CN207320095U - A kind of new cupro-nickel gold IC package convex block - Google Patents
A kind of new cupro-nickel gold IC package convex block Download PDFInfo
- Publication number
- CN207320095U CN207320095U CN201721406022.3U CN201721406022U CN207320095U CN 207320095 U CN207320095 U CN 207320095U CN 201721406022 U CN201721406022 U CN 201721406022U CN 207320095 U CN207320095 U CN 207320095U
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- CN
- China
- Prior art keywords
- package
- leg
- package blocks
- cupro
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a kind of new cupro-nickel gold IC package convex block; including package blocks; encapsulation upper cover is provided with above the package blocks; encapsulation lower cover is provided with below the package blocks; the outer surface of the encapsulation upper cover is provided with insulating heat-conductive piece; one end of the package blocks is provided with leg; the encapsulation upper cover is internally provided with IC chip; the outer surface of the IC chip is provided with gold thread; aluminum steel is provided with the link position of the IC chip and leg, protecting box is provided with the outside of the leg；By being provided with protecting box on leg; it can cause the extruding that leg is reduced in the transportational process of package blocks after packaging is accomplished; prevent the deformation of leg; reduce the damage of package blocks; play the role of protection to the leg of package blocks, by being provided with silica gel in package blocks, the inside that the steam in air enters package blocks can be absorbed; being corroded be subject to steam for electric elements is reduced, increases the service life of the IC chip inside package blocks.
Description
Technical field
The utility model belongs to IC package bump technology field, and in particular to a kind of new cupro-nickel gold IC package convex block.
Background technology
IC chip is by substantial amounts of microelectronic component, and the integrated circuit that IC chip is formed is placed on one piece of modeling base, makes
Chip piece.Now nearly all chip seen, can be called IC chip, integrated circuit be a kind of microelectronic device or
Component.Using certain technique, element and the cloth such as transistor, diode, resistance, capacitance and inductance needed for a circuit
Line interconnects together, is produced on a fritter or a few fritter semiconductor wafers or dielectric substrate, is then encapsulated in a shell, into
For the microstructure with required circuit function；Wherein all elements have formed a whole in structure, make electronic component to
Major step is strided forward in terms of microminaturization, low-power consumption and high reliability, it is represented with alphabetical " IC " in circuit, is partly led now
The most of applications of body industry are the integrated circuits based on silicon.
Existing cupro-nickel gold IC package convex block, it is thinner to possess the leg of cupro-nickel gold IC package convex block, and in transport, leg connects
The realization of leg is be easy to cause when contact is contacted with exterior object so that cupro-nickel gold IC package convex block is scrapped, cupro-nickel gold IC package
The problem of IC chip of convex block cannot contact moisture, and contact of the moisture with IC chip is easily reduced the service life of IC chip, is
This is it is proposed that a kind of new cupro-nickel gold IC package convex block.
Utility model content
The purpose of this utility model is to provide a kind of new cupro-nickel gold IC package convex block, to solve in above-mentioned background technology
It is proposed existing cupro-nickel gold IC package convex block, it is thinner to possess the leg of cupro-nickel gold IC package convex block, the leg contact point in transport
The realization of leg is be easy to cause when being contacted with exterior object so that cupro-nickel gold IC package convex block is scrapped, cupro-nickel gold IC package convex block
IC chip cannot contact moisture, the problem of contact of the moisture with IC chip is easily reduced the service life of IC chip.
To achieve the above object, the utility model provides following technical solution：A kind of new cupro-nickel gold IC package convex block, bag
Package blocks are included, encapsulation upper cover is provided with above the package blocks, encapsulation lower cover, the envelope are provided with below the package blocks
The outer surface for loading onto lid is provided with insulating heat-conductive piece, and one end of the package blocks is provided with leg, the inside of the encapsulation upper cover
It is provided with IC chip, the outer surface of the IC chip is provided with gold thread, is provided with the link position of the IC chip and leg
Aluminum steel, protecting box is provided with the outside of the leg, and the protecting box is internally provided with spring, and one end of the spring is set
There is rubber pad, the package blocks are internally provided with silica gel, and the protecting box is internally provided with leg holding chamber.
Preferably, the encapsulation upper cover and package blocks are internally provided with layer of silica gel, and layer of silica gel is internally provided with silicon
Glue.
Preferably, the spring one end is fixedly connected on rubber pad by electric welding, and the other end is fixedly connected by electric welding
In the inner side of protecting box.
Preferably, the spring is provided with ten altogether, and ten springs are uniformly arranged on the inner side of protecting box.
Preferably, the rubber pad position U-shape structure.
Compared with prior art, the beneficial effects of the utility model are：By being provided with protecting box on leg, can make
The extruding that leg is reduced in the transportational process of package blocks after packaging is accomplished is obtained, the deformation of leg is prevented, reduces the damage of package blocks
It is bad, play the role of protection to the leg of package blocks, by being provided with silica gel in package blocks, the steam in air can be absorbed
The inside of package blocks is entered, reduces being corroded be subject to steam for electric elements so that the problem of the damage of electrical equipment, increase
The service life of IC chip inside package blocks.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the section structure diagram of the utility model；
Fig. 3 is the protecting box section structure diagram of the utility model；
In figure：1- encapsulation lower cover, 2- insulating heat-conductives piece, 3- encapsulation upper cover, 4- package blocks, 5- legs, 6- aluminum steels, 7-IC cores
Piece, 8- gold threads, 9- protecting box, 10- springs, 11- rubber pads, 12- silica gel, 13- leg holding chambers.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
Please refer to Fig.1, Fig. 2 and Fig. 3, the utility model provide a kind of new cupro-nickel gold IC package bump technology scheme：One
The new cupro-nickel gold IC package convex block of kind, including package blocks 4, the top of package blocks 4 are provided with encapsulation upper cover 3, the lower section of package blocks 4
Encapsulation lower cover 1 is provided with, the outer surface of encapsulation upper cover 3 is provided with insulating heat-conductive piece 2, and one end of package blocks 4 is provided with leg 5,
Encapsulation upper cover 3 is internally provided with IC chip 7, and the outer surface of IC chip 7 is provided with gold thread 8, IC chip 7 and the connection of leg 5
Aluminum steel 6 is provided with position, the outside of leg 5 is provided with protecting box 9, and protecting box 9 is internally provided with spring 10, spring 10
One end is provided with rubber pad 11, and package blocks 4 are internally provided with silica gel 12, and protecting box 9 is internally provided with leg holding chamber 13.
In order to enable the inside of cupro-nickel gold IC package convex block prevents the entrance of steam, in the present embodiment, it is preferred that in encapsulation
Lid 3 and package blocks 4 are internally provided with layer of silica gel, and layer of silica gel is internally provided with silica gel 12.
In order to enable spring 10 be fixedly connected more stablize, in the present embodiment, it is preferred that 10 one end of spring passes through electric welding
It is fixedly connected on rubber pad 11, the other end is fixedly connected on the inner side of protecting box 9 by electric welding.
In order to enable protecting box 9 preferably plays the role of leg 5 protection, in the present embodiment, it is preferred that spring 10 is common
Ten are provided with, and ten springs 10 are uniformly arranged on the inner side of protecting box 9.
It is installed in order to enable leg 5 is more convenient in protecting box 9, in the present embodiment, it is preferred that 11 U of rubber pad
Shape shape and structure.
The operation principle and process for using of the utility model：The utility model is after installation is complete, it is possible to uses, during use
The encapsulation lower cover 1 of package blocks 4 and encapsulation upper cover 3 are sealed connected together, silica gel 12 can absorb external moisture, prevent steam
Into the inside of package blocks 4, leg 5 is inserted into protecting box 9, and the extruding of spring 10 in protecting box 9 drives rubber pad 11 so that protecting
Shield box 9 is connected with leg 5.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from the principle of the utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of new cupro-nickel gold IC package convex block, including package blocks（4）, it is characterised in that：The package blocks（4）Top set
It is equipped with encapsulation upper cover（3）, the package blocks（4）Lower section be provided with encapsulation lower cover（1）, the encapsulation upper cover（3）Outer surface
It is provided with insulating heat-conductive piece（2）, the package blocks（4）One end be provided with leg（5）, the encapsulation upper cover（3）Inside set
It is equipped with IC chip（7）, the IC chip（7）Outer surface be provided with gold thread（8）, the IC chip（7）With leg（5）Connection
Aluminum steel is provided with position（6）, the leg（5）Outside be provided with protecting box（9）, the protecting box（9）Inside set
There is spring（10）, the spring（10）One end be provided with rubber pad（11）, the package blocks（4）Be internally provided with silica gel
（12）, the protecting box（9）Be internally provided with leg holding chamber（13）.
A kind of 2. new cupro-nickel gold IC package convex block according to claim 1, it is characterised in that：The encapsulation upper cover（3）
And package blocks（4）Be internally provided with layer of silica gel, and layer of silica gel is internally provided with silica gel（12）.
A kind of 3. new cupro-nickel gold IC package convex block according to claim 1, it is characterised in that：The spring（10）One end
Rubber pad is fixedly connected on by electric welding（11）On, the other end is fixedly connected on protecting box by electric welding（9）Inner side.
A kind of 4. new cupro-nickel gold IC package convex block according to claim 1, it is characterised in that：The spring（10）Set altogether
It is equipped with ten, and ten springs（10）It is uniformly arranged on protecting box（9）Inner side.
A kind of 5. new cupro-nickel gold IC package convex block according to claim 1, it is characterised in that：The rubber pad（11）Position
U-shape structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721406022.3U CN207320095U (en) | 2017-10-29 | 2017-10-29 | A kind of new cupro-nickel gold IC package convex block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721406022.3U CN207320095U (en) | 2017-10-29 | 2017-10-29 | A kind of new cupro-nickel gold IC package convex block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207320095U true CN207320095U (en) | 2018-05-04 |
Family
ID=62379722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721406022.3U Active CN207320095U (en) | 2017-10-29 | 2017-10-29 | A kind of new cupro-nickel gold IC package convex block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207320095U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710614A (en) * | 2020-05-12 | 2020-09-25 | 龚建中 | Novel oxygen-free packaging method for integrated circuit |
| WO2022052209A1 (en) * | 2020-09-11 | 2022-03-17 | 安徽龙芯微科技有限公司 | Chip packaging body and preparation method therefor |
-
2017
- 2017-10-29 CN CN201721406022.3U patent/CN207320095U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111710614A (en) * | 2020-05-12 | 2020-09-25 | 龚建中 | Novel oxygen-free packaging method for integrated circuit |
| CN111710614B (en) * | 2020-05-12 | 2022-01-11 | 中山市东翔微电子有限公司 | Oxygen-free packaging method of integrated circuit |
| WO2022052209A1 (en) * | 2020-09-11 | 2022-03-17 | 安徽龙芯微科技有限公司 | Chip packaging body and preparation method therefor |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |