CN220123340U - Efficient heat dissipation type power supply - Google Patents
Efficient heat dissipation type power supply Download PDFInfo
- Publication number
- CN220123340U CN220123340U CN202321616886.3U CN202321616886U CN220123340U CN 220123340 U CN220123340 U CN 220123340U CN 202321616886 U CN202321616886 U CN 202321616886U CN 220123340 U CN220123340 U CN 220123340U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- aluminum
- gallium nitride
- bottom shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 25
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000741 silica gel Substances 0.000 claims abstract description 16
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 11
- 239000004576 sand Substances 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 241000255925 Diptera Species 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-efficiency heat-dissipation type power supply, which comprises an aluminum bottom shell and an aluminum top cover, wherein a circuit board is arranged on the aluminum bottom shell, a gallium nitride heat-conducting sheet is welded on the bottom surface of the circuit board, a heat-conducting silica gel layer is adhered on the surface of the gallium nitride heat-conducting sheet, and the position of the gallium nitride heat-conducting sheet is matched with the position of a chip on the circuit board; the bottom wall of the aluminum bottom shell is provided with an insulating sheet, the insulating sheet is positioned on the bottom surface of the circuit board, and the bottom surface of the heat-conducting silica gel layer is attached to the insulating sheet; the heat of the circuit board is transferred to the aluminum bottom shell through the gallium nitride heat conducting sheet, the heat conducting silica gel layer and the insulating sheet to realize heat dissipation. The gallium nitride heat conducting fin is added, and has high frequency, good heat conducting performance and good low-temperature performance, so that the gallium nitride heat conducting fin is beneficial to quickly realizing heat conduction on a circuit board, improving heat radiating performance, improving heat radiating efficiency, realizing efficient heat radiating effect, and has strong applicability and good practicability.
Description
Technical Field
The utility model belongs to the technical field of power supplies, and particularly relates to a high-efficiency heat-dissipation type power supply.
Background
Switch power supply isotructure is more common structure in the LED lamps and lanterns, it generally includes end box and top cap, set up the circuit board between end box and top cap simultaneously, set up corresponding circuit on the circuit board, among the prior art, its circuit board is in between bottom plate and the top cap, most, the diagonal angle department at the circuit board passes through the screw fixation on end box, it can satisfy the user demand, but it is in the practical application in-process, it is more direct dispel the heat through heat conduction silica gel, its radiating efficiency is comparatively limited, moreover the dismouting convenience is relatively poor, thereby also can influence dismouting efficiency, applicability and practicality are restricted.
Disclosure of Invention
The utility model aims to provide a high-efficiency heat-dissipation type power supply which is reasonable in structural arrangement and beneficial to improving heat dissipation performance.
The technical scheme for achieving the purpose of the utility model is that the high-efficiency heat-dissipation type power supply comprises an aluminum bottom shell and an aluminum top cover, wherein a circuit board is arranged on the aluminum bottom shell, a gallium nitride heat-conducting sheet is welded on the bottom surface of the circuit board, a heat-conducting silica gel layer is adhered on the surface of the gallium nitride heat-conducting sheet, and the position of the gallium nitride heat-conducting sheet is matched with the position of a chip on the circuit board;
the bottom wall of the aluminum bottom shell is provided with an insulating sheet, the insulating sheet is positioned on the bottom surface of the circuit board, and the bottom surface of the heat-conducting silica gel layer is attached to the insulating sheet;
and heat of the circuit board is transferred to the aluminum bottom shell through the gallium nitride heat conducting fin, the heat conducting silica gel layer and the insulating sheet to realize heat dissipation.
Further preferred are: two screw hole columns are integrally formed on the bottom wall of the aluminum bottom shell;
a strip-shaped clamping groove is formed in the inner wall of the aluminum bottom shell;
the connecting line of the two screw hole columns is parallel to the strip-shaped clamping groove, one side of the circuit board is fixed on the screw hole columns through screws, and the other side of the circuit board is inserted and clamped in the strip-shaped clamping groove.
Further preferred are: the edge integrated into one piece of insulating piece has the support sand grip, the bottom surface border butt of circuit board is in spacing on the support sand grip.
Further preferred are: the thickness of the insulating sheet is 2-15mm.
Further preferred are: the top of the symmetrical inner wall of the aluminum bottom shell is provided with a mounting strip-shaped groove;
the symmetrical edge outer walls of the aluminum top cover are integrally formed with mounting raised strips;
the aluminum top cover is matched with the aluminum bottom shell, and the installation convex strips are clamped into the installation strip-shaped grooves for positioning.
Further preferred are: the outer wall bottom integrated into one piece of aluminum product top cap has the ground connection journal stirrup, the ground connection journal stirrup is attached at the top surface of circuit board and the screw passes ground connection journal stirrup and screw post is fixed.
The utility model has the positive effects that: the structure of the utility model is reasonable, and the gallium nitride heat conducting fin is added, so that the gallium nitride heat conducting fin has high frequency, good heat conducting property and good low-temperature property, thereby being beneficial to quickly realizing heat conduction on a circuit board, being beneficial to improving heat radiating performance, improving heat radiating efficiency, realizing high-efficiency heat radiating effect, and having strong applicability and good practicability.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments that are illustrated in the appended drawings, in which:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a circuit diagram of a circuit board according to the present utility model;
fig. 3 is an enlarged schematic view of the structure at a in fig. 1.
Reference numerals: aluminum bottom shell 1, aluminum top cover 2, circuit board 3, gallium nitride heat conducting fin 4, heat conducting silica gel layer 5, insulating sheet 6, ground connection lug 7, bar draw-in groove 8, support sand grip 9, installation bar groove 10, installation sand grip 11.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1 to 3, a high-efficiency heat dissipation type power supply comprises an aluminum bottom shell 1 and an aluminum top cover 2, wherein in the embodiment, the aluminum bottom shell is a U-shaped bottom shell, and the aluminum top cover is an n-shaped top cover, and when the power supply is installed, two vertical parts of the n-shaped top cover are positioned at two ends of a concave area of the U-shaped bottom shell, and the two vertical parts are matched to form a whole installation space; in order to improve the convenience of installation, the top of the symmetrical inner wall of the aluminum bottom shell is provided with an installation strip-shaped groove 10; the symmetrical edge outer walls of the aluminum top cover are integrally formed with mounting raised strips 11; the aluminum top cover is matched with the aluminum bottom shell, and the installation convex strips are clamped into the installation strip-shaped grooves for positioning. The outer wall bottom integrated into one piece of aluminum product top cap has ground connection journal stirrup 7, ground connection journal stirrup is attached at the top surface of circuit board and the screw passes ground connection journal stirrup and screw post is fixed. The connecting combination is carried out through the buckle, and the positioning fixation of the connecting combination and the connecting combination can be realized through one screw during the combination.
The aluminum bottom shell is provided with a circuit board 3, the circuits are all of a conventional structure in the prior art, and the corresponding chips are also conventional chips in the prior art, so the details are not described.
Meanwhile, in order to improve heat dissipation performance, a gallium nitride heat conducting sheet 4 is welded on the bottom surface of the circuit board, a heat conducting silica gel layer 5 is adhered on the surface of the gallium nitride heat conducting sheet, and the position of the gallium nitride heat conducting sheet is matched with the position of a chip on the circuit board; in this embodiment, the gallium nitride heat conducting fin has high frequency, good heat conducting performance and good low-temperature effect, so that the heat radiating efficiency can be improved, and heat can be transmitted to the aluminum bottom shell through the heat conducting silica gel layer to realize heat radiation, and the heat radiating efficiency is improved.
An insulating sheet 6 is arranged on the bottom wall of the aluminum bottom shell, and is positioned on the bottom surface of the circuit board, and the bottom surface of the heat-conducting silica gel layer is attached to the insulating sheet; in the practical application process, the thickness of the insulating sheet is 2-15mm. Namely, the thin insulating sheet is matched with the gallium nitride heat conducting sheet and the heat conducting silica gel layer to realize rapid heat transfer, so that the heat dissipation performance is improved.
When the aluminum bottom shell is installed, heat of the circuit board is transferred to the aluminum bottom shell through the gallium nitride heat conducting fin, the heat conducting silica gel layer and the insulating sheet to realize heat dissipation.
In the practical application process, in order to ensure the mounting stability of the circuit board, two screw hole columns are integrally formed on the bottom wall of the aluminum bottom shell; a strip-shaped clamping groove 8 is formed in the inner wall of the aluminum bottom shell; the connecting line of the two screw hole columns is parallel to the strip-shaped clamping groove, one side of the circuit board is fixed on the screw hole columns through screws, and the other side of the circuit board is inserted and clamped in the strip-shaped clamping groove. By adopting the structure, the stability and the reliability of the circuit board can be ensured, looseness or shaking is prevented, and the situation of loose collapse is avoided.
Meanwhile, in the practical application process, in order to prevent mosquitoes from entering between the insulating sheet and the circuit board, the edge integrated into one piece of the insulating sheet is provided with a supporting raised line 9, and the edge of the bottom surface of the circuit board is abutted to the upper limit of the supporting raised line.
The utility model has the positive effects that: the structure of the utility model is reasonable, and the gallium nitride heat conducting fin is added, so that the gallium nitride heat conducting fin has high frequency, good heat conducting property and good low-temperature property, thereby being beneficial to quickly realizing heat conduction on a circuit board, being beneficial to improving heat radiating performance, improving heat radiating efficiency, realizing high-efficiency heat radiating effect, and having strong applicability and good practicability.
The standard components used in this embodiment may be purchased directly from the market, but the nonstandard structural components described in the specification may also be obtained directly by unambiguous processing according to the common general knowledge in the prior art, and meanwhile, the connection manner of each component adopts the conventional means mature in the prior art, and the machinery, the components and the equipment all adopt the conventional types in the prior art, so that no specific description will be made here.
It is to be understood that the above examples of the present utility model are provided by way of illustration only and not by way of limitation of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While those obvious variations or modifications which come within the spirit of the utility model remain within the scope of the utility model.
Claims (6)
1. The utility model provides a high-efficient heat dissipation formula power, includes aluminum product drain pan and aluminum product top cap, be provided with the circuit board on the aluminum product drain pan, its characterized in that: the bottom surface of the circuit board is welded with a gallium nitride heat conducting sheet, the surface of the gallium nitride heat conducting sheet is adhered with a heat conducting silica gel layer, and the position of the gallium nitride heat conducting sheet is matched with the position of a chip on the circuit board;
the bottom wall of the aluminum bottom shell is provided with an insulating sheet, the insulating sheet is positioned on the bottom surface of the circuit board, and the bottom surface of the heat-conducting silica gel layer is attached to the insulating sheet;
and heat of the circuit board is transferred to the aluminum bottom shell through the gallium nitride heat conducting fin, the heat conducting silica gel layer and the insulating sheet to realize heat dissipation.
2. The high efficiency heat sink power supply of claim 1, wherein: two screw hole columns are integrally formed on the bottom wall of the aluminum bottom shell;
a strip-shaped clamping groove is formed in the inner wall of the aluminum bottom shell;
the connecting line of the two screw hole columns is parallel to the strip-shaped clamping groove, one side of the circuit board is fixed on the screw hole columns through screws, and the other side of the circuit board is inserted and clamped in the strip-shaped clamping groove.
3. The high efficiency heat sink power supply of claim 2, wherein: the edge integrated into one piece of insulating piece has the support sand grip, the bottom surface border butt of circuit board is in spacing on the support sand grip.
4. A high efficiency heat sink power supply as set forth in claim 3 wherein: the thickness of the insulating sheet is 2-15mm.
5. The high efficiency heat sink power supply of claim 1, wherein: the top of the symmetrical inner wall of the aluminum bottom shell is provided with a mounting strip-shaped groove;
the symmetrical edge outer walls of the aluminum top cover are integrally formed with mounting raised strips;
the aluminum top cover is matched with the aluminum bottom shell, and the installation convex strips are clamped into the installation strip-shaped grooves for positioning.
6. The high efficiency heat sink power supply of claim 2, wherein: the outer wall bottom integrated into one piece of aluminum product top cap has the ground connection journal stirrup, the ground connection journal stirrup is attached at the top surface of circuit board and the screw passes ground connection journal stirrup and screw post is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321616886.3U CN220123340U (en) | 2023-06-25 | 2023-06-25 | Efficient heat dissipation type power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321616886.3U CN220123340U (en) | 2023-06-25 | 2023-06-25 | Efficient heat dissipation type power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220123340U true CN220123340U (en) | 2023-12-01 |
Family
ID=88894741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321616886.3U Active CN220123340U (en) | 2023-06-25 | 2023-06-25 | Efficient heat dissipation type power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220123340U (en) |
-
2023
- 2023-06-25 CN CN202321616886.3U patent/CN220123340U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN220123340U (en) | Efficient heat dissipation type power supply | |
| KR20180001949U (en) | Assembly for a radiator | |
| CN212320018U (en) | Electric control box and air conditioner with same | |
| CN210188766U (en) | Positioning assembly for maintenance of medical equipment circuit board | |
| CN217238762U (en) | Double-fan strong pressure type CPU radiator | |
| CN210781885U (en) | Novel switching power supply's heat dissipation package assembly | |
| CN220108493U (en) | Shell with grounding device | |
| CN220021110U (en) | Power semiconductor module | |
| CN216980548U (en) | High-stability trigger diode | |
| CN201146661Y (en) | Heat radiation structure for module power supply | |
| CN214792129U (en) | Air-cooled radiator suitable for small refrigerator | |
| CN210469653U (en) | Intelligence audio amplifier mainboard radiator | |
| CN217470633U (en) | Double heat radiation structure of intelligent card | |
| CN220795785U (en) | Radiating fin structure, main board assembly and portable intelligent device | |
| CN219395398U (en) | Gateway equipment with good heat dissipation effect | |
| CN211509670U (en) | Mounting structure of high-efficient heat dissipation circuit board | |
| CN217088483U (en) | Radiator convenient to installation | |
| CN218451069U (en) | Driver | |
| CN219046591U (en) | Circuit board chip radiating shell | |
| CN205026458U (en) | Easy radiating LED module | |
| CN211406616U (en) | Heat radiation structure for computer hard disk chip type circuit board | |
| CN220629907U (en) | DC power module with uniform heat dissipation | |
| CN219352230U (en) | Heat dissipation type power cabinet structure | |
| CN214205595U (en) | Semiconductor refrigerator for cooling mobile phone | |
| CN216596126U (en) | CPU protective bracket and CPU radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |