CN217213613U - Computer mainframe capable of quickly radiating - Google Patents
Computer mainframe capable of quickly radiating Download PDFInfo
- Publication number
- CN217213613U CN217213613U CN202220794008.XU CN202220794008U CN217213613U CN 217213613 U CN217213613 U CN 217213613U CN 202220794008 U CN202220794008 U CN 202220794008U CN 217213613 U CN217213613 U CN 217213613U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- computer
- casing
- computer mainframe
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 238000005057 refrigeration Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 230000017525 heat dissipation Effects 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000002209 hydrophobic effect Effects 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000010276 construction Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a computer mainframe that can dispel heat fast in computer mainframe equipment technical field, including casing and case lid board, the inside of casing holds the chamber for the mainboard, case lid board cover holds the top face in chamber at the mainboard, the mainboard holds the bottom in chamber and is equipped with two mainboard reference columns, it carries out radiating heat conduction contact piece to the computer mainboard to be equipped with between two mainboard reference columns, the bottom of heat conduction contact piece is equipped with the semiconductor refrigeration piece, one side of semiconductor refrigeration piece is refrigeration portion, the opposite side of semiconductor refrigeration piece is for the portion of heating, the heat conduction contact piece carries out zonulae occludens with refrigeration portion, the lateral surface of case lid board is equipped with circulation tank, make the inside heat of mainframe carry out rapid cooling through the semiconductor refrigeration piece, form good operational environment for the computer, simultaneously its simple structure, be fit for promoting on a large scale.
Description
Technical Field
The utility model relates to a computer equipment technical field specifically is a computer mainframe that can dispel the heat fast.
Background
The case is used as a part of computer accessories and has the main function of placing and fixing the computer accessories, thereby having a supporting and protecting function. In addition, the computer case has an important role of shielding electromagnetic radiation, and although the computer case is not an important configuration in the DIY, the case with poor quality is likely to short-circuit the motherboard and the case, so that the computer system becomes unstable.
Current quick-witted case all dispels the heat to the mainboard through external equipment, and the heat dissipation of mainboard is not good can lead to the host computer wholeness ability variation, and current heat abstractor all is difficult to dispel the heat fast to the mainboard simultaneously. Therefore, in view of these current situations, it is urgently needed to develop a computer main case capable of dissipating heat quickly to meet the needs of practical use.
Disclosure of Invention
The utility model aims at solving above defect, provide a quick radiating computer mainframe.
In order to solve the technical problem, the utility model discloses a following technical scheme:
a computer mainframe box capable of quickly dissipating heat comprises a casing and a case cover plate, wherein a mainboard accommodating cavity is formed in the casing, the case cover plate covers the top end face of the mainboard accommodating cavity, two mainboard positioning columns are arranged at the bottom of the mainboard accommodating cavity, a heat conduction contact piece for dissipating heat of a computer mainboard is arranged between the two mainboard positioning columns, a semiconductor refrigerating piece is arranged at the bottom of the heat conduction contact piece, one side of the semiconductor refrigerating piece is a refrigerating part, the other side of the semiconductor refrigerating piece is a heating part, the heat conduction contact piece is tightly connected with the refrigerating part, a circulating water tank is arranged on the outer side face of the case cover plate, one side of the circulating water tank extends to the surface of the heating part towards the mainboard accommodating cavity, a heat dissipation water tank is arranged on the side wall of the casing, capillary heat dissipation tubes are formed in the heat dissipation water tank, a plurality of heat dissipation fans are arranged on the front end face of the heat dissipation water tank, and the heat dissipation fans blow air towards the direction of the capillary heat dissipation tubes, the heat dissipation water tank is in conduction connection with the circulating water tank through the drainage component.
In the above description, as a preferable scheme, the drain assembly is composed of a connection hose, an electromagnetic throttle valve and a micro water pump, the electromagnetic throttle valve is installed and in conduction connection with the heat dissipation water tank, the micro water pump is in conduction connection with the circulation water tank, one end of the connection hose is fixedly connected with the electromagnetic throttle valve, and the other end of the connection hose is fixedly connected with the micro water pump.
In the above description, it is preferable that the front end surface of the housing is provided with an activation button.
In the above description, as a preferred embodiment, the capillary heat dissipation pipe is formed by a corrugated copper pipe, so as to increase the heat dissipation area between the capillary heat dissipation pipe and the air.
In the above description, as an optimal scheme, power jack, network cable jack and display jack have been seted up to the rear end face of casing, and power jack, network cable jack and display jack all hold the chamber with the mainboard and switch on.
In the above description, as a preferable aspect, a top end surface of the casing is provided with a heat dissipation grille for air intake, and when the heat dissipation fan is started, the heat dissipation grille is used for air intake of the main board accommodating cavity.
In the above description, as a preferred scheme, the bottom surface of the casing is provided with a plurality of brackets, so that the host and the bottom surface are suspended.
In the above description, as a preferable scheme, the chassis cover plate is provided with mounting bolts at four corners, and the chassis cover plate is fixedly connected with the chassis cover plate through the mounting bolts.
The utility model discloses produced beneficial effect as follows:
the utility model provides a can quick radiating computer mainframe can freeze the heat dissipation through the refrigeration portion of semiconductor refrigeration piece with the heat of computer mainboard, circulation tank passes through the heat that the semiconductor refrigeration piece was derived inside hydrophobic subassembly water conservancy diversion to the radiator tank, carry out the forced air cooling heat dissipation to the capillary cooling tube through radiator fan, the heat that makes the quick-witted case conducts through the capillary cooling tube, the heat that makes the mainframe inside carries out rapid cooling through the semiconductor refrigeration piece, form good operational environment for the computer, its simple structure simultaneously, be fit for promoting on a large scale.
Drawings
FIG. 1 is a perspective view of the present embodiment;
FIG. 2 is a schematic view of the internal structure of the present embodiment;
FIG. 3 is a schematic front view of the present embodiment;
in the figure: 1-machine shell, 2-support, 3-main board containing cavity, 4-main board positioning column, 5-radiating water tank, 6-capillary radiating pipe, 7-radiating fan, 8-starting button, 9-mounting bolt, 10-machine box cover plate, 11-circulating water tank, 12-power jack, 13-network cable jack, 14-display jack, 15-radiating grid, 16-semiconductor refrigerating sheet, 17-heat conducting contact sheet, 18-connecting hose, 19-electromagnetic throttle valve and 20-micro water pump.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.
Please refer to fig. 1-3, which illustrate a computer mainframe box capable of dissipating heat rapidly, comprising a casing 1 and a casing cover plate 10, wherein the casing 1 is internally provided with a motherboard receiving cavity 3, the casing cover plate 10 covers the top end surface of the motherboard receiving cavity 3, the bottom of the motherboard receiving cavity 3 is provided with two motherboard positioning posts 4, a heat conducting contact plate 17 for dissipating heat of a computer motherboard is arranged between the two motherboard positioning posts 4, the bottom of the heat conducting contact plate 17 is provided with a semiconductor refrigerating plate 16, one side of the semiconductor refrigerating plate 16 is a refrigerating part, the other side of the semiconductor refrigerating plate 16 is a heating part, the heat conducting contact plate 17 is tightly connected with the refrigerating part, the outer side surface of the casing cover plate 10 is provided with a circulating water tank 11, one side of the circulating water tank 11 extends to the surface of the heating part from the motherboard receiving cavity 3, the side wall of the casing 1 is provided with a heat dissipating water tank 5, the inside of the heat dissipating water tank 5 is provided with a capillary heat dissipating pipe 6, the preceding terminal surface of radiator tank 5 is equipped with a plurality of radiator fan 7, and radiator fan 7 bloies to capillary cooling tube 6's direction, and capillary cooling tube 6 has the wave type copper pipe to constitute, improves the heat radiating area between capillary cooling tube 6 and the air, carries out turn-on connection through hydrophobic component between radiator tank 5 and the circulation tank 11.
The water drainage assembly is composed of a connecting hose 18, an electromagnetic throttle valve 19 and a micro water pump 20, wherein the electromagnetic throttle valve 19 is installed and connected with the heat dissipation water tank 5 in a conduction mode, the micro water pump 20 is connected with the circulating water tank 11 in a conduction mode, one end of the connecting hose 18 is fixedly connected with the electromagnetic throttle valve 19, and the other end of the connecting hose 18 is fixedly connected with the micro water pump 20.
The preceding terminal surface of casing 1 is equipped with start button 8, and supply socket 12, net twine jack 13 and display jack 14 have been seted up to the rear end face of casing 1, and supply socket 12, net twine jack 13 and display jack 14 all hold chamber 3 with the mainboard and switch on.
The radiator grille 15 that is used for admitting air is offered to the top face of casing 1, when radiator fan 7 starts, holds chamber 3 through radiator grille 15 and admits air to the mainboard, and the bottom face of casing 1 is equipped with a plurality of support 2, makes host computer and bottom surface unsettled, and four corners of case apron 10 are equipped with construction bolt 9, and case apron 10 carries out fixed connection through construction bolt 9 and case apron 10.
Aim at mainboard reference column 4 with outside mainboard and install the inside that the mainboard held chamber 3 into, bond heat conduction contact piece 17 and the surface of mainboard through silica gel, lead cold to heat conduction contact piece 17 through the refrigeration portion of semiconductor refrigeration piece 16, make the heat of mainboard cool down the heat dissipation through heat conduction contact piece 17.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention is disclosed in the preferred embodiment, it is not limited to the above description, and any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the technical solutions of the present invention are within the scope of the present invention.
Claims (8)
1. The utility model provides a but quick radiating computer mainframe, includes casing and case apron board, and the inside of casing holds the chamber for the mainboard, and case apron board housing lid holds the top face in chamber, its characterized in that at the mainboard: the bottom that the chamber was held to the mainboard is equipped with two mainboard reference columns, be equipped with between two mainboard reference columns and carry out radiating heat conduction contact piece to the computer mainboard, the bottom of heat conduction contact piece is equipped with the semiconductor refrigeration piece, one side of semiconductor refrigeration piece is the refrigeration portion, the opposite side of semiconductor refrigeration piece is the portion of heating, the heat conduction contact piece carries out zonulae occludens with the refrigeration portion, the lateral surface of quick-witted case apron is equipped with circulation tank, one side of circulation tank holds the chamber to the mainboard and extends to the surface of the portion of heating, the lateral wall of casing is equipped with heat dissipation water tank, heat dissipation water tank's inside is capillary cooling tube, heat dissipation water tank's preceding terminal surface is equipped with a plurality of radiator fan, radiator fan blows to the direction of capillary cooling tube, carry out turn-on connection through hydrophobic component between heat dissipation water tank and the circulation tank.
2. The computer mainframe box capable of dissipating heat rapidly according to claim 1, wherein: the water drainage assembly is composed of a connecting hose, an electromagnetic throttle valve and a miniature water pump, the electromagnetic throttle valve is installed and connected with the heat dissipation water tank in a conduction mode, the miniature water pump is connected with the circulating water tank in a conduction mode, one end of the connecting hose is fixedly connected with the electromagnetic throttle valve, and the other end of the connecting hose is fixedly connected with the miniature water pump.
3. The computer mainframe capable of dissipating heat rapidly according to claim 1, wherein: the capillary radiating pipe is composed of a wave-shaped copper pipe.
4. The computer mainframe capable of dissipating heat rapidly according to any of claims 1-3, wherein: the front end face of the shell is provided with a starting button.
5. The computer mainframe capable of dissipating heat rapidly according to any of claims 1-3, wherein: the rear end face of the casing is provided with a power jack, a network cable jack and a display jack, and the power jack, the network cable jack and the display jack are all communicated with the main board accommodating cavity.
6. The computer mainframe capable of dissipating heat rapidly according to any of claims 1-3, wherein: the top end face of the shell is provided with a heat dissipation grid for air intake.
7. A computer main case capable of dissipating heat rapidly according to any one of claims 1 to 3, wherein: the bottom end face of the casing is provided with a plurality of supports.
8. The computer mainframe capable of dissipating heat rapidly according to any of claims 1-3, wherein: and the four corners of the case cover plate are provided with mounting bolts, and the case cover plate is fixedly connected with the case cover plate through the mounting bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220794008.XU CN217213613U (en) | 2022-04-08 | 2022-04-08 | Computer mainframe capable of quickly radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220794008.XU CN217213613U (en) | 2022-04-08 | 2022-04-08 | Computer mainframe capable of quickly radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217213613U true CN217213613U (en) | 2022-08-16 |
Family
ID=82760358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220794008.XU Expired - Fee Related CN217213613U (en) | 2022-04-08 | 2022-04-08 | Computer mainframe capable of quickly radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217213613U (en) |
-
2022
- 2022-04-08 CN CN202220794008.XU patent/CN217213613U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220816 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |