CN219068493U

CN219068493U - Bracket assembly, electronic equipment and electric automobile

Info

Publication number: CN219068493U
Application number: CN202223340591.6U
Authority: CN
Inventors: 陈高锡; 钟旭; 林和清; 周权
Original assignee: Suzhou Huichuan United Power System Co Ltd
Current assignee: Suzhou Huichuan United Power System Co Ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-05-23
Anticipated expiration: 2032-12-12

Abstract

The utility model discloses a bracket assembly, electronic equipment and an electric automobile. The bracket assembly comprises a first bracket and is fixedly arranged on the circuit board; the first bracket is provided with a first installation position for installing the first electronic component module, and the first installation position is arranged at intervals with the circuit board. According to the technical scheme, the bracket assembly enables the first electronic component module to be lifted relative to the circuit board, and compared with a mode of being directly and closely mounted on the circuit board, the bracket assembly reduces the occupied area of the circuit board, improves the space utilization rate and enables the structure to be more compact.

Description

Bracket assembly, electronic equipment and electric automobile

Technical Field

The utility model relates to the technical field of electronics, in particular to a bracket assembly, electronic equipment and an electric automobile.

Background

In the related art, electronic components inside electronic devices such as an On Board Charger (On Board Charger), a Direct Current (dc converter), a Direct Current (PDU) (Power Distribution Unit) and the like are directly welded On a PCB, which easily causes a problem of large occupied space, for example, an inductance module may be directly attached to a circuit Board after being welded On the PCB, which causes a problem that the occupied space is large, and the whole circuit Board is also enlarged, and the whole structure of the whole machine is large.

Disclosure of Invention

The utility model mainly aims to provide a bracket assembly which aims to reduce the occupied area of an electronic component module on a circuit board and enable the structure to be more compact.

To achieve the above object, the present utility model provides a bracket assembly, comprising:

the first bracket is fixedly arranged on the circuit board; the first bracket is provided with a first installation position for installing a first electronic component module, and the first installation position is arranged at intervals with the circuit board.

In one embodiment of the present utility model, the first bracket includes:

the support columns are arranged on the circuit board at intervals; and

the support plates are arranged at one ends of the support columns, far away from the circuit board, and are used for bearing the first electronic component modules, and the first installation positions are located at one sides of the support plates, far away from the circuit board.

In an embodiment of the present utility model, a fixing portion is disposed at an end of the support column near the circuit board, and the support column is fixedly connected with the circuit board through the fixing portion.

In an embodiment of the utility model, the support column is provided with a through hole, and the pins of the first electronic component module pass through the through hole and are welded and fixed with the circuit board.

In an embodiment of the utility model, the first electronic component module is an inductance module, at least two side plates are arranged on the supporting plate, and the two side plates and the supporting plate are enclosed to form the first installation position;

the winding post of the inductance module is arranged at the first installation position, and the coil of the inductance module is wound on the winding post.

In an embodiment of the utility model, a plurality of support columns and one side of the support plate, which faces the circuit board, enclose to form a second installation position, the first support is provided with a first shock absorption structure at the second installation position, the first shock absorption structure is used for propping against a second electronic component module installed at the second installation position, and the second electronic component module is arranged on the circuit board.

In an embodiment of the utility model, the first shock absorbing structure includes a first shock absorbing member, and the first shock absorbing member is connected to a side of the support board facing the circuit board, so as to be abutted against an end of the second electronic component module, which is close to the support board.

In an embodiment of the utility model, the first damping structure includes a second damping member, and the second damping member is connected to the support column, so as to be abutted against a side wall of the second electronic component module.

In an embodiment of the utility model, the second shock absorbing member is disposed around an outer peripheral wall of the second electronic component module.

In an embodiment of the present utility model, the bracket assembly further includes a second bracket fixedly disposed on the circuit board, the second bracket is provided with a third mounting position for mounting a third electronic component module, and the third electronic component module is disposed on the circuit board;

and the second support is provided with a second damping structure at the third installation position for propping against the third electronic component module.

In an embodiment of the utility model, the second shock absorbing structure includes at least two third shock absorbing members, and the two third shock absorbing members are abutted against the side walls of the third electronic component module.

In an embodiment of the utility model, the third shock absorbing member is an arc-shaped block.

In order to achieve the above object, the present utility model further provides an electronic device, including a housing, a circuit board, a first electronic component module disposed on the circuit board, and the bracket assembly described above; the support assembly is fixedly arranged on the circuit board, and the circuit board, the first electronic component module and the support assembly are all arranged in the shell.

In order to achieve the above purpose, the utility model also provides an electric automobile, which comprises the electronic equipment.

In the bracket assembly, the first bracket is arranged on the circuit board, and the first bracket is provided with the first mounting position for mounting the first electronic component module, and the first mounting position is arranged at intervals with the circuit board, so that the first electronic component module is lifted relative to the circuit board, and compared with the mode of being directly and closely mounted on the circuit board, the occupied area of the circuit board is reduced, the space utilization rate is improved, and the structure is more compact.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present utility model;

fig. 2 is an assembly schematic diagram of a bracket assembly and an inductance module according to an embodiment of the utility model;

fig. 3 is an assembly schematic diagram of the second bracket and the second shock absorbing structure according to an embodiment of the utility model.

Reference numerals illustrate:

the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

Meanwhile, the meaning of "and/or" and/or "appearing throughout the text is to include three schemes, taking" a and/or B "as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The utility model provides a bracket assembly 100, which is applied to electronic equipment, wherein the electronic equipment comprises a circuit board 200 and a first electronic component module 300 arranged on the circuit board 200. As shown in fig. 1 to 2, the bracket assembly 100 includes a first bracket 110 fixedly disposed on the circuit board 200, and a first mounting location 110a for mounting the first electronic component module 300 is disposed on the first bracket 110, and the first mounting location 110a is spaced from the circuit board 200.

In this embodiment, the first electronic component module 300 is disposed on the circuit board 200, so as to implement corresponding functions. The first bracket 110 is disposed on the circuit board 200, the first bracket 100 has a first mounting position 110a for mounting the first electronic component module 300, and the first mounting position 110a is spaced from the circuit board 200, so that the first electronic component module 300 is spaced from the circuit board 200, that is, the first electronic component module 300 is lifted relative to the circuit board 200, the occupied area of the first electronic component module 300 on the circuit board 200 is reduced, the space utilization is increased, the transverse occupied size is reduced, and the effect of reducing the overall size of the circuit board 200 is achieved.

It can be appreciated that the first electronic component module 300 forms a mounting cavity between the first bracket 110 and the circuit board 200, and can mount or accommodate other electronic component modules, so that the space utilization rate is further improved, and the overall structure is more compact.

In addition, during practical application, except that be equipped with water course module 700 in the electronic equipment and dispel the heat the interior heating element of electronic equipment and cool down, still can connect the upper cover of heating element and shell 600 through heat conduction material such as heat conduction glue to dispel the heat with the heat transfer of heating element to the upper cover, this embodiment is with first electronic element module 300 rise through first support 110, then reduced the distance between first electronic element module 300 and the upper cover, make first electronic element module 300 more closely apart from the upper cover, thereby can reduce the quantity of heat conduction material such as heat conduction glue between first electronic element module 300 and the upper cover, reduce material cost.

Alternatively, the first bracket 110 is fixedly mounted on the circuit board 200, and may be fixed on the circuit board 200 by welding, clamping, screwing, or the like. The specific manner of fixing is not limited herein.

Alternatively, the first electronic component module 300 may be an inductance module, a capacitance module, or other electronic component module, or the like.

In the bracket assembly 100 according to the technical scheme of the utility model, the first bracket 110 is arranged on the circuit board 200, the first bracket 110 is provided with the first mounting position 110a for mounting the first electronic component module 300, and the first mounting position 110a is arranged at intervals from the circuit board 200, so that the first electronic component module 300 is lifted relative to the circuit board 200, and compared with the mode of being directly and closely mounted on the circuit board 200, the occupied area of the circuit board 200 is reduced, the space utilization rate is improved, and the structure is more compact.

In an embodiment of the present utility model, referring to fig. 1 and 2, the first support 110 includes a plurality of support columns 113 and a support plate 111, the plurality of support columns 113 are disposed on the circuit board 200 at intervals, the support plate 111 is disposed at an end of the plurality of support columns 113 away from the circuit board 200, the support plate 111 is used for carrying the first electronic component module 300, and the first mounting location 110a is located at a side of the support plate 111 away from the circuit board 200.

In this embodiment, for the structure of the first bracket 110, the first electronic component module 300 is disposed at one end of the support plate 111 away from the circuit board 200, and the plurality of support columns 113 are connected to one side of the support plate 111 facing the circuit board 200, so as to support the support plate 111, thereby realizing the function of setting the first electronic component module 300 and the circuit board 200 at intervals. The plurality of support columns 113 and the support plate 111 form a second mounting location 110b, and it can be appreciated that the second mounting location 110b can be used for mounting or accommodating other modules of electronic components, such as a capacitor module, a functional module, or other modules. In this way, the space utilization can be further improved.

In an embodiment of the utility model, a fixing portion 1131 is disposed at an end of the support column 113 near the circuit board 200, and the support column 113 is fixedly connected to the circuit board 200 through the fixing portion 1131.

Optionally, the fixing portion 1131 may be a metal pin, a threaded fixing post, a snap fixing post, etc., and the specific structure thereof may be according to the actual situation. Alternatively, the fixing portion 1131 may be fixedly connected to the circuit board 200 by welding, screws or a snap, etc.

In this embodiment, the fixing of the support columns 113 and the circuit board 200 can be realized by adopting a manner of welding and fixing metal pins, so that the installation process is simplified.

In an embodiment of the utility model, the supporting column 113 is provided with a through hole 113a, and the pins 320 of the first electronic component module 300 are soldered to the circuit board 200 after passing through the through hole 113 a.

It can be appreciated that after the first electronic component module 300 is lifted by the first bracket 110, it still needs to be electrically connected with the circuit board 200, and in this embodiment, by providing the through holes 113a on the support columns 113, the pins 320 of the first electronic component module 300 pass through the through holes 113a and then are welded and fixed with the circuit board 200, so that not only the electrical connection function between the first electronic component module 300 and the circuit board 200, but also the fixing and guiding function for the pins 320 are realized.

In practical application, when the fixing portion 1131 of the support column 113 is a metal pin, the pin 320 of the first electronic component module 300 passes through the through hole 113a and then reaches the metal pin, and at this time, the pin 320 and the metal pin can share a metal welding hole of the circuit board 200 and are welded together on the circuit board 200, so as to integrate the first electronic component module 300 with the first bracket 110, thereby improving the welding efficiency; alternatively, the pins 320 and the metal pins may be respectively soldered on the circuit board 200 through different metal soldering holes of the circuit board 200, so as to facilitate the separate replacement and maintenance of the first electronic component module 300.

Further, the first electronic component module 300 is an inductance module; the support plate 111 is provided with at least two side plates 112, and the two side plates 112 and the support plate 111 are enclosed to form a first installation position 110a; the winding post 330 of the inductance module is mounted on the first mounting location 110a, and the coil 310 of the inductance module is wound on the winding post 330.

It will be appreciated that the support plate 111 encloses the two side plates 112 to form a first mounting location 110a, i.e. the inductor module is mounted between the two side plates 112, while the inductor module has a coil 310 and a winding post 330, and that by mounting the winding post 330 between the two adjacent side plates 112, a reliable mounting of the inductor module is achieved.

In practical applications, at least two first mounting locations 110a may be formed on the support plate 111, where an inductance module may be mounted at each first mounting location 110a, and the specific number may be determined according to practical requirements, which may not be limited herein.

Optionally, a winding post 330 is connected between every two adjacent side plates 112, and the winding post 330 extends transversely, so that after the coil 310 of the inductance module is wound on the winding post 330, the leads at two ends of the coil 310 can extend downward smoothly, so as to be guided to the circuit board 200 to realize an electrical connection function.

It can be appreciated that the coil 310 of the inductance module is wound on the winding post 330, and by extending the lead wire of the coil 310 from the support plate 111 along the support post 113 toward the circuit board 200, that is, the support post 113 plays a role of guiding and supporting the lead wire, the lead wire is prevented from being disordered.

In an embodiment of the present utility model, referring to fig. 1 and 2, a plurality of support columns 113 and a side of the support plate 111 facing the circuit board 200 enclose to form a second mounting location 110b, the first support 110 is provided with a first shock-absorbing structure 120 at the second mounting location 110b, the first shock-absorbing structure 120 is used for abutting against a second electronic component module 400 mounted at the second mounting location 110b, and the second electronic component module 400 is disposed on the circuit board 200.

As can be seen from the foregoing embodiments, the first bracket 110 serves to support and mount the first electronic component module 300. The first shock absorbing structure 120 is disposed at the second mounting position 110b, and the first shock absorbing structure 120 is used for propping against the second electronic component module 400, so as to realize a shock absorbing function of the second electronic component module 400, and prevent the second electronic component module 400 from vibrating or even being damaged by collision when the electronic equipment is subjected to external vibration, so as to protect the second electronic component module 400.

It can be appreciated that the bracket assembly 100 of the present embodiment can not only play a role in supporting and installing the first electronic component module 300, but also play a role in damping the second electronic component module 400, so as to ensure that the second electronic component module 400 is not damaged in a vibration environment, and improve the functional integration level of the bracket assembly 100.

In practical applications, the shape and structure of the first shock absorbing structure 120 may be a single shock absorbing block structure or a plurality of separate shock absorbing block structures. In the case of an integral damper block structure, the first damper structure 120 may be disposed around the outer peripheral wall of the second electronic component module 400 to ensure a multidirectional anti-collision effect of the second electronic component module 400. In the case of a plurality of separate damper block structures, the damper block structures may be disposed at regular intervals around the outer peripheral wall of the second electronic component module 400, or may be disposed at intervals along the height direction of the first bracket 110 with respect to the circuit board 200 at the outer wall of the second electronic component module 400. The specific structural shape of the first shock absorbing structure 120 is not limited herein.

Alternatively, the first shock absorbing structure 120 may be made of a soft material having a certain plasticity, such as soft rubber, silica gel, or sponge.

Alternatively, the second electronic component module 400 may be a capacitive module.

In an embodiment of the present utility model, referring to fig. 1 and 2, the first shock absorbing structure 120 includes a first shock absorbing member 121, and the first shock absorbing member 121 is connected to a side of the support board 111 facing the circuit board 200 for abutting against an end of the second electronic component module 400 near the support board 111.

It can be appreciated that the second mounting location 110b is located below (in the direction of the drawing) the first mounting location 110a, and in this embodiment, by disposing the first shock absorbing member 121 on the top of the second mounting location 110b, the first shock absorbing member 121 abuts against the top wall of the second electronic component module 400, so as to weaken the vibration degree of the second electronic component module 400 in the height direction of the first bracket 110 relative to the circuit board 200, thereby preventing the second electronic component module 400 from being separated from the circuit board 200 in the vibration environment, and ensuring the safety of the second electronic component module 400.

Alternatively, the first shock absorbing member 121 may be made of a soft material having a certain plasticity, such as soft rubber, silica gel, or sponge, etc. Alternatively, the first shock absorbing member 121 may be fixed to the first bracket 110 by an adhesive.

Alternatively, the first shock absorbing member 121 may be a block structure or a plate structure.

In an embodiment of the present utility model, the first shock absorbing structure 120 includes a second shock absorbing member 122, the second shock absorbing member 122 is connected to the support column 113, and the second shock absorbing member 122 abuts against a side wall of the second electronic component module 400.

In this embodiment, the first shock absorbing structure 120 is provided with the second shock absorbing member 122 at the middle position of the second mounting position 110b along the height direction of the first bracket 110 relative to the circuit board 200, and the second shock absorbing member 122 can support against the side wall of the second electronic component module 400, so as to avoid shaking when the second electronic component module 400 is vibrated, and ensure the safety of the second electronic component module 400.

It can be appreciated that the first shock absorbing structure 120 may include only the first shock absorbing member 121 or only the second shock absorbing member 122, or include both the first shock absorbing member 121 and the second shock absorbing member 122, when including both the first shock absorbing member 121 and the second shock absorbing member 122, not only can the shock of the second electronic component module 400 in the height direction of the first bracket 110 relative to the circuit board 200 be limited, but also the left-right shaking of the second electronic component module 400 can be limited, thereby ensuring a better shock absorbing effect.

In practical application, the second shock absorbing member 122 may abut against a portion of the sidewall of the second electronic component module 400, and may be disposed around the outer periphery of the second electronic component module 400.

In an embodiment of the present utility model, the second shock absorbing member 122 is disposed around the outer peripheral wall of the second electronic component module 400 to limit the shake of the second electronic component module 400 in multiple directions, so as to further enhance the shock absorbing effect on the second electronic component module 400.

Optionally, the second damper 122 is a damper ring structure or a damper rib structure.

In practical application, the cross beams 114 can be arranged between two adjacent support columns 113, the cross beams 114 can be connected end to form a cylinder structure around the periphery of the second electronic component module 400, the second shock absorbing members 122 can be fixed on the cross beams 114, the structural strength is improved, the shock absorbing effect on the second electronic component module 400 can be improved, and the reliability is guaranteed.

Alternatively, the first shock absorbing member 121 is adhered to the bottom wall of the support plate 111.

Optionally, the second shock absorbing members 122 are bonded to the support columns 113.

In an embodiment of the present utility model, referring to fig. 1 and 3, the bracket assembly 100 further includes a second bracket 130 fixedly disposed on the circuit board 200, the second bracket 130 is provided with a third mounting location 130a for mounting a third electronic component module 500, and the third electronic component module 500 is disposed on the circuit board 200;

the second bracket 130 is provided with a second shock absorbing structure 140 at the third mounting position 130a for abutting against the third electronic component module 500.

It can be appreciated that, in order to prevent the third electronic component module 500 from being damaged when being subjected to external vibration, the embodiment sets the second bracket 130 on the circuit board 200, the second bracket 130 has the third mounting position 130a, the third electronic component module 500 is mounted at the third mounting position 130a, and the second shock-absorbing structure 140 is disposed at the third mounting position 130a, and the second shock-absorbing structure 140 abuts against the third electronic component module 500, so as to achieve the shock-absorbing effect on the third electronic component module 500, thereby ensuring that the third electronic component module 500 is not damaged when being subjected to external vibration, and improving the reliability of the third electronic component module 500.

Optionally, the second support 130 may adopt a frame structure, and by arranging hollowed-out parts on different surfaces, heat dissipation can be accelerated while cost is saved.

Alternatively, the second bracket 130 is fixedly mounted on the circuit board 200, such as by PIN soldering, on the circuit board 200.

Optionally, the third electronic component module 500 is a busbar capacitance module.

In an embodiment, referring to fig. 1 and 3, the second shock absorbing structure 140 includes at least two third shock absorbing members 141, and the two third shock absorbing members 141 are abutted against the side walls of the third electronic component module 500.

In this embodiment, by arranging at least two third shock absorbing members 141 to abut against the third electronic component module 500, the contact area between the second shock absorbing structure 140 and the third electronic component module 500 is increased, and the shock absorbing effect is improved.

Optionally, at least two third shock absorbing members 141 are oppositely disposed at two sides of the third mounting location 130a, so that the two third shock absorbing members 141 are clamped at two opposite sides of the third electronic component module 500, and have better shock-proof effect on the third electronic component module 500.

Optionally, the second shock absorbing structure 140 includes at least two third shock absorbing member groups disposed at intervals along the height direction of the second bracket 130 relative to the circuit board 200, each third shock absorbing member group includes two third shock absorbing members 141 disposed opposite to each other, and the two third shock absorbing members 141 are clamped at opposite sides of the third electronic component module 500.

In this embodiment, the second shock absorbing structure 140 includes at least two layers of third shock absorbing member sets, that is, at least two layers of third shock absorbing member sets shock-proof the third electronic component module 500, so that the contact area between the second shock absorbing structure 140 and the third electronic component module 500 is increased, and the shock-proof effect is further improved.

It is understood that the at least two layers of the third damper group may be two layers, three layers, four layers, or the like. In the present embodiment, the second shock absorbing structure 140 may include two third shock absorbing member groups that may be respectively disposed at upper and middle portions of the third electronic component module 500 in a height direction with respect to the circuit board 200 in consideration of heat dissipation and cost.

Specifically, each layer of the third damping member set includes two third damping members 141 disposed opposite to each other, and the two third damping members 141 are disposed on opposite sides of the third electronic component module 500, respectively, so as to clamp the third electronic component module 500, thereby preventing the third electronic component module 500 from shaking due to external vibration.

Optionally, the third damping member 141 is an arc block, so as to adapt to the shape of the outer wall of the third electronic component module 500, thereby enabling better lamination and supporting, and achieving a better shockproof effect.

Alternatively, the second shock absorbing structure 140 may be made of a soft material having a certain plasticity, such as soft rubber, silica gel, or sponge.

The utility model further provides an electronic device, referring to fig. 1 to 3, the electronic device includes a housing 600, a circuit board 200, a first electronic component module 300 disposed on the circuit board 200, and a bracket assembly 100, and the specific structure of the bracket assembly 100 refers to the above embodiment. The bracket assembly 100 is fixedly disposed on the circuit board 200, and the first electronic component module 300, the circuit board 200, and the bracket assembly are disposed in the housing 600.

