CN218451047U - Electronic component - Google Patents
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- CN218451047U CN218451047U CN202222494992.0U CN202222494992U CN218451047U CN 218451047 U CN218451047 U CN 218451047U CN 202222494992 U CN202222494992 U CN 202222494992U CN 218451047 U CN218451047 U CN 218451047U
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- electronic component
- heat dissipation
- heat
- dissipation fan
- fixing frame
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Abstract
The utility model discloses an electronic component, which comprises an electronic component body and a mounting seat, wherein the upper surface of the mounting seat is provided with oppositely distributed side plates, heat conducting plates and a fixing frame which are distributed in a staggered manner are arranged between the two side plates, the bottom of the electronic component body is provided with a bottom plate, the bottom plate is positioned on the fixing frame and is connected with the fixing frame in an installing manner, and the upper ends of the two side plates are provided with top baffles; the bottom of the mounting seat is provided with mounting pieces which are oppositely distributed, a heat dissipation fan is arranged between the two groups of mounting pieces, and heat dissipation holes are formed in the mounting seat; through the arrangement of the heat conducting plate, the upper end of the heat conducting plate is connected with the bottom plate at the bottom of the electronic component body in a butting manner, so that the heat conducting effect of the electronic component body is effectively improved; through the combination setting of heat dissipation fan and louvre, the effectual efficiency that improves the circulation of air to electronic components's heat dispersion has been improved, and the unsettled setting of fan heat fan avoids the wind gap to appear sheltering from, has further improved the radiating effect.
Description
Technical Field
The utility model relates to an electronic components technical field, concretely relates to electronic components.
Background
The electronic components are components of electronic elements and small machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of electronic devices such as capacitor, transistor, balance spring and spiral spring. Diodes and the like are common.
The electronic elements can generate heat in the operation and use process, the heat needs to be evacuated to avoid the overheating damage of the electronic elements, but the existing electronic element radiator has slow heat dissipation rate and poor effect, and the heat generated by the electronic elements cannot be effectively evacuated in time, so that the normal and stable operation and use of the electronic elements are influenced.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide an electronic component in order to solve the above-mentioned problems.
The utility model discloses a following technical scheme realizes above-mentioned purpose, an electronic components, including electronic components body and mount pad, the mount pad upper surface is equipped with the curb plate that opposites the distribution, is equipped with crisscross heat-conducting plate and mount that distributes between two said curb plates, electronic components body bottom is equipped with the bottom plate, the bottom plate is located and installs with the mount, two the curb plate upper ends are equipped with the top shield;
the mounting base bottom is equipped with the installed part that the opposition distributes, and is two sets of be equipped with the heat dissipation fan between the installed part, be equipped with the louvre on the mount pad.
Preferably, the fixing frame is of a 7-shaped structure, the fixing frame is provided with a screw hole for fixing the bottom plate, and the lower end of the fixing frame is fixedly connected with the mounting seat.
Preferably, the heat conducting plate is longitudinally arranged on the mounting seat, the heat conducting plate is fixedly connected with the mounting seat, and the height of the heat conducting plate is the same as that of the fixing frame.
Preferably, the upper ends of the two side plates are provided with symmetrically distributed insertion grooves, the top baffle is inserted into the insertion grooves, and the top baffle is provided with screws for realizing fixed installation.
Preferably, a plurality of through holes are formed in the top baffle and distributed in a matrix.
Preferably, the installed part is "L" type structure, the installed part with mount pad welded type fixed connection, be equipped with the installation screw on the installed part.
Preferably, the mount pad bottom is equipped with heat dissipation fan erection column, the heat dissipation fan pass through the screw with heat dissipation fan erection column is connected, the heat dissipation fan with the high sum of heat dissipation fan erection column is less than the height of installed part.
The beneficial effects of the utility model are that:
(1) Through the arrangement of the heat conducting plate, the upper end of the heat conducting plate is connected with the bottom plate at the bottom of the electronic component body in a butting manner, so that the heat conducting effect of the electronic component body is effectively improved;
(2) Through the combination setting of heat dissipation fan and louvre, and the unsettled setting of fan heat, avoid the wind gap to appear sheltering from, influence the heat dissipation, the effectual efficiency that improves the circulation of air to electronic components's heat dispersion has further been improved.
Drawings
Fig. 1 is one of the overall structural diagrams of the electronic component of the present invention;
fig. 2 is a second schematic view of the overall structure of the electronic component according to the present invention;
fig. 3 is a side view of the electronic component of the present invention;
FIG. 4 is a schematic view of a mounting base of the present invention;
fig. 5 is a second schematic structural diagram of the mounting base of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
As shown in fig. 1-5:
in the embodiment, an electronic component comprises an electronic component body 11 and a mounting seat 1, wherein the upper surface of the mounting seat 1 is provided with oppositely distributed side plates 5, heat-conducting plates 3 and fixing frames 2 which are distributed in a staggered manner are arranged between the two side plates 5, the heat-conducting plates 3 are arranged to play a role in heat conduction, the bottom of the electronic component body 11 is provided with a bottom plate 12, the bottom plate 12 is positioned on and connected with the fixing frames 2, the top baffle 10 is arranged at the upper ends of the two side plates 5, the top baffle 10 is provided with a plurality of through holes, the through holes are distributed in a matrix manner, the top baffle 10 is arranged to play a role in top protection, the top baffle 10 is provided with the through holes to facilitate air circulation and avoid the situation of difficult heat dissipation, the side protection is realized through the arrangement of the side plates 5, meanwhile, symmetrically distributed insertion grooves 6 are arranged at the upper ends of the two side plates 5, the top baffle 10 is inserted into the insertion grooves 6, and screws for realizing fixed mounting are arranged on the top baffle 10 to support the top baffle 10 and realize the mounting of the top baffle 10; the bottom of the mounting seat 1 is provided with mounting pieces 4 which are oppositely distributed, a heat dissipation fan 9 is arranged between the mounting pieces 4, and heat dissipation holes 8 are formed in the mounting seat 1.
1 bottom of mount pad is equipped with heat dissipation fan erection column 7, heat dissipation fan 9 pass through the screw with heat dissipation fan erection column 7 is connected, heat dissipation fan 9 with the high sum of heat dissipation fan erection column 7 is less than the height of installed part 4, through the setting of heat dissipation fan erection column 7 is avoided heat dissipation fan 9 with 1 laminating of mount pad influences the radiating effect, simultaneously through inciting somebody to action the high sum of heat dissipation fan erection column 7 is less than the height of installed part 4 makes 9 unsettled settings of heat dissipation fan, the effectual efficiency that improves the circulation of air.
Heat-conducting plate 3 vertically set up in on the mount pad 1, heat-conducting plate 3 with 1 fixed connection of mount pad, just heat-conducting plate 3 highly with the highly the same of mount 2, through with heat-conducting plate 3 highly with the highly setting of mount 2 is same height, makes heat-conducting plate 3 with bottom plate 12 contact is connected, further improves heat conduction 3's heat conduction effect.
The mounting piece 4 is of an L-shaped structure, the mounting piece 4 is fixedly connected with the mounting base 1 in a welding mode, and mounting screw holes are formed in the mounting piece 4; the fixing frame 2 is of a 7-shaped structure, screw holes for fixing the bottom plate 12 are formed in the fixing frame 2, and the lower end of the fixing frame 2 is fixedly connected with the mounting base 1.
The working principle is as follows:
the electronic component body is fixedly mounted through the arrangement of the fixing frame, and the mounting structure is simple; through the arrangement of the heat conducting plate, the upper end of the heat conducting plate is connected with the bottom plate at the bottom of the electronic component body in a butting manner, so that the heat conducting effect of the electronic component body is effectively improved; through the combination setting of heat dissipation fan and louvre, and the unsettled setting of fan heat, avoid the wind gap to appear sheltering from, influence the heat dissipation, the effectual efficiency that improves the circulation of air to electronic components's heat dispersion has further been improved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides an electronic components, includes electronic components body and mount pad, its characterized in that: the upper surface of the mounting seat is provided with side plates which are distributed oppositely, a heat conducting plate and a fixing frame which are distributed in a staggered manner are arranged between the two side plates, the bottom of the electronic component body is provided with a bottom plate, the bottom plate is positioned on the fixing frame and is connected with the fixing frame in an installing manner, and the upper ends of the two side plates are provided with top baffles;
the mounting base bottom is equipped with the installed part that the opposition distributes, and is two sets of be equipped with the heat dissipation fan between the installed part, be equipped with the louvre on the mount pad.
2. An electronic component as claimed in claim 1, wherein: the fixing frame is of a 7-shaped structure, screw holes for fixing the bottom plate are formed in the fixing frame, and the lower end of the fixing frame is fixedly connected with the mounting seat.
3. An electronic component as claimed in claim 1, wherein: the heat-conducting plate is longitudinally arranged on the mounting seat, the heat-conducting plate is fixedly connected with the mounting seat, and the height of the heat-conducting plate is the same as that of the fixing frame.
4. An electronic component as claimed in claim 1, wherein: the upper ends of the two side plates are provided with symmetrically distributed inserting grooves, the top baffle is inserted into the inserting grooves, and the top baffle is provided with screws for realizing fixed installation.
5. An electronic component as claimed in claim 1, wherein: the top baffle is provided with a plurality of through holes, and the through holes are distributed in a matrix.
6. An electronic component as claimed in claim 1, wherein: the installed part is "L" type structure, the installed part with mount pad welded type fixed connection, be equipped with the installation screw on the installed part.
7. An electronic component as claimed in claim 1, wherein: the utility model discloses a heat dissipation fan, including mount pad, heat dissipation fan, the mount pad bottom is equipped with heat dissipation fan erection column, the heat dissipation fan pass through the screw with heat dissipation fan erection column is connected, the heat dissipation fan with the high sum of heat dissipation fan erection column is less than the height of installed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222494992.0U CN218451047U (en) | 2022-09-20 | 2022-09-20 | Electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222494992.0U CN218451047U (en) | 2022-09-20 | 2022-09-20 | Electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218451047U true CN218451047U (en) | 2023-02-03 |
Family
ID=85082468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222494992.0U Active CN218451047U (en) | 2022-09-20 | 2022-09-20 | Electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218451047U (en) |
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2022
- 2022-09-20 CN CN202222494992.0U patent/CN218451047U/en active Active
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