CN208225870U - A kind of package of ic that can eliminate external carbuncle - Google Patents
A kind of package of ic that can eliminate external carbuncle Download PDFInfo
- Publication number
- CN208225870U CN208225870U CN201820393127.8U CN201820393127U CN208225870U CN 208225870 U CN208225870 U CN 208225870U CN 201820393127 U CN201820393127 U CN 201820393127U CN 208225870 U CN208225870 U CN 208225870U
- Authority
- CN
- China
- Prior art keywords
- primary seal
- positioning
- ratchet wheel
- package
- seal casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses the package of ic that one kind can eliminate external carbuncle, its structure includes heat sink, top cover, de-stress shell, positioning pin, chip board, loose tongue, interface, positioning clamping pin device, primary seal casing, card slot, buffer board, naked core body, fixture block, the utility model one kind can eliminate the package of ic of external carbuncle, it is structurally independent to be provided with positioning clamping pin device, buffer board paving is become owner of inside package casing, de-stress casing is then set to naked core in vitro and is put into primary seal casing, then the connecting plate of pressing two sides makes to be embedded in bar insertion receipts kelly, ratchet wheel plate is meshed with limiting slot and spring downward, ratchet wheel body is turned round no longer by locating clamp plate and makes its positioning, then heat sink and top cover are covered, it has thereby compensateed for existing when positioning internal integrated circuit Defect, avoid the integrated circuit of enclosure interior due to the phenomenon that positioning unstable and damaged in collision, and improve use scope.
Description
Technical field
The utility model is a kind of package of ic that can eliminate external carbuncle, belongs to integrated circuit technique neck
Domain.
Background technique
Integrated circuit is a kind of microelectronic device or component, using certain technique, crystalline substance needed for a circuit
The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function；Wherein all elements are in structure
On formed a whole, so that electronic component has been strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step.
Prior art discloses application No. is: 201620848789.0 one kind can eliminate external carbuncle integrated circuit envelope
Casing includes bottom plate and the shell for chip placement, and the bottom plate is fixedly connected with the shell, consolidating on the bottom plate
Determine mounting hole and be arranged to open U-shaped installation mouth structure, but the prior art is positioned to internal integrated circuit
When existing defects, cause the integrated circuit of enclosure interior due to positioning unstable and damaged in collision, there is limitation in use.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of integrated electricity that can eliminate external carbuncle
Road package casing leads to enclosure interior to solve prior art existing defects when positioning to internal integrated circuit
Integrated circuit has the problem of limitation due to positioning unstable and damaged in collision in use.
To achieve the goals above, the utility model is achieved through the following technical solutions: one kind can be eliminated outside
The package of ic of stress, structure include heat sink, top cover, de-stress shell, positioning pin, chip board, loose tongue, connect
Table on mouth, positioning clamping pin device, primary seal casing, card slot, buffer board, naked core body, fixture block, the heat sink lower surface and top cover
Face fits, and the top cover insertion is installed on primary seal casing upper surface and is gap-matched, the de-stress shell peace
Loaded on naked core external surface, the positioning pin insertion is installed on inside chip board and is gap-matched, on the chip board
Surface fits with naked core body lower surface, and the loose tongue insertion is installed on interface internal and is located at same axle center, the interface
It set on primary seal casing outer surface and is integrated, the positioning clamping pin device insertion is installed on inside primary seal casing
And it is gap-matched, primary seal casing upper surface is equipped with card slot and is integrated, the buffer board following table
Face fits with primary seal casing inner surface, and primary seal casing upper surface fits with chip board lower surface, the naked core
Body is set to below heat sink and is parallel to each other, and the fixture block is set to top cover lower surface and is integrated, the positioning
Lift sub pin device is made of connecting plate, insertion bar, receipts kelly, limiting slot, ratchet wheel plate, shaft, spring, ratchet wheel body, locating clamp plate, institute
It states connecting plate outer surface insertion bar is installed and is mutually perpendicular to, the connecting plate outer surface, which is welded with, receives kelly and mutually hang down
Directly, the limiting slot be set to receive kelly inside and be integrated, the ratchet wheel plate be installed on ratchet external surface and
It adopts and is hinged, the shaft is set to ratchet wheel body front surface, and the spring is connected with ratchet wheel plate, and the locating clamp plate is set to
Ratchet wheel plate outer surface.
Further, the fixture block insertion is installed on inside card slot and using interference fit.
Further, the buffer board upper surface fits with chip board lower surface.
Further, the de-stress shell is for rectangular parallelepiped structure and with a thickness of 1CM.
Further, the insertion bar insertion is installed on inside primary seal casing and is gap-matched.
Further, the top cover uses aluminum alloy material, hardness height and light weight.
Further, the loose tongue uses stainless steel material, and hardness is high and is not easy to corrode.
Beneficial effect
The utility model one kind can eliminate the package of ic of external carbuncle, structurally independent to be provided with positioning
Buffer board paving is become owner of inside package casing, de-stress casing is then set to naked core in vitro and is put into primary seal by lift sub pin device
In casing, the connecting plate for then pressing two sides makes to be embedded in bar insertion receipts kelly, and ratchet wheel plate is meshed with limiting slot and bullet
Spring pushes, and turns round ratchet wheel body no longer by locating clamp plate and makes its positioning, then covers heat sink and top cover, thereby compensate for
The existing defect when positioning to internal integrated circuit avoids the integrated circuit of enclosure interior since positioning is unstable
The phenomenon that fixed and damaged in collision, and improve use scope.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon:
Fig. 1 is the structural schematic diagram for the package of ic that the utility model one kind can eliminate external carbuncle；
Fig. 2 is the schematic diagram of the section structure of the positioning clamping pin device of the utility model.
Fig. 3 is the partial structural diagram of the A of the utility model Fig. 2.
In figure: heat sink -1, de-stress shell -3, positioning pin -4, chip board -5, loose tongue -6, interface -7, is determined top cover -2
Position lift sub pin device -8, primary seal casing -9, card slot -10, buffer board -11, naked core body -12, fixture block -13, connecting plate -801, insertion
Bar -802 receives kelly -803, limiting slot -804, ratchet wheel plate -805, shaft -806, spring -807, ratchet wheel body -808, positioning card
Plate -809.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
Fig. 1, Fig. 2, Fig. 3 are please referred to, the utility model provides a kind of package of ic that can eliminate external carbuncle
Technical solution: its structure includes heat sink 1, top cover 2, de-stress shell 3, positioning pin 4, chip board 5, loose tongue 6, interface 7, positioning
Lift sub pin device 8, primary seal casing 9, card slot 10, buffer board 11, naked core body 12, fixture block 13,1 lower surface of heat sink and top cover
2 upper surfaces fit, and the insertion of top cover 2 is installed on 9 upper surface of primary seal casing and is gap-matched, the de-stress
Shell 3 is installed on 12 outer surface of naked core body, and the insertion of positioning pin 4 is installed on 5 inside of chip board and is gap-matched, institute
It states 5 upper surface of chip board to fit with 12 lower surface of naked core body, the insertion of loose tongue 6 is installed on 7 inside of interface and is located at same
One axle center, the interface 7 are set to 9 outer surface of primary seal casing and are integrated, the insertion of positioning clamping pin device 8 peace
It loaded on 9 inside of primary seal casing and is gap-matched, 9 upper surface of primary seal casing is equipped with card slot 10 and is integrated
Change structure, 11 lower surface of buffer board fits with 9 inner surface of primary seal casing, 9 upper surface of primary seal casing and core
5 lower surface of sheet fits, and the naked core body 12 is set to 1 lower section of heat sink and is parallel to each other, and the fixture block 13 is set to top cover 2
Lower surface and be integrated, the positioning clamping pin device 8 by connecting plate 801, insertion bar 802, receive kelly 803, limit
Slot 804, ratchet wheel plate 805, shaft 806, spring 807, ratchet wheel body 808, locating clamp plate 809 form, 801 outer surface of connecting plate
Insertion bar 802 is installed and is mutually perpendicular to, 801 outer surface of connecting plate, which is welded with, receives kelly 803 and be mutually perpendicular to, institute
It states limiting slot 804 to be set to 803 inside of receipts kelly and be integrated, the ratchet wheel plate 805 is installed on 808 appearance of ratchet wheel body
Face and adopting is hinged, and the shaft 806 is set to 808 front surface of ratchet wheel body, and the spring 807 is connected with ratchet wheel plate 805
It connects, the locating clamp plate 809 is set to 805 outer surface of ratchet wheel plate, and the insertion of fixture block 13 is installed on 10 inside of card slot and uses
Interference fit, 11 upper surface of buffer board fit with 5 lower surface of chip board, and the de-stress shell 3 is rectangular parallelepiped structure
And with a thickness of 1CM, the insertion of insertion bar 802 is installed on 9 inside of primary seal casing and is gap-matched, the top cover
2 use aluminum alloy material, and hardness is high and light weight, the loose tongue 6 use stainless steel material, and hardness is high and is not easy to corrode.
Shaft 806 described in this patent, as the term suggests be connect zero main part of product must use, for rotating work
Not only moment of flexure had been born in work but also has born the axis of torque, and the spring 807 is a kind of using the elastic machine components come work, with elasticity
Deformation occurs under external force for part made of material, restores to the original state again after removing external force, also makees " spring ", generally use spring
Steel is made, and the complicated multiplicity of the type of spring mainly has helical spring, scroll spring, flat spring, heterotypic spring etc. by shape point.
Carry out using when by buffer board 11 paving become owner of inside package casing 9, de-stress shell 3 is then sheathed on naked core
Body 12 is outer and is put into primary seal casing 9, and the connecting plate 801 for then pressing two sides receives the insertion insertion of bar 802 in kelly 803,
Ratchet wheel plate 805 is meshed with limiting slot 804 and spring 807 pushes, and turns round ratchet wheel body 808 no longer by locating clamp plate 809
And make its positioning, then heat sink 1 and top cover 2 are covered.
The utility model solves prior art existing defects when positioning to internal integrated circuit, leads to shell
Internal integrated circuit has limitation, the utility model passes through above-mentioned due to positioning unstable and damaged in collision in use
Component is combined with each other, structurally independent to be provided with positioning clamping pin device, buffer board paving is become owner of inside package casing, then
De-stress casing is set to naked core in vitro and is put into primary seal casing, the connecting plate for then pressing two sides makes to be embedded in bar insertion
It receives in kelly, ratchet wheel plate is meshed with limiting slot and spring downward, turns round ratchet wheel body no longer by locating clamp plate and makes it
Positioning, then covers heat sink and top cover, has thereby compensateed for the existing defect when positioning to internal integrated circuit,
The integrated circuit of enclosure interior is avoided due to the phenomenon that positioning unstable and damaged in collision, and improves use scope.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. the package of ic that one kind can eliminate external carbuncle, it is characterised in that: its structure includes heat sink (1), top
Cover (2), de-stress shell (3), positioning pin (4), chip board (5), loose tongue (6), interface (7), positioning clamping pin device (8), primary seal
Casing (9), card slot (10), buffer board (11), naked core body (12), fixture block (13), heat sink (1) lower surface and top cover
(2) upper surface fits, and top cover (2) insertion is installed on primary seal casing (9) upper surface and is gap-matched, described
De-stress shell (3) is installed on naked core body (12) outer surface, positioning pin (4) insertion be installed on chip board (5) it is internal and
It is gap-matched, chip board (5) upper surface fits with naked core body (12) lower surface, loose tongue (6) the insertion installation
In interface (7) inside and it is located at same axle center, the interface (7) is set to primary seal casing (9) outer surface and is integrated
Structure, positioning clamping pin device (8) insertion are installed on primary seal casing (9) inside and are gap-matched, the primary seal
Casing (9) upper surface is equipped with card slot (10) and is integrated, buffer board (11) lower surface and primary seal casing
(9) inner surface fits, and primary seal casing (9) upper surface fits with chip board (5) lower surface, the naked core body (12)
Below heat sink (1) and it is parallel to each other, the fixture block (13) is set to top cover (2) lower surface and is integrated,
The positioning clamping pin device (8) is by connecting plate (801), insertion bar (802), receipts kelly (803), limiting slot (804), ratchet wheel plate
(805), shaft (806), spring (807), ratchet wheel body (808) composition, connecting plate (801) outer surface is equipped with insertion bar
(802) it and is mutually perpendicular to, connecting plate (801) outer surface, which is welded with, receives kelly (803) and be mutually perpendicular to, the limit
Slot (804), which is set to, to be received kelly (803) inside and is integrated, and the ratchet wheel plate (805) is installed on ratchet wheel body (808) outside
Surface and adopting is hinged, and the shaft (806) is set to ratchet wheel body (808) front surface, the spring (807) and ratchet wheel plate
(805) it is connected.
2. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that: described
Fixture block (13) insertion is installed on card slot (10) inside and using interference fit.
3. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that: described
Buffer board (11) upper surface fits with chip board (5) lower surface.
4. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that: described
De-stress shell (3) is for rectangular parallelepiped structure and with a thickness of 1CM.
5. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that: described
Insertion bar (802) insertion is installed on primary seal casing (9) inside and is gap-matched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820393127.8U CN208225870U (en) | 2018-03-22 | 2018-03-22 | A kind of package of ic that can eliminate external carbuncle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820393127.8U CN208225870U (en) | 2018-03-22 | 2018-03-22 | A kind of package of ic that can eliminate external carbuncle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208225870U true CN208225870U (en) | 2018-12-11 |
Family
ID=64502937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820393127.8U Expired - Fee Related CN208225870U (en) | 2018-03-22 | 2018-03-22 | A kind of package of ic that can eliminate external carbuncle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208225870U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556303A (en) * | 2019-09-06 | 2019-12-10 | 东和半导体设备(南通)有限公司 | semiconductor packaging mold and packaging process thereof |
| CN113471150A (en) * | 2021-07-08 | 2021-10-01 | 李琴 | Integrated circuit package |
-
2018
- 2018-03-22 CN CN201820393127.8U patent/CN208225870U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556303A (en) * | 2019-09-06 | 2019-12-10 | 东和半导体设备(南通)有限公司 | semiconductor packaging mold and packaging process thereof |
| CN110556303B (en) * | 2019-09-06 | 2021-07-09 | 东和半导体设备(南通)有限公司 | Semiconductor packaging mold and packaging process thereof |
| CN113471150A (en) * | 2021-07-08 | 2021-10-01 | 李琴 | Integrated circuit package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 Termination date: 20190322 |