CN210781885U - Novel switching power supply's heat dissipation package assembly - Google Patents
Novel switching power supply's heat dissipation package assembly Download PDFInfo
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- CN210781885U CN210781885U CN201921653593.6U CN201921653593U CN210781885U CN 210781885 U CN210781885 U CN 210781885U CN 201921653593 U CN201921653593 U CN 201921653593U CN 210781885 U CN210781885 U CN 210781885U
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- heat dissipation
- support
- heating panel
- power supply
- switching power
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Abstract
The utility model provides a novel switching power supply's heat dissipation package assembly, fix the circuit board on the support including support and installation, a side of support upwards extend be equipped with an integrated into one piece fashioned first heating panel, the circuit board middle part has the second heating panel of perpendicular setting, the second heating panel with first heating panel parallel arrangement, be provided with the components and parts that generate heat on the circuit board, the components and parts that generate heat are fixed in on first heating panel and the second heating panel. The utility model discloses its small, equipment convenience, radiating effect of switching power supply's heat dissipation package assembly are good.
Description
Technical Field
The utility model relates to a switching power supply's heat dissipation package assembly.
Background
At present, the existing switching power supply circuit board is locked on a bracket through screws, so that the assembly and disassembly are very inconvenient, time and labor are consumed; in addition, in order to reduce the overall size of the heat dissipation structure, a heat dissipation assembly structure for separately mounting a heat generating component (MOS, rectifier bridge, schottky diode, etc.) on a heat dissipation plate is provided at present, and in order to achieve a better heat dissipation effect, a plurality of heat dissipation plates are generally adopted, and for the convenience of production or assembly, the heat dissipation plates are generally arranged at the edge positions of the heat dissipation mechanism, and are generally arranged in an intersecting manner or in a mutually perpendicular manner, when the heat dissipation assembly structure is used in cooperation with a heat dissipation fan, no matter which direction of the heat dissipation assembly structure the heat dissipation fan is mounted, the heat dissipation plates can block the flow of wind, and then the wind can be influenced to send the heat out of the equipment, and the overall heat dissipation.
Disclosure of Invention
An object of the utility model is to provide a small, equipment convenience, the good heat dissipation package assembly of novel switching power supply of radiating effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a novel switching power supply's heat dissipation package assembly, includes that support and installation fix the circuit board on the support, a side of support upwards extend be equipped with an integrated into one piece fashioned first heating panel, the circuit board middle part has the second heating panel of perpendicular setting, the second heating panel with first heating panel parallel arrangement, be provided with the heating element on the circuit board, the heating element is fixed in on first heating panel and the second heating panel.
Further, still include an insulation board that is the L type, the insulation board is including the horizontal plate and the vertical board that are connected, horizontal plate, vertical board respectively with support, first heating panel laminating setting, just the horizontal plate is located between support and the circuit board.
Furthermore, the horizontal plate, the vertical plate and the support are all provided with a through part for heat dissipation, and the horizontal plate and the through part on the support are correspondingly arranged.
Furthermore, a plurality of positioning clamping columns are arranged on the support, fixing holes which are clamped and fixed with the positioning clamping columns are correspondingly arranged on the circuit board, and the upper parts of the positioning clamping columns are provided with flexible torsion parts.
Furthermore, the horizontal plate is provided with a through hole for the positioning clamping column to pass through.
Further, the heating element is sleeved with a silica gel sleeve, and heat-conducting silicone grease is arranged between the silica gel sleeve and the second heat dissipation plate and between the silica gel sleeve and the insulation plate.
Furthermore, the support is made of an aluminum plate, and the thickness of the aluminum plate is 1.5-2.5 mm.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses circuit board and support adopt locator card post and fixed orifices to realize that the assembly is fixed, simple structure, and assembly efficiency is showing and is improving, on the components and parts direct fixation that will generate heat is in the heating panel, its whole small, and wherein the parallel arrangement of heating panel reaches better radiating effect with the radiator fan cooperation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic perspective view of the heat dissipation structure of the present invention;
fig. 2 is an exploded perspective view of the heat dissipation structure of the present invention;
fig. 3 is an exploded perspective view of another angle of the heat dissipation structure of the present invention.
Description of the main elements
10-a support, wherein the support is provided with a plurality of brackets,
11-first heat dissipation plate, 12-positioning clamp column, 121-torsion part, 13-fixing piece, 14-locking screw, 15-screw hole,
20-a circuit board, wherein the circuit board is provided with a plurality of circuit boards,
21-second heat dissipation plate, 22-heating element, 23-fixing hole,
30-an insulating plate, wherein the insulating plate is provided with a plurality of insulating holes,
31-horizontal plate, 32-vertical plate, 33-through hole,
40-open space.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
Referring to fig. 1 to 3, the present invention discloses a novel heat dissipation assembly structure of a switching power supply, including a bracket 10 and a circuit board 20 fixed on the bracket 10, wherein one side of the bracket 10 extends upward to form a first heat dissipation plate 11 integrally formed with the bracket, a second heat dissipation plate 21 vertically arranged is arranged in the middle of the circuit board 20, the second heat dissipation plate 21 is arranged in parallel with the first heat dissipation plate 11, a heat generating component 22 is arranged on the circuit board 20, the heat generating component 22 is fixed on the first heat dissipation plate 11 and the second heat dissipation plate 21, the heat dissipation plates are aluminum heat dissipation plates, when in use, a heat dissipation fan is arranged at one end side of the two heat dissipation plates, that is, the wind direction blown by the fan is parallel to the two heat dissipation plates, so that the heat dissipation plates can not obstruct the flow of the wind, and a wind channel is formed between the heat dissipation plates, the wind guide is convenient to send out of the equipment, and the heat dissipation effect is improved.
In this embodiment, the support 10 adopts aluminum plate, and the thickness of aluminum plate is 1.5-2.5 millimeters, be equipped with a plurality of locator card posts 12 on the support 10, correspond on the circuit board 20 and be equipped with the fixed orifices 23 with locator card post 12 block is fixed, support 10 and circuit board 20 realize the assembly through the block of locator card post 12 and fixed orifices 23, the upper portion of locator card post 12 has a flexible portion of torsion 121, and after locator card post 12 and the block assembly of fixed orifices 23, can twist certain angle with portion of torsion 121, can prevent that locator card post 12 from loosening from fixed orifices 23.
The utility model discloses switching power supply's heat dissipation package assembly still includes an insulation board 30 that is the L type, insulation board 30 is including the horizontal plate 31 and the vertical board 32 that are connected, horizontal plate 31, vertical board 32 respectively with support 10, the laminating of first heating panel 11 set up, just horizontal plate 31 is located between support 10 and the circuit board 20, insulation board 30's setting to make the better operation of circuit board 20. Specifically, be equipped with the through-hole 33 that supplies the locator card post 12 to pass on the horizontal plate 31, locator card post 12 passes this through-hole 33 again with the fixed orifices 23 block assembly of circuit board 20, and the heating element 22 of fixing on first heating panel 11 then fixes through mounting 13 and locking screw 14, heating element 22 is located between mounting 13 and the vertical board 32 of insulation board 30, all be equipped with the screw hole 15 of one-to-one on first heating panel 11, vertical board 32, the mounting 13, heating element 22 is locked and is fixed through the cooperation of locking screw 14 and screw hole 15.
In this embodiment, the horizontal plate 31, the vertical plate 32, and the support 10 are all provided with a through-hole 40 for heat dissipation, the horizontal plate 31 and the through-hole 40 on the support 10 are correspondingly arranged, and the through-holes 40 are in one-to-one correspondence, that is, when the horizontal plate 31 and the support 10 are attached to each other, the through-hole 40 is in correspondence with each other, and has the same shape and size, and completely coincides with each other.
In this embodiment, the heating element 22 is sleeved with a silica gel sleeve, and heat-conducting silicone grease is arranged between the silica gel sleeve and the second heat dissipation plate 21, between the silica gel sleeve and the insulation plate 30, and between the silica gel sleeve and the fixing member 13. The silica gel sleeve achieves the effects of heat conduction and insulation, and the heat-conducting silicone grease has excellent heat resistance and heat conduction performance, so that gaps can be prevented from appearing between the silica gel sleeve and the insulating plate 30, between the silica gel sleeve and the second heat dissipation plate 21 and between the silica gel sleeve and the fixing piece 13, and a better heat conduction effect can be achieved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a novel switching power supply's heat dissipation package assembly, a serial communication port, fix the circuit board on the support including support and installation, a side of support upwards extend be equipped with an integrated into one piece fashioned first heating panel, the circuit board middle part has the second heating panel of perpendicular setting, the second heating panel with first heating panel parallel arrangement, be provided with the components and parts that generate heat on the circuit board, the components and parts that generate heat are fixed in on first heating panel and the second heating panel.
2. The heat dissipation assembly structure of the novel switching power supply according to claim 1, wherein: still include an insulation board that is the L type, the insulation board is including the horizontal plate and the vertical board that are connected, horizontal plate, vertical board respectively with support, first heating panel laminating setting, just the horizontal plate is located between support and the circuit board.
3. The heat dissipation assembly structure of the novel switching power supply according to claim 2, wherein: the horizontal plate, the vertical plate and the support are all provided with a through part for heat dissipation, and the horizontal plate and the through part on the support are correspondingly arranged.
4. The heat dissipation assembly structure of the novel switching power supply according to claim 2, wherein: the support is provided with a plurality of positioning clamp columns, the circuit board is correspondingly provided with fixing holes which are clamped and fixed with the positioning clamp columns, and the upper parts of the positioning clamp columns are provided with flexible torsion parts.
5. The novel heat dissipation assembly structure of the switching power supply according to claim 4, wherein: and the horizontal plate is provided with a through hole for the positioning clamping column to pass through.
6. The heat dissipation assembly structure of the novel switching power supply according to claim 2, wherein: the heating element is sleeved with a silica gel sleeve, and heat-conducting silicone grease is arranged between the silica gel sleeve and the second heat dissipation plate and between the silica gel sleeve and the insulation plate.
7. The heat dissipation assembly structure of the novel switching power supply according to claim 1, wherein: the support adopts aluminum plate, and the thickness of aluminum plate is 1.5-2.5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921653593.6U CN210781885U (en) | 2019-09-30 | 2019-09-30 | Novel switching power supply's heat dissipation package assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921653593.6U CN210781885U (en) | 2019-09-30 | 2019-09-30 | Novel switching power supply's heat dissipation package assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781885U true CN210781885U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201921653593.6U Active CN210781885U (en) | 2019-09-30 | 2019-09-30 | Novel switching power supply's heat dissipation package assembly |
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| CN (1) | CN210781885U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492861A (en) * | 2020-12-23 | 2021-03-12 | 南京沪泰成套电器有限公司 | Switching power supply heat dissipation package assembly |
-
2019
- 2019-09-30 CN CN201921653593.6U patent/CN210781885U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492861A (en) * | 2020-12-23 | 2021-03-12 | 南京沪泰成套电器有限公司 | Switching power supply heat dissipation package assembly |
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