CN106449527A - Metal casing for integrated circuit packaging - Google Patents
Metal casing for integrated circuit packaging Download PDFInfo
- Publication number
- CN106449527A CN106449527A CN201610702817.2A CN201610702817A CN106449527A CN 106449527 A CN106449527 A CN 106449527A CN 201610702817 A CN201610702817 A CN 201610702817A CN 106449527 A CN106449527 A CN 106449527A
- Authority
- CN
- China
- Prior art keywords
- line
- foot
- outer cover
- cover body
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses a metal casing for integrated circuit packaging. The metal casing is characterized by including a casing body, a glass body, upper cavity pin wires, lower cavity pin wires, and grids. the casing body has upper and lower cavities, and the upper cavity of the casing body is provided with an even number of upper cavity pin wires, the lower cavity of the casing body is provided with an odd number of lower cavity pin wires, and the bottoms of the upper and lower cavities of the casing body are provided with the grids, the upper and lower cavity pin wires are fixed to the casing body by the glass body, the upper and lower cavity pin wires are led out from the side surface of the casing body, an upper cavity pin wire installing hole axis is on the front and rear neutral planes of the casing body, and the horizontal axis of the upper cavity pin wire installing holes and the horizontal axis of the lower cavity pin wire installing holes are symmetrical with respect to the upper and lower neutral planes of the casing body. The metal casing has the advantages of simple structure, small volume, high assembly density, good heat dissipation and high reliability, and can be used for packaging of all kinds of hybrid integrated circuits.
Description
Technical field
The invention belongs to integrated antenna package technical field and in particular to a kind of for the metal of integrated antenna package outside
Shell.
Background technology
Metal-packaged shell is one of key component of IC-components, plays circuit supporting, electric signal transmission, dissipates
The effects such as heat, sealing and chemical protection.The purpose of integrated antenna package is to protect chip free from the influence of the external environment, and is
One good condition of work of offer.The encapsulation technology of hydrid integrated circuit is by substrate fabrication techniques, Micro-package technique
Deng, the hybrid integrated such as semiconductor integrated circuit, passive element is internal in an encapsulation, realize specific function integrated assembling skill
Art, also known as Two-level ensemble technology, is to realize miniaturization of electronic products, multi-functional, high performance main path.Hybrid integrated at present
Circuit package casing be mostly directed to one side and encapsulate components and parts, the package casing being related to High Density Packaging product is also fewer,
Also there is no large-scale production and application.
Content of the invention
The technical problem to be solved is to provide one kind to be used for integrated circuit for above-mentioned the deficiencies in the prior art
The metal shell of encapsulation, its structure is simple, small volume, and packing density is high, and thermal diffusivity is good, and dependability is high, can be used at different levels
The encapsulation of hydrid integrated circuit.
For realizing above-mentioned technical purpose, the technical scheme that the present invention takes is：
A kind of metal shell for integrated antenna package, including outer cover body, vitreum, upper cavity lead-foot-line, cavity of resorption
Body lead-foot-line, grid, described outer cover body has upper and lower two cavitys, and described outer cover body upper cavity is provided with even number epicoele
Body lead-foot-line, described outer cover body lower chamber is provided with odd number lower chamber lead-foot-line, described outer cover body upper and lower cavity bottom
Face is equipped with grid, and described upper cavity lead-foot-line is fixed on outer cover body by vitreum with lower chamber lead-foot-line, described
Upper cavity lead-foot-line and lower chamber lead-foot-line are drawn by the side of outer cover body, a described upper cavity lead-foot-line installing hole
On axis neutral surface before and after outer cover body, the described horizontal axis of upper cavity lead-foot-line installing hole and lower chamber lead-foot-line
The horizontal axis of installing hole is symmetrical with regard to the neutral surface up and down of outer cover body.
For optimizing technique scheme, the concrete measure taken also includes：
Above-mentioned outer cover body is the rectangular structure form of two-sided uncovered.
The material of above-mentioned outer cover body adopts 4J29 alloy.
The cavity bottom thickness of above-mentioned outer cover body is more than sidewall thickness.
Metal shell structure mechanical strength is good, can carry out the encapsulation of bilateral structure using hybrid integration technology, according to two-sided
Encapsulation order, welding and bonding technology carry out the encapsulation of electronic devices and components, and the design of metal shell structure is so as to have preferably
Intensity, lighter weight, the design of two-sided bottom of chamber grid, increase electronic devices and components and the cohesive force of metal shell bottom of chamber, prevent
Electronics unit device is subject to come off during external shock, and promotes heat quickly to shed so as to have more preferable serviceability, and raising can
By property.
Present configuration is simple, small volume, and packing density is high, and thermal diffusivity is good, and dependability is high, can be used for mixing at different levels
The encapsulation of integrated circuit.
Brief description
Fig. 1 is the front view of the present invention.
Fig. 2 is the top view of the present invention.
Reference therein is：Outer cover body 1, vitreum 2, upper cavity lead-foot-line 3, lower chamber lead-foot-line 3, grid 4.
Specific embodiment
Below in conjunction with the accompanying drawings the specific embodiment of the present invention is further illustrated：
A kind of metal shell for integrated antenna package, wherein：Including outer cover body 1, vitreum 2, upper cavity pin
Line 3, lower chamber lead-foot-line 3, grid 4, described outer cover body 1 has upper and lower two cavitys, and described outer cover body 1 upper cavity sets
There is even number upper cavity lead-foot-line 3, described outer cover body 1 lower chamber is provided with odd number lower chamber lead-foot-line 4, described shell
Body is equipped with grid 4 in cavity bottom surface about 1, and described upper cavity lead-foot-line 3 is fixed by vitreum 2 with lower chamber lead-foot-line 4
On outer cover body 1, described upper cavity lead-foot-line 3 is drawn by the side of outer cover body 1 with lower chamber lead-foot-line 4, described
Upper cavity lead-foot-line 3 install on axially bored line neutral surface before and after shell body 1, described upper cavity lead-foot-line 3 is pacified
The horizontal axis in dress hole is symmetrical with regard to the neutral surface up and down of outer cover body 1 with the horizontal axis of lower chamber lead-foot-line 4 installing hole.
In embodiment, outer cover body 1 is the rectangular structure form of two-sided uncovered.
In embodiment, the material of outer cover body 1 adopts 4J29 alloy.
In embodiment, the sidewall thickness of outer cover body is less than the thickness of cavity bottom surface.
The big I of outer cover body is set according to actual conditions, and the position of upper and lower cavity lead-foot-line and spacing also can roots
Change according to situation.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical schemes belonging under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that for the art
For those of ordinary skill, some improvements and modifications without departing from the principles of the present invention, should be regarded as the protection of the present invention
Scope.
Claims (4)
1. a kind of metal shell for integrated antenna package it is characterised in that：Including outer cover body (1), vitreum (2), on
Cavity lead-foot-line (3), lower chamber lead-foot-line (3), grid (4), described outer cover body (1) has upper and lower two cavitys, described
Outer cover body (1) upper cavity is provided with even number upper cavity lead-foot-line (3), and described outer cover body (1) lower chamber is provided with odd number
Lower chamber lead-foot-line (4), cavity bottom surface is equipped with grid (4) up and down for described outer cover body (1), described upper cavity lead-foot-line
(3) be fixed on outer cover body (1) by vitreum (2) with lower chamber lead-foot-line (4), described upper cavity lead-foot-line (3) with
Cavity lead-foot-line (4) is drawn by the side of outer cover body (1), and a described upper cavity lead-foot-line (3) is installed axially bored line and existed
Before and after outer cover body (1) on neutral surface, the described horizontal axis of upper cavity lead-foot-line (3) installing hole and lower chamber lead-foot-line
(4) horizontal axis of installing hole is symmetrical with regard to the neutral surface up and down of outer cover body (1).
2. a kind of metal shell for integrated antenna package according to claim 1 it is characterised in that：Described shell
Body (1) is the rectangular structure form of two-sided uncovered.
3. a kind of metal shell for integrated antenna package according to claim 1 and 2 it is characterised in that：Described
The material of outer cover body (1) adopts 4J29 alloy.
4. a kind of metal shell for integrated antenna package according to claim 1 or 2 or 3 it is characterised in that：Described
Outer cover body (1) sidewall thickness be less than cavity bottom surface thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702817.2A CN106449527A (en) | 2016-08-23 | 2016-08-23 | Metal casing for integrated circuit packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702817.2A CN106449527A (en) | 2016-08-23 | 2016-08-23 | Metal casing for integrated circuit packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449527A true CN106449527A (en) | 2017-02-22 |
Family
ID=58181427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610702817.2A Pending CN106449527A (en) | 2016-08-23 | 2016-08-23 | Metal casing for integrated circuit packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449527A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117316878A (en) * | 2023-11-28 | 2023-12-29 | 北京七星华创微电子有限责任公司 | Packaging shell and packaging electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
| CN101609803A (en) * | 2008-06-17 | 2009-12-23 | 力成科技股份有限公司 | The validation test method of semiconductor packaging process with and the shared substrate that uses |
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN203288586U (en) * | 2013-05-06 | 2013-11-13 | 北京七星华创电子股份有限公司 | Double-layer shallow cavity type circuit package casing |
-
2016
- 2016-08-23 CN CN201610702817.2A patent/CN106449527A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
| CN101609803A (en) * | 2008-06-17 | 2009-12-23 | 力成科技股份有限公司 | The validation test method of semiconductor packaging process with and the shared substrate that uses |
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN203288586U (en) * | 2013-05-06 | 2013-11-13 | 北京七星华创电子股份有限公司 | Double-layer shallow cavity type circuit package casing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117316878A (en) * | 2023-11-28 | 2023-12-29 | 北京七星华创微电子有限责任公司 | Packaging shell and packaging electronic device |
| CN117316878B (en) * | 2023-11-28 | 2024-02-13 | 北京七星华创微电子有限责任公司 | Packaging shell and packaging electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |