CN213244732U - Heat radiator for microelectronic device - Google Patents
Heat radiator for microelectronic device Download PDFInfo
- Publication number
- CN213244732U CN213244732U CN202022088967.3U CN202022088967U CN213244732U CN 213244732 U CN213244732 U CN 213244732U CN 202022088967 U CN202022088967 U CN 202022088967U CN 213244732 U CN213244732 U CN 213244732U
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- Prior art keywords
- heat dissipation
- backup pad
- chassis
- supporting
- microelectronic device
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Abstract
The utility model discloses a heat abstractor for on microelectronic device, including supporting the chassis, the backup pad is installed at the top of supporting the chassis, and the connecting plate is installed at the top of backup pad, and the bottom both sides of supporting the chassis are provided with the kink, and the inner chamber of kink is provided with the spread groove, and the mounting is installed to the lateral wall of backup pad, and the inner chamber spiro union of mounting has fastening bolt, and spacing post is installed to the left and right sides symmetry of backup pad. The utility model provides a common radiator is great on the market, and be difficult for and electronic components cooperation installation, and electronic components's inner space is limited, partial solid radiator occupation space for the radiating effect of components and parts worsens problem.
Description
Technical Field
The utility model relates to a radiator technical field specifically is a heat abstractor for on microelectronic device.
Background
Can produce a large amount of heats in electronic components working process, if not timely heat of discharging, probably make electronic components overheat and damage, ordinary radiator is great on the market, and be difficult for installing with electronic components cooperation, and electronic components's inner space is limited, and partial solid radiator occupation space for the radiating effect of components and parts worsens, consequently, we have designed a heat abstractor for on the microelectronic device.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a heat abstractor for on microelectronic device has solved common radiator in the market great, and is difficult for and electronic components cooperation installation, and electronic components's inner space is limited, and partial solid radiator occupation space for the radiating effect of components and parts worsens problem.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a heat abstractor for on microelectronic device, includes and supports the chassis, the backup pad is installed at the top of supporting the chassis, the connecting plate is installed at the top of backup pad, the bottom both sides of supporting the chassis are provided with the kink, the inner chamber of kink is provided with the spread groove, the mounting is installed to the lateral wall of backup pad, the inner chamber spiro union of mounting has fastening bolt, spacing post is installed to the left and right sides symmetry of backup pad.
In the heat dissipation device for the microelectronic device, two fixed mounting columns are mounted on the left side of the supporting bottom frame, so that the heat dissipation device can be conveniently mounted and fixed.
The utility model provides a heat abstractor for on microelectronic device, the heating panel is installed to the inner chamber of backup pad, the heating panel passes through fastening bolt and backup pad fastening connection, the inner chamber of heating panel is provided with a plurality of radiating grooves, and a plurality of radiating grooves have accelerated electronic components's radiating efficiency.
In the heat dissipation device for the microelectronic device, the plurality of heat dissipation grooves are arranged in an array shape, and the heat dissipation grooves are rectangular grooves.
The inner cavity of the connecting plate is provided with the circular connecting groove, the inner cavity of the connecting plate is a cavity, the circular connecting groove is located right above the radiating groove, heat can be conveniently discharged from the radiating groove in the radiating plate, the heat can be timely discharged outwards through the connecting groove, and radiating efficiency is improved.
According to the heat dissipation device for the microelectronic device, the two limiting columns are arranged in an inclined mode at 45 degrees, the limiting columns and the supporting plate are integrally formed, and the limiting columns are arranged in an inclined mode through the limiting columns, so that a limiting effect is achieved when an external device is connected with the heat dissipation device.
The utility model has the advantages that: the inner cavity of the connecting plate is provided with a circular connecting groove, the inner cavity of the connecting plate is a cavity, an electronic component is connected with the connecting plate through the cavity, the mounting space is saved, the electronic component can be in direct contact with a heat dissipation device, the circular connecting groove is positioned right above the heat dissipation groove, when the component dissipates heat, heat can be conveniently discharged from the heat dissipation groove in the heat dissipation plate, the heat can be timely discharged outwards through the connecting groove, the heat dissipation efficiency is enhanced, the left side of the supporting underframe is provided with two fixed mounting columns, the heat dissipation device can be conveniently mounted and fixed, the limiting columns are obliquely arranged at 45 degrees, the limiting columns and the supporting plate are integrally formed, the limiting columns are obliquely arranged, the limiting function is realized when an external device is connected with the heat dissipation device, the problem that a common radiator in the market is large, the electronic component is not easy to be matched with the electronic component, the heat dissipation effect of the components is poor.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the heat dissipation plate.
In the figure: 1. supporting chassis, 101, erection column, 2, backup pad, 201, heating panel, 202, radiating groove, 3, connecting plate, 301, circular groove that connects, 4, kink, 5, spread groove, 6, mounting, 7, fastening bolt, 8, spacing post.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to FIGS. 1-2: a heat dissipation device for a microelectronic device comprises a supporting chassis 1, two fixed mounting columns 101 are mounted on the left side of the supporting chassis 1, a supporting plate 2 is mounted at the top of the supporting chassis 1, a connecting plate 3 is mounted at the top of the supporting plate 2, bending parts 4 are arranged on two sides of the bottom of the supporting chassis 1, connecting grooves 5 are arranged in inner cavities of the bending parts 4, a fixing part 6 is mounted on the side wall of the supporting plate 2, fastening bolts 7 are screwed in inner cavities of the fixing part 6, a heat dissipation plate 201 is mounted in an inner cavity of the supporting plate 2, the heat dissipation plate 201 is fixedly connected with the supporting plate 2 through the fastening bolts 7, a plurality of heat dissipation grooves 202 are arranged in an array manner in the inner cavity of the heat dissipation plate 201, the heat dissipation grooves 202 are rectangular grooves, a circular connecting groove 301 is formed in the inner cavity of the connecting plate 3, and, spacing post 8 is installed to the left and right sides symmetry of backup pad 2, and two spacing posts 8 are 45 degrees slopes to be set up, spacing post 8 and backup pad 2 integrated into one piece.
To sum up, when the utility model is used, the inner cavity of the connecting plate 3 is provided with the circular connecting groove 301, the inner cavity of the connecting plate 3 is a cavity, the electronic component is connected with the connecting plate 3 through the cavity, the installation space is saved, the electronic component can be directly contacted with the heat dissipation device, and the circular connecting groove 301 is positioned right above the heat dissipation groove 202, when the component dissipates heat, the heat can be conveniently discharged from the heat dissipation groove 202 in the heat dissipation plate and can be timely discharged outwards through the connecting groove 5, the heat dissipation efficiency is enhanced, the left side of the supporting chassis 1 is provided with two fixed mounting columns 101, the installation and fixation of the heat dissipation device are convenient, the limiting column 8 is arranged in an inclined way of 45 degrees, the limiting column 8 and the supporting plate 2 are integrally formed, the inclined arrangement of the limiting column 8 plays a limiting role when the external device is connected with the heat dissipation device, the problem that the common radiator in the, and the internal space of the electronic components is limited, and part of the solid radiators occupy space, so that the heat dissipation effect of the components is poor.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. A heat dissipation device for microelectronic devices, comprising a support chassis (1), characterized in that: the utility model discloses a fixing device for fixing a car, including support chassis (1), connecting plate (3), kink (4), connecting groove (5), mounting (6) are installed to the lateral wall of backup pad (2), the inner chamber spiro union of mounting (6) has fastening bolt (7), spacing post (8) are installed to the left and right sides symmetry of backup pad (2), backup pad (2) are installed to the top of supporting chassis (1), the bottom both sides of supporting chassis (1) are provided with kink (4), the inner chamber of kink (4) is provided with spread groove (5).
2. A heat dissipation device for use with a microelectronic device, as claimed in claim 1, wherein: two fixed mounting columns (101) are mounted on the left side of the supporting underframe (1).
3. A heat dissipation device for use with a microelectronic device, as claimed in claim 1, wherein: heating panel (201) are installed to the inner chamber of backup pad (2), heating panel (201) pass through fastening bolt (7) and backup pad (2) fastening connection, the inner chamber of heating panel (201) is provided with a plurality of radiating grooves (202).
4. A heat dissipation device for use with a microelectronic device, according to claim 3, wherein: the heat dissipation grooves (202) are arranged in an array shape, and the heat dissipation grooves (202) are rectangular grooves.
5. A heat dissipation device for use with a microelectronic device, according to claim 3, wherein: the inner cavity of the connecting plate (3) is provided with a circular connecting groove (301), the inner cavity of the connecting plate (3) is a cavity, and the circular connecting groove (301) is positioned right above the heat dissipation groove (202).
6. A heat dissipation device for use with a microelectronic device, as claimed in claim 1, wherein: two spacing post (8) are 45 degrees slope settings, spacing post (8) and backup pad (2) integrated into one piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022088967.3U CN213244732U (en) | 2020-09-22 | 2020-09-22 | Heat radiator for microelectronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022088967.3U CN213244732U (en) | 2020-09-22 | 2020-09-22 | Heat radiator for microelectronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213244732U true CN213244732U (en) | 2021-05-18 |
Family
ID=75875330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022088967.3U Active CN213244732U (en) | 2020-09-22 | 2020-09-22 | Heat radiator for microelectronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213244732U (en) |
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2020
- 2020-09-22 CN CN202022088967.3U patent/CN213244732U/en active Active
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