CN217238762U

CN217238762U - Double-fan strong pressure type CPU radiator

Info

Publication number: CN217238762U
Application number: CN202220830972.3U
Authority: CN
Inventors: 许晋维
Original assignee: Suzhou Yongteng Electronic Product Co ltd
Current assignee: Suzhou Yongteng Electronic Product Co ltd
Priority date: 2022-04-12
Filing date: 2022-04-12
Publication date: 2022-08-19
Anticipated expiration: 2032-04-12

Abstract

The utility model provides a double-fan forced compression type CPU radiator, including the heat-conducting plate, the top fixedly connected with heat conduction box of heat-conducting plate, the coaxial fixedly connected with quadrangle carriage in top of heat conduction box, the top of quadrangle carriage is connected with second bar limiting plate perpendicularly, and top one side of second bar limiting plate is connected with first bar limiting plate perpendicularly; the top of the quadrilateral supporting frame is coaxially provided with a semiconductor refrigeration piece, the top of the semiconductor refrigeration piece is abutted against the bottom surface of the first strip-shaped limiting plate, and one side of the second strip-shaped limiting plate is sealed by a strip-shaped sealing plate; the two sides of the heat conducting plate are respectively connected with a plurality of first heat pipes and a plurality of second heat pipes, a plurality of radiating fins are distributed above the heat conducting box at equal intervals, and the horizontal ends of the first heat pipes and the second heat pipes penetrate through the radiating fins. The utility model discloses a semiconductor refrigeration piece that sets up can carry out quick cooling to the hot-air to accelerate thermal flow through the fan, improved holistic radiating efficiency.

Description

Double-fan strong pressure type CPU radiator

Technical Field

The utility model belongs to the technical field of the radiator, especially indicate a double fan forced compression formula CPU radiator.

Background

The CPU can generate a large amount of heat when working, if the heat is not dissipated in time, the heat is easy to crash, the CPU can be burnt out, and the CPU radiator is used for radiating the CPU. The radiator plays a decisive role in the stable operation of the CPU, and it is very important to choose a good radiator when assembling the computer. Air-cooled heat sinks are the most common type of heat sink, including a heat sink fan and a heat sink. The principle is that heat generated by a CPU is transferred to a heat dissipation sheet and then taken away by a fan, but the heat dissipation mechanism in the prior art cannot effectively realize rapid cooling. Therefore, we propose a double-fan strong pressure type CPU heat sink.

SUMMERY OF THE UTILITY MODEL

For solving the deficiencies of the prior art, the utility model provides a double-fan forced compression formula CPU radiator.

The technical scheme of the utility model is realized like this:

a double-fan forced-compression type CPU radiator comprises a heat conducting plate, wherein a heat conducting box is fixedly connected to the top of the heat conducting plate, a quadrilateral supporting frame is coaxially and fixedly connected to the top of the heat conducting box, a second strip-shaped limiting plate is vertically connected to the top of the quadrilateral supporting frame, the second strip-shaped limiting plate is arranged in a C shape, and a first strip-shaped limiting plate is vertically connected to one side of the top of the second strip-shaped limiting plate;

the top of the quadrilateral supporting frame is coaxially provided with a semiconductor refrigeration sheet, the top of the semiconductor refrigeration sheet is abutted against the bottom surface of the first strip-shaped limiting plate, and one side of the second strip-shaped limiting plate is sealed by a strip-shaped sealing plate;

the both sides of heat-conducting plate are connected with a plurality of first heat pipes, second heat pipe respectively, the top of first heat pipe, second heat pipe is the horizontality and extends to heat conduction box top, heat conduction box's top equidistance distributes has a plurality of fin, the fin setting is all run through to the horizontal end of first heat pipe, second heat pipe.

Preferably, one side of the strip-shaped sealing plate is horizontally connected with a clamping strip, the clamping strip can be clamped between the semiconductor refrigeration sheet and the first strip-shaped limiting plate, and the strip-shaped sealing plate is connected with the end part of the second strip-shaped limiting plate through a bolt.

Preferably, a plurality of threading holes are formed in the strip-shaped sealing plate, and the conducting wires of the semiconductor refrigeration piece penetrate through the threading holes.

Preferably, the end of the second bar-shaped limiting plate is provided with a connecting hole, and the bolt is in threaded connection with the connecting hole.

Preferably, the equal fixedly connected with installing frame in top both sides that heat conduction box top is the horn mouth form and of outside extension, the inside fixedly connected with support of installing frame, the central point department of putting of support installs driving motor through the motor mount, driving motor's tip fixedly connected with fan.

Preferably, one side of the heat conducting plate is fixedly connected with a connecting seat.

Compared with the prior art, the utility model discloses when the semiconductor refrigeration piece that sets up refrigerates, can carry out quick cooling to the hot-air, the top of semiconductor refrigeration piece can dispel the heat, and first heat pipe, second heat pipe can be with heat conduction to fin department to accelerate thermal flow through the effect of fan, further accelerated radiating efficiency.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a dual-fan forced CPU radiator according to the present invention.

Fig. 2 is a schematic view of a partial structure of a dual-fan forced CPU heat sink according to the present invention.

In the figure: the heat-conducting plate comprises a semiconductor refrigerating piece 1, a heat-conducting plate 2, a connecting seat 3, a first heat pipe 4, a quadrilateral supporting frame 5, a first strip-shaped limiting plate 6, a second strip-shaped limiting plate 7, a connecting hole 8, a mounting frame 9, a strip-shaped sealing plate 10, a threading hole 11, a clamping strip 12, a heat-conducting box 13, a fan 14, a support 15, a radiating fin 16, a second heat pipe 17 and a driving motor 18.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a two fan pressure formula CPU radiators, includes heat-conducting plate 2, the top fixedly connected with heat conduction box 13 of heat-conducting plate 2, and heat conduction box 13 is the rectangular pyramid structure of invering, has improved the area at heat conduction box 13 top, and then can increase radiating effect, is favorable to the quick heat dissipation of device.

The top of the heat conduction box 13 is coaxially and fixedly connected with a quadrilateral supporting frame 5, the top of the quadrilateral supporting frame 5 is vertically connected with a second strip-shaped limiting plate 7, the second strip-shaped limiting plates 7 are arranged in a C shape, and one side of the top of the second strip-shaped limiting plate 7 is vertically connected with a first strip-shaped limiting plate 6;

the semiconductor refrigeration piece 1 is coaxially placed at the top of the quadrilateral supporting frame 5, the top of the semiconductor refrigeration piece 1 is abutted against the bottom surface of the first strip-shaped limiting plate 6, and one side of the second strip-shaped limiting plate 7 is sealed through a strip-shaped sealing plate 10;

the both sides of heat-conducting plate 2 are connected with a plurality of first heat pipes 4, second heat pipe 17 respectively, and the top of first heat pipe 4, second heat pipe 17 is the horizontality and extends to heat conduction box 13 top, and the top equidistance of heat conduction box 13 distributes has a plurality of fin 16, and the fin 16 setting is all run through to the horizontal end of first heat pipe 4, second heat pipe 17.

Specifically, the utility model discloses when using, install semiconductor refrigeration piece 1 at the top of heat conduction box 13 for when the bottom of semiconductor refrigeration piece 1 refrigerates, can refrigerate the hot-air of heat conduction box 13 inside, can carry out quick cooling, the top of semiconductor refrigeration piece 1 can carry out quick heat dissipation with the heat simultaneously, the first heat pipe 4 that sets up simultaneously, second heat pipe 17 can be with the quick conduction of heat to fin 16 department, and the heat at semiconductor refrigeration piece 1 top can be conducted to fin 16, further accelerated the conduction of heat;

and the arranged fan 14 can further blow the dissipated hot air, so that the heat flow is accelerated, and the heat dissipation efficiency is further improved.

Further, one side horizontally connected with card strip 12 of strip sealing plate 10, card strip 12 can the joint at semiconductor refrigeration piece 1, between the first strip limiting plate 6, and strip sealing plate 10 passes through the end connection of bolt and second strip limiting plate 7, strip sealing plate 10 can play spacing effect to semiconductor refrigeration piece 1, the stability of semiconductor refrigeration piece 1 installation has been improved, the card strip 12 that sets up simultaneously can play further chucking effect to semiconductor refrigeration piece 1, the stability of connecting has been guaranteed.

Furthermore, a plurality of threading holes 11 are formed in the strip-shaped sealing plate 10, the conducting wires of the semiconductor refrigerating sheet 1 penetrate through the threading holes 11, and the installation of the conducting wires is facilitated due to the arrangement of the threading holes 11.

Further, the end portion of the second bar-shaped limiting plate 7 is provided with a connecting hole 8, the bolt is in threaded connection with the connecting hole 8, and the connection between the bolt and the connecting hole 8 facilitates the installation and the disassembly of the bar-shaped sealing plate 10 by a user, so that the installation of the semiconductor refrigeration sheet 1 is further facilitated.

Further, the top of the heat conduction box is the horn mouth shape of the outward extension and the equal fixedly connected with installing frame 9 in top both sides, the inside fixedly connected with support 15 of installing frame 9, driving motor 18 is installed through the motor mount in the central point department of putting of support 15, and driving motor 18's tip fixedly connected with fan 14 can drive the flow of hot-air under fan 14's effect for radiating effect.

Further, one side of the heat conducting plate 2 is fixedly connected with a connecting seat 3, and the side surface of the connecting seat 3 is connected on the mainboard through a lock catch.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The double-fan forced-compression type CPU radiator comprises a heat conducting plate (2) and is characterized in that the top of the heat conducting plate (2) is fixedly connected with a heat conducting box (13), the top of the heat conducting box (13) is coaxially and fixedly connected with a quadrilateral supporting frame (5), the top of the quadrilateral supporting frame (5) is vertically connected with a second strip-shaped limiting plate (7), the second strip-shaped limiting plate (7) is arranged in a C shape, and one side of the top of the second strip-shaped limiting plate (7) is vertically connected with a first strip-shaped limiting plate (6);

the semiconductor refrigeration piece (1) is coaxially placed at the top of the quadrilateral supporting frame (5), the top of the semiconductor refrigeration piece (1) is abutted against the bottom surface of the first strip-shaped limiting plate (6), and one side of the second strip-shaped limiting plate (7) is sealed through a strip-shaped sealing plate (10);

the both sides of heat-conducting plate (2) are connected with a plurality of first heat pipes (4), second heat pipe (17) respectively, the top of first heat pipe (4), second heat pipe (17) is the horizontality and extends to heat conduction box (13) top, the top equidistance of heat conduction box (13) distributes and has a plurality of fin (16), the horizontal end of first heat pipe (4), second heat pipe (17) all runs through fin (16) and sets up.

2. The double-fan strong pressure type CPU heat sink according to claim 1, wherein a clamping strip (12) is horizontally connected to one side of the strip sealing plate (10), the clamping strip (12) can be clamped between the semiconductor chilling plate (1) and the first strip limiting plate (6), and the strip sealing plate (10) is connected to an end of the second strip limiting plate (7) by a bolt.

3. The double-fan forced-type CPU heat sink as claimed in claim 2, wherein said strip-shaped sealing plate (10) has a plurality of threading holes (11), and the wires of said semiconductor refrigeration chip (1) are disposed through the threading holes (11).

4. The double-fan strong pressure type CPU radiator according to claim 2, wherein the end of the second strip-shaped limiting plate (7) is provided with a connecting hole (8), and the bolt is screwed in the connecting hole (8).

5. The dual-fan forced CPU radiator according to claim 1, wherein the top of the heat conducting box (13) is flared outward and both sides of the top are fixedly connected with a mounting frame (9), a support (15) is fixedly connected inside the mounting frame (9), a driving motor (18) is mounted at a central position of the support (15) through a motor fixing frame, and an end of the driving motor (18) is fixedly connected with a fan (14).

6. The double-fan forced CPU radiator according to claim 1, wherein a connecting seat (3) is fixedly connected to one side of said heat conducting plate (2).