CN209544312U - A kind of integrated circuit anti static device - Google Patents
A kind of integrated circuit anti static device Download PDFInfo
- Publication number
- CN209544312U CN209544312U CN201920707982.6U CN201920707982U CN209544312U CN 209544312 U CN209544312 U CN 209544312U CN 201920707982 U CN201920707982 U CN 201920707982U CN 209544312 U CN209544312 U CN 209544312U
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- insulation shell
- package substrate
- chip
- groove
- integrated circuit
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Abstract
The utility model discloses a kind of integrated circuit anti static devices, including package substrate, chip and insulation shell structure, the inside of the package substrate opens up fluted, the inner wall that the package substrate is located at groove is fixedly installed PVC board layer, for reducing the electrostatic between package substrate and chip, chip is placed in the groove, the cross-sectional area of the chip is less than the cross-sectional area of groove, two sides above the package substrate are fixedly installed fixed block respectively, T-slot is offered in the fixed block, the insulation shell structure includes insulation shell, shielding metal leve and PET sheet layer.The utility model in fixed block by offering T-slot, also convex block is respectively equipped in the bottom of insulation shell two sides, by being matched between convex block and T-slot, it can make to be to be slidably connected between insulation shell and package substrate, it is convenient for mounting and dismounting, has the advantages that structure is simple, easy to use, using effect is good.
Description
Technical field
The utility model relates to IDE technical field, specially a kind of integrated circuit anti static device.
Background technique
Integrated circuit is a kind of microelectronic device or component.Using certain technique, crystalline substance needed for a circuit
The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function；Wherein all elements are in structure
On formed a whole, so that electronic component has been strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step.It uses alphabetical " IC " to indicate in circuit.It is that the one kind to grow up one sixties of later period the 1950s novel is partly led
Body device.It is that have certain function constituting through semiconductor fabrication process such as peroxidating, photoetching, diffusion, extension, evaporations of aluminum
The elements such as semiconductor needed for circuit, resistance, capacitor and the connecting wire between them are fully integrated on a fritter silicon wafer, so
The electronic device being encapsulated in a shell is welded afterwards.Its package casing has round shell-type, flat or dual inline type etc. a variety of
Form.Integrated circuit technique includes chip fabrication techniques and designing technique, is mainly reflected in process equipment, processing technology, encapsulation
In the ability of test, batch production and design innovation.
Traditional integrated antenna package, since structure is simple, be usually all by gluing or welding by shell and substrate into
Row is fixedly connected, and is not easy to be dismantled.
Utility model content
The purpose of this utility model is to provide a kind of integrated circuit anti static devices, to solve to mention in above-mentioned background technique
Out the problem of.
To achieve the above object, the utility model provides the following technical solutions: a kind of integrated circuit anti static device, including
Package substrate, chip and insulation shell structure, the inside of the package substrate open up fluted, and the package substrate is located at groove
Inner wall be fixedly installed PVC board layer, for reducing the electrostatic between package substrate and chip, be placed with core in the groove
Piece, the cross-sectional area of the chip are less than the cross-sectional area of groove, and fixation is set the two sides above the package substrate respectively
Be equipped with fixed block, offer T-slot in the fixed block, the insulation shell structure include insulation shell, shielding metal leve and
PET sheet layer, the insulation shell are located at the surface of package substrate, and the bottom of the insulation shell two sides is respectively arranged with convex
Block matches between the convex block and T-slot, for being slidably connected between insulation shell and fixed block.
Preferably, the outside of the insulation shell is fixedly installed shielding metal leve, for reducing the generation of short circuit.
Preferably, it is fixedly installed PET sheet layer on the inside of the insulation shell, for improving the antistatic effect of insulation shell
Fruit.
Preferably, the two sides for being internally located at groove of the package substrate are fixedly installed grounding pin, the core respectively
Piece passes through between conducting wire and grounding pin as electric connection.
Preferably, the distance between the insulation shell and groove are greater than the height of chip.
Preferably, the package substrate is made of organic resin material.
Compared with prior art, the utility model has the beneficial effects that
1, the utility model is fluted by opening up in package substrate, can in groove chip, also in chip
Inner wall be equipped with PVC board layer, can reduce chip and package substrate due to friction generate electrostatic generation, then in package substrate
The two sides of top are equipped with fixed block, and T-slot is offered in fixed block, are also equipped with convex block in the bottom of insulation shell two sides, convex
To match between block and T-slot, so insulation shell can be slidably connected between fixed block, it is easily installed and dismantles,
And it is very stable between insulation shell and package substrate；
2, the utility model is also equipped with shielding metal leve in the outside of insulation shell simultaneously, and it is short can to reduce chip generation
Road, and it is equipped with PET sheet layer in the inside of insulation shell, it can be improved the antistatic effect of insulation shell, and in encapsulation base
Two sides in plate positioned at groove are fixedly installed grounding pin respectively, and chip, which passes through, to be carried out electrically connecting between conducting wire and grounding pin
It connects, the electrostatic in chip can be exported by grounding pin, prevent in chip that there is structure because electrostatic crosses the short circuit that mostly occurs
Simply, advantage easy to use, using effect is good.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is the utility model local structure top view；
Fig. 3 is the utility model insulation shell side view.
In figure: 1- package substrate；101- groove；102-PVC plate layer；2- fixed block；201-T type groove；3- chip；4- insulation
Shell；401- convex block；5- shielding metal leve；6-PET plate layer；7- grounding pin.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of integrated circuit anti static device, including bottom
Seat 19, including package substrate 1, chip 3 and insulation shell structure, the inside of the package substrate 1 open up fluted 101, described
The inner wall that package substrate 1 is located at groove 101 is fixedly installed PVC board layer 102, for reducing between package substrate 1 and chip 3
Electrostatic, chip 3 is placed in the groove 101, and the cross-sectional area of the chip 3 is less than the cross-sectional area of groove 101, institute
The two sides for stating 1 top of package substrate are fixedly installed fixed block 2 respectively, and T-slot 201 is offered in the fixed block 2, described exhausted
Edge shell structure includes insulation shell 4, shielding metal leve 5 and PET sheet layer 6, and the insulation shell 4 is being located at package substrate 1 just
Top, the bottom of 4 two sides of insulation shell are respectively arranged with convex block 401, are mating between the convex block 401 and T-slot 201
It uses, for being slidably connected between insulation shell 4 and fixed block 2.
The outside of the insulation shell 4 is fixedly installed shielding metal leve 5, for reducing the generation of short circuit；The insulation
The inside of shell 4 is fixedly installed PET sheet layer 6, for improving the antistatic effect of insulation shell 4；The package substrate 1 it is interior
The two sides that portion is located at groove 101 are fixedly installed grounding pin 7 respectively, and the chip 3 by being between conducting wire and grounding pin 7
It is electrically connected, the electrostatic of chip 3 can be passed to the earth by grounding pin 7；Between the insulation shell 4 and groove 101
Distance be greater than chip 3 height, be easily installed chip 3；The package substrate 1 is made of organic resin material, not only insulate
Effect is good and antistatic property is high.
Working principle: the utility model can be installed by opening up fluted 101 in package substrate 1 in groove 101
Chip 3 is also equipped with PVC board layer 102 in the inner wall of chip 3, can reduce chip 3 and package substrate 1 since friction generates electrostatic
Generation, then the two sides above package substrate 1 be equipped with fixed block 2, T-slot 201 is offered in fixed block 2, also exhausted
The bottom of 4 two sides of edge shell is equipped with convex block 401, matches between convex block 401 and T-slot 201, so insulation shell 4 can
To be slidably connected between fixed block 2, it is easily installed and dismantles, and is very stable between insulation shell 4 and package substrate 1；Together
When also the outside of insulation shell 4 be equipped with shielding metal leve 5, chip 3 can be reduced, short circuit occurs, and in insulation shell 4
Inside is equipped with PET sheet layer 6, can be improved the antistatic effect of insulation shell 4, and positioned at groove 101 in package substrate 1
Two sides are fixedly installed grounding pin 7 respectively, and chip 3, can be by core by being electrically connected between conducting wire and grounding pin 7
Electrostatic in piece 3 is exported by grounding pin 7, is prevented in chip 3 because electrostatic crosses the short circuit that mostly occurs, and has that structure is simple, makes
With the good advantage of convenient, using effect.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of integrated circuit anti static device, including package substrate (1), chip (3) and insulation shell structure, feature exist
In: the inside of the package substrate (1) opens up fluted (101), and the inner wall that the package substrate (1) is located at groove (101) is solid
Surely PVC board layer (102) are provided with, for reducing the electrostatic between package substrate (1) and chip (3), are put in the groove (101)
It is equipped with chip (3), the cross-sectional area of the chip (3) is less than the cross-sectional area of groove (101), the package substrate (1)
The two sides of top are fixedly installed fixed block (2) respectively, offer T-slot (201), the insulation shell in the fixed block (2)
Body structure includes insulation shell (4), shielding metal leve (5) and PET sheet layer (6), and the insulation shell (4) is located at package substrate
(1) bottom of surface, insulation shell (4) two sides is respectively arranged with convex block (401), the convex block (401) and T-slot
(201) to match between, for being slidably connected between insulation shell (4) and fixed block (2).
2. a kind of integrated circuit anti static device according to claim 1, it is characterised in that: the insulation shell (4)
Outside is fixedly installed shielding metal leve (5), for reducing the generation of short circuit.
3. a kind of integrated circuit anti static device according to claim 1, it is characterised in that: the insulation shell (4)
Inside is fixedly installed PET sheet layer (6), for improving the antistatic effect of insulation shell (4).
4. a kind of integrated circuit anti static device according to claim 1, it is characterised in that: the package substrate (1)
The two sides for being internally located at groove (101) are fixedly installed grounding pin (7) respectively, and the chip (3) passes through conducting wire and grounding lead
It is electric connection between foot (7).
5. a kind of integrated circuit anti static device according to claim 1, it is characterised in that: the insulation shell (4) with
The distance between groove (101) is greater than the height of chip (3).
6. a kind of integrated circuit anti static device according to claim 1, it is characterised in that: the package substrate (1) by
Organic resin material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920707982.6U CN209544312U (en) | 2019-05-16 | 2019-05-16 | A kind of integrated circuit anti static device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920707982.6U CN209544312U (en) | 2019-05-16 | 2019-05-16 | A kind of integrated circuit anti static device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209544312U true CN209544312U (en) | 2019-10-25 |
Family
ID=68246727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920707982.6U Active CN209544312U (en) | 2019-05-16 | 2019-05-16 | A kind of integrated circuit anti static device |
Country Status (1)
| Country | Link |
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| CN (1) | CN209544312U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN112234050A (en) * | 2020-09-22 | 2021-01-15 | 江苏盐芯微电子有限公司 | Multi-chip integrated circuit packaging structure |
| US20210217676A1 (en) * | 2020-01-10 | 2021-07-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip package structure with ring structure and method for forming the same |
-
2019
- 2019-05-16 CN CN201920707982.6U patent/CN209544312U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111050534B (en) * | 2019-12-19 | 2022-02-18 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| US20210217676A1 (en) * | 2020-01-10 | 2021-07-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip package structure with ring structure and method for forming the same |
| US11728233B2 (en) * | 2020-01-10 | 2023-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chip package structure with ring structure and method for forming the same |
| CN112234050A (en) * | 2020-09-22 | 2021-01-15 | 江苏盐芯微电子有限公司 | Multi-chip integrated circuit packaging structure |
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