped with the socket, and the inside of socket is equipped with the integrated circuit body, the top of base is equipped with the shell, and the top inner wall of shell is equipped with the depression bar, one side welding of shell has the second fixed strip, the welding of top one side of base has first fixed strip, the opposite side welding of shell has the fixed plate, and first through-hole has been seted up at the top of fixed plate, and the inside of first through-hole is equipped with the screw, top one side of base is equipped with a screw thread section of thick bamboo, screw thread section of thick bamboo and screw threaded connection.
Furthermore, the bottom of the pressure rod is provided with a pressure cylinder, a spring is welded between the pressure cylinder and the pressure rod, and the bottom of the pressure cylinder is bonded with a rubber pad.
Furthermore, a plurality of strip-shaped openings are formed in the top end of the shell, a heat dissipation plate is arranged inside each strip-shaped opening, and a heat absorption plate is welded at the bottom of each heat dissipation plate.
Further, the first fixing strip is L-shaped.
Furthermore, the bottom of the base is provided with a plurality of conductive columns, and the conductive columns are electrically connected with the insertion openings of the fixing strips.
Furthermore, a plurality of support columns are welded at the top of the base.
Furthermore, an annular groove is formed in the top end of the base, a sealing ring is arranged inside the annular groove, and the sealing ring is located at the bottom of the shell.
Furthermore, the inner wall of the shell is provided with a shielding cover.
The utility model has the advantages that:
1. by arranging the shell, the fixing strip and the screws, during installation, one side of a golden finger of the integrated circuit body is inserted into the fixing strip, so that the integrated circuit body is installed, then the second fixing strip on one side of the shell is inserted into the bottom of the first fixing strip, so that one side of the shell is fixed, the screws are screwed into the threaded cylinders, so that the shell is fixed, at the moment, the integrated circuit body is pressed and fixed by the pressure rod in the shell, and the device is convenient to disassemble and assemble;
2. the integrated circuit body can be prevented from being damaged by pressing of the pressing rod through the arrangement of the spring and the rubber pad which are buffered;
3. by arranging the heat absorbing plate and the heat radiating plate, after the shell is installed, the heat absorbing plate is positioned at the top of the integrated circuit body to absorb heat generated by the integrated circuit body, and then the heat is radiated in time through the heat radiating plate, so that the heat radiating performance of the integrated circuit body is improved;
4. by arranging the sealing ring, the sealing performance in the device can be improved, and dust and water vapor are prevented from entering the device;
5. through setting up the shield cover, shield, stability when promoting the use of integrated circuit body.
Drawings
Fig. 1 is a front view structural section of an integrated circuit SIP package structure provided in embodiment 1;
fig. 2 is a schematic cross-sectional structural diagram of an integrated circuit SIP package structure according to embodiment 1;
fig. 3 is a schematic cross-sectional structural diagram of an integrated circuit SIP package structure provided in embodiment 2.
In the figure: the heat sink comprises a base 1, a threaded cylinder 2, a fixing plate 3, a screw 4, a shell 5, an integrated circuit body 6, a rubber pad 7, a pressure rod 8, a spring 9, a pressure cylinder 10, a heat dissipation plate 11, a heat absorption plate 12, a first fixing strip 13, a second fixing strip 14, a sealing ring 15, a fixing strip 16, a conductive column 17, a supporting column 18 and a shielding cover 19.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-2, an integrated circuit SIP package structure includes a base 1, a fixing strip 16 is disposed on one side of the top of the base 1, a socket is disposed on one side of the fixing strip 16, an integrated circuit body 6 is disposed inside the socket, a housing 5 is disposed on the top of the base 1, a pressure bar 8 is disposed on the inner wall of the top of the housing 5, a second fixing strip 14 is welded on one side of the housing 5, a first fixing strip 13 is welded on one side of the top of the base 1, a fixing plate 3 is welded on the other side of the housing 5, a first through hole is disposed on the top of the fixing plate 3, a screw 4 is disposed inside the first through hole, a threaded cylinder 2 is disposed on one side of the top of the base 1, the threaded cylinder 2 is in threaded connection with the screw 4, during installation, one side of a golden finger of the integrated circuit body 6 is inserted into the fixing strip 16, so as to install the integrated circuit body 6, then the second fixing strip 14 on one side of the housing 5 is inserted into the bottom of the first fixing strip 13, make one side of shell 5 fixed, twist screw 4 again among the screw thread section of thick bamboo 2 to fixed shell 5, the depression bar 8 of shell 5 inside can press integrated circuit body 6 fixed this moment, device easy dismounting.