It will be appreciated that the housing 600 serves as a shield, the circuit board 200 is disposed in the housing 600, and the first electronic component module 300 is fixedly connected to the circuit board 200 and electrically connected by soldering. The electronic device further comprises a second electronic component module 400 and a third electronic component module 500 which are arranged on the circuit board 200, the first bracket 110 of the bracket assembly 100 plays a role in supporting the first electronic component module 300 and accommodating the second electronic component module 400, and the first damping structure 120 is arranged on the first bracket 110 to resist the second electronic component module 400, so that the space utilization rate is improved, and the shockproof function of the second electronic component module 400 is realized. The second shock absorbing structure 140 is arranged on the second bracket 130 of the bracket assembly 100 to clamp the third electronic component module 500, so that the third electronic component module 500 is shock-proof.

Optionally, the first electronic component module 300 is an inductance module. It can be appreciated that the inductance module acts as a filter, an oscillator, a choke, etc.

Optionally, the second electronic component module 400 is an X capacitance/Y capacitance module. It can be understood that the function of the X capacitor module is mainly that the power supply line crossing circuit, the EMI filter, the spark eliminating circuit and the like ensure that the finished product of the electronic product meets EMC requirements. The Y capacitor module can inhibit common mode interference, and is used as a connection between two circuits to allow an alternating current signal to pass through and be transmitted to a next-stage circuit. In the process of transmitting and amplifying low-frequency signals, the static working points of the front and rear two-stage circuits are prevented from being influenced mutually.

Optionally, the third electronic component module 500 is a busbar capacitance module. It will be appreciated that the bus capacitor module acts as a filter which acts to attenuate the output voltage of the rectifier circuit to a minimum.

The utility model also provides an electric automobile, which comprises electronic equipment, and the specific structure of the electronic equipment refers to the embodiment, and because the electric automobile adopts all the technical schemes of all the embodiments, the electric automobile at least has all the beneficial effects brought by the technical schemes of the embodiments, and the details are not repeated here.

The foregoing description of the preferred embodiments of the present utility model should not be construed as limiting the scope of the utility model, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims

1. The bracket assembly is characterized by being applied to electronic equipment, wherein the electronic equipment comprises a circuit board and a first electronic component module arranged on the circuit board; the bracket assembly includes:

the first bracket is fixedly arranged on the circuit board; the first bracket is provided with a first installation position for installing the first electronic component module, and the first installation position is arranged at intervals with the circuit board.

2. The bracket assembly of claim 1, wherein the first bracket comprises:

the support columns are arranged on the circuit board at intervals; and

3. The bracket assembly of claim 2, wherein the support post is provided with a fixing portion at an end thereof adjacent to the circuit board, and the support post is fixedly connected with the circuit board through the fixing portion.

4. The bracket assembly of claim 3, wherein the support post is provided with a through hole, and the pins of the first electronic component module are welded and fixed with the circuit board after passing through the through hole.

5. The bracket assembly of claim 4, wherein the first electronic component module is an inductance module, the support plate is provided with at least two side plates, and the two side plates and the support plate are enclosed to form the first installation position;

6. The bracket assembly of any of claims 2-5, wherein a plurality of the support posts and the side of the support plate facing the circuit board enclose a second mounting location, the first bracket is provided with a first shock absorbing structure at the second mounting location for abutting against a second electronic component module mounted at the second mounting location, and the second electronic component module is disposed on the circuit board.

7. The bracket assembly of claim 6, wherein the first shock absorbing structure comprises a first shock absorbing member connected to a side of the support plate facing the circuit board for abutting an end of the second electronic component module adjacent to the support plate.

8. The bracket assembly of claim 6, wherein the first shock absorbing structure includes a second shock absorbing member coupled to the support post for abutting against a side wall of the second electronics module.

9. The rack assembly of claim 8, wherein the second shock absorber is disposed about a peripheral wall of the second electronics module.

10. The rack assembly according to any one of claims 1 to 5, further comprising a second rack fixedly provided on the circuit board, the second rack being provided with a third mounting location for mounting a third electronic component module provided on the circuit board;

11. The bracket assembly of claim 10, wherein the second shock absorbing structure comprises at least two third shock absorbing members, the two third shock absorbing members abutting against side walls of the third electronics module.

12. The bracket assembly of claim 11, wherein the third shock absorbing member is an arcuate block.

13. An electronic device comprising a housing, a circuit board, a first electronics module disposed on the circuit board, and a bracket assembly of any one of claims 1 to 12; the support assembly is fixedly arranged on the circuit board, and the circuit board, the first electronic component module and the support assembly are all arranged in the shell.

14. An electric vehicle comprising the electronic device according to claim 13.