CN221768561U - A packaging structure of a switching power supply module - Google Patents

Abstract

The utility model relates to the technical field of switching power supplies and provides a packaging structure of a switching power supply module, which comprises a packaging shell and a circuit board, wherein a boss extending inwards is arranged in the bottom end of the packaging shell, a heat dissipation cavity communicated with the outside is formed in the bottom end of the boss, a heat conduction assembly is arranged in the bottom end of the packaging shell, the upper end of the packaging shell is connected with a top cover through a clamping structure, buffer mounting column structures are fixed at four corners of the inner wall of the bottom end of the packaging shell, and the circuit board is mounted on the four buffer mounting column structures. Through above-mentioned technical scheme, the switching power supply packaging structure among the prior art has been solved and the heat of switching power supply inside can not be with the effectual outside derivation of switching power supply, leads to the heat can form the high temperature in the inside part of power supply easily, influences switching power supply's life and circuit board hardness easily and fixes on the mounting bracket, easily leads to the circuit board to receive violent vibrations when switching power supply drops, causes the circuit board impaired and can not use the problem easily.

Description

A packaging structure of a switching power supply module

Technical Field

The utility model relates to the technical field of switching power supplies, and in particular to a packaging structure of a switching power supply module.

Background Art

A switching mode power supply, also known as an exchange power supply or a switching converter, is a high-frequency power conversion device and a type of power supply. Its function is to convert a voltage level into the voltage or current required by the user through different forms of architecture. The input of a switching power supply is mostly AC power or DC power, and the output is mostly a device that requires DC power, such as a personal computer, and the switching power supply performs the voltage and current conversion between the two.

The prior art can refer to the Chinese patent with the authorization publication number CN213043587U, which discloses a packaging structure of a switching power supply, including: a packaging structure, a bottom layer and a storage layer, the bottom of the packaging structure is installed with the bottom layer, and the top of the packaging structure is installed with the storage layer, the packaging structure is provided with a packaging component inside, and the bottom layer is provided with a ventilation component, but the packaging structure still has shortcomings:

First, the heat inside the switching power supply cannot be effectively dissipated outward, causing the heat to form high temperatures locally inside the switching power supply, which can easily affect the service life of the switching power supply;

Secondly, the circuit board is rigidly fixed on the mounting frame, and when the switching power supply falls, the circuit board is easily subjected to severe vibration, which may easily cause the circuit board to be damaged and unusable.

Therefore, a packaging structure of a switching power supply module is now provided.

Utility Model Content

The utility model proposes a packaging structure of a switching power supply module, which solves the problem that the packaging structure of the switching power supply in the related art fails to effectively discharge the heat inside the switching power supply to the outside, resulting in the heat easily forming high temperature locally inside the switching power supply, which easily affects the service life of the switching power supply and the circuit board is rigidly fixed on the mounting frame, which easily causes the circuit board to be subjected to severe vibration when the switching power supply falls, and easily causes the circuit board to be damaged and cannot be used.

The technical solution of the utility model is as follows:

A packaging structure for a switching power supply module comprises a packaging shell and a circuit board, wherein a boss extending inward is arranged inside the bottom end of the packaging shell, a heat dissipation cavity communicating with the outside is opened at the bottom end of the boss, a heat conduction component is arranged inside the bottom end of the packaging shell, the upper end of the packaging shell is connected to a top cover via a clamping structure, buffer mounting column structures are fixed at the four corners of the inner wall of the bottom end of the packaging shell, the circuit board is mounted on the four buffer mounting column structures, and a gap is reserved between the circuit board and the boss.

Through the above scheme, by using the heat dissipation cavity and the heat-conducting component in coordination, the heat generated by the circuit board can be exchanged with the outside world, thereby achieving effective heat dissipation of the switching power supply, thereby avoiding the internal heat accumulation of the switching power supply to generate high temperature, and ensuring the service life of the switching power supply. When the power supply falls, the buffer mounting column structure can buffer the severe vibration of the circuit board to reduce the impact force on the circuit board, thereby avoiding damage to the circuit board due to vibration to a large extent.

Preferably, the heat conducting component comprises an annular heat conducting sheet fixed to the inner wall of the bottom end of the packaging shell and located outside the boss, and heat conducting fins are connected equidistantly between inner walls on two opposite sides of the annular heat conducting sheet.

Through the above solution, the heat generated by the circuit board can be absorbed by the annular heat conductive sheet and the heat conductive fins.

Preferably, heat dissipation holes having the same number as the heat-conducting fins are formed on opposite sides of the boss, and each heat-conducting fin passes through the heat dissipation holes on both sides of the boss respectively.

Through the above solution, as the heat-conducting fins absorb the heat generated by the circuit board, the portion of the heat-conducting fins located in the heat dissipation cavity can exchange heat with the outside, thereby achieving heat dissipation for the switching power supply.

Preferably, a gap is reserved between each of the heat-conducting fins and the heat-dissipating holes through which the fins pass.

Through the above solution, part of the heat is dissipated from the gap, thereby improving the heat dissipation effect.

Preferably, a filter screen is fixed to the bottom end of the heat dissipation cavity.

Through the above solution, external dust can be prevented from entering the interior of the packaging shell, and dust can be prevented from adhering to the circuit board to a large extent.

Preferably, the snap-fit structure comprises a snap hook fixed to the side of the lower end of the top cover, and a snap groove for snapping with the snap hook is formed on the top of the inner wall of the packaging shell.

With the above solution, the top cover can be quickly installed on the packaging shell through the engagement of the hook and the slot, and can also be easily disassembled.

Preferably, a groove is provided on the side wall of the top cover, and a sealing ring is embedded on the upper edge of the packaging shell.

Through the above solution, the sealing performance between the top cover and the packaging shell is ensured by the provided sealing ring.

Preferably, the buffer mounting column structure includes a spring damper fixed to the inner wall of the bottom end of the packaging shell, and a support block is fixed to the upper end of the spring damper, a threaded column is fixed to the upper end of the support block, four threaded columns are respectively inserted at the four corners of the circuit board, and nuts are screwed to the upper ends of the four threaded columns.

Through the above scheme, the spring damper provides elastic support for the circuit board, so that when the switching power supply falls, the severe vibration of the circuit board can be buffered to reduce the impact force on the circuit board, thereby avoiding damage to the circuit board due to vibration to a large extent.

The working principle and beneficial effects of the utility model are:

1. The heat generated by the circuit board can be absorbed by the annular heat conductive sheet and the heat conductive fins. The heat can be exchanged with the outside world in the part where the heat conductive fins are located in the heat dissipation cavity, thereby achieving effective heat dissipation of the switching power supply, thereby avoiding the internal heat accumulation of the switching power supply to generate high temperature and ensuring the service life of the switching power supply.

2. The spring damper provides elastic support for the circuit board, which can buffer the severe vibration of the circuit board when the switching power supply falls, so as to reduce the impact force on the circuit board, thereby avoiding damage to the circuit board due to vibration to a large extent.

To sum up, by using the heat dissipation cavity and the heat-conducting component in coordination, the heat generated by the circuit board can be exchanged with the outside world, thereby achieving effective heat dissipation of the switching power supply, thereby avoiding the internal heat accumulation of the switching power supply to generate high temperature, and ensuring the service life of the switching power supply. The buffer mounting column structure can buffer the severe vibration of the circuit board when the power supply falls, so as to reduce the impact force on the circuit board, thereby avoiding damage to the circuit board due to vibration to a large extent.

BRIEF DESCRIPTION OF THE DRAWINGS

The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

FIG1 is a schematic diagram of a three-dimensional structure of a packaging structure of a switching power supply module proposed by the present invention from a first viewing angle.

FIG. 2 is a schematic diagram of a third-dimensional structure of a packaging structure of a switching power supply module proposed by the present invention from a second viewing angle.

FIG. 3 is a schematic diagram of a first partial structure of a packaging structure of a switching power supply module proposed by the present invention.

FIG. 4 is a second partial structural diagram of a packaging structure of a switching power supply module proposed by the present invention.

FIG. 5 is a schematic diagram of a third partial structure of a packaging structure of a switching power supply module proposed by the present invention.

FIG. 6 is an enlarged structural schematic diagram of point A in FIG. 3 of a packaging structure of a switching power supply module proposed by the present invention.

In the figure: 1. packaging shell; 2. top cover; 3. circuit board; 4. sealing ring; 5. heat dissipation cavity; 6. hook; 7. groove; 8. filter; 9. annular heat conductive sheet; 10. boss; 11. heat dissipation hole; 12. heat conductive fin; 13. spring damper; 14. support block; 15. threaded column.

DETAILED DESCRIPTION

The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Embodiment 1, referring to FIGS. 1-6, a packaging structure of a switching power supply module includes a packaging shell 1 and a circuit board 3, a boss 10 extending inward is provided inside the bottom end of the packaging shell 1, a heat dissipation cavity 5 communicating with the outside is opened at the bottom end of the boss 10, a heat conduction component is provided inside the bottom end of the packaging shell 1, and a top cover 2 is connected to the upper end of the packaging shell 1 through a clamping structure;

The heat conducting component includes an annular heat conducting sheet 9 fixed to the inner wall of the bottom end of the packaging shell 1 and located outside the boss 10, and heat conducting fins 12 are connected equidistantly between the inner walls on two opposite sides of the annular heat conducting sheet 9;

The heat generated by the circuit board 3 can be absorbed by the annular heat conducting sheet 9 and the heat conducting fins 12;

The boss 10 has two opposite sides provided with heat dissipation holes 11, the same number as the heat conduction fins 12, and each heat conduction fin 12 passes through the heat dissipation holes 11 on both sides of the boss 10;

As the heat-conducting fins 12 absorb the heat generated by the circuit board 3, the portion of the heat-conducting fins 12 located in the heat dissipation cavity 5 can exchange heat with the outside, thereby achieving heat dissipation for the switching power supply;

A gap is reserved between each heat-conducting fin 12 and the heat-dissipating hole 11 through which it passes, so that part of the heat is dissipated from the gap, thereby improving the heat dissipation effect;

A filter screen 8 is fixed at the bottom of the heat dissipation cavity 5 to prevent external dust from entering the packaging shell 1 and to prevent dust from adhering to the circuit board 3 to a large extent;

The snap-fit structure includes a snap hook 6 fixed to the lower side of the top cover 2, and a snap groove for snapping with the snap hook 6 is provided on the top of the inner wall of the packaging shell 1. The snap-fitting of the snap hook 6 with the snap groove facilitates the quick installation of the top cover 2 on the packaging shell 1 and facilitates its removal.

The side wall of the top cover 2 is provided with a groove 7, and the upper edge of the packaging shell 1 is embedded with a sealing ring 4, and the sealing ring 4 is provided to ensure the sealing between the top cover 2 and the packaging shell 1;

A buffer mounting column structure is fixed at the four corners of the inner wall of the bottom end of the packaging shell 1, and the circuit board 3 is mounted on the four buffer mounting column structures. A gap is reserved between the circuit board 3 and the boss 10. The buffer mounting column structure includes a spring damper 13 fixed to the inner wall of the bottom end of the packaging shell 1, and a support block 14 is fixed to the upper end of the spring damper 13, and a threaded column 15 is fixed to the upper end of the support block 14. The four threaded columns 15 are respectively inserted at the four corners of the circuit board 3, and nuts are screwed to the upper ends of the four threaded columns 15.

The spring damper 13 elastically supports the circuit board 3, and when the switching power supply falls, the severe vibration of the circuit board 3 can be buffered to reduce the impact force on the circuit board 3, thereby avoiding damage to the circuit board 3 due to vibration to a large extent.

Working principle: The heat generated by the circuit board 3 can be absorbed by the annular heat conductive sheet 9 and the heat conductive fins 12. The part of the heat conductive fins 12 located in the heat dissipation cavity 5 can exchange heat with the outside, thereby realizing effective heat dissipation of the switching power supply, thereby avoiding the internal heat accumulation of the switching power supply to generate high temperature, and ensuring the service life of the switching power supply. The spring damper 13 elastically supports the circuit board 3, and when the switching power supply falls, the severe vibration of the circuit board 3 can be buffered to reduce the impact force on the circuit board 3, thereby avoiding the circuit board 3 to be damaged by vibration to a large extent.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A packaging structure of a switching power supply module, characterized in that it comprises a packaging shell (1) and a circuit board (3), wherein a boss (10) extending inward is arranged inside the bottom end of the packaging shell (1), a heat dissipation cavity (5) communicating with the outside is opened at the bottom end of the boss (10), a heat conduction component is arranged inside the bottom end of the packaging shell (1), the upper end of the packaging shell (1) is connected to a top cover (2) through a clamping structure, buffer mounting column structures are fixed at the four corners of the inner wall of the bottom end of the packaging shell (1), the circuit board (3) is mounted on the four buffer mounting column structures, and a gap is reserved between the circuit board (3) and the boss (10). 2. A packaging structure for a switching power supply module according to claim 1, characterized in that the heat-conducting component comprises an annular heat-conducting sheet (9) fixed to the inner wall of the bottom end of the packaging shell (1) and located outside the boss (10), and heat-conducting fins (12) are connected equidistantly between the inner walls on both sides of the opposite sides of the annular heat-conducting sheet (9). 3. A packaging structure of a switching power supply module according to claim 2, characterized in that heat dissipation holes (11) having the same number as the heat-conducting fins (12) are provided on opposite sides of the boss (10), and each heat-conducting fin (12) passes through the heat dissipation holes (11) on both sides of the boss (10). 4. A packaging structure of a switching power supply module according to claim 3, characterized in that a gap is reserved between each of the heat-conducting fins (12) and the heat-dissipating holes (11) through which the fins pass. 5. The packaging structure of a switching power supply module according to claim 1, characterized in that a filter screen (8) is fixed to the bottom end of the heat dissipation cavity (5). 6. A packaging structure for a switching power supply module according to claim 1, characterized in that the snap-in structure comprises a snap hook (6) fixed to the lower side of the top cover (2), and a snap groove for engaging with the snap hook (6) is provided on the top of the inner wall of the packaging shell (1). 7. A packaging structure for a switching power supply module according to claim 6, characterized in that a groove (7) is provided on the side wall of the top cover (2), and a sealing ring (4) is embedded on the upper edge of the packaging shell (1). 8. A packaging structure of a switching power supply module according to claim 1, characterized in that the buffer mounting column structure includes a spring damper (13) fixed to the inner wall of the bottom end of the packaging shell (1), and a support block (14) is fixed to the upper end of the spring damper (13), and a threaded column (15) is fixed to the upper end of the support block (14), and four threaded columns (15) are respectively inserted into the four corners of the circuit board (3), and nuts are screwed to the upper ends of the four threaded columns (15).