CN207367953U - A kind of encapsulating structure of electronic component - Google Patents
A kind of encapsulating structure of electronic component Download PDFInfo
- Publication number
- CN207367953U CN207367953U CN201720796702.4U CN201720796702U CN207367953U CN 207367953 U CN207367953 U CN 207367953U CN 201720796702 U CN201720796702 U CN 201720796702U CN 207367953 U CN207367953 U CN 207367953U
- Authority
- CN
- China
- Prior art keywords
- sealing plate
- wall
- lead
- mounting groove
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of encapsulating structure of electronic component, including component body and the respectively upper sealing plate above component body and the lower sealing plate below component body, the bottom interior wall of the upper sealing plate is equipped with the first inverted T shaped glove passage, the bottom outer wall both ends of the upper sealing plate have been fixedly connected with lead, the mounting groove being provided symmetrically on the outer wall of the lead, spring is fixedly connected with the mounting groove, the one end of the spring away from mounting groove is fixedly connected with the movable plate being obliquely installed, the bottom of the movable plate is fixedly connected with rotating bar, the rotating bar is rotationally connected with lead, the lower section of the lead is equipped with the second glove passage at the top of lower sealing plate.The utility model facilitates the encapsulation of component body, allows to replace component during component wear in time, and the component of encapsulating structure can reuse, and economize on resources, and electronic component is connected firmly in transport, easy to operate, easy to use.
Description
Technical field
It the utility model is related to packaging system technical field, more particularly to a kind of encapsulating structure of electronic component.
Background technology
Encapsulation, just refers to, the circuit pin on silicon chip, be connect and guided at external lug with conducting wire, in order to which other devices connect
Connect.Packing forms refer to the shell for installing semiconductor integrated circuit chip.It not only plays installation, fixation, sealing, protection core
The effect of piece and enhancing electric heating property etc., but also it is wired to by the contact on chip the pin of package casing
On, these pins are connected further through the conducting wire on printed circuit board (PCB) with other devices, so as to fulfill inside chip and external electrical
The connection on road.Because chip must be isolated from the outside, to prevent the impurity in air from being caused to the corrosion of chip circuit electrically
Hydraulic performance decline.On the other hand, the chip after encapsulation is also more convenient for installing and transporting.Since the quality of encapsulation technology also directly affects
To the performance of chip self performance and the design and manufacture of the PCB (printed circuit board) being attached thereto, therefore it is most important
's.
The encapsulating structure transport of electronic component is inconvenient under the prior art, moreover, when electronic component damages, with electronics
The encapsulating structure that element is used together can be dropped with electronic component, cause the waste of resource.
Utility model content
The purpose of this utility model is and a kind of electronic component for proposing in order to solve shortcoming existing in the prior art
Encapsulating structure.
To achieve these goals, the utility model employs following technical solution：
A kind of encapsulating structure of electronic component, including component body and the upper sealing plate above the component body and position respectively
Lower sealing plate below component body, the bottom interior wall of the upper sealing plate are equipped with the first inverted T shaped glove passage, the upper envelope
The bottom outer wall both ends of plate have been fixedly connected with lead, the mounting groove being provided symmetrically on the outer wall of the lead, institute
To state and spring is fixedly connected with mounting groove, the one end of the spring away from mounting groove is fixedly connected with the movable plate being obliquely installed,
The bottom of the movable plate is fixedly connected with rotating bar, and the rotating bar is rotationally connected with lead, under the lead
Side is equipped with the second glove passage at the top of lower sealing plate, and limiting slot is equipped with the middle part of the inner wall of the second glove passage, described
The top inner wall of limiting slot is equipped with the adjusting passage being vertically arranged, and the top of the lower sealing plate is equipped with fixing groove, the fixation
The bottom interior wall of groove is equipped with two pin installation through-holes.
Preferably, the bottom of the component body is equipped with pin, and the pin is slidably connected with pin installation through-hole, and draws
The bottom of foot is located at the lower section of lower sealing plate.
Preferably, the bottom thread of the lower sealing plate is connected with protective case, and the top exterior walls of the upper sealing plate are equipped with card
Groove, the bottom cross section of the protective case are identical with the top cross-sectional area of card slot.
Preferably, the outer wall of the lead is equipped with rotating bar mounting groove, and the rotating bar mounting groove is with adjusting passage
Connection, the rotating bar are rotationally connected with the inner wall of rotating bar mounting groove.
Preferably, the first glove passage, component body and the fixing groove are located at same perpendicular.
Preferably, it is fixedly connected with radiating fin at the top of the component body.
In the utility model, the rotation of movable plate is realized by the design of lead, movable plate, spring, facilitates element
The encapsulation of body, allows to replace component during component wear in time, and the component of encapsulating structure can reuse, and economize on resources,
Electronic component is set to be connected firmly in transport by the design of protective case and card slot, it is easy to operate easy to the transport of electronic component,
It is easy to use.
Brief description of the drawings
Fig. 1 be the utility model proposes a kind of electronic component encapsulating structure structure diagram；
Fig. 2 be the utility model proposes a kind of electronic component encapsulating structure lead structure diagram.
In figure：1 component body, 2 upper sealing plates, 3 times sealing plates, 4 leads, 5 mounting grooves, 6 springs, 7 movable plates, 8 rotate
Bar, 9 second glove passages, 10 adjust passage, 11 fixing grooves, 12 pin installation through-holes, 13 first glove passages.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
With reference to Fig. 1-2, a kind of encapsulating structure of electronic component, including component body 1 and respectively above component body 1
Upper sealing plate 2 and the lower sealing plate 3 positioned at the lower section of component body 1, the bottom interior wall of upper sealing plate 2 be equipped with the first inverted T shaped glove
Passage 13, the bottom outer wall both ends of upper sealing plate 2 have been fixedly connected with lead 4, have been provided symmetrically on the outer wall of lead 4
Mounting groove 5, is fixedly connected with spring 6 in mounting groove 5, the one end of spring 6 away from mounting groove 5 is fixedly connected with what is be obliquely installed
Movable plate 7, the bottom of movable plate 7 are fixedly connected with rotating bar 8, and rotating bar 8 is rotationally connected with lead 4, under lead 4
Side is equipped with the second glove passage 9 positioned at the lower top of sealing plate 3, and limiting slot 14 is equipped with the middle part of the inner wall of the second glove passage 9, spacing
The top inner wall of groove 14 is equipped with the adjusting passage 10 being vertically arranged, and the outer wall of lead 4 is equipped with rotating bar mounting groove, rotates
Bar mounting groove is connected with adjusting passage 10, and rotating bar 8 is rotationally connected with the inner wall of rotating bar mounting groove, the top of lower sealing plate 3
Equipped with fixing groove 11, the first glove passage 13, component body 1 and fixing groove 11 are located at same perpendicular, the bottom of fixing groove 11
Portion's inner wall is equipped with two pin installation through-holes 12, and the bottom of component body 1 is equipped with pin, and pin is slided with pin installation through-hole 12
Dynamic connection, and the bottom of pin is located at the lower section of lower sealing plate 3, the bottom thread of lower sealing plate 3 is connected with protective case, upper sealing plate 2
Top exterior walls are equipped with card slot, and the bottom cross section of protective case is identical with the top cross-sectional area of card slot, the top of component body 1
Portion, which is fixedly connected with radiating fin, realizes the rotation of movable plate 7, convenient member by the design of lead 4, movable plate 7, spring 6
The encapsulation of part body 1, allows to replace component during component wear in time, and the component of encapsulating structure can reuse, and saves money
Source, makes electronic component be connected firmly in transport, easy to the transport of electronic component, operation letter by the design of protective case and card slot
It is single, it is easy to use.
In the utility model, in use, by first glove passage 13 of the component body 1 as 2 bottom of upper sealing plate and lower envelope
Between the fixing groove 11 at the top of plate 3, meanwhile, the pin of 1 bottom of component body is located in pin installation through-hole 12, lead 4
In in the second glove passage 9, subsequent upper sealing plate 2 downward move by 3 side of sealing plate, and under the active force of spring 6, movable plate 7 moves
To limiting slot 14, the encapsulation of component body 1 is completed, when component body 1 damages, is moved by adjusting 10 movable plate 7 of passage
Move to rotating bar mounting groove, lead 4 removes out of second glove passage 9 and replaces component body 1.
The above, is only the preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
1. a kind of encapsulating structure of electronic component, including component body (1) and the upper sealing plate above component body (1) respectively
(2) the lower sealing plate (3) and below component body (1), it is characterised in that the bottom interior wall of the upper sealing plate (2) is equipped with
The first inverted T shaped glove passage (13), the bottom outer wall both ends of the upper sealing plate (2) have been fixedly connected with lead (4), described
The mounting groove (5) being provided symmetrically on the outer wall of lead (4), the mounting groove (5) is interior to be fixedly connected with spring (6), institute
State the one end of spring (6) away from mounting groove (5) and be fixedly connected with the movable plate (7) being obliquely installed, the bottom of the movable plate (7)
Rotating bar (8) is fixedly connected with, the rotating bar (8) is rotationally connected with lead (4), is set below the lead (4)
There is the second glove passage (9) at the top of lower sealing plate (3), limiting slot is equipped with the middle part of the inner wall of the second glove passage (9)
(14), the top inner wall of the limiting slot (14) is equipped with the adjusting passage (10) being vertically arranged, the top of the lower sealing plate (3)
Equipped with fixing groove (11), the bottom interior wall of the fixing groove (11) is equipped with two pin installation through-holes (12).
2. the encapsulating structure of a kind of electronic component according to claim 1, it is characterised in that the component body (1)
Bottom is equipped with pin, and the pin is slidably connected with pin installation through-hole (12), and the bottom of pin is located under lower sealing plate (3)
Side.
A kind of 3. encapsulating structure of electronic component according to claim 1, it is characterised in that the bottom of the lower sealing plate (3)
Portion is threaded with protective case, and the top exterior walls of the upper sealing plate (2) are equipped with card slot, the bottom cross section of the protective case with
The top cross-sectional area of card slot is identical.
4. the encapsulating structure of a kind of electronic component according to claim 1, it is characterised in that outside the lead (4)
Wall is equipped with rotating bar mounting groove, and the rotating bar mounting groove is connected with adjusting passage (10), rotating bar (8) rotation connection
In on the inner wall of rotating bar mounting groove.
A kind of 5. encapsulating structure of electronic component according to claim 1, it is characterised in that the first glove passage
(13), component body (1) and fixing groove (11) are located at same perpendicular.
6. the encapsulating structure of a kind of electronic component according to claim 1, it is characterised in that the component body (1)
Top is fixedly connected with radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720796702.4U CN207367953U (en) | 2017-07-04 | 2017-07-04 | A kind of encapsulating structure of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720796702.4U CN207367953U (en) | 2017-07-04 | 2017-07-04 | A kind of encapsulating structure of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207367953U true CN207367953U (en) | 2018-05-15 |
Family
ID=62421482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720796702.4U Expired - Fee Related CN207367953U (en) | 2017-07-04 | 2017-07-04 | A kind of encapsulating structure of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207367953U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244054A (en) * | 2018-09-05 | 2019-01-18 | 吴革洪 | Electronic component |
-
2017
- 2017-07-04 CN CN201720796702.4U patent/CN207367953U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244054A (en) * | 2018-09-05 | 2019-01-18 | 吴革洪 | Electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180515 Termination date: 20190704 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |