CN108470725B - A kind of high performance control chip-packaging structure - Google Patents
A kind of high performance control chip-packaging structure Download PDFInfo
- Publication number
- CN108470725B CN108470725B CN201810411156.7A CN201810411156A CN108470725B CN 108470725 B CN108470725 B CN 108470725B CN 201810411156 A CN201810411156 A CN 201810411156A CN 108470725 B CN108470725 B CN 108470725B
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- Prior art keywords
- upper cover
- pin
- high performance
- control chip
- performance control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
Abstract
The invention discloses a kind of high performance control chip-packaging structures, including upper cover and lower case, the upper cover and lower case are mutually butted sealing, form package casing, the package casing is internally provided with substrate, integrated circuit die is fixedly installed on the substrate, the two sides of the package casing are fixedly installed several short pins along its length, it is welded between hard contact and short pin on the integrated circuit die by metal lead wire, the inner cavity of the package casing is embedded to resin, and resin is reserved with gap at the top of upper cover, the upper cover is located at gap location and is provided with radiator structure.It is of the invention novel in design, structure is simple, easy to use, the design seperated with chip of external pin both can guarantee that pin will not fracture in transportational process, pin can be made replaceable again, the utilization rate for improving chip reduces scrappage, while while guaranteeing leakproofness, the radiating efficiency of chip is improved, is suitable for promoting the use of.
Description
Technical field
The present invention relates to chip encapsulation technology field more particularly to a kind of high performance control chip-packaging structures.
Background technique
Encapsulation, just refers to the circuit pin on silicon wafer, is connect and guided at external lug with conducting wire, in order to other devices company
It connects.Packing forms refer to the shell of installation semiconductor integrated circuit chip.It not only plays installation, fixation, sealing, protection core
The effect of piece and enhancing electric heating property etc., but also it is wired to by the contact on chip the pin of package casing
On, these pins are connected further through the conducting wire on printed circuit board with other devices, to realize inside chip and external electrical
The connection on road.Because chip must be isolated from the outside, to prevent the impurity in air from causing to the corrosion of chip circuit electrically
Performance decline.On the other hand, the chip after encapsulation is also more convenient for installing and be transported.Since the quality of encapsulation technology also directly affects
To the performance of chip self performance and designing and manufacturing for PCB (printed circuit board) that is attached thereto, therefore it is most important
's.
After the completion of traditional chip package, pin is fixedly connected with package casing, is held very much in transport and use process
It easily leads to pipeline to fracture, leads to entire chip rejection, and chip cost is high, this results in largely losing, and in order to guarantee
Chip interior bare board not by impurity and moisture and ray influenced, general package casing is sealing structure, this is resulted in
Chip cooling effect is poor, influences chip in work so that efficiency, traditional chip-packaging structure are unable to satisfy making for user
With demand, we design a kind of high performance control chip-packaging structure thus, to solve the above problems.
Summary of the invention
The purpose of the present invention is to solve conventional package pin frangibility in the prior art, heat dissipation effect difference lack
Point, and a kind of high performance control chip-packaging structure proposed.
To achieve the goals above, present invention employs following technical solutions:
A kind of high performance control chip-packaging structure, including upper cover and lower case, the upper cover and lower case are mutually butted
Sealing forms package casing, and the package casing is internally provided with substrate, and it is naked to be fixedly installed with integrated circuit on the substrate
Piece, the two sides of the package casing are fixedly installed several short pins, the gold on the integrated circuit die along its length
Belong to and being welded between contact and short pin by metal lead wire, the inner cavity of the package casing is embedded to resin, and resin is apart from upper cover
Top be reserved with gap, the upper cover is located at gap location and is provided with radiator structure, and the both ends of the lower case two sides are all provided with
It is equipped with fixed structure, the fixed structure includes support rod, and one end of the support rod is fixedly connected in lower case, separately there is one
End is fixedly installed L shape fixed link, clamping groove is formed between the L shape fixed link and support rod, and be provided in L shape fixed link
Perforative screw, two are fixedly installed with external pin between the fixed structure of the same side of the lower case, and external
Pin is connected with short pin.
Preferably, the radiator structure includes two positive stop strips, and two positive stop strips are fixedly installed on upper cover internal clearance
Two sides inner wall on, and adjustable plate is movably set between the upside of two positive stop strips, it is equidistant on the adjustable plate to be provided with
First radiating groove, and the first radiating groove is arranged along the width direction of adjustable plate, is fixedly connected in the middle part of one end of the adjustable plate
Supporting plate, the supporting plate are fixedly installed perpendicular push plate far from one end of adjustable plate, equidistant in the upper cover to be provided with
Perforative second radiating groove, and the second radiating groove is arranged along its width direction, the side wall that the upper cover is located at supporting plate is provided with
Notch, and supporting plate extends to the outside of upper cover by notch.
Preferably, the spacing of first radiating groove between any two with the second radiating groove being equidistant between any two, adjust
Section plate and upper cover are located in the state of initial position, and the first radiating groove is staggered with the second radiating groove, and supporting plate is located at upper cover
Outer length is equal with the spacing of the first radiating groove between any two.
Preferably, the external pin includes fixed strut, and the fixed strut is strip structure, and both ends are respectively provided with
There is docking block, the side of the fixed strut has been equidistantly positioned copper cap along its length, and the side of the copper cap is provided with
Docking groove, the fixed strut have been equidistantly positioned long pin far from the side of copper cap along its length, the long pin with
Copper cap corresponds, and long pin is connected positioned at interior one end of fixed strut with copper cap.
Preferably, the equal length of the length of the fixed strut and package casing, and the docking block at fixed strut both ends
It is docked in two clamping grooves of encapsulating housing the same side.
Preferably, the setting quantity of the copper cap and the setting quantity of short pin are equal, and correspond.
Preferably, the side that the substrate is in contact with integrated circuit die is equipped with one layer of heat sink material.
Preferably, it is provided with screw hole on the upside of the docking block, and screw is fixedly connected with screw hole.
Compared with prior art, the beneficial effects of the present invention are:
1, short pin is arranged in package casing two sides, and connects external pin by fixed structure, external during transportation
Pin and package casing are separable, in use, the short pin of external pin and encapsulating housing can be fixedly connected, avoid core
Piece pin fractures in transport and use process, and external pin fracture after be conveniently replaceable, can guarantee that chip will not be because of
Pin fractures and scraps, and improves the service life and utilization rate of chip；
2, under radiator structure original state, adjustable plate blocks the second radiating groove, guarantees transportational process and unused state
Under, the leakproofness of package casing after chip is installed, can push push plate, so that the first radiating groove is overlapped with the second radiating groove,
The radiating efficiency for improving chip improves the efficiency in chip use process.
Of the invention novel in design, structure is simple, easy to use, and the design seperated with chip of external pin both can guarantee transport
Pin will not fracture in the process, and pin can be made replaceable, improve the utilization rate of chip, reduce scrappage, while
While guaranteeing leakproofness, the radiating efficiency of chip is improved, is suitable for promoting the use of.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of high performance control chip-packaging structure proposed by the present invention；
Fig. 2 is a kind of overlook explosive view of high performance control chip-packaging structure proposed by the present invention；
Fig. 3 is a kind of side sectional view of the upper cover of high performance control chip-packaging structure proposed by the present invention；
Fig. 4 is a kind of structural schematic diagram of the adjustable plate of high performance control chip-packaging structure proposed by the present invention；
Fig. 5 is a kind of side view of the external pin of high performance control chip-packaging structure proposed by the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1 with 2, a kind of high performance control chip-packaging structure, including upper cover 1 and lower case 2, upper cover 1 and lower casing
Body 2 is mutually butted sealing, forms package casing, and package casing is internally provided with substrate 3, is fixedly installed on substrate 3 integrated
Circuit die 4, the side that substrate 3 is in contact with integrated circuit die 4 are equipped with one layer of heat sink material 18, the two sides of package casing
It is fixedly installed several short pins 5 along its length, passes through between the hard contact and short pin 5 on integrated circuit die 4
Metal lead wire 6 welds, and the inner cavity of package casing is embedded to resin 7, and top of the resin 7 apart from upper cover 1 is reserved with gap, upper cover 1
Gap location is provided with radiator structure, the both ends of 2 two sides of lower case are provided with fixed structure, and fixed structure includes support
Bar 14, one end of support rod 14 are fixedly connected in lower case 2, separately have one end to be fixedly installed L shape fixed link 15, L shape is fixed
Clamping groove is formed between bar 15 and support rod 14, and is provided with perforative screw 16 in L shape fixed link 15, and two are located at lower case
External pin 17 is fixedly installed between the fixed structure of 2 same sides, and external pin 17 is connected with short pin 5.
External pin 17 is seperated with package casing to be designed, and not only can guarantee that pin will not fracture in transportational process, but also can make
Pin is replaceable, improves the utilization rate of chip, reduces scrappage, while while guaranteeing leakproofness, improving chip
Radiating efficiency, be suitable for promote the use of.
Referring to Fig. 2-4, radiator structure includes two positive stop strips 9, and two positive stop strips 9 are fixedly installed between 1 inside of upper cover
On the two sides inner wall of gap, and it is movably set with adjustable plate 10 between the upside of two positive stop strips 9, is equidistantly positioned on adjustable plate 10
There is the first radiating groove 11, and the first radiating groove 11 is arranged along the width direction of adjustable plate 10, it is fixed in the middle part of one end of adjustable plate 10
It is connected with supporting plate 12, supporting plate 12 is fixedly installed perpendicular push plate 13 far from one end of adjustable plate 10, equidistant in upper cover 1
It is provided with perforative second radiating groove 8, and the second radiating groove 8 is arranged along its width direction, upper cover 1 is located at the side wall at supporting plate 12
It is provided with notch, and supporting plate 12 extends to the outside of upper cover 1, the spacing and second of the first radiating groove 11 between any two by notch
Being equidistant between any two of radiating groove 8, adjustable plate 10 and upper cover 1 are located in the state of initial position, the first radiating groove 11 and
Second radiating groove 8 is staggered, and supporting plate 12 is located at spacing phase of the length with the first radiating groove 11 between any two outside upper cover 1
Deng.
Under radiator structure original state, adjustable plate 10 blocks the second radiating groove 8, guarantees transportational process and unused state
Under, the leakproofness of package casing after chip is installed, can push push plate 13 into upper cover 1, so that the first radiating groove 11 and
Two radiating grooves 8 are overlapped, and are improved the radiating efficiency of chip, are improved the efficiency in chip use process.
Referring to Fig.1,2 and 5, external pin 17 includes fixed strut 171, fixes strut 171 as strip structure, and both ends
It is provided with docking block 175, the side of fixed strut 171 has been equidistantly positioned copper cap 172 along its length, copper cap 172
Side is provided with docking groove 173, and fixed strut 171 has been equidistantly positioned long tube far from the side of copper cap 172 along its length
Foot 174, long pin 174 and copper cap 172 correspond, and long pin 174 is located at interior one end and the copper cap of fixed strut 171
172 are connected, the length of fixed strut 171 and the equal length of package casing, and the docking block 175 at fixed 171 both ends of strut
It is docked in two clamping grooves of encapsulating housing the same side, the setting quantity and the setting quantity phase of short pin 5 of copper cap 172
Deng, and correspond, the upside of docking block 175 is provided with screw hole, and screw 16 is fixedly connected with screw hole.
Short pin 5 is arranged in package casing two sides, and connects external pin 17 by fixed structure, external during transportation
Pin 17 and package casing are separable, in use, external pin 17 and the short pin 5 of encapsulating housing can be fixedly connected, phase
When docking, short pin 5 is inserted on external pin 17 in the docking groove 173 of copper cap 172, so that short pin 5 is connected with long pin 174
It is logical, and long pin 174 can be the shape needed in the actual productions such as strip, zigzag shape, avoid chip pin transport with
And fracture in use process, and external pin 17 fracture after be conveniently replaceable, can guarantee that chip will not be reported because pin fractures
It is useless, improve the service life and utilization rate of chip.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of high performance control chip-packaging structure, including upper cover (1) and lower case (2), the upper cover (1) and lower case
(2) it is mutually butted sealing, forms package casing, which is characterized in that being internally provided with substrate (3) for the package casing, it is described
Integrated circuit die (4) are fixedly installed on substrate (3), if the two sides of the package casing are fixedly installed along its length
Dry short pin (5) is welded by metal lead wire (6) between the hard contact and short pin (5) on the integrated circuit die (4)
Connect, the inner cavity of the package casing is embedded to resin (7), and resin (7) is reserved with gap at the top of upper cover (1), it is described on
Lid (1) is located at gap location and is provided with radiator structure, and the both ends of lower case (2) two sides are provided with fixed structure, described
Fixed structure includes support rod (14), and one end of the support rod (14) is fixedly connected on lower case (2), separately has one end to fix
It is provided with L shape fixed link (15), forms clamping groove, and L shape fixed link between the L shape fixed link (15) and support rod (14)
(15) it is provided on perforative screw (16), two are located at fixed peace between the fixed structure of the lower case (2) same side
Equipped with external pin (17), and external pin (17) is connected with short pin (5).
2. a kind of high performance control chip-packaging structure according to claim 1, which is characterized in that the radiator structure packet
Two positive stop strips (9) are included, and two positive stop strips (9) are fixedly installed on the two sides inner wall of upper cover (1) internal clearance, and two limits
It is movably set with adjustable plate (10) between the upside of position item (9), it is equidistant on the adjustable plate (10) to be provided with the first radiating groove
(11), and the first radiating groove (11) is arranged along the width direction of adjustable plate (10), fixed in the middle part of one end of the adjustable plate (10)
It being connected with supporting plate (12), the supporting plate (12) is fixedly installed perpendicular push plate (13) far from the one end of adjustable plate (10),
It is equidistant on the upper cover (1) to be provided with perforative second radiating groove (8), and the second radiating groove (8) is arranged along its width direction,
The upper cover (1) is located at the side wall at supporting plate (12) and is provided with notch, and supporting plate (12) extends to the outer of upper cover (1) by notch
Portion.
3. a kind of high performance control chip-packaging structure according to claim 2, which is characterized in that first radiating groove
(11) being equidistant between any two, adjustable plate (10) and upper cover (1) are located at just spacing between any two with the second radiating groove (8)
In the state of beginning position, the first radiating groove (11) is staggered with the second radiating groove (8), and supporting plate (12) is located at upper cover (1) outside
Length it is equal with the spacing of the first radiating groove (11) between any two.
4. a kind of high performance control chip-packaging structure according to claim 1, which is characterized in that the external pin
It (17) include fixed strut (171) that the fixed strut (171) is strip structure, and both ends are provided with docking block
(175), the side of the fixed strut (171) has been equidistantly positioned copper cap (172) along its length, the copper cap (172)
Side be provided with docking groove (173), the fixed strut (171) far from copper cap (172) side it is equidistant along its length
From being provided with long pin (174), the long pin (174) and copper cap (172) are corresponded, and long pin (174) is located at fixation
Interior one end of strut (171) is connected with copper cap (172).
5. a kind of high performance control chip-packaging structure according to claim 4, which is characterized in that the fixed strut
(171) equal length of length and package casing, and the docking block (175) at fixed strut (171) both ends is docked at and is located at envelope
In two clamping grooves for filling shell the same side.
6. a kind of high performance control chip-packaging structure according to claim 4, which is characterized in that the copper cap (172)
Setting quantity it is equal with the setting quantity of short pin (5), and correspond.
7. a kind of high performance control chip-packaging structure according to claim 1, which is characterized in that the substrate (3) with
The side that integrated circuit die (4) is in contact is equipped with one layer of heat sink material (18).
8. a kind of high performance control chip-packaging structure according to claim 4, which is characterized in that the docking block
(175) screw hole is provided on the upside of, and screw (16) is fixedly connected with screw hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810411156.7A CN108470725B (en) | 2018-05-02 | 2018-05-02 | A kind of high performance control chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810411156.7A CN108470725B (en) | 2018-05-02 | 2018-05-02 | A kind of high performance control chip-packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108470725A CN108470725A (en) | 2018-08-31 |
| CN108470725B true CN108470725B (en) | 2019-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810411156.7A Active CN108470725B (en) | 2018-05-02 | 2018-05-02 | A kind of high performance control chip-packaging structure |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115064511B (en) * | 2022-08-17 | 2022-10-25 | 广东长华科技有限公司 | Semiconductor packaging part with heat radiation structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3941877B2 (en) * | 2005-11-16 | 2007-07-04 | 国立大学法人九州工業大学 | Double-sided electrode package and manufacturing method thereof |
| CN202003988U (en) * | 2011-02-22 | 2011-10-05 | 苏州日月新半导体有限公司 | QFN (quad flat no-lead) package structure and lead frame strip thereof |
| JP6501606B2 (en) * | 2015-05-19 | 2019-04-17 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| CN206711899U (en) * | 2017-05-04 | 2017-12-05 | 萨锐微电子（上海）有限公司 | There is one kind power to increase powerful Transient Suppression Diode encapsulating structure |
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Effective date of registration: 20190819 Address after: 230000 18 Floor, Block C, J2 District, Phase II Innovation Industrial Park, Hefei High-tech Zone, Anhui Province Applicant after: Hefei dragon totem Information Technology Co., Ltd. Address before: 213001 Room 1818, Seven Blocks, Shimao Commercial Plaza, Xinbei District, Changzhou City, Jiangsu Province Applicant before: Jiangsu ingenuity Mdt InfoTech Ltd |
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Effective date of registration: 20191023 Address after: Room 101, building D2, 188 Linjiang Avenue, Linjiang Town, Haimen City, Nantong City, Jiangsu Province 226100 Applicant after: Jiangsu sensiton Electronic Technology Co., Ltd Address before: 230000 18 Floor, Block C, J2 District, Phase II Innovation Industrial Park, Hefei High-tech Zone, Anhui Province Applicant before: Hefei dragon totem Information Technology Co., Ltd. |
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