CN216982199U

CN216982199U - Novel integrated circuit board with shock-absorbing structure

Info

Publication number: CN216982199U
Application number: CN202220560008.3U
Authority: CN
Inventors: 吴婷
Original assignee: Shenzhen Benqiang Circuit Co ltd
Current assignee: Shenzhen Benqiang Circuit Co ltd
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-07-15
Anticipated expiration: 2032-03-15

Abstract

The utility model relates to the technical field of integrated circuits, in particular to a novel integrated circuit board with a damping structure. The technical scheme comprises the following steps: loading board, bottom plate, bradyseism subassembly and coupling assembling, the internally mounted of loading board has coupling assembling, installs the copper in the coupling assembling, and the transmission band is installed to the bottom of copper, and the stationary blade is installed at the both ends of transmission band, and the bradyseism subassembly is installed to the bottom of stationary blade, installs the bradyseism groove in the bradyseism subassembly, and the bradyseism section of thick bamboo is installed to the inside both sides in bradyseism groove. According to the utility model, the cushioning cylinder is arranged in the cushioning groove, so that the assembly at the top can be elastically supported through the cushioning cylinder, and further the cushioning groove and the bearing plate can be elastically connected, so that when the bottom plate is vibrated, the cushioning cylinder is utilized to buffer the impact force, the impact force on the assembly at the top is reduced, and the stability of the integrated circuit during connection can be further ensured.

Description

Novel integrated circuit board with shock-absorbing structure

Technical Field

The utility model relates to the technical field of integrated circuits, in particular to a novel integrated circuit board with a damping structure.

Background

The integrated circuit is a semiconductor technology for reducing the volume of internal components of electronic equipment, along with the continuous increase of the functions of the electronic equipment, the number of parts installed inside the equipment is gradually increased, the whole circuit volume of the electronic equipment is reduced, the operation efficiency of the circuit is improved, the circuit board with high integration is required to be adopted as a carrier for welding and installing electronic elements, and therefore, the novel integrated circuit board with the damping structure is provided for increasing the practicability of the integrated circuit board.

Through the retrieval, patent publication No. CN213028929U discloses an integrated circuit board, including casing and integrated circuit board main part, the integrated circuit board main part with be provided with two sets of fixed establishment between the casing, fixed establishment includes two sets of fixed blocks, the inside of fixed block is seted up flutedly, the inside of recess is provided with cutting and two sets of fixed columns respectively, the outside of cutting is provided with two sets of draw slips, the inside of draw slip is seted up the confession the movable groove that the tip of fixed column passed, the both sides face of integrated circuit board main part all is provided with the installation piece.

The existing integrated circuit board has the following defects:

1. when the existing integrated circuit board is used, the whole structure of the integrated circuit board is fixed and does not have a buffer space, so that when the integrated circuit board is shaken, the vibration impact force applied to the bottom of the integrated circuit board can be directly transmitted to the connecting position of the top of the circuit board, the welding point of an electronic element is easy to loosen, and the welding point is broken to influence the connection stability of the circuit;

2. the sealing performance of the existing integrated circuit board is not ideal enough when the integrated circuit board is used, the device is easy to enable water vapor to enter the interior of the device when the integrated circuit board is used, the water vapor is easy to cause corrosion and aging of metal connection points after contacting with metal parts inside the device, welding spots can be rusted to influence the conductivity, and the overall working stability of the integrated circuit can be influenced.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a novel integrated circuit board with a shock absorbing structure to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel integrated circuit board with shock-absorbing structure, includes loading board, bottom plate, bradyseism subassembly and coupling assembling, the insulation board is installed at the top of loading board, the inside equidistance of insulation board is equipped with the fixed slot, the internally mounted of loading board has coupling assembling, install the copper in the coupling assembling, the transmission band is installed to the bottom of copper, the stationary blade is installed at the both ends of transmission band, the bradyseism subassembly is installed to the bottom of stationary blade, install the bradyseism groove in the bradyseism subassembly, a bradyseism section of thick bamboo is installed to the inside both sides in bradyseism groove, the conducting rod is installed to the bottom equidistance in bradyseism groove, the bottom plate is installed to the bottom in bradyseism groove, the inside both sides of bottom plate are equipped with spacing hole, waterproof pad is installed in the top outside of bottom plate.

When using a novel integrated circuit board with shock-absorbing structure among this technical scheme, carry out fixed mounting through the inside spacing hole of bottom plate and bolt cooperation to the bottom of device, the tinsel and the external circuit that utilize the welding seat top weld, make the inside circuit of device and outside circuit electric connection, utilize the cylindrical bradyseism section of thick bamboo of cavity to carry out elastic connection between loading board and the bradyseism groove, make the device can cushion the shock attenuation when receiving mechanical vibration, waterproof pad through the U-shaped design and the bottom block of loading board, increase the leakproofness between loading board and the bradyseism groove, prevent that outside aqueous vapor from getting into the inside of bradyseism groove and causing the corruption to the metal tie point.

Preferably, the inside of loading board is equipped with the mounting groove, and the inside outside of loading board is equipped with the spacing groove. The mounting groove can provide the position of installation for the subassembly of inside, and the spacing groove can be connected with the limiting plate block, and then can guarantee the loading board at the stability of vertical direction when the loading board vertical migration cushions the shock attenuation to prevent that the horizontal direction from rocking from appearing in the loading board.

Preferably, a limiting plate is installed on one side of the waterproof pad, and a silica gel sleeve is installed on the outer side of the limiting plate. The limiting plate can be connected with the limiting groove in a clamping mode, so that the stability of the bearing plate during buffering and shock absorption can be guaranteed, the sealing performance between the limiting plate and the limiting groove can be improved through the silica gel sleeve, and then external steam is prevented from entering the device.

Preferably, the bottom of the conducting rod is provided with a mounting seat, and the bottom of the mounting seat is welded with an elastic sheet. The mounting seat can provide the position of installation to the shell fragment, and the shell fragment can make the bottom of bottom plate and other electronic component electric connection, and then can make outside electronic component and the inside circuit electric connection of device.

Preferably, the top of copper board is installed the roof, and the outside of copper board is installed the protection and is filled up. The roof can provide the position of installation to the subassembly at top to can make the subassembly at top and copper carry out electric connection, the protection pad can form the protection around the copper, and can fill up the gap in the copper outside, and then prevent that the copper from taking place to rock in the inside of device.

Preferably, the inside of fixed slot is installed with the welding seat, and the top welding of welding seat has the tin bar. The welding seat can provide welded position to the top of device, and then can make the inside circuit of device and outside circuit electric connection, and the tin bar can melt after the heating, and then can utilize the tin bar to weld outside cable and welding seat to can guarantee the stable transmission of electric current.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the cushioning cylinder is arranged in the cushioning groove, so that the assembly at the top can be elastically supported through the cushioning cylinder, and further the cushioning groove and the bearing plate can be elastically connected, so that when the bottom plate is vibrated, the cushioning cylinder is utilized to buffer the impact force, the impact force on the assembly at the top is reduced, and the stability of the integrated circuit during connection can be further ensured.

2. According to the utility model, the waterproof pad is arranged at the top of the bottom plate, and can be clamped with the bottom of the bearing plate through the U-shaped waterproof pad, so that the waterproof performance between the bearing plate and the bottom plate can be improved on the premise of ensuring the buffering effect of the device, and further, the corrosion of external water vapor entering the device to conductive metal parts can be avoided.

Drawings

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a front external view of the present invention;

FIG. 3 is a partial structural view of the shock absorption assembly of the present invention;

fig. 4 is a partial structural view of the connecting assembly of the present invention.

In the figure: 1. a carrier plate; 101. a limiting groove; 102. mounting grooves; 2. a base plate; 201. a limiting hole; 202. a waterproof pad; 203. a silica gel sleeve; 204. a limiting plate; 3. a cushioning component; 301. a cushioning tank; 302. a cushioning cylinder; 303. a conductive rod; 304. a mounting seat; 305. a spring plate; 4. a connecting assembly; 401. a copper plate; 402. a top plate; 403. a protective pad; 404. a conveyor belt; 405. a fixing sheet; 5. an insulating plate; 501. a tin block; 502. welding a base; 503. and fixing the grooves.

Detailed Description

The technical solution of the present invention is further explained with reference to the accompanying drawings and specific embodiments.

Example one

As shown in fig. 1-4, the novel integrated circuit board with a shock-absorbing structure provided by the utility model comprises a bearing plate 1, a bottom plate 2, a shock-absorbing component 3 and a connecting component 4, wherein an insulating plate 5 is installed at the top of the bearing plate 1, fixing grooves 503 are equidistantly arranged inside the insulating plate 5, the connecting component 4 is installed inside the bearing plate 1, a copper plate 401 is installed inside the connecting component 4, a transmission belt 404 is installed at the bottom of the copper plate 401, fixing pieces 405 are installed at two ends of the transmission belt 404, the shock-absorbing component 3 is installed at the bottom of the fixing pieces 405, a shock-absorbing groove 301 is installed inside the shock-absorbing component 3, shock-absorbing cylinders 302 are installed at two sides inside the shock-absorbing groove 301, conducting rods 303 are equidistantly installed at the bottom of the shock-absorbing groove 301, the bottom plate 2 is installed at the bottom of the shock-absorbing groove 301, limiting holes 201 are arranged at two sides inside the bottom plate 2, and a waterproof pad 202 is installed outside the top of the bottom plate 2.

The working principle of the novel integrated circuit board with the damping structure based on the first embodiment is as follows: utilize the tin bar 501 and the external circuit at welding seat 502 top to weld, make the inside circuit of device and outside circuit electric connection, utilize hollow cylindrical bradyseism section of thick bamboo 302 to carry out elastic connection between loading board 1 and the bradyseism groove 301, make the device can cushion the shock attenuation when receiving mechanical oscillation, waterproof pad 202 through the U-shaped design and the bottom block of loading board 1 increase the leakproofness between loading board 1 and the bradyseism groove 301.

Example two

As shown in fig. 1-4, compared to the first embodiment, the present invention provides a novel integrated circuit board with a shock absorbing structure, which further includes: the inside of loading board 1 is equipped with mounting groove 102, and the inside outside of loading board 1 is equipped with spacing groove 101, limiting plate 204 is installed to one side of waterproof pad 202, and silica gel cover 203 is installed to the outside of limiting plate 204, mount pad 304 is installed to the bottom of conducting rod 303, and the bottom welding of mount pad 304 has shell fragment 305, roof 402 is installed at the top of copper 401, and protection pad 403 is installed in the outside of copper 401, the internally mounted of fixed slot 503 has welding seat 502, and the top welding of welding seat 502 has tin plate 501.

In this embodiment, the mounting groove 102 can provide a mounting position for the internal component, the limiting groove 101 can be connected with the limiting plate 204 in a clamping manner, so as to ensure the stability of the loading plate 1 in the vertical direction when the loading plate 1 moves vertically for buffering and damping, and prevent the loading plate 1 from providing a mounting position for the elastic sheet 305, the elastic sheet 305 can electrically connect the bottom of the bottom plate 2 with other electronic components, so as to electrically connect the external electronic components with the circuit inside the device, the top plate 402 can provide a mounting position for the top component, and can electrically connect the top component with the copper plate 401, the protection pad 403 can protect the periphery of the copper plate 401, and can fill up the gap outside the copper plate 401, so as to prevent the copper plate 401 from shaking inside the device, and the welding seat 502 can provide a welding position for the top of the device, and then can make the inside circuit of device and outside circuit electric connection, tin 501 can melt after the heating, and then can utilize tin 501 to weld outside cable and soldering socket 502 to can guarantee the stable transmission of electric current.

The above embodiments are merely some preferred embodiments of the present invention, and those skilled in the art can make various alternative modifications and combinations of the above embodiments based on the technical solution of the present invention and the related teaching of the above embodiments.

Claims

1. The utility model provides a novel integrated circuit board with shock-absorbing structure, includes loading board (1), bottom plate (2), bradyseism subassembly (3) and coupling assembling (4), its characterized in that: the top of the bearing plate (1) is provided with an insulating plate (5), fixing grooves (503) are equidistantly arranged in the insulating plate (5), the interior of the bearing plate (1) is provided with a connecting component (4), a copper plate (401) is arranged in the connecting component (4), a transmission belt (404) is arranged at the bottom of the copper plate (401), fixing pieces (405) are arranged at two ends of the transmission belt (404), the bottom of the fixing plate (405) is provided with a cushioning component (3), a cushioning groove (301) is arranged in the cushioning component (3), the two sides in the shock absorption groove (301) are provided with shock absorption cylinders (302), the bottom of the shock absorption groove (301) is provided with conducting rods (303) at equal intervals, bottom plate (2) are installed to the bottom of bradyseism groove (301), the inside both sides of bottom plate (2) are equipped with spacing hole (201), waterproof pad (202) are installed in the top outside of bottom plate (2).

2. The novel integrated circuit board with shock-absorbing structure as claimed in claim 1, wherein: the bearing plate (1) is internally provided with a mounting groove (102), and the outer side of the interior of the bearing plate (1) is provided with a limiting groove (101).

3. The novel integrated circuit board with shock-absorbing structure of claim 1, wherein: a limiting plate (204) is installed on one side of the waterproof pad (202), and a silica gel sleeve (203) is installed on the outer side of the limiting plate (204).

4. The novel integrated circuit board with shock-absorbing structure of claim 1, wherein: the bottom of conducting rod (303) is installed with mount pad (304), and the bottom welding of mount pad (304) has shell fragment (305).

5. The novel integrated circuit board with shock-absorbing structure of claim 1, wherein: the top of copper (401) is installed roof (402), and protection pad (403) is installed to the outside of copper (401).

6. The novel integrated circuit board with shock-absorbing structure as claimed in claim 1, wherein: the inside of fixed slot (503) is installed and is welded seat (502), and the top welding of welding seat (502) has tin (501).