CN212810273U - Fast recovery diode module - Google Patents
Fast recovery diode module Download PDFInfo
- Publication number
- CN212810273U CN212810273U CN202021280502.1U CN202021280502U CN212810273U CN 212810273 U CN212810273 U CN 212810273U CN 202021280502 U CN202021280502 U CN 202021280502U CN 212810273 U CN212810273 U CN 212810273U
- Authority
- CN
- China
- Prior art keywords
- diode module
- bottom plate
- fixing plate
- plate
- fast recovery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000011084 recovery Methods 0.000 title claims abstract description 17
- 230000035939 shock Effects 0.000 claims abstract description 11
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000013016 damping Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a fast recovery diode module, including diode module main part, encapsulation casing and bottom plate, install diode module main part on the bottom plate, the diode module main part outside is packaged with the encapsulation casing, the encapsulation casing is installed on the bottom plate, the shock attenuation supporting legs is installed to the bottom plate bottom, the shock attenuation supporting legs comprises upper fixed plate, elastic component and bottom plate, the elastic component both ends are fixed with upper fixed plate and bottom plate. The utility model is provided with the shock absorption supporting leg which consists of an upper fixing plate, an elastic part and a lower fixing plate, wherein the elastic part is arranged into a silica gel column or a rubber column; the anti-seismic performance of the diode module can be enhanced, and the looseness of elements in the diode module is avoided, so that the service life of the diode module is prolonged.
Description
Technical Field
The utility model relates to a diode technical field specifically is a fast recovery diode module.
Background
The conventional common fast recovery diode module generally comprises a plurality of groups of diode chips mounted on a bottom plate, electrodes on the diode chips, a fixing plate outside the chips, an insulating shell for packaging the outside of each group of diode chips, and epoxy resin. The fixing piece is fixed on the bottom plate through a small screw, and the insulating shell is stably and firmly packaged on the bottom plate through the fixing piece and the small screw. The high-power high-frequency power supply has the advantages of small volume, high reliability, convenience in installation and the like, and is widely applied to equipment such as a high-power high-frequency power supply and the like.
The existing fast recovery diode module is poor in damping effect, and easily causes the looseness of elements inside the fast recovery diode module, so that poor contact is caused, and the damage of the fast recovery diode module is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fast recovery diode module to solve the problem among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a fast recovery diode module, includes diode module main part, encapsulation casing and bottom plate, install diode module main part on the bottom plate, the encapsulation casing is packaged with in the diode module main part outside, the encapsulation casing is installed on the bottom plate, the shock attenuation supporting legs is installed to the bottom plate bottom, the shock attenuation supporting legs comprises upper fixed plate, elastic component and bottom plate, the elastic component both ends are fixed with upper fixed plate and bottom plate.
Preferably, the diode module main body is provided with an electrode and a copper column, and the electrode and the copper column penetrate through the packaging shell.
Preferably, the packaging shell and the bottom plate are connected through a connecting piece.
Preferably, the upper fixing plate and the lower fixing plate have the same structure, and the upper fixing plate and the lower fixing plate are provided with a cover body structure.
Preferably, a through hole is formed in the middle of the elastic piece, and two ends of the elastic piece are fixed on the upper fixing plate and the lower fixing plate through bolts.
Preferably, the elastic member is configured as a silica gel column or a rubber column.
Compared with the prior art, the beneficial effects of the utility model are that: the damping support leg is arranged and consists of an upper fixing plate, an elastic piece and a lower fixing plate, and the elastic piece is a silica gel column or a rubber column; the anti-seismic performance of the diode module can be enhanced, and the looseness of elements in the diode module is avoided, so that the service life of the diode module is prolonged.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a cross-sectional view of the present invention.
Fig. 3 is a schematic structural view of the shock-absorbing supporting leg of the present invention.
In the figure: 1. a package housing; 2. an electrode; 3. a copper pillar; 4. a connecting member; 5. a base plate; 6. damping supporting legs; 601. an upper fixing plate; 602. an elastic member; 603. and a lower fixing plate.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, in an embodiment of the present invention, a fast recovery diode module includes a diode module main body, a package case 1 and a bottom plate 5, the diode module main body is mounted on the bottom plate 5, the package case 1 is packaged outside the diode module main body, the package case 1 is mounted on the bottom plate 5, a shock-absorbing support leg 6 is mounted at the bottom end of the bottom plate 5, the shock-absorbing support leg 6 is composed of an upper fixing plate 601, an elastic member 602 and a lower fixing plate 603, an upper fixing plate 601 and a lower fixing plate 603 are fixed at two ends of the elastic member 602, an electrode 2 and a copper pillar 3 are disposed on the diode module main body, the electrode 2 and the copper pillar 3 penetrate through the package case 1, the package case 1 and the bottom plate 5 are connected by a connecting member 4, the upper fixing plate 601 and the lower fixing plate 603 have the same structure, and the upper fixing plate 601 and the lower, a through hole is formed in the middle of the elastic member 602, two ends of the elastic member 602 are fixed to the upper fixing plate 601 and the lower fixing plate 603 through bolts, and the elastic member 602 is a silica gel column or a rubber column; by arranging the shock absorption supporting leg 6, the shock absorption supporting leg 6 is composed of an upper fixing plate 601, an elastic member 602 and a lower fixing plate 603, and the elastic member 602 is arranged as a silica gel column or a rubber column; the anti-seismic performance of the diode module can be enhanced, and the looseness of elements in the diode module is avoided, so that the service life of the diode module is prolonged.
The utility model discloses a theory of operation is: by arranging the shock absorption supporting leg 6, the shock absorption supporting leg 6 is composed of an upper fixing plate 601, an elastic member 602 and a lower fixing plate 603, and the elastic member 602 is arranged as a silica gel column or a rubber column; the anti-seismic performance of the diode module can be enhanced, and the looseness of elements in the diode module is avoided, so that the service life of the diode module is prolonged.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A fast recovery diode module, includes diode module main part, encapsulation casing (1) and bottom plate (5), its characterized in that: install diode module main part on bottom plate (5), the encapsulation casing (1) is packaged with in the diode module main part outside, install on bottom plate (5) encapsulation casing (1), shock attenuation supporting legs (6) are installed to bottom plate (5) bottom, shock attenuation supporting legs (6) comprise upper fixed plate (601), elastic component (602) and bottom plate (603), elastic component (602) both ends are fixed with upper fixed plate (601) and bottom plate (603).
2. A fast recovery diode module according to claim 1, wherein: the diode module is characterized in that an electrode (2) and a copper column (3) are arranged on the diode module body, and the electrode (2) and the copper column (3) penetrate through the packaging shell (1).
3. A fast recovery diode module according to claim 1, wherein: the packaging shell (1) is connected with the bottom plate (5) through a connecting piece (4).
4. A fast recovery diode module according to claim 1, wherein: the upper fixing plate (601) and the lower fixing plate (603) are identical in structure, and the upper fixing plate (601) and the lower fixing plate (603) are of cover body structures.
5. A fast recovery diode module according to claim 1, wherein: the middle part of the elastic piece (602) is provided with a through hole, and the two ends of the elastic piece (602) are fixed on the upper fixing plate (601) and the lower fixing plate (603) through bolts.
6. A fast recovery diode module according to claim 5, characterized in that: the elastic piece (602) is arranged as a silica gel column or a rubber column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021280502.1U CN212810273U (en) | 2020-07-04 | 2020-07-04 | Fast recovery diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021280502.1U CN212810273U (en) | 2020-07-04 | 2020-07-04 | Fast recovery diode module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212810273U true CN212810273U (en) | 2021-03-26 |
Family
ID=75099600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021280502.1U Active CN212810273U (en) | 2020-07-04 | 2020-07-04 | Fast recovery diode module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212810273U (en) |
-
2020
- 2020-07-04 CN CN202021280502.1U patent/CN212810273U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 01, Building 30, Xingrun Zhigu Industrial Park, No. 1378 Xinzhuang Avenue, Xinzhuang Town, Changshu City, Jiangsu Province, 215500 Patentee after: Jiangsu Jingbaiyuan Semiconductor Technology Co.,Ltd. Address before: 215300 room 8, 9 Tiandu Road, Lujia Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan jingbaiyuan Semiconductor Technology Co.,Ltd. |