Wherein, the bottom of depression bar 8 is equipped with pressure section of thick bamboo 10, and the welding has spring 9 between pressure section of thick bamboo 10 and the depression bar 8, and the bottom of pressure section of thick bamboo 10 bonds there is rubber pad 7, through the buffering of spring 9 and rubber pad 7, can avoid the depression bar 8 to press integrated circuit body 6 and damage.
Wherein, a plurality of bar openings have been seted up on the top of shell 5, and bar open-ended inside is equipped with heating panel 11, and the bottom welding of heating panel 11 has absorber plate 12, and after the installation of shell 5, absorber plate 12 can be in integrated circuit body 6's top, absorbs the heat to the heat that integrated circuit body 6 produced, in time gives off the heat through heating panel 11 afterwards to promote integrated circuit body 6's heat dispersion.
Wherein, first fixed strip 13 is L shape, and the first fixed strip 13 that is L shape is convenient for second fixed strip 14 to insert the bottom of first fixed strip 13, fixes shell 5.
The bottom of the base 1 is provided with a plurality of conductive posts 17, the conductive posts 17 are electrically connected with the insertion openings of the fixing bars 16, and the integrated circuit body 6 is convenient to mount through the conductive posts 17.
Wherein, a plurality of support posts 18 are welded on the top of the base 1, and the integrated circuit body 6 is conveniently supported by the support posts 18.
Wherein, the annular groove has been seted up on the top of base 1, and the inside of annular groove is equipped with sealing washer 15, and sealing washer 15 is in the bottom of shell 5, can promote the inside leakproofness of device through sealing washer 15, avoids the inside dust, the steam that gets into of device.
The working principle is as follows: during installation, one side of a golden finger of the integrated circuit body 6 is inserted into the fixing strip 16, so that the integrated circuit body 6 is installed, then the second fixing strip 14 on one side of the shell 5 is inserted into the bottom of the first fixing strip 13, so that one side of the shell 5 is fixed, and then the screw 4 is screwed into the threaded cylinder 2, so that the shell 5 is fixed, at the moment, the integrated circuit body 6 is pressed and fixed by the pressure lever 8 in the shell 5, and the device is convenient to disassemble and assemble;
through the buffering of the spring 9 and the rubber pad 7, the integrated circuit body 6 can be prevented from being pressed and damaged by the pressing rod 8;
after the shell 5 is installed, the heat absorbing plate 12 is positioned at the top of the integrated circuit body 6 to absorb heat generated by the integrated circuit body 6, and then the heat is dissipated in time through the heat dissipating plate 11, so that the heat dissipating performance of the integrated circuit body 6 is improved;
the L-shaped first fixing strip 13 facilitates the insertion of the second fixing strip 14 into the bottom of the first fixing strip 13 to fix the shell 5;
the conductive column 17 is electrically connected with the socket of the fixing strip 16, and the integrated circuit body 6 is convenient to mount through the conductive column 17;
the support of the integrated circuit body 6 is facilitated by support posts 18;
the sealing performance inside the device can be improved through the sealing ring 15, and dust and water vapor are prevented from entering the device.
Example 2
Referring to fig. 3, in this embodiment, compared with embodiment 1, in order to increase the practicability of the device, the inner wall of the housing 5 is provided with a shielding cover 19, and the shielding cover 19 is used for shielding, so as to improve the stability of the integrated circuit body 6 during use.
The working principle is as follows: during installation, one side of a golden finger of the integrated circuit body 6 is inserted into the fixing strip 16, so that the integrated circuit body 6 is installed, then the second fixing strip 14 on one side of the shell 5 is inserted into the bottom of the first fixing strip 13, so that one side of the shell 5 is fixed, and then the screw 4 is screwed into the threaded cylinder 2, so that the shell 5 is fixed, at the moment, the integrated circuit body 6 is pressed and fixed by the pressure lever 8 in the shell 5, and the device is convenient to disassemble and assemble;
through the buffering of the spring 9 and the rubber pad 7, the integrated circuit body 6 can be prevented from being pressed and damaged by the pressing rod 8;
after the shell 5 is installed, the heat absorbing plate 12 is positioned at the top of the integrated circuit body 6 to absorb heat generated by the integrated circuit body 6, and then the heat is dissipated in time through the heat dissipating plate 11, so that the heat dissipating performance of the integrated circuit body 6 is improved;
the first fixing strip 13 in the L shape facilitates the insertion of the second fixing strip 14 into the bottom of the first fixing strip 13 to fix the housing 5;
the conductive column 17 is electrically connected with the socket of the fixing strip 16, and the integrated circuit body 6 is convenient to mount through the conductive column 17;
the support of the integrated circuit body 6 is facilitated by support posts 18;
the sealing performance in the device can be improved through the sealing ring 15, and dust and water vapor are prevented from entering the device;
the shielding is performed by the shielding case 19, and the stability of the integrated circuit body 6 in use is improved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (8)
1. An integrated circuit SIP packaging structure comprises a base (1) and is characterized in that, a fixing strip (16) is arranged on one side of the top of the base (1), a socket is arranged on one side of the fixing strip (16), an integrated circuit body (6) is arranged in the socket, the top end of the base (1) is provided with a shell (5), the inner wall of the top end of the shell (5) is provided with a pressure lever (8), one side of the shell (5) is fixedly connected with a second fixing strip (14), one side of the top end of the base (1) is fixedly connected with a first fixing strip (13), the other side of the shell (5) is fixedly connected with a fixed plate (3), the top of the fixed plate (3) is provided with a first through hole, a screw (4) is arranged inside the first through hole, a threaded cylinder (2) is arranged on one side of the top end of the base (1), and the threaded cylinder (2) is in threaded connection with the screw (4).
2. The integrated circuit SIP package structure of claim 1, wherein a pressing cylinder (10) is disposed at the bottom of the pressing rod (8), a spring (9) is fixedly connected between the pressing cylinder (10) and the pressing rod (8), and a rubber pad (7) is bonded to the bottom of the pressing cylinder (10).
3. The integrated circuit SIP package structure of claim 1, wherein the top end of the housing (5) is provided with a plurality of strip-shaped openings, the strip-shaped openings are internally provided with heat dissipation plates (11), and the bottom of the heat dissipation plates (11) is fixedly connected with a heat sink plate (12).
4. An integrated circuit SIP package structure according to claim 1, characterized in that the first fixing strip (13) is L-shaped.
5. The integrated circuit SIP package structure of claim 1, wherein the bottom of the base (1) is provided with a plurality of conductive pillars (17), and the conductive pillars (17) are electrically connected to the sockets of the fixing bar (16).
6. An integrated circuit SIP package structure according to claim 1, characterized in that a plurality of supporting pillars (18) are fixedly connected to the top of the base (1).
7. The integrated circuit SIP package structure of claim 1, wherein an annular groove is formed at a top end of the base (1), a sealing ring (15) is disposed inside the annular groove, and the sealing ring (15) is disposed at a bottom of the housing (5).
8. An integrated circuit SIP package according to claim 1, characterized in that the inner wall of the housing (5) is provided with a shielding (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122771483.3U CN216749861U (en) | 2021-11-12 | 2021-11-12 | Integrated circuit SIP packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122771483.3U CN216749861U (en) | 2021-11-12 | 2021-11-12 | Integrated circuit SIP packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216749861U true CN216749861U (en) | 2022-06-14 |
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ID=81924496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122771483.3U Active CN216749861U (en) | 2021-11-12 | 2021-11-12 | Integrated circuit SIP packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216749861U (en) |
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2021
- 2021-11-12 CN CN202122771483.3U patent/CN216749861U/en active Active
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