CN217406899U - Electronic component mounting plate - Google Patents
Electronic component mounting plate Download PDFInfo
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- CN217406899U CN217406899U CN202220323017.0U CN202220323017U CN217406899U CN 217406899 U CN217406899 U CN 217406899U CN 202220323017 U CN202220323017 U CN 202220323017U CN 217406899 U CN217406899 U CN 217406899U
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- electronic component
- component mounting
- mounting plate
- heat dissipation
- plate
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Abstract
The utility model belongs to the technical field of electronic component mounting plates, and discloses an electronic component mounting plate, which comprises an outer frame of the electronic component mounting plate, the periphery of the outer frame of the electronic component mounting plate is provided with two radiating grooves of the electronic component mounting plate which are arranged oppositely, and the inner part of the heat dissipation groove of the electronic component mounting plate is fixedly connected with a first heat dissipation screen plate, the inner bottom end of the outer frame of the electronic component mounting plate is fixedly connected with a heat dissipation plate, the top of the heat dissipation plate is provided with a first heat conduction groove and a second heat conduction groove, the electronic component mounting plate mounting frame is fixedly connected inside the electronic component mounting plate outer frame, so that the electronic components and the electronic component mounting plate can be better and efficiently dissipated, the electronic components and the electronic component mounting plate are not easy to be damaged due to overhigh temperature when used for a long time, and the service life of the electronic components and the electronic component mounting plate is prolonged.
Description
Technical Field
The utility model belongs to the technical field of the electronic components mounting panel, specifically be an electronic components mounting panel.
Background
The electronic component is a component of an electronic component and a small machine or instrument, is usually composed of a plurality of parts and can be commonly used in the similar products; it is a general name of electronic devices such as capacitor, transistor, balance spring and spiral spring. Diodes and the like are common.
At present, most electronic components are usually installed on the electronic components mounting panel, because electronic components mounting panel structure is more single, and it is unsatisfactory to lead to electronic components and electronic components mounting panel radiating effect under long-time the use, very easily receives the harm, reduces life, consequently need improve the structure of electronic components mounting panel, simultaneously the utility model provides an electronic components mounting panel, the problem that the better solution of being convenient for was proposed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the above-mentioned problems: provided is an electronic component mounting board.
The utility model adopts the technical scheme as follows: an electronic component mounting plate comprises an electronic component mounting plate outer frame, wherein every two opposite electronic component mounting plate radiating grooves are formed in the periphery of the electronic component mounting plate outer frame, a first radiating screen plate is fixedly connected inside the electronic component mounting plate radiating grooves, a radiating plate is fixedly connected to the bottom inside the electronic component mounting plate outer frame, a first heat conducting groove and a second heat conducting groove are formed in the top of the radiating plate, an electronic component mounting plate mounting frame is fixedly connected inside the electronic component mounting plate outer frame, a second radiating screen plate is fixedly connected inside the electronic component mounting plate mounting frame, the electronic component mounting plate mounting frame is attached to the top of the radiating plate, an electronic component mounting plate is inserted into the upper inside of the electronic component mounting plate outer frame, and the electronic component mounting plate is attached to the tops of the electronic component mounting plate mounting frame and the second radiating screen plate, electronic components is installed at the top of the electronic components mounting plate, and bolt mounting holes are formed in the relative positions around the electronic components mounting plate mounting frame and the electronic components mounting plate.
In a preferred embodiment, the second heat conduction grooves are linearly distributed on the top of the heat dissipation plate, the number of the second heat conduction grooves is not less than four, and the second heat conduction grooves are located on the left side and the right side of the first heat conduction groove.
In a preferred embodiment, the electronic component mounting plate mounting frame is located above the first heat conduction groove and the second heat conduction groove, and the top of the electronic component mounting plate outer frame are located on the same horizontal plane.
In a preferred embodiment, the distance between the top of the electronic component mounting plate mounting frame and the upper part of the inner wall of the electronic component mounting plate outer frame is the same as the thickness of the electronic component mounting plate.
In a preferred embodiment, the electronic component mounting plate and the first heat dissipation screen are arranged around oppositely, and the top of the electronic component mounting plate mounting frame and the inner lower part of the heat dissipation groove of the electronic component mounting plate are located on the same horizontal plane.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that: the electronic component and the electronic component mounting plate are convenient to radiate effectively, so that the electronic component and the electronic component mounting plate are not easy to damage due to overhigh temperature and the service life of the electronic component and the electronic component mounting plate is prolonged under the condition of long-time use.
The utility model discloses in, can dispel the heat to electronic components mounting panel and electronic components through electronic components mounting panel radiating groove, through the heating panel, the cooperation of first heat conduction groove and second heat conduction groove, can carry out the heat conduction to electronic components mounting panel and electronic components, make the better heat spill through electronic components mounting panel radiating groove, can dispel the heat to electronic components mounting panel and electronic components through second heat dissipation otter board, through the cooperation of bolt mounting hole and bolt, can fix a position the electronic components mounting panel on electronic components mounting panel installing frame, the better inside of installing at electronic components mounting panel frame of electronic components mounting panel this moment.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a diagram of the blasting head of the present invention;
fig. 3 is an enlarged schematic view of the structure of the area a in fig. 2 according to the present invention.
The labels in the figure are: 1-outer frame of electronic component mounting plate; 2-electronic component mounting plate radiating grooves; 3-a first heat dissipation screen plate; 4-a heat sink; 5-a first heat conducting groove; 6-a second heat conducting groove; 7-electronic component mounting plate mounting frame; 8-a second heat dissipation screen plate; 9-electronic component mounting plate; 10-electronic components; 11-bolt mounting hole.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
An electronic component mounting board according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.
Example (b):
referring to fig. 1-3, an electronic component mounting panel, including electronic component mounting panel frame 1, electronic component mounting panel radiating groove 2 that two liang of relative settings all set up around electronic component mounting panel frame 1, and the first heat dissipation otter board 3 of inside fixedly connected with of electronic component mounting panel radiating groove 2, the inside bottom fixedly connected with heating panel 4 of electronic component mounting panel frame 1, and first heat conduction slot 5 and second heat conduction slot 6 have been seted up at the top of heating panel 4, second heat conduction slot 6 is the linear distribution at the top of heating panel 4, and second heat conduction slot 6 is no less than four, second heat conduction slot 6 is located the left and right sides of first heat conduction slot 5.
Referring to fig. 1 and 2, an electronic component mounting plate mounting frame 7 is fixedly connected to the inside of an electronic component mounting plate outer frame 1, the electronic component mounting plate mounting frame 7 is positioned above a first heat conduction groove 5 and a second heat conduction groove 6, the top of the electronic component mounting plate mounting frame 7 and the inside of an electronic component mounting plate heat dissipation groove 2 are positioned on the same horizontal plane, a second heat dissipation screen plate 8 is fixedly connected to the inside of the electronic component mounting plate mounting frame 7, the electronic component mounting plate mounting frame 7 is attached to the top of a heat dissipation plate 4, an electronic component mounting plate 9 is inserted into the inside of the electronic component mounting plate outer frame 1, the electronic component mounting plate 9 is attached to the tops of the electronic component mounting plate mounting frame 7 and the second heat dissipation screen plate 8, the top of the electronic component mounting plate 9 and the top of the electronic component mounting plate outer frame 1 are positioned on the same horizontal plane, the interval between the top of electronic component mounting panel installing frame 7 and the inner wall top of electronic component mounting panel frame 1 is the same with electronic component mounting panel 9 thickness, and electronic component mounting panel 9 sets up with first heat dissipation otter board 3 relative all around, and electronic component 10 is installed at electronic component mounting panel 9 top, and bolt mounting hole 11 has all been seted up to the relative position all around of electronic component mounting panel installing frame 7 and electronic component mounting panel 9.
This application advantage: the electronic component and the electronic component mounting plate are convenient to radiate effectively, so that the electronic component and the electronic component mounting plate are not easy to damage due to overhigh temperature when used for a long time, and the service life of the electronic component and the electronic component mounting plate is prolonged.
The utility model discloses in, can dispel the heat to electronic components mounting panel 9 and electronic components 10 through electronic components mounting panel radiating groove 2, through heating panel 4, the cooperation of first heat conduction groove 5 and second heat conduction groove 6, can carry out heat conduction to electronic components mounting panel 9 and electronic components 10, make the better heat spill through electronic components mounting panel radiating groove 2, can dispel the heat to electronic components mounting panel 9 and electronic components 10 through second heat dissipation otter board 8, through the cooperation of bolt mounting hole 11 and bolt, can fix a position electronic components mounting panel 9 on electronic components mounting panel installing frame 7, the better inside at electronic components mounting panel frame 1 of installing of electronic components mounting panel 9 this moment.
The working principle is as follows: when the electronic component mounting plate 9 is mounted, the electronic component mounting plate 9 is inserted into the electronic component mounting plate outer frame 1, so that the electronic component mounting plate 9 is placed at the top of the electronic component mounting plate mounting frame 7 and the second heat dissipation screen plate 8, the bolt mounting holes 11 formed around the electronic component mounting frame 7 and the electronic component mounting plate 9 are oppositely arranged, bolts are screwed in the bolt mounting holes 11, the electronic component mounting plate 9 can be positioned on the electronic component mounting plate mounting frame 7 and the second heat dissipation screen plate 8, the electronic component mounting plate 9 is better positioned in the electronic component mounting plate outer frame 1, when the electronic component mounting plate 9 and the electronic component 10 generate heat after being used for a long time, the heat is discharged through the second heat dissipation screen plate 8 and the electronic component mounting plate heat dissipation grooves 2, and the heat is under the cooperation of heating panel 4, first heat-conducting groove 5 and second heat-conducting groove 6, better dispels the heat to electronic components mounting panel 9 and electronic components 10 for electronic components mounting panel 9 and electronic components 10 are difficult for receiving the damage under long-time the using.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (5)
1. The utility model provides an electronic components mounting panel, includes electronic components mounting panel frame (1), its characterized in that: the heat dissipation structure is characterized in that every two electronic component mounting plate heat dissipation grooves (2) which are arranged oppositely are formed in the periphery of the electronic component mounting plate outer frame (1), a first heat dissipation screen plate (3) is fixedly connected to the inner portion of each electronic component mounting plate heat dissipation groove (2), a heat dissipation plate (4) is fixedly connected to the bottom end of the inner portion of the electronic component mounting plate outer frame (1), a first heat conduction groove (5) and a second heat conduction groove (6) are formed in the top portion of the heat dissipation plate (4), an electronic component mounting plate installation frame (7) is fixedly connected to the inner portion of the electronic component mounting plate outer frame (1), a second heat dissipation screen plate (8) is fixedly connected to the inner portion of the electronic component mounting plate installation frame (7), the electronic component mounting plate installation frame (7) is attached to the top portion of the heat dissipation plate (4), and an electronic component mounting plate (9) is inserted into the upper portion of the inner portion of the electronic component mounting plate outer frame (1), and laminating electronic components mounting panel (9) at the top of electronic components mounting panel installing frame (7) and second heat dissipation otter board (8), electronic components (10) are installed at electronic components mounting panel (9) top, bolt mounting hole (11) have all been seted up to the relative position all around of electronic components mounting panel installing frame (7) and electronic components mounting panel (9).
2. An electronic component mounting board as claimed in claim 1, wherein: the second heat conduction grooves (6) are linearly distributed at the top of the heat dissipation plate (4), the number of the second heat conduction grooves (6) is not less than four, and the second heat conduction grooves (6) are located on the left side and the right side of the first heat conduction grooves (5).
3. An electronic component mounting board as claimed in claim 1, wherein: the electronic component mounting plate installing frame (7) is located above the first heat conducting groove (5) and the second heat conducting groove (6), and the top of the electronic component mounting plate (9) and the top of the electronic component mounting plate outer frame (1) are located on the same horizontal plane.
4. An electronic component mounting board as claimed in claim 1, wherein: the distance between the top of the electronic component mounting plate mounting frame (7) and the upper part of the inner wall of the electronic component mounting plate outer frame (1) is the same as the thickness of the electronic component mounting plate (9).
5. An electronic component mounting board as claimed in claim 4, wherein: the electronic component mounting plate (9) and the first heat dissipation screen plate (3) are arranged around oppositely, and the top of the electronic component mounting plate mounting frame (7) and the inner lower part of the electronic component mounting plate heat dissipation groove (2) are located on the same horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220323017.0U CN217406899U (en) | 2022-02-17 | 2022-02-17 | Electronic component mounting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220323017.0U CN217406899U (en) | 2022-02-17 | 2022-02-17 | Electronic component mounting plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217406899U true CN217406899U (en) | 2022-09-09 |
Family
ID=83137246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220323017.0U Active CN217406899U (en) | 2022-02-17 | 2022-02-17 | Electronic component mounting plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217406899U (en) |
-
2022
- 2022-02-17 CN CN202220323017.0U patent/CN217406899U/en active Active
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