CN214205595U

CN214205595U - Semiconductor refrigerator for cooling mobile phone

Info

Publication number: CN214205595U
Application number: CN202022769291.4U
Authority: CN
Inventors: 李林; 吴永庆; 贾宇鹏
Original assignee: Hangzhou Dahe Thermo Magnetics Co Ltd
Current assignee: Hangzhou Dahe Thermo Magnetics Co Ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-09-14
Anticipated expiration: 2030-11-25

Abstract

The utility model relates to a semiconductor cooler for cell-phone cooling. The problems of low refrigeration efficiency, unobvious heat dissipation effect and unreasonable structure of the existing mobile phone heat dissipation device are solved. The refrigerator comprises an upper shell and a lower shell which are connected, wherein a fan, a radiator, a refrigerating piece and a cold guide block are sequentially connected and arranged in a cavity formed by the upper shell and the lower shell, a heat conduction hole is formed in the lower shell, the cold guide block is fixed in the heat conduction hole, a protrusion is exposed out of the heat conduction hole, an air inlet is formed in the upper shell, the fan is attached to the air inlet, clamping arms for clamping the mobile phone are respectively arranged on two opposite sides of the lower shell, and the clamping arms are connected through an elastic piece. The utility model discloses a structure that refrigeration piece and radiator combine, the radiating efficiency is high, and structural design is more reasonable compact.

Description

Semiconductor refrigerator for cooling mobile phone

Technical Field

The utility model relates to a refrigeration technology field especially relates to a semiconductor cooler for cell-phone cooling.

Background

With the continuous enhancement of the functions of the mobile phone, the mobile phone chip load and the heat generation still influence the service performance of the mobile phone and influence the experience of the user. The overhigh temperature of the mobile phone will affect the endurance time of the mobile phone and the service life of the mobile phone. The existing mobile phone heat dissipation device in the market is low in cooling rate due to pure air cooling, and is inconvenient to use and carry due to the fact that a water pump is externally connected to the mobile phone heat dissipation device due to water cooling. The existing semiconductor cooling device has low refrigeration efficiency and unobvious heat dissipation effect, and is not easy to clean and maintain.

Disclosure of Invention

The utility model discloses mainly solved current mobile phone heat abstractor refrigeration inefficiency, the radiating effect is not obvious, and the unreasonable problem of structure provides a semiconductor cooler for cell-phone cooling.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a semiconductor cooler for cell-phone cooling, includes the epitheca and the inferior valve that are connected, connects gradually in the cavity that epitheca and inferior valve constitute and is provided with fan, radiator, refrigeration piece and lead cold piece, has seted up the heat-conducting hole on the inferior valve, lead cold piece to fix and expose outside the heat-conducting hole at heat-conducting hole and arch, the air intake has been seted up on the epitheca, the fan pastes tightly on the air intake, is provided with the arm lock of pressing from both sides between the cell-phone respectively on the relative both sides of inferior valve, links to each other through the elastic component between the arm lock. The utility model is used for paste and put on the cell-phone, absorb the heat of cell-phone and dispel the heat, prevented overheated problem in the cell-phone use, improved the cell-phone heat dissipation, cell-phone duration and life are longer. The utility model discloses a refrigeration piece carries out heat conduction, and heat exchange efficiency is high, and structural design is more reasonable compact. Be provided with the arm lock and be used for centre gripping cell-phone for the refrigerator can be better combine with the cell-phone, and it is more convenient to use. The radiator is arranged on the refrigerating sheet, the refrigerating sheet is arranged on the cold guide block, the cold end of the refrigerating sheet is in contact with the cold guide block, the hot end of the refrigerating sheet is in contact with the radiator, heat is conducted to the radiator from the cold guide block, and the bulge of the cold guide block is exposed out of the heat conduction hole and is in contact with the mobile phone to conduct the heat of the mobile phone. The fan is attached to the air inlet, blows air into the radiator fins and then blows air out of the radiator fins to form heat dissipation. The utility model discloses a structure that refrigeration piece and radiator combine, the radiating efficiency is high, and simple structure is reasonable.

As a preferable scheme of the above scheme, a heat insulation gasket is arranged between the radiator and the cold guide block, the heat insulation gasket covers the range of the bottom of the radiator, a mounting hole is formed in the middle of the heat insulation gasket, and the refrigerating sheet is embedded in the mounting hole. The heat insulating gasket is arranged in the scheme to prevent heat on the radiator from being conducted to the cold guide block. The shape of the heat insulation gasket is matched with the shape of the bottom of the radiator, the bottom of the radiator is completely covered, a mounting hole with the shape matched with the shape of the refrigerating sheet is formed in the middle of the heat insulation gasket, the refrigerating sheet is embedded in the mounting hole, and the size of the cold guide block is larger than that of the mounting hole, so that the refrigerating sheet is integrally attached to the cold guide block.

As an optimal scheme of above-mentioned scheme radiator both sides are provided with first fixed orifices, the correspondence of thermal-insulated gasket both sides is provided with the second fixed orifices, the cold block both sides are provided with the ear respectively, correspond on the ear and be provided with the third fixed orifices, and the bolt penetrates fastening behind first fixed orifices, the second fixed orifices in the third fixed orifices, and is fixed mutually radiator and thermal-insulated gasket, cold block, is provided with thermal-insulated particle in the third fixed orifices, and thermal-insulated particle covers at the bolt front end. First fixed orifices, second fixed orifices and third fixed orifices are located the same position in this scheme correspondingly, fix mutually through the bolt, and the bolt nut card is on the radiator, and the bolt passes first fixed orifices, second fixed orifices and penetrates at the third fixed orifices at last, has one section space between bolt front end and the third fixed orifices opening plane, and thermal-insulated particle setting covers at the bolt front end in this space. The heat insulation particles reduce the heat quantity and conduct the heat quantity to the cold end of the refrigerating sheet through the bolts.

As a preferable scheme of the above scheme, step grooves corresponding to the shapes of the lug parts are formed on two sides of the heat conduction hole, the cold conduction block is buckled on the heat conduction hole, and the lug parts are clamped in the step grooves. The step groove is used for fixing the cold guide block, the lower part of the cold guide block is embedded into the heat conduction hole, and the lug part is clamped in the step groove when the cold guide block is installed in place and forms limiting fixation with the step groove to prevent the cold guide block from displacing.

As a preferable scheme of the above scheme, a heat conduction pad is arranged on the surface of the cold conduction block exposed out of the heat conduction hole, and the heat conduction pad is a silica gel heat conduction pad. This scheme sets up the heat conduction pad on leading cold block surface to be suitable for the binding face of different cell-phones, increase area of contact promotes cooling efficiency. The silica gel heat conduction pad has better heat conduction effect.

As a preferred scheme of the above scheme, the edges of the two opposite side walls of the lower shell are respectively provided with a clamping groove, the inner sides of the side walls are provided with a lower limiting platform, the surface of the lower limiting platform is parallel to the bottom surface of the clamping groove, the inner sides of the two opposite side walls of the upper shell are respectively provided with an upper limiting platform, the surface of the upper limiting platform is parallel to the edge surface of the side walls, and the clamping arm is inserted into the clamping groove and is located in a limiting space formed between the upper limiting platform and the lower limiting platform. Set up on the inferior valve in this scheme and supply arm lock male draw-in groove, lower spacing platform surface flushes and links to each other with the draw-in groove bottom surface, goes up spacing platform surface and flushes with upper casing lateral wall edge surface, and lower spacing platform aims at lower spacing platform, and at upper casing and inferior valve lock back, go up spacing platform and form spacing space down between the spacing platform, lie in spacing space after the arm lock inserts the draw-in groove, carry out the spacing of vertical direction to the arm that presss from both sides to stability when keeping the arm lock tensile.

As a preferable scheme of the above scheme, the clamping arm includes a stretching portion and a clamping portion vertically connected to a rear end of the stretching portion, two sides of a front end of the stretching portion are respectively provided with a chuck, two ends of the elastic member are respectively connected between front ends of the stretching portions of the two clamping arms, and a supporting plate is arranged on an inner side of the front end of the clamping portion. The tensile portion front end of arm lock is provided with the dop and forms T shape end in this scheme, inserts and forms behind the draw-in groove and ends the position effect, prevents that tensile portion from breaking away from out the draw-in groove, also prevents the tensile process of spring, arouses the spring inefficacy. The front end of the clamping part is provided with a supporting plate which is turned inwards, so that the effect of supporting the mobile phone is achieved when the mobile phone is clamped, and the mobile phone is clamped more stably.

As a preferable scheme of the above scheme, the heat sink is provided with an elongated slot, the elastic member is placed in the elongated slot, the elastic member is a spring, and two ends of the spring are respectively buckled on the clamping arms at two sides. In the scheme, the long grooves are formed in the direction in which the two clamping arms are connected on the radiator and used for placing the elastic piece, the elastic piece is provided with the springs, the drag hooks at two ends of each spring are buckled on the clamping arms at two sides respectively, each spring has certain pre-stretching amount, and the two clamping arms are tensioned.

As an optimal scheme of above-mentioned scheme be provided with the wiring hole on inferior valve one side, be fixed with the connector socket in the wiring hole, the connector socket is connected with fan, refrigeration piece, the wiring hole is the shoulder hole, is located to be provided with the boss in the downthehole side inferior valve of wiring, the connector socket sets up on the boss, is provided with the card edge on the connector socket outside, and the card is put at the wiring downthehole along the card, still is provided with the fixing base on the connector socket, the fixing base includes the step face, and fixing base and connector socket surface looks block just fix on the inferior valve. Connector socket is used for connecting the data line in this scheme, set up the wiring hole on inferior valve one side, this wiring hole is the shoulder hole including the first wiring hole of equidimension not and second wiring hole, be equipped with round card edge on the connector socket outside, the card is along in the second wiring hole of card in the shoulder hole, connector socket front end inserts in first wiring hole, connector socket rear end is near on the boss, the fixing base lock is equipped with on connector socket rear end and fixes in the inferior valve, it is spacing to connecing to connect to remove the socket formation, connector socket and fan, the refrigeration piece electricity is connected, provide electric power for fan and refrigeration piece.

As a preferable scheme of the above scheme, the upper casing is of a wedge-shaped structure, inclined planes are respectively formed on two sides of the upper casing, the upper casing is tightly attached to the top of the fan, a plurality of air outlets are formed on the inclined planes on the two sides of the upper casing, and the air outlets are attached to fins of the radiator. In the scheme, the upper shell is tightly attached to the top of the fan after being installed, so that the fan is prevented from vibrating in the vertical direction. The air outlet is arranged, so that heat dissipation can be better performed.

The utility model has the advantages that: the structure that adopts refrigeration piece and radiator to combine, the radiating efficiency is high, and structural design is more reasonable compact.

Drawings

Fig. 1 is an exploded view of a structure of the present invention;

fig. 2 is a structural sectional view of the present invention;

fig. 3 is a schematic perspective view of the present invention.

1-upper shell 2-lower shell 3-fan 4-radiator 5-refrigeration piece 6-cold guide block 7-heat conduction hole 8-clamping arm 9-heat insulation gasket 10-mounting hole 11-first fixing hole 12-second fixing hole 13-ear 14-third fixing hole 15-heat insulation particle 16-step groove 17-clamping groove 18-lower limiting platform 19-upper limiting platform 20-stretching part 21-clamping part 22-clamping head 23-supporting plate 24-elongated slot 25-wiring hole 26-connector socket 27-boss 28-clamping edge 29-fixing seat 30-elastic piece 31-air outlet 32-air inlet 33-heat conduction pad.

Detailed Description

The technical solution of the present invention is further described below by way of examples and with reference to the accompanying drawings.

Example (b):

the semiconductor refrigerator for cooling a mobile phone in the embodiment includes an upper case 1 and a lower case 2 connected with each other, as shown in fig. 1, a fan 3, a radiator 4, a cooling fin 5 and a cold conducting block 6 are sequentially connected in a cavity formed by the upper case and the lower case, clamping arms 8 for clamping the mobile phone are respectively arranged on two opposite sides of the lower case, and the clamping arms are connected with each other through an elastic member 30.

The inferior valve is the square frame body at the bottom of taking, is provided with heat conduction hole 7 in the middle of the bottom surface of inferior valve, and heat conduction hole 7 both sides are provided with step groove 16, and the cold block both sides are provided with 13 shapes of ear looks ears shape and step groove shape respectively corresponding, and the cold block that leads is detained on the heat conduction hole, and the ear card is put at the step inslot, and the protruding outside heat conduction hole that exposes of cold block lower extreme, and the lower extreme of cold block is provided with thermal pad 33 on the surface, and the thermal pad is the silica gel thermal pad. Lower screw columns are respectively arranged on two opposite sides of the lower shell.

The heat-insulating gasket 9 is arranged on the cold-conducting block, the mounting hole 10 is formed in the middle of the heat-insulating gasket, the refrigerating sheet is embedded in the mounting hole, and the size of the heat-insulating gasket is the same as that of the bottom of the radiator. The radiator is arranged on the heat insulation gasket, the heat insulation gasket completely covers the bottom of the radiator, the radiator is in contact with the refrigeration sheet, the cold end of the refrigeration sheet is in contact with the cold guide block, and the hot end of the refrigeration sheet is in contact with the radiator. The two sides of the radiator 4 are provided with first fixing holes 11, the two sides of the heat insulation gasket 9 are correspondingly provided with second fixing holes 12, the ear part of the cold guide block is correspondingly provided with third fixing holes 14, a bolt penetrates through the first fixing holes and the second fixing holes and then is fastened in the third fixing holes, the radiator is fixed with the heat insulation gasket and the cold guide block, heat insulation particles 15 are arranged in the third fixing holes, and the heat insulation particles cover the front end of the bolt. The fan adopts big air volume hush air fan, and the fan passes through 4M 3 screws to screw in between the radiator fin, fixes the fan on the radiator.

As shown in fig. 3, the upper casing 1 is a wedge-shaped structure, inclined planes are respectively formed at two sides, an air inlet 32 is formed in the middle of the upper casing, and a plurality of air outlets 31 are uniformly arranged on the inclined planes at intervals. The two opposite sides of the upper shell are provided with upper screw columns, the positions of the upper screw columns correspond to those of the lower screw columns, screws penetrate through the upper screw columns from the lower screw columns and are connected into the upper screw columns, the upper shell and the lower shell are fixed, the upper shell is tightly attached to the fan, the air inlet is aligned to the fan, and fins of the radiator are attached to the air outlet.

The edge of the other two side walls of the side wall of the lower shell 2, which are opposite to the lower screw column, is provided with a clamping groove 17, the inner side of the side wall is provided with a lower limiting platform 18, the surface of the lower limiting platform is parallel to the bottom surface of the clamping groove, the inner side of the other two side walls of the upper shell 1, which are opposite to the upper screw column, is provided with an upper limiting platform 19, the surface of the upper limiting platform is parallel to the edge surface of the side wall, and the clamping arm is inserted into the clamping groove and is positioned in a limiting space formed between the upper limiting platform and the lower limiting platform. Clamping arm 8 includes tensile portion 20 and the vertical clamping part 21 of connecting at tensile portion rear end, and tensile portion front end both sides are provided with dop 22 respectively, and tensile portion inserts in spacing space, forms through the dop and ends the position effect, and the clamping part front end is provided with layer board 23 to the inboard. The two ends of the elastic piece are respectively connected to the front ends of the stretching parts of the two clamping arms, the elastic piece is a spring, the radiator 4 is provided with a long groove 24, the spring is prevented from being in the long groove, the drag hooks at the two ends of the spring are respectively buckled on the stretching parts at the two sides, and the spring has a certain pretension amount and is used for tensioning the two clamping arms.

A wiring hole 25 is formed on one side of the lower shell 2, and a connector socket 26 is fixed in the wiring hole and connected with the fan 3 and the refrigerating sheet 5 to provide electric energy for the fan and the refrigerating sheet. The wiring hole is the shoulder hole, is located and is provided with boss 27 in the inboard inferior valve of wiring hole, and the connector socket sets up on the boss, is provided with card edge 28 on the connector socket outside, and the card is put in the wiring hole along the card, still is provided with fixing base 29 on the connector socket, and the fixing base includes the step face, and fixing base and connector socket surface looks block just fix on the inferior valve.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.

Although the terms upper shell, lower shell, fan, radiator, refrigeration fins, etc. are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

Claims

1. A semiconductor cooler for cooling a mobile phone is characterized in that: including epitheca (1) and inferior valve (2) that are connected, it has set gradually fan (3), radiator (4), refrigeration piece (5) and leads cold piece (6) to connect up in the cavity that epitheca and inferior valve constitute, has seted up heat-conducting hole (7) on the inferior valve, lead cold piece to fix and expose outside heat-conducting hole at heat-conducting hole and arch, air intake (32) have been seted up on the epitheca, the fan pastes tightly on the air intake, is provided with arm lock (8) of putting between the clamp and putting the cell-phone respectively on the relative both sides of inferior valve, links to each other through elastic component (30) between the arm lock.

2. The semiconductor refrigerator for cooling the mobile phone according to claim 1, wherein a heat insulating gasket (9) is arranged between the heat radiator (4) and the cold guide block (6), the heat insulating gasket covers the bottom range of the heat radiator, a mounting hole (10) is formed in the middle of the heat insulating gasket, and the refrigerating sheet is embedded in the mounting hole.

3. The semiconductor refrigerator for cooling the mobile phone according to claim 2, wherein the heat sink (4) is provided with first fixing holes (11) at both sides thereof, the heat insulating gasket (9) is correspondingly provided with second fixing holes (12) at both sides thereof, the cold conducting block (6) is respectively provided with ear portions (13) at both sides thereof, the ear portions are correspondingly provided with third fixing holes (14), bolts are fastened in the third fixing holes after penetrating into the first fixing holes and the second fixing holes to fix the heat sink with the heat insulating gasket and the cold conducting block, heat insulating particles (15) are provided in the third fixing holes, and the heat insulating particles cover the front ends of the bolts.

4. A semiconductor cooler for cooling mobile phones according to claim 3, wherein step grooves (16) corresponding to the shapes of the lug parts (13) are formed on two sides of the heat conduction hole (7), the cold conduction block (6) is buckled on the heat conduction hole, and the lug parts are clamped in the step grooves.

5. The semiconductor refrigerator for cooling the mobile phone according to claim 1, 2 or 3, wherein a heat conducting pad (33) is arranged on the surface of the cold conducting block (6) exposed out of the heat conducting hole (7), and the heat conducting pad is a silica gel heat conducting pad.

6. The semiconductor refrigerator for cooling the mobile phone according to claim 1, wherein the edges of the two opposite side walls of the lower case (2) are respectively provided with a slot (17), the inner sides of the side walls are provided with a lower limiting platform (18), the surface of the lower limiting platform is parallel to the bottom surface of the slot, the inner sides of the two opposite side walls of the upper case (1) are respectively provided with an upper limiting platform (19), the surface of the upper limiting platform is parallel to the edge surface of the side wall, and the clamping arm is inserted into the slot and positioned in a limiting space formed between the upper limiting platform and the lower limiting platform.

7. The semiconductor refrigerator for cooling the mobile phone according to claim 6, wherein the clamp arm (8) comprises a stretching portion (20) and a clamping portion (21) vertically connected to a rear end of the stretching portion, two sides of a front end of the stretching portion are respectively provided with a chuck (22), two ends of an elastic member are respectively connected to front ends of the stretching portions of the two clamp arms, and a supporting plate (23) is arranged at the front end of the clamping portion towards an inner side.

8. The semiconductor cooler for cooling the mobile phone according to claim 1, 6 or 7, wherein the heat sink (4) is provided with a long groove (24), the elastic member is placed in the long groove, the elastic member is a spring, and two ends of the spring are respectively buckled on the two side clamping arms (8).

9. A semiconductor cooler for cooling mobile phones according to any one of claims 1 to 4, characterized in that a wiring hole (25) is formed in one side of the lower case (2), a connector receptacle (26) is fixed in the wiring hole, the connector receptacle is connected to the fan (3) and the cooling plate (5), the wiring hole is a stepped hole, a boss (27) is formed in the lower case inside the wiring hole, the connector receptacle is arranged on the boss, a locking edge (28) is formed on the outer side of the connector receptacle, the locking edge is locked in the wiring hole, a fixing seat (29) is further formed on the connector receptacle, the fixing seat includes a stepped surface, and the fixing seat is surface-locked with the connector receptacle and fixed on the lower case.

10. The semiconductor refrigerator for cooling the mobile phone according to any one of claims 1 to 4, wherein the upper case (1) has a wedge-shaped structure, and two sides of the wedge-shaped structure are respectively formed with an inclined surface, the upper case is tightly attached to the top of the fan (3), and the inclined surfaces on the two sides of the upper case are provided with a plurality of air outlets (31), and the air outlets are attached to the fins of the heat sink.