CN117316878A - Packaging shell and packaging electronic device - Google Patents
Packaging shell and packaging electronic device Download PDFInfo
- Publication number
- CN117316878A CN117316878A CN202311597146.4A CN202311597146A CN117316878A CN 117316878 A CN117316878 A CN 117316878A CN 202311597146 A CN202311597146 A CN 202311597146A CN 117316878 A CN117316878 A CN 117316878A
- Authority
- CN
- China
- Prior art keywords
- chamber
- shell
- connector
- cavity
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 239000012212 insulator Substances 0.000 claims description 60
- 239000003292 glue Substances 0.000 claims description 39
- 239000007788 liquid Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 17
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 17
- 238000003780 insertion Methods 0.000 description 14
- 230000037431 insertion Effects 0.000 description 14
- 230000036544 posture Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000004308 accommodation Effects 0.000 description 6
- 230000013011 mating Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 229910000833 kovar Inorganic materials 0.000 description 5
- 229910052573 porcelain Inorganic materials 0.000 description 5
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000000638 solvent extraction Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- -1 helium Chemical compound 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The application relates to a packaging shell and a packaging electronic device in the technical field of microelectronics, wherein the packaging shell comprises a barrel-type shell with a hollow interior and two end face openings, and the end faces are perpendicular to the axis of the barrel-type shell; the barrel type shell is configured to contain the circuit element, and an electric connecting piece is arranged on the barrel type shell in a penetrating way and is provided with an inner connecting end positioned in the barrel type shell and an outer connecting end positioned outside the barrel type shell; the packaging shell further comprises a bottom plate, and the bottom plate divides the inner space of the barrel type shell into a first cavity and a second cavity which are distributed along the axis; the bottom plate includes first region and second region, and the position that first cavity and second region correspond is outwards protruded towards the direction that the second cavity was located, and the position that second cavity and first region correspond is outwards protruded towards the direction that first cavity was located, and this encapsulation shell is favorable to promoting circuit element to the utilization ratio in space, reduces encapsulation electronic device's height and volume, promotes encapsulation electronic device integrated level height.
Description
Technical Field
The present application relates to the field of microelectronic technology, and in particular, to a package housing and a packaged electronic device.
Background
The package housing serves as a key component of the integrated circuit, and provides a containing cavity for arranging the circuit element, and the containing cavity has the functions of supporting and protecting the circuit element, radiating heat outwards, sealing and shielding, protecting chemistry and the like. In the related art, the package shell is basically in a barrel-shaped structure, namely, a shell main body is formed by surrounding a bottom surface and a side surface, the top surface of the shell main body is opened to realize the assembly of circuit elements, and after the assembly of the circuit elements is completed, a top cover is arranged on the top surface by adopting processes such as parallel seam welding and the like to realize the package of the integrated circuit.
The integrated circuit packaged by the packaging shell has large volume and is not beneficial to the realization of miniaturization and high integration of the integrated circuit.
Disclosure of Invention
In order to reduce the volume of an integrated circuit and improve the integration level of the integrated circuit, the embodiment of the application provides a packaging shell and a packaging electronic device.
In a first aspect, the present application provides a packaging housing comprising a cartridge housing that is hollow in the interior and has two end faces that are open, the end faces being perpendicular to the axis of the cartridge housing; the cartridge housing is configured to house a circuit element, and an electrical connector is provided on the cartridge housing in a penetrating manner, the electrical connector having an inner connection end positioned in the cartridge housing and an outer connection end positioned outside the cartridge housing, the inner connection end being configured to be electrically connected to the circuit element, the outer connection end being configured to be electrically connected to an external circuit;
The packaging shell further comprises a bottom plate arranged in the barrel type shell, and the bottom plate divides the inner space of the barrel type shell into a first cavity and a second cavity which are distributed along the axis and are independent from each other; the bottom plate comprises a first area and a second area, the positions of the first chamber and the second area are outwards protruded towards the direction of the second chamber, and the positions of the second chamber and the first area are outwards protruded towards the direction of the first chamber.
By adopting the technical scheme, the bottom plate of the packaging shell divides the inner space of the barrel type shell into the first cavity and the second cavity which are independent of each other, when the circuit element is assembled, the first cavity and the second cavity can independently contain the circuit element, two surfaces of the bottom plate can be used as setting surfaces of the circuit element, and the packaging shell converts the arrangement of the circuit element from two-dimensional tiling into three-dimensional stacking, so that the space in the shell of the packaging shell can be more effectively utilized. Meanwhile, because the packaging shell is provided with two accommodating chambers, the circuit elements can be arranged in a cavity-dividing manner according to actual requirements, for example, the analog circuit elements and the digital circuit elements are arranged in the cavity-dividing manner, so that electromagnetic interference between circuits is reduced. In addition, the bottom plate at least comprises a first area and a second area, the two areas are not on the same plane, the position of the first cavity corresponding to the second area is outwards protruded towards the direction of the second cavity, and the position of the second cavity corresponding to the first area is outwards protruded towards the direction of the first cavity.
Optionally, a socket is provided on the barrel housing, the electrical connector is a first connector provided on the socket, the socket is configured to mate with an electrical connector having a plurality of second connectors, one of the first connector and the second connector is a conductive pin, and the other is a conductive barrel into which the conductive pin can be inserted; the cylinder type shell is provided with first through holes corresponding to the first plug connectors one by one, the first plug connectors are arranged on the cylinder type shell in a penetrating way through the first through holes, part of the inner connecting ends of the first plug connectors extend into the first cavity and are configured to be electrically connected with the circuit elements arranged in the first cavity, and the other part of the inner connecting ends of the first plug connectors extend into the second cavity and are configured to be electrically connected with the circuit elements arranged in the second cavity;
the cylinder type shell body and the bottom plate are made of metal materials, the bottom plate is electrically insulated from the first plug connector through an insulating layer, the plug connector further comprises shell insulators corresponding to the first plug connector one to one, the shell insulators wrap the parts corresponding to the first plug connector and the first through holes, the first plug connector and the cylinder type shell body are arranged at intervals, a glue cavity is formed in the shell insulators, glue liquid is sealed in the glue cavity, and the glue liquid is configured to flow out from a crack after the shell insulators are broken.
Through adopting above-mentioned technical scheme, the electrical connector on the encapsulation shell is the plug connector form, consequently the encapsulation electron device that utilizes this encapsulation shell encapsulation to go out can directly realize being connected with the electricity of external circuit through the grafting, this can reduce in encapsulation shell test, encapsulation electron device test and encapsulation electron device use and install loaded down with trivial details welding work in-process, is showing and is promoting production efficiency. The cylinder type shell is isolated from the first plug connector through the insulator on the shell, and a glue cavity for containing glue solution is arranged in the insulator on the shell, so that the problems that the sealing performance and the electrical reliability of the packaging shell are affected due to the fact that the insulator on the shell is damaged and broken in the process of multiple plugging and unplugging of the first plug connector can be solved: when the insulator on the shell is damaged and broken, the glue solution flows out from the crack, and under the condition that the insulator on the shell is not seriously broken, the glue solution flows to the crack and plugs the crack; under the condition that the insulator on the shell is seriously broken, the glue solution can also fill gaps between the first plug connector and the cylinder type shell, so that the tightness of the packaging shell is maintained, and the electrical insulation between the first plug connector and the cylinder type shell is ensured. The glue cavity is arranged in the insulator on the shell to contain glue solution, so that the reliability of the packaging shell and the packaging electronic device assembled based on the packaging shell is improved, and the quality of the packaging electronic device is enhanced.
Optionally, a plurality of limiting convex rings are arranged on the inner wall of the conductive plug tube, limiting concave rings corresponding to the limiting convex rings one to one are arranged on the outer wall of the conductive plug pin, and the limiting convex rings are configured to be matched with the corresponding limiting concave rings.
Through adopting above-mentioned technical scheme, set up spacing concave ring, spacing bulge loop respectively on electrically conductive contact pin, electrically conductive cartridge, through spacing concave ring and spacing bulge loop between the cooperation, can realize spacing between electrically conductive contact pin and the electrically conductive cartridge and fix, reduce electrically conductive contact pin and deviate from the electrically conductive cartridge probability. Meanwhile, as the conductive contact pin is only required to be inserted into the conductive contact tube, the cooperation of the limit concave ring and the limit convex ring can be realized, the process is simple and easy to implement, the fixing efficiency is high, the limit fixing effect of the conductive contact pin and the conductive contact tube can basically meet the fixing requirement in temporary connection situations (such as package shell test, package electronic device test and other situations), complex fixing operation of a tester before the test is avoided, connection and detachment are carried out after the test is finished, and the test efficiency is improved.
Optionally, a fixing seat is fixed on the outer wall of the barrel type shell, a guiding groove is formed by inwards recessing a region corresponding to the plug seat in the direction of the barrel type shell, the outer connecting end of the first plug connector extends out of the groove bottom of the guiding groove, and the distance between the outer connecting end and the groove bottom is smaller than or equal to the groove depth of the guiding groove; the notch profile of the guide groove is matched with the plugging surface profile of the electric connector, and the plugging surface profile is the profile of the setting plane of the second plug connector on the electric connector; the fixing base is also provided with a fixing hole, and the fixing hole is configured to be matched with an external fixing piece to fasten the electric connector on the fixing base.
Through adopting above-mentioned technical scheme, the outer wall of cylinder casing is fixed with the fixing base, and the regional indent that corresponds with the cylinder casing forms the guide groove in the fixing base, and the notch profile of guide groove matches with the grafting face profile of electric connector, utilizes the guide groove can guide electric connector and grafting seat cooperation to realize the electric connection of first plug connector and second plug connector smoothly. Meanwhile, a fixing hole is further formed in the fixing base, the electric connector can be fastened to the fixing base through the matching of the fixing hole and an external fixing piece, the electric connector is prevented from being separated from the plug base, and the reliability and stability of electric connection between the first plug connector and the second plug connector are ensured.
Optionally, at least two plugging seats are arranged on the cylinder type shell, each plugging seat is provided with a guiding groove uniquely corresponding to the plugging seat, and the notch outlines of any two guiding grooves are different in at least one of shape and size.
By adopting the technical scheme, the guide grooves corresponding to the plug seats on the cylinder type shell are not identical in the aspect of the shape and the size of the notch outline, so that the plug face outlines of any two electric connectors configured to be matched with the plug seats are different in at least one aspect of the shape and the size, when an assembler selects the electric connectors to be matched with the plug seats, the correct electric connectors can be selected for the plug seats directly according to the notch outlines of the guide grooves and the plug face outlines of the electric connectors, and the assembly connection efficiency is improved.
Optionally, the end surface of the cylinder casing is a rounded rectangle, the first connectors on the same side of the rounded rectangle are arranged into two connector rows parallel to the end surface, and the two connector rows respectively correspond to the first chamber and the second chamber.
Through adopting above-mentioned technical scheme, each first plug connector that is located barrel casing and is located one side arranges into two plug connector rows that are on a parallel with barrel casing terminal surface, not only can make the outer wall of encapsulation shell more succinct neat in the vision like this, promotes encapsulation shell's aesthetic property, also more makes things convenient for the setting of fixing base.
Optionally, a second through hole is formed in the bottom plate, an inter-chamber conductive member is penetrated in the second through hole, two ends of the inter-chamber conductive member are respectively located in the first chamber and the second chamber, and the inter-chamber conductive member is configured to electrically connect the circuit element located in the first chamber with the circuit element located in the second chamber; the inter-chamber conductive member is spaced from the base plate by an on-board insulator wrapped around the inter-chamber conductive member.
Through adopting above-mentioned technical scheme, set up the room conducting piece on the bottom plate, utilize the room conducting piece, can realize the electric connection of circuit component in first cavity and the circuit component in the second cavity, reduce even avoid connecting the condition of circuit component in the cavity through electric connector electricity, not only can reduce the quantity of first plug connector on the plug seat and the quantity of second plug connector on the electric connector like this, also can reduce the complexity of circuit in the electric connector simultaneously.
Optionally, the thickness of the bottom plate is uniform throughout.
Through adopting above-mentioned technical scheme, the thickness is even everywhere of bottom plate, can simplify the design and the production of bottom plate, promotes the utilization ratio of encapsulation shell inner space.
In a second aspect, the present application provides a packaged electronic device, including a plurality of circuit elements, two end caps, and a package housing according to any one of the preceding claims, wherein a portion of the plurality of circuit elements is disposed in the first chamber, another portion of the plurality of circuit elements is disposed in the second chamber, and the circuit elements are electrically connected to the inner connection terminals of the electrical connectors; the two end covers are respectively covered on the two end faces of the cylinder type shell.
By adopting the technical scheme, the bottom plate in the packaging shell divides the inner space of the barrel type shell into the first cavity and the second cavity which are independent of each other, when the circuit element is assembled, the first cavity and the second cavity can independently contain the circuit element, two surfaces of the bottom plate can be used as setting surfaces of the circuit element, and the packaging shell converts the arrangement of the circuit element from two-dimensional tiling into three-dimensional stacking, so that the space in the shell of the packaging shell can be more effectively utilized. Meanwhile, because the packaging shell is provided with two accommodating chambers, the circuit elements can be arranged in a cavity-dividing mode according to actual requirements, for example, an analog circuit and a digital circuit are arranged in a cavity-dividing mode, and therefore electromagnetic interference among the circuits is reduced. In addition, the bottom plate at least comprises a first area and a second area, the two areas are not on the same plane, the position of the first cavity corresponding to the second area is outwards protruded towards the direction of the second cavity, and the position of the second cavity corresponding to the first area is outwards protruded towards the direction of the first cavity.
Optionally, in the first chamber, a height of the circuit element provided in the first region is smaller than a height of the circuit element provided in the second region; in the second chamber, the height of the circuit element provided in the first region is greater than the height of the circuit element provided in the second region.
In summary, the present application at least includes the following beneficial technical effects:
the structure of the packaging shell is improved from a structure with one accommodating cavity to a structure with two accommodating cavities, so that the arrangement of circuit elements is converted from two-dimensional tiling to three-dimensional stacking, and the utilization rate of the space in the packaging shell is improved;
the two accommodating chambers of the packaging shell support the arrangement of the circuit elements in a cavity-dividing manner;
the bottom plate at least comprises a first area and a second area which are not on the same plane, so that different areas of the accommodating cavity (the first cavity or the second cavity) have different space heights, the arrangement area is flexibly selected according to the height of the circuit element when the circuit element is arranged, and the utilization rate of the space in the packaging shell is further improved. Under the condition of assembling the same circuit element, the whole height and the volume of the packaging shell can be reduced relative to the packaging shell with uniform height in the accommodating space, and the miniaturization of the packaged electronic device is facilitated.
Drawings
FIG. 1 is a schematic cross-sectional view of a package housing according to one embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of a second embodiment of a package housing;
FIG. 3 is a schematic cross-sectional view of a package housing provided in an embodiment of the present application;
FIG. 4 is a third cross-sectional schematic view of a package housing according to one embodiment of the present application;
FIG. 5 is a schematic cross-sectional view of a first plug provided in an embodiment of the present application;
FIG. 6 is a schematic top view of a package housing according to an embodiment of the present disclosure;
FIG. 7 is a fourth cross-sectional schematic view of a package housing according to an embodiment of the present application;
FIG. 8 is a schematic cross-sectional view of a first plug and mating structure with an insulator on a shell according to one embodiment of the present disclosure;
FIG. 9 is a schematic left-hand view of a package housing according to an embodiment of the present application;
FIG. 10 is a right side view of a package housing according to one embodiment of the present disclosure;
FIG. 11 is a schematic cross-sectional view of a packaged electronic device according to one embodiment of the present application;
FIG. 12 is a schematic view of a structure of an end cap for mating with a package housing according to one embodiment of the present application;
Fig. 13 is another cross-sectional schematic view of a packaged electronic device provided in an embodiment of the present application.
Reference numerals illustrate:
10-packaging the shell; 11-a cartridge housing; 111-a first chamber; 112-a second chamber; 12-a bottom plate; 121-a first region; 122-a second region; 123-a third region; 13-electrical connection; 131-a first plug; 132—inter-chamber conductive member; 14-connecting ribs; 151-insulator on shell; 1510-glue chamber; 152-on-board insulators; 153-insulating layer; 16-a fixed seat; 160-guiding grooves; 161-fixing holes; 17-a mounting base; 170-flange holes; 20-packaging an electronic device; 30-circuit elements; 40-end caps; a-a first circuit element; b-a second circuit element; c-a third circuit element; d-fourth circuit element.
Description of the embodiments
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In order to reduce the volume of the packaged electronic device and improve the integration level of the packaged electronic device, the present embodiment provides a package housing 10, please refer to a schematic cross-sectional view of the package housing 10 shown in fig. 1: the package housing 10 includes a cartridge housing 11, a base plate 12, and electrical connectors 13.
The cartridge case 11 is a tube having a hollow interior and two open end surfaces, the end surface of the cartridge case 11 is perpendicular to the axis thereof, and the cut surface of the package case 10 in fig. 1 is perpendicular to the end surface of the cartridge case 11. In some examples of the present embodiment, the cartridge housing 11 is flat, i.e., the height (dimension in the axial direction) of the cartridge housing 11 is relatively small, generally smaller than the maximum dimension of the cartridge housing 11 in the direction perpendicular to the axial direction. The end surface of the cartridge housing 11 may have a regular geometric shape such as a circle, an ellipse, a rectangle, a pentagon, a hexagon, or the like, or may have another irregular geometric shape. The housing space provided inside the cartridge case 11 is for housing circuit elements, and a plurality of circuit elements are assembled inside the cartridge case 11 to form a packaged electronic device.
An electrical connector 13 is provided to pass through the cartridge housing 11, with one end thereof being located in the space inside the cartridge housing 11 for electrical connection with the circuit element inside the cartridge housing 11 and the other end thereof being located outside the cartridge housing 11 for electrical connection with an external circuit. In the present embodiment, the end of the electrical connector 13 located in the space inside the case is referred to as an "inner connection end", and the end located outside the cartridge case 11 is referred to as an "outer connection end". In some examples of the present embodiment, the barrel housing 11 is made of metal and has conductivity, in which case it is necessary to achieve electrical insulation between the barrel housing 11 and the electrical connector 13 by an insulator, which may be any one of a glass insulator, a porcelain insulator, and a composite insulator. The porcelain insulator is an insulator made of electroceramics, and the electroceramics are formed by baking quartz, feldspar and clay. In order to improve the mechanical strength of the porcelain insulator, prevent water seepage and increase the surface smoothness, the surface of the porcelain insulator is generally covered with a glaze layer. The glass insulator refers to an insulator made of insulating tempered glass. The composite insulator is also called as a composite insulator and consists of a glass fiber resin core rod (or core tube), an organic material sheath and an umbrella skirt. Has the characteristics of small volume, light weight, high tensile strength, good anti-pollution flashover performance and the like.
The bottom plate 12 is provided in the cartridge housing 11, which divides the space in the cartridge housing 11 into two accommodation chambers of the first chamber 111 and the second chamber 112, which are distributed along the axis of the cartridge housing 11, so that the end surfaces of the two openings of the cartridge housing 11 correspond to the two accommodation chambers, respectively, for communicating the two accommodation chambers with the external space, respectively. The two surfaces of the base plate 12 serve as the arrangement surfaces of the circuit elements in the first chamber 111 and the circuit elements in the second chamber 112, respectively. In the case that the first chamber 111 and the second chamber 112 are provided in the cartridge housing 11, at least two electrical connectors 13 are provided in the cartridge housing 11, and an inner connecting end of one part of the electrical connectors 13 extends into the first chamber 111 to be electrically connected to the circuit element in the first chamber 111, and an inner connecting end of the other part of the electrical connectors 13 extends into the second chamber 112 to be electrically connected to the circuit element in the second chamber 112.
In some examples of this embodiment, the base plate 12 and the cartridge housing 11 may be integrally formed, but this embodiment does not exclude the case that the base plate 12 and the cartridge housing 11 are two separate components that are fixed together by welding or the like. In some examples of the present embodiment, the bottom plate 12 is made of metal, the barrel housing 11 is also made of metal, and the barrel housing 11 can electromagnetically shield the circuit elements in the barrel housing 11, so as to reduce electromagnetic interference; further, based on the metal bottom plate 12, electromagnetic isolation between the first chamber 111 and the second chamber 112 can be performed, so that electromagnetic interference between the two accommodating chambers is reduced or even avoided.
In some examples of the present embodiment, the bottom plate 12 may be divided into at least a first region 121 and a second region 122 in a direction parallel to the end surface of the cartridge housing 11, wherein a position of the first chamber 111 corresponding to the second region 122 is convex toward a direction in which the second chamber 112 is located, and a position of the second chamber 112 corresponding to the first region 121 is convex toward a direction in which the first chamber 111 is located, as shown in fig. 1. For the sake of understanding by those skilled in the art, it is assumed here that one end surface (the upper end surface is selected in fig. 1) of the cartridge housing 11 is selected as the reference surface, and the distance d1 from the reference surface of the first region 121 and the distance d2 from the reference surface of the second region 122 on the base plate 12 are not equal.
It will be appreciated that the heights of the circuit elements fitted into the same receiving chamber will generally not be exactly the same, for example, assuming that the first and second circuit elements a, b need to be fitted into the first chamber 111, the heights of the two being h1, h2 > h1 respectively, then the height of the first chamber 111 must be greater than h2. Assuming that the third circuit element c and the fourth circuit element d need to be assembled to the second chamber 112, the heights of the two are h3 and h4, respectively, and h3 > h4, the height of the second chamber 112 must be greater than h3. In this case, if the respective areas of the bottom plate 12 are equally spaced from the same reference plane in a flat plate shape, the height of the cartridge housing 11 must exceed the sum of h2 and h3. However, if the bottom plate 12 is not simply flat, it is only necessary that the maximum height of the first chamber 111 exceeds h2 and the maximum height of the second chamber 112 exceeds h4, and since the first chamber 111 and the second chamber 112 overlap with each other partially in the axial direction, the height of the cartridge housing 11 does not necessarily exceed the sum of h2 and h3.
In some examples of the present embodiment, the base plate 12 may be divided into a first region 121 and a second region 122, and further includes a third region 123, as shown in fig. 2, where the spatial heights of the three regions are different.
In some examples of the present embodiment, the thicknesses of the different regions of the base plate 12 are not identical, for example, in the package case 10 shown in fig. 2, the thickness of the first region 121 and the thickness of the second region 122 in the base plate 12 are identical, but the thicknesses of the first region and the second region are different from the thickness of the third region 123, and the cutting direction of the package case 10 in fig. 2 is identical to the cutting direction of the package case 10 in fig. 1. In still other examples, the thickness of the base plate 12 may be uniform throughout the various regions, as shown in FIG. 1.
It will be appreciated that after the circuit components are assembled to the package housing 10, the open end face of the cartridge housing 11 needs to be sealed to form the packaged electronic device. In some examples of this embodiment, after the circuit element assembly is completed, an end cap cover that mates with the end face of the cartridge housing 11 may be provided on the end face of the cartridge housing 11, and in order to ensure tightness of the mating of the end cap and the cartridge housing 11, the welded fixation of the cartridge housing 11 and the end cap may be optionally achieved by using a parallel seam welding or the like. In some examples of the present embodiment, in order to protect the circuit element in the package case 10, oxidation of the circuit element is prevented to extend the service life of the circuit element, and a protective gas, such as nitrogen or an inert gas (e.g., helium, etc.), is also introduced into the barrel housing 11 during the parallel seam welding. It is needless to say that the packaged electronic device assembled based on the package case 10 described above necessarily has the end cap fitted with the cartridge case 11, but the end cap is not necessarily produced and sold in a set with the cartridge case 11, and thus, in some examples, the package case 10 itself does not have the end cap, and the manufacturer of the packaged electronic device can obtain the package case 10 and the end cap corresponding to the package case 10 from different sources, respectively. In still other examples, the enclosure 10 itself may also have end caps, e.g., the end caps and enclosure 10 are manufactured by the same manufacturer and sold in packages.
In some examples, the electrical connection 13 is a conductive lead that is relatively flexible and capable of bending deformation. Meanwhile, a plurality of conductive leads are provided on the barrel housing 11, and even a plurality of conductive leads are provided on the same side of the barrel housing 11, in order to prevent the conductive leads from being intertwined during sales and transportation and affecting the use of the package housing 10, in some examples of this embodiment, a connecting rib 14 integrally formed with the conductive leads is provided at one end of the plurality of conductive leads away from the barrel housing 11 when the package housing 10 is produced, as shown in fig. 3, so as to connect the plurality of conductive leads together. Fig. 3 shows a schematic cross-section of the enclosure 10, which is parallel to the end face of the cartridge housing 11. Before the package 10 is used for assembling an integrated circuit, the package 10 needs to be tested, the connecting ribs 14 are cut off in the test stage, the free ends of the conductive leads far away from the cylinder shell 11 are welded on connecting sheets for testing, and then the test fixture is adopted to realize the test of the package 10; after the test is finished, the connecting sheet is cut off firstly, and then the free end of the conductive lead far away from the cylinder type shell 11 is welded on the bridging plate so as to realize the electric connection between the conductive lead and the circuit in the bridging plate. It will be appreciated that this process is cumbersome and severely impacts the efficiency of the integrated circuit assembly using the package housing 10.
In this regard, the present embodiment also provides another package housing 10, please refer to fig. 4: the cartridge housing 11 is provided with a socket, the electrical connector 13 is a first connector 131 on the socket, the socket is configured to mate with an external electrical connector, the electrical connector is provided with a second connector that mates with the first connector 131, one of the first connector 131 and the second connector is a conductive pin, and the other is a conductive socket, and the conductive pin can be inserted into the conductive socket so as to be electrically connected with the conductive socket. The socket comprises a plurality of first plug members 131 which are matched with the same electric connector. The first plug-in component 131 is in a rigid rod shape, and is connected with the second plug-in component which is also in a rigid rod shape through plug-in matching, so that the electrical connection between the package shell 10 and an external circuit can be directly realized through plug-in connection in the test stage of the package shell 10, the test stage of the package electronic device or the formal assembly and use stage of the package electronic device, the electrical connection piece 13 is not required to be welded on a connecting sheet or a bridging plate, and the connection is simple and the efficiency is higher. For example, in fig. 4 and 5, the first plug member 131 is a conductive socket, and an end of the first plug member, where an external connection end is located, is hollow, so that a conductive pin on the power supply connector can be inserted. The direction of the cut-out of the package case 10 and the first connector 131 in fig. 4 and 5 is the same as the direction of the cut-out of the package case 10 in fig. 1.
In some examples of the present embodiment, the package housing 10 is entirely rectangular, such as the package housing 10 is a flat rectangular parallelepiped, in which case the end face of the cartridge housing 11 is rectangular, alternatively, the end face of the cartridge housing 11 is rounded rectangular in one example. It will be appreciated that when the end face of the cartridge housing 11 is rectangular, the cartridge housing 11 has four sides, and therefore the plurality of first connectors 131 on the same side of the rectangular end face are actually on the same side of the cartridge housing 11. In some examples, no matter how many areas (e.g., the first area 121, the second area 122, the third area 123, etc.) are divided into on the bottom plate 12, the plurality of first connectors 131 located on the same side of the cartridge housing 11 are arranged in only two connector rows parallel to the end face of the cartridge housing 11. One of the two connector rows corresponds to the first chamber 111, the inner connecting end of each first connector 131 in the connector row extends into the first chamber 111, and the other connector row corresponds to the second chamber 112, and the inner connecting end of each first connector 131 in the connector row extends into the second chamber 112. In short, each socket located on the same side of the cylinder housing 11 is located on the same plane parallel to the end face of the cylinder housing 11, so that the arrangement of the sockets on the cylinder housing 11 is simpler and more attractive.
In some examples of this embodiment, one or several limiting convex rings are provided on the inner wall of the conductive socket, correspondingly, limiting concave rings corresponding to the limiting convex rings one to one are provided on the outer wall of the conductive pin, and when the conductive pin and the conductive socket are plugged in place, the limiting convex rings will be matched with the corresponding limiting concave rings. Through the cooperation of spacing concave ring and spacing bulge loop, can promote the closely degree of cooperation between electrically conductive contact pin and the electrically conductive cartridge, in the scene of interim cooperation between electric connector and the socket like this (for example to the scene of carrying out the test to encapsulation shell 10 or encapsulation electron device), even if no longer adopt extra fixed measure to fix electric connector and encapsulation shell 10, only utilize spacing concave ring and spacing bulge loop also can ensure electric connection and physical connection's reliability between electric connector and encapsulation shell 10.
The first plug member 131 is disposed on the barrel housing 11 through a first through hole penetrating the barrel housing 11, and in the case that the barrel housing 11 is made of metal, an insulator 151 on the shell is disposed on the first plug member 131 in a sleeved manner, and the insulator 151 on the shell is spaced between the barrel housing 11 and the first plug member 131 to prevent the first plug member 131 from contacting the barrel housing 11. In addition, in order to facilitate the electrical connection between the inner connection end of the first connector 131 and the circuit element in the barrel housing 11, in some examples of the present embodiment, the inner connection end of the first connector 131 is located close to the bottom plate 12, so that in the case that the bottom plate 12 is made of metal, it is also necessary to electrically isolate the inner connection end of the first connector 131 from the bottom plate 12, and in some examples, the bottom plate 12 and the first connector 131 may be insulated by the insulating layer 153 by providing the insulating layer 153 in a region corresponding to the inner connection end of the bottom plate 12 and the first connector 131, please refer to fig. 4 and 6. In other examples, insulating layers 153 may be provided on all areas of both surfaces of the bottom plate 12 facing the two accommodation chambers, respectively. The insulating layer 153 may be formed by coating a glue material such as insulating resin on the metal base plate 12. In other examples, the base plate 12 is a metal-plastic integrated plate (i.e. a plate formed by splicing metal and plastic), and the area of the base plate 12 corresponding to the connection end in the first connector 131 is formed by insulating plastic.
In some examples of the present embodiment, the package housing 10 is further provided with an inter-chamber conductive member 132, and please continue to refer to fig. 6 and 7, the inter-chamber conductive member 132 is disposed on the bottom plate 12 through a second through hole disposed on the bottom plate 12, one end of the inter-chamber conductive member 132 is disposed in the first chamber 111 and configured to be electrically connected to a circuit element disposed in the first chamber 111, and the other end of the inter-chamber conductive member is disposed in the second chamber 112 and configured to be electrically connected to a circuit element disposed in the second chamber 112, and by disposing the inter-chamber conductive member 132, the electrical connection of two inter-chamber circuit elements can be directly achieved inside the cartridge housing 11, so that it is possible to reduce, even avoid the case that the first plug member 131 is disposed exclusively on the cartridge housing 11 and a connection circuit is designed in the electrical connector, to simplify the design of the electrical connector, and to reduce the disposition area occupied by the plug socket on the cartridge housing 11. In general, the bottom plate 12 is made of a conductive material, so in order to prevent the inter-chamber conductive member 132 from being shorted, the inter-chamber conductive member 132 and the bottom plate 12 need to be electrically isolated by an insulator, for example, in fig. 6 and 7, the inter-chamber conductive member 132 is wrapped by the insulator 152, and the space is formed between the inter-chamber conductive member 132 and the inner wall of the second through hole (i.e., the space is formed between the inter-chamber conductive member 132 and the bottom plate 12).
It will be appreciated that during testing of the package 10, testing and mounting of packaged electronic devices assembled based on the package 10, the first connector 131 must be mated with an external electrical connector through a socket, and thus the first connector 131 must undergo multiple plugging and unplugging, and the on-shell insulator 151, such as a glass insulator or porcelain insulator, is susceptible to damage and breakage during the multiple plugging and unplugging. The severe breakage of the insulator 151 on the shell not only affects the air tightness of the packaged electronic device, so that the protective gas escapes along the gap between the first plug connector 131 and the barrel type shell 11, but also external water vapor easily enters the packaged electronic device along the gap, and more serious, the severe breakage of the insulator 151 on the shell may affect the electrical insulation between the barrel type shell 11 and the first plug connector 131, so that the packaged electronic device has a short circuit and other problems, and the normal functions of the packaged electronic device are seriously affected.
In order to reduce the impact of the breakage of the on-shell insulator 151, in some examples of this embodiment, a glue cavity 1510 is provided in the on-shell insulator 151, as shown in fig. 8, glue is sealed in the glue cavity 1510, and the glue sealed in the glue cavity 1510 is kept in a liquid state because moisture is not evaporated, but when the on-shell insulator 151 is damaged and broken, the glue flows out from the crack, and the moisture in the glue evaporates to solidify the glue. It should be appreciated that if the insulator 151 is not severely damaged, only a small amount of cracks appear, the original shape of the insulator 151 is not damaged, then only a small amount of glue will infiltrate into the cracks, the process is slow, the glue may be cured after reaching the cracks, thus the cracks can be plugged by the glue, and the rest of the glue is continuously sealed in the glue cavity 1510; if the insulator 151 on the shell is seriously damaged and the original shape of the insulator is damaged, the glue solution in the glue cavity 1510 will flow out rapidly, solidify between the first plug connector 131 and the inner wall of the first through hole, reduce the influence of the damage of the insulator 151 on the shell on the sealing performance of the packaged electronic device, and more importantly, the solidified glue can continuously maintain the electrical insulation state between the first plug connector 131 and the cylinder shell 11. In addition, the glue solution is solidified between the first plug-in connector 131 and the inner wall of the first through hole, so that the fixing effect on the first plug-in connector 131 can be enhanced, and the situation that after the insulator 151 on the shell is broken, the relative position of the first plug-in connector 131 and the barrel type shell 11 changes due to the gap between the first plug-in connector 131 and the inner wall of the first through hole, so that the plugging of an external electric connector and a packaged electronic device is affected can be prevented.
In some examples, the structure of the on-board insulator 152 is the same as that of the on-shell insulator 151, for example, a glue cavity for containing glue is also provided in the on-board insulator 152, and the glue contained in the glue cavity can lift the reliability of the on-board insulator 152 and prevent the on-board insulator 152 from being broken to cause a short circuit between the bottom plate 12 and the inter-chamber conductive member 132. Typically, the two ends of the inter-chamber conductive member 132 are electrically connected to the corresponding circuit elements by soldering, and are not substantially subjected to multiple plugging and unplugging, so that the on-board insulator 152 is less damaged and broken, and thus, in some examples, the on-board insulator 152 may be a common insulator without a glue cavity.
In some examples of the present embodiment, the outer wall of the barrel housing 11 is fixed with a convex fixing base 16, and as shown in fig. 4, 6 and 7 and 9, a guiding groove 160 is concavely formed in a region of the fixing base 16 corresponding to the socket toward the direction in which the barrel housing 11 is located, and the outer connection end of the first socket 131 protrudes from the bottom of the guiding groove 160. The notch profile of the guiding groove 160 matches with the plugging surface profile of the electrical connector, the plugging surface of the electrical connector refers to the surface of the electrical connector facing the plugging seat when the electrical connector is matched with the plugging seat, that is, the setting plane of the second plug connector on the electrical connector, and the plugging surface profile refers to the profile of the plugging surface. Matching the mating face profile with the slot profile means that the profile shapes of the two are identical, and the size of the mating face profile is slightly smaller than the size of the slot profile. The guiding groove 160 has guiding function for plugging the electric connector, and when the electric connector is plugged, the electric connector can be inserted along the guiding groove 160, so that the first plug connector 131 and the second plug connector on the electric connector can be plugged smoothly.
Assuming that one direction is arbitrarily selected from the directions parallel to the plugging surface of the electrical connector as the first reference direction and one direction is arbitrarily selected from the directions parallel to the bottom of the guiding groove 160 as the second reference direction, when the electrical connector is normally mated with the socket, the angle between the first reference direction and the second reference direction is fixed, and the electrical connector and the socket can be properly mated only when maintained in the relative position. With the center of the notch profile of the guide groove 160 as the rotational symmetry center, if the notch profile is a rotationally symmetrical pattern with a rotational angle α, and each first plug 131 in the socket is rotationally symmetrically distributed about the rotational symmetry center according to the rotational angle α, then the electrical connector will have 360 °/α optional insertion attitudes, but only one of these 360 °/α insertion attitudes will allow the electrical connector to be properly mated with the socket, and the smaller the rotational angle α, the more optional insertion attitudes of the electrical connector will be, and the lower the likelihood that the assembler will randomly select one insertion attitudes for the electrical connector from these optional insertion attitudes, i.e., will cause the electrical connector to be inserted into the guide groove 160 in the proper attitudes. For example, the notch profile of the guiding groove 160 is square, the four first connectors 131 in the socket are rotationally symmetrically distributed around the center of the square, and then the electrical connector has four optional insertion postures, but only one of the four optional insertion postures can complete the correct fitting with the socket, so if the electrical connector randomly selects one of the four optional insertion postures to insert the guiding groove 160, the probability of the electrical connector insertion error is 75%; if the notch profile of the guide groove 160 is rectangular, the four first connectors 131 in the socket are rotationally symmetrically distributed around the center of the rectangle, and there are two optional insertion postures of the electrical connector, only one of the two optional insertion postures can complete the correct fitting with the socket, and if the electrical connector randomly selects one of the two optional insertion postures to insert into the guide groove 160, the probability of the electrical connector insertion error is 50%.
In some examples of this embodiment, to facilitate the