CN208127181U - A kind of package of ic that can eliminate external carbuncle - Google Patents
A kind of package of ic that can eliminate external carbuncle Download PDFInfo
- Publication number
- CN208127181U CN208127181U CN201820366004.5U CN201820366004U CN208127181U CN 208127181 U CN208127181 U CN 208127181U CN 201820366004 U CN201820366004 U CN 201820366004U CN 208127181 U CN208127181 U CN 208127181U
- Authority
- CN
- China
- Prior art keywords
- mounting plate
- shell
- package
- placed cavity
- eliminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses the package of ic that one kind can eliminate external carbuncle,Its structure includes bottom plate,Shell,Placed cavity,Wearing layer,Pin,U-shaped mounting plate,The utility model one kind can eliminate the package of ic of external carbuncle,Equipped with U-shaped mounting plate,It is connected together with bottom plate by connecting plate,When then encapsulating,Screw is without being accurately positioned installing port,Installing port can be threaded directly into be fixed,Installation fixation hole is improved in structure,The installation fixation hole of package casing is arranged to open U-shaped installing port form,To simplify the fixed process of installation,Allow to achieve the effect that eliminate stress,Ensure the complete of internal components,Reduce the fixed spoilage of installation,And increase the service life of package casing,Package casing is caused to lead to the problem of deformation damage chip to eliminate due to the external force at fixation hole squeezes,Make package casing use more convenient,It is firm.
Description
Technical field
The utility model is a kind of package of ic that can eliminate external carbuncle, belongs to integrated antenna package equipment
Field.
Background technique
Integrated circuit is a kind of microelectronic device or component.Using certain technique, crystalline substance needed for a circuit
The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell.
Prior art discloses application No. is：A kind of package of ic of CN201720713239.2, including shell
Body, the first slide opening, the second slide opening, fixed link, slide plate, fixing pipe, fluting, limiting tooth, fixed tooth, nut, integrated circuit, it is fixed
Bar passes through the first slide opening and the second slide opening through being connected on shell, welds between described fixed link one end and slide plate side, institute
It states and is fitted and connected between slide plate side and hull outside surface, the fixing pipe is set in fixed link and fixing pipe and fixation
Be slidably connected between bar, equidistantly offer fluting in the fixing pipe, described limiting tooth one end and fixed link outer surface it
Between weld and limiting tooth be equidistantly welded in fixed link, described limiting tooth one end be also nested in fluting in and slot is limited
The activity space of position tooth, is welded between described fixed tooth one end and fixing pipe outer surface and fixed tooth is equidistantly welded on admittedly
Determine on pipe.This package of ic structure is simple, improves packaging efficiency, and use is more convenient.But its shortcoming exists
In in encapsulation process, deformation often is caused since the external force at screw fixed hole squeezes, to damage in package casing
Chip.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of integrated electricity that can eliminate external carbuncle
Road package casing, to solve above equipment in encapsulation process, often since the external force extruding at screw fixed hole causes shape
Become, thus the problem of damaging the chip in package casing.
To achieve the goals above, the utility model is to realize by the following technical solutions：One kind can be eliminated outer
The package of ic of stress, structure include bottom plate, shell, placed cavity, wearing layer, pin, U-shaped mounting plate, described
The generally integrated rectangular parallelepiped structure of bottom plate, the backplate surface and the welding of shell gapless, the shell are generally integrated
Rectangular parallelepiped structure, and surrounding is semicircle, forms a placed cavity in the middle part of the shell, four wall of placed cavity is equipped with wear-resisting
Layer, the placed cavity both ends are equipped with pin, and the pin is mutually in equidistant arrangement, and the shell side is equipped with U-shaped mounting plate, institute
U-shaped mounting plate rear end surface is stated to be fastenedly connected with bottom plate side end surface；The U-shaped mounting plate is by mounting plate main body, screw socket, connection
Plate, erosion resistant coating, installing port composition, mounting plate body surfaces rear end is equipped with screw socket, there are two the screw socket is set altogether, the peace
Loading board body rear is fixed with connecting plate, is equipped with installing port in the middle part of the mounting plate body front end, the installing port is generally
Handstand U-typed, the installing port and mounting plate body surfaces surrounding are equipped with erosion resistant coating, the connecting plate rear end surface and bottom plate
Side end surface is fastenedly connected.
Further, the shell is equipped with placed cavity, wearing layer, pin.
Further, the placed cavity is integrated constitute with shell.
Further, the pin is equipped with four groups altogether and extends through connection shell.
Further, the mounting plate main body is equipped with screw socket, connecting plate, erosion resistant coating, installing port.
Further, the screw socket is screwed with shell fastening and is connect.
Further, for being put into the accommodating chamber of integrated circuit when the placed cavity.
Further, the wearing layer has wear-resisting effect.
Beneficial effect
The utility model one kind can eliminate the package of ic of external carbuncle, be equipped with U-shaped mounting plate, pass through connection
Plate connects together it with bottom plate, and when then encapsulating, screw can thread directly into installation without being accurately positioned to installing port
It mouthful is fixed, installation fixation hole is improved in structure, the installation fixation hole of package casing is arranged to the U-shaped installation of opening
Degree of lip-rounding formula allows to achieve the effect that eliminate stress, ensures the complete of internal components, drop to simplify the fixed process of installation
The fixed spoilage of low installation, and the service life of package casing is increased, so that the external force eliminated at because of fixation hole squeezes
And package casing is caused to lead to the problem of deformation damage chip, it makes package casing use more convenient, consolidates.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon：
Fig. 1 is the structural schematic diagram for the package of ic that the utility model one kind can eliminate external carbuncle；
Fig. 2 is the U-shaped mounting plate schematic diagram of the utility model.
In figure：Bottom plate -1, shell -2, placed cavity -3, wearing layer -4, pin -5, U-shaped mounting plate -6, mounting plate main body -
601, screw socket -602, connecting plate -603, erosion resistant coating -604, installing port -605.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
Fig. 1-Fig. 2 is please referred to, the utility model provides a kind of technical solution：A kind of integrated circuit that can eliminate external carbuncle
Package casing, structure include bottom plate 1, shell 2, placed cavity 3, wearing layer 4, pin 5, U-shaped mounting plate 6, and the bottom plate 1 is whole
For integrated rectangular parallelepiped structure, 1 surface of bottom plate and 2 gapless welding of shell, the generally integrated cuboid of the shell 2
Structure, and surrounding is semicircle, forms a placed cavity 3 in the middle part of the shell 2,3 four wall of placed cavity is equipped with wearing layer
4,3 both ends of placed cavity are equipped with pin 5, and the pin 5 is mutually in equidistant arrangement, and 2 side of shell is equipped with U-shaped mounting plate
6, U-shaped 6 rear end surface of mounting plate is fastenedly connected with 1 side end surface of bottom plate；The U-shaped mounting plate 6 is by mounting plate main body
601, screw socket 602, connecting plate 603, erosion resistant coating 604, installing port 605 form, and the 601 surface rear end of mounting plate main body is equipped with spiral shell
Mouthfuls 602, there are two the screw socket 602 is set altogether, 601 rear end of mounting plate main body is fixed with connecting plate 603, the mounting plate
601 front center of main body is equipped with installing port 605, the installing port 605 generally handstand U-typed, the installing port 605 and installation
601 surface surrounding of plate main body is equipped with erosion resistant coating 604, and 603 rear end surface of connecting plate and the fastening of 1 side end surface of bottom plate connect
It connects, the shell 2 is equipped with placed cavity 3, wearing layer 4, pin 5, and the placed cavity 3 is integrated composition with shell 2, described to draw
Foot 5 is equipped with four groups altogether and extends through connection shell 2, and the mounting plate main body 601 is equipped with screw socket 602, connecting plate 603, prevents
Rotten layer 604, installing port 605, the screw socket 602 are screwed with the fastening of shell 2 and are connect.
Erosion resistant coating 604 described in this patent inhibits a kind of material that chemical attack and electrochemical corrosion are occurred by anti-corrosion object
Layer, the installing port 605 are U-shaped open connection fore shaft.
It is carrying out in use, first elements and wirings such as transistor, resistance, capacitor and inductance needed for a circuit
Interconnection together, is produced on a fritter or a few fritter semiconductor wafers or dielectric substrate, to form a complete integrated circuit,
Then integrated circuit is placed into the placed cavity 3 on shell 2, then the pin 5 with both ends is electrically connected together, then again by
Shell 2 is packaged fixation, and 2 side of shell because improvement is equipped with U-shaped mounting plate 6, it be first pass through connecting plate 603 by its with
Bottom plate 1 connects together, and when then encapsulating, screw can thread directly into installing port without being accurately positioned to installing port 605
605 are fixed, and installation fixation hole is improved in structure, and the installation fixation hole of package casing is arranged to open U-shaped peace
Degree of lip-rounding formula is filled, during usage, due to the design of U-shaped installing port, without being accurately positioned to mounting screw holes, so that it may
It realizes the fixation to package casing, and pressure will not be applied to package casing to lead to its deformation, destroys the core inside shell 2
Piece allows to achieve the effect that eliminate stress, ensures the complete of internal components, reduces the fixed spoilage of installation, and increase
The service life of package casing, so that the external force eliminated at fixation hole squeezes due to package casing is caused to generate deformation damage
The problem of chip, makes package casing use more convenient, consolidates.
The utility model solves the problems, such as it is in encapsulation process, often since the external force extruding at screw fixed hole is made
At deformation, to damage the chip in package casing, the utility model is combined with each other by above-mentioned component, allows to reach
The effect for eliminating stress ensures the complete of internal components, reduces the fixed spoilage of installation, and increase the use of package casing
Service life damages chip to eliminate and cause package casing to lead to the problem of deformation due to external force at fixation hole squeezes, and allows envelope
Casing use is more convenient, consolidates.It is described in detail below:
The 601 surface rear end of mounting plate main body is equipped with screw socket 602, there are two the screw socket 602 is set altogether, the mounting plate
601 rear end of main body is fixed with connecting plate 603, and 601 front center of mounting plate main body is equipped with installing port 605, the installation
The generally handstand U-typed of mouth 605, the installing port 605 is equipped with erosion resistant coating 604 with 601 surface surrounding of mounting plate main body, described
603 rear end surface of connecting plate is fastenedly connected with 1 side end surface of bottom plate.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. one kind can eliminate the package of ic of external carbuncle, structure includes bottom plate (1), shell (2), placed cavity
(3), wearing layer (4), pin (5), U-shaped mounting plate (6), the generally integrated rectangular parallelepiped structure of the bottom plate (1), feature exist
In：
Bottom plate (1) surface and shell (2) gapless welding, the generally integrated rectangular parallelepiped structure of the shell (2), and four
Week is semicircle, forms a placed cavity (3) in the middle part of the shell (2), and (3) four wall of placed cavity is equipped with wearing layer (4),
Placed cavity (3) both ends are equipped with pin (5), and the pin (5) is mutually in equidistant arrangement, and shell (2) side is equipped with U-shaped
Mounting plate (6), U-shaped mounting plate (6) rear end surface are fastenedly connected with bottom plate (1) side end surface；
The U-shaped mounting plate (6) is by mounting plate main body (601), screw socket (602), connecting plate (603), erosion resistant coating (604), installation
Mouthful (605) composition, mounting plate main body (601) the surface rear end are equipped with screw socket (602), there are two the screw socket (602) sets altogether,
Mounting plate main body (601) rear end is fixed with connecting plate (603), and mounting plate main body (601) front center is equipped with peace
It fills mouth (605), the installing port (605) generally handstand U-typed, the installing port (605) and mounting plate main body (601) surface
Surrounding is equipped with erosion resistant coating (604), and connecting plate (603) rear end surface is fastenedly connected with bottom plate (1) side end surface.
2. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that：It is described
Shell (2) is equipped with placed cavity (3), wearing layer (4), pin (5).
3. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that：It is described
Placed cavity (3) is integrated constitute with shell (2).
4. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that：It is described
Pin (5) is equipped with four groups altogether and extends through connection shell (2).
5. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that：It is described
Mounting plate main body (601) is equipped with screw socket (602), connecting plate (603), erosion resistant coating (604), installing port (605).
6. the package of ic that one kind according to claim 1 can eliminate external carbuncle, it is characterised in that：It is described
Screw socket (602) is screwed with shell (2) fastening and is connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820366004.5U CN208127181U (en) | 2018-03-16 | 2018-03-16 | A kind of package of ic that can eliminate external carbuncle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820366004.5U CN208127181U (en) | 2018-03-16 | 2018-03-16 | A kind of package of ic that can eliminate external carbuncle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208127181U true CN208127181U (en) | 2018-11-20 |
Family
ID=64199085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820366004.5U Expired - Fee Related CN208127181U (en) | 2018-03-16 | 2018-03-16 | A kind of package of ic that can eliminate external carbuncle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208127181U (en) |
-
2018
- 2018-03-16 CN CN201820366004.5U patent/CN208127181U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100652397B1 (en) | Stack type semiconductor package using an interposer print circuit board | |
| US20080303125A1 (en) | Three-dimensional package structure | |
| CN101960591A (en) | Semiconductor device, semiconductor device manufacturing method, printed circuit board and electronic device | |
| US20090040727A1 (en) | Circuit Carrier Structure with Improved Heat Dissipation | |
| TW200633163A (en) | Semiconductor device and capsule type semiconductor package | |
| JP2008545278A (en) | Die package with asymmetric leadframe connection | |
| JP2010199286A (en) | Semiconductor device | |
| CN101330075B (en) | Stereo encapsulation structure | |
| KR20110135629A (en) | Package on package having a improved thermal characteristics | |
| TW201729655A (en) | Electronic module with a magnetic device | |
| CN208127181U (en) | A kind of package of ic that can eliminate external carbuncle | |
| TW200832670A (en) | Electronic device with inductor and integrated componentry | |
| CN108899283A (en) | The encapsulating structure and its packaging method of ball grid array | |
| CN208225870U (en) | A kind of package of ic that can eliminate external carbuncle | |
| US7230317B2 (en) | Capacitor placement for integrated circuit packages | |
| CN210042212U (en) | MEMS microphone | |
| CN108878302A (en) | The encapsulating structure and its packaging method of ball grid array | |
| JP5418308B2 (en) | Mounting structure | |
| CN212113705U (en) | Power semiconductor module | |
| CN212084994U (en) | Parallel packaged device group | |
| US20050064739A1 (en) | Socket with multiple contact pad area socket contacts | |
| CN206806338U (en) | It is thinned the encapsulating structure that splices of dual chip | |
| CN207517660U (en) | It is a kind of to manufacture ic chip package structure with ultrasonic copper wire | |
| CN207367953U (en) | A kind of encapsulating structure of electronic component | |
| CN106449527A (en) | Metal casing for integrated circuit packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181120 Termination date: 20190316 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |