CN211792218U - Printed circuit board with shock-absorbing function - Google Patents
Printed circuit board with shock-absorbing function Download PDFInfo
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- CN211792218U CN211792218U CN202020289832.0U CN202020289832U CN211792218U CN 211792218 U CN211792218 U CN 211792218U CN 202020289832 U CN202020289832 U CN 202020289832U CN 211792218 U CN211792218 U CN 211792218U
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- circuit board
- plate
- protection
- mounting plate
- buffer spring
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Abstract
The utility model relates to the technical field of printed circuit boards, in particular to a printed circuit board with a shock absorption function, which comprises a circuit board body and a protective edge device; the edge protection device comprises an upper protection plate and a lower protection plate; the top of the circuit board body is provided with an upper connecting plate; the bottom of the circuit board body is provided with a lower connecting plate; the top of the upper connecting plate is connected with the upper mounting plate through an upper buffer spring; the bottom of the lower connecting plate is connected with the lower mounting plate through a lower buffer spring; the top of the upper mounting plate is connected with the bottom of the upper protection plate; the bottom of the lower mounting plate is connected with the top of the lower protection plate. The utility model discloses a set up buffer spring and lower buffer spring respectively in the top and the bottom of circuit board body, when printed circuit board bumps, under last buffer spring and lower buffer spring's cushioning effect, can reduce the vibrations of circuit board body to it is impaired because of the collision to have protected the circuit board body.
Description
Technical Field
The utility model relates to a printed circuit board technical field, concretely relates to printed circuit board with shock-absorbing function.
Background
The circuit board is also called as a circuit board, can make the circuit miniaturized, visualized, play an important role in the batch production of fixed circuit and optimizing the layout of electrical appliances, and can also be called as a printed circuit board, and has the characteristics of high wiring density, light weight, thin thickness and good bending property.
But because the use of circuit board is extensive, make the circuit board need have the ability of coping with current service environment, for example insulating, shock attenuation or waterproof etc. receive after damaging can have serious influence to current equipment, cause people's resource loss, current circuit board is mostly simple and easy structure, and is relatively poor to the effect in the aspect of the shock attenuation, influences the work efficiency of device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the above-mentioned among the prior art not enough, provide a printed circuit board with shock-absorbing function.
The purpose of the utility model is realized through the following technical scheme: a printed circuit board with a shock absorption function comprises a circuit board body and an edge protection device coated on the edge of the circuit board body; the edge protection device comprises an upper protection plate and a lower protection plate; the circuit board body is arranged between the upper protection plate and the lower protection plate;
the top of the circuit board body is provided with an upper connecting plate; the bottom of the circuit board body is provided with a lower connecting plate; the printed circuit board with the damping function further comprises an upper buffer spring, an upper mounting plate, a lower buffer spring and a lower mounting plate; the top of the upper connecting plate is connected with the upper mounting plate through an upper buffer spring; the bottom of the lower connecting plate is connected with the lower mounting plate through a lower buffer spring;
the top of the upper mounting plate is connected with the bottom of the upper protection plate; the bottom of the lower mounting plate is connected with the top of the lower protection plate.
The utility model is further arranged that the top of the upper connecting plate is provided with a first protective column; the bottom of the upper mounting plate is provided with a second protection column; the upper buffer spring is sleeved on the first protection column and the second protection column.
The utility model is further arranged that the bottom of the lower connecting plate is provided with a third guard post; a fourth protection column is arranged at the top of the lower mounting plate; the lower buffer spring is sleeved on the third protection column and the fourth protection column.
The utility model is further provided with that the upper protection plate is provided with a first screw hole in a penetrating way; the upper mounting plate is provided with a second screw hole in a penetrating manner; the bottom of the upper mounting plate is provided with a nut; the printed circuit board with the damping function further comprises a fine adjustment bolt; the fine tuning bolt sequentially penetrates through the first screw hole, the second screw hole and the nut.
The utility model discloses further set up to, the nut inlays the bottom of locating the mounting panel.
The utility model discloses further set up to, the safe edge device is equipped with the groove of stepping down that is used for placing the circuit board body.
The utility model is further arranged in that the circuit board body comprises an upper layer board, a first grid layer, a double-sided substrate, a second grid layer and a lower layer board which are arranged from top to bottom in sequence; the upper layer plate and the lower layer plate are respectively electrically connected with the double-sided substrate; the first grid layer is composed of a plurality of vertically crossed strip-shaped epoxy resins; the second grid layer is composed of a plurality of vertically intersected strip-shaped silica gel plates.
The utility model is further provided with that the first grid layer is provided with first heat dissipation holes; and the second grid layer is provided with second heat dissipation holes.
The utility model is further arranged that the circuit board body is provided with a through hole in a penetrating way; a conductive layer is arranged in the through hole; the upper layer plate and the lower layer plate are electrically connected with the double-sided substrate through the conducting layers respectively.
The utility model has the advantages that: the utility model discloses a set up buffer spring and lower buffer spring respectively in the top and the bottom of circuit board body, when printed circuit board bumps, under last buffer spring and lower buffer spring's cushioning effect, can reduce the vibrations of circuit board body to it is impaired because of the collision to have protected the circuit board body.
Drawings
The invention is further described with the aid of the accompanying drawings, in which, however, the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived from the following drawings without inventive effort.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a schematic structural diagram of the circuit board body of the present invention;
fig. 4 is a schematic structural view of the edge protection device of the present invention;
wherein: 1. a circuit board body; 11. an upper plate; 12. a first mesh layer; 13. a double-sided substrate; 14. a second mesh layer; 15. a lower layer plate; 2. a protective edge device; 21. an upper protection plate; 22. a lower guard plate; 23. a yielding groove; 31. an upper connecting plate; 32. a lower connecting plate; 41. an upper buffer spring; 42. a lower buffer spring; 51. an upper mounting plate; 52. a lower mounting plate; 61. a first protective column; 62. a second guard post; 63. a third guard post; 64. a fourth guard post; 71. a first screw hole; 72. a second screw hole; 73. a nut; 74. fine-tuning the bolt; 81. a first heat dissipation hole; 82. a second heat dissipation hole; 9. a through hole; 91. and a conductive layer.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 4, the printed circuit board with a shock absorbing function according to the present embodiment includes a circuit board body 1 and an edge protection device 2 coated on an edge of the circuit board body 1; the edge protection device 2 comprises an upper protection plate 21 and a lower protection plate 22; the circuit board body 1 is arranged between an upper protection plate 21 and a lower protection plate 22;
the top of the circuit board body 1 is provided with an upper connecting plate 31; the bottom of the circuit board body 1 is provided with a lower connecting plate 32; the printed circuit board with the shock absorption function further comprises an upper buffer spring 41, an upper mounting plate 51, a lower buffer spring 42 and a lower mounting plate 52; the top of the upper connecting plate 31 is connected with an upper mounting plate 51 through an upper buffer spring 41; the bottom of the lower connecting plate 32 is connected with a lower mounting plate 52 through a lower buffer spring 42;
the top of the upper mounting plate 51 is connected with the bottom of the upper protection plate 21; the bottom of the lower mounting plate 52 is connected to the top of the lower fender 22.
Specifically, the printed circuit board with a shock absorption function according to this embodiment can protect the edge position of the circuit board body 1 by wrapping the edge protection device 2 on the edge of the circuit board body 1; in addition, the upper buffer spring 41 and the lower buffer spring 42 are respectively arranged at the top and the bottom of the circuit board body 1, so that when the printed circuit board collides, the vibration of the circuit board body 1 can be reduced under the buffer action of the upper buffer spring 41 and the lower buffer spring 42, and the circuit board body 1 is protected from being damaged due to collision.
In the printed circuit board with the shock absorption function in this embodiment, the top of the upper connecting plate 31 is provided with a first protection column 61; the bottom of the upper mounting plate 51 is provided with a second protection column 62; the upper buffer spring 41 is sleeved on the first protection column 61 and the second protection column 62. The upper buffer spring 41 is convenient to limit through the arrangement.
In the printed circuit board with the shock absorption function of this embodiment, the bottom of the lower connection plate 32 is provided with a third protection column 63; a fourth protection column 64 is arranged at the top of the lower mounting plate 52; the lower buffer spring 42 is sleeved on the third protection column 63 and the fourth protection column 64. The lower buffer spring 42 is limited by the arrangement.
In the printed circuit board with the damping function in this embodiment, the upper protection plate 21 is provided with a first screw hole 71 in a penetrating manner; the upper mounting plate 51 is provided with a second screw hole 72 in a penetrating way; the bottom of the upper mounting plate 51 is provided with a nut 73; the printed circuit board with the shock absorption function further comprises a fine adjustment bolt 74; the fine adjustment bolt 74 is inserted through the first screw hole 71, the second screw hole 72, and the nut 73 in sequence. Specifically, by providing the fine adjustment bolt 74, the distance between the upper guard plate 21 and the upper mounting plate 51 can be finely adjusted, so that the tightness of the upper cushion spring 41 is adjusted, and the cushioning degree of the upper cushion spring 41 is adjusted.
In the printed circuit board with the shock absorbing function of the present embodiment, the nut 73 is embedded in the bottom of the upper mounting plate 51. The above arrangement is convenient for use in adjusting the trim bolts 74.
In the embodiment, the edge protection device 2 is provided with the abdicating groove 23 for placing the circuit board body 1. Through the arrangement, the circuit board body 1 can be conveniently placed in the edge protection device 2.
According to the printed circuit board with the shock absorption function, the circuit board body 1 comprises an upper plate 11, a first grid layer 12, a double-sided substrate 13, a second grid layer 14 and a lower plate 15 which are sequentially arranged from top to bottom; the upper plate 11 and the lower plate 15 are respectively electrically connected with the double-sided substrate 13; the first grid layer 12 is made of a plurality of vertically crossed strip-shaped epoxy resins; the second grid layer 14 is composed of a plurality of vertically intersected strip-shaped silica gel plates.
Specifically, in the present embodiment, the grid-shaped board layers are respectively used between the upper board 11 and the double-sided board 13, and between the double-sided board 13 and the lower board 15, instead of the board-type prepreg, and since the second grid layer 14 is formed by a plurality of vertically intersecting strip-shaped silicone plates, the silicone plates have high elasticity, and the shock absorption performance of the circuit board body 1 can be further enhanced.
In the printed circuit board with a shock absorption function according to this embodiment, the first mesh layer 12 is provided with a first heat dissipation hole 81; the second mesh layer 14 is provided with second heat dissipation holes 82. The arrangement facilitates heat dissipation of the circuit board body 1.
In the printed circuit board with the damping function of the embodiment, the through hole 9 is formed in the circuit board body 1 in a penetrating manner; a conductive layer 91 is arranged in the through hole 9; the upper plate 11 and the lower plate 15 are electrically connected to the double-sided substrate 13 through the conductive layer 91. The electrical communication between the double-sided substrate 13, the upper board 11, and the lower board 15 is achieved by the above arrangement.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. The utility model provides a printed circuit board with shock-absorbing function which characterized in that: comprises a circuit board body (1) and an edge protection device (2) coated on the edge of the circuit board body (1); the edge protection device (2) comprises an upper protection plate (21) and a lower protection plate (22); the circuit board body (1) is arranged between the upper protection plate (21) and the lower protection plate (22);
the top of the circuit board body (1) is provided with an upper connecting plate (31); the bottom of the circuit board body (1) is provided with a lower connecting plate (32); the printed circuit board with the shock absorption function further comprises an upper buffer spring (41), an upper mounting plate (51), a lower buffer spring (42) and a lower mounting plate (52); the top of the upper connecting plate (31) is connected with an upper mounting plate (51) through an upper buffer spring (41); the bottom of the lower connecting plate (32) is connected with a lower mounting plate (52) through a lower buffer spring (42);
the top of the upper mounting plate (51) is connected with the bottom of the upper protection plate (21); the bottom of the lower mounting plate (52) is connected with the top of the lower protection plate (22).
2. The printed wiring board with a vibration damping function according to claim 1, wherein: the top of the upper connecting plate (31) is provided with a first protective column (61); a second protection column (62) is arranged at the bottom of the upper mounting plate (51); the upper buffer spring (41) is sleeved on the first protection column (61) and the second protection column (62).
3. The printed wiring board with a vibration damping function according to claim 1, wherein: a third protection column (63) is arranged at the bottom of the lower connecting plate (32); a fourth protection column (64) is arranged at the top of the lower mounting plate (52); the lower buffer spring (42) is sleeved on the third protection column (63) and the fourth protection column (64).
4. The printed wiring board with a vibration damping function according to claim 1, wherein: the upper protection plate (21) is provided with a first screw hole (71) in a penetrating way; the upper mounting plate (51) is provided with a second screw hole (72) in a penetrating way; the bottom of the upper mounting plate (51) is provided with a nut (73); the printed circuit board with the shock absorption function further comprises a fine adjustment bolt (74); the fine adjustment bolt (74) is sequentially arranged in the first screw hole (71), the second screw hole (72) and the nut (73) in a penetrating mode.
5. The printed wiring board with a vibration damping function according to claim 4, wherein: the nut (73) is embedded at the bottom of the upper mounting plate (51).
6. The printed wiring board with a vibration damping function according to claim 1, wherein: the edge protection device (2) is provided with a yielding groove (23) for placing the circuit board body (1).
7. The printed wiring board with a vibration damping function according to claim 1, wherein: the circuit board body (1) comprises an upper plate (11), a first grid layer (12), a double-sided substrate (13), a second grid layer (14) and a lower plate (15) which are sequentially arranged from top to bottom; the upper layer plate (11) and the lower layer plate (15) are respectively electrically connected with the double-sided substrate (13); the first grid layer (12) is composed of a plurality of vertically crossed strip-shaped epoxy resins; the second grid layer (14) is composed of a plurality of vertically intersected strip-shaped silica gel plates.
8. The printed wiring board with a vibration damping function according to claim 7, wherein: the first grid layer (12) is provided with first heat dissipation holes (81); the second grid layer (14) is provided with second heat dissipation holes (82).
9. The printed wiring board with a vibration damping function according to claim 7, wherein: the circuit board body (1) is provided with a through hole (9) in a penetrating way; a conductive layer (91) is arranged in the through hole (9); the upper layer plate (11) and the lower layer plate (15) are respectively electrically connected with the double-sided substrate (13) through the conducting layer (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020289832.0U CN211792218U (en) | 2020-03-10 | 2020-03-10 | Printed circuit board with shock-absorbing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020289832.0U CN211792218U (en) | 2020-03-10 | 2020-03-10 | Printed circuit board with shock-absorbing function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211792218U true CN211792218U (en) | 2020-10-27 |
Family
ID=72939617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020289832.0U Active CN211792218U (en) | 2020-03-10 | 2020-03-10 | Printed circuit board with shock-absorbing function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211792218U (en) |
-
2020
- 2020-03-10 CN CN202020289832.0U patent/CN211792218U/en active Active
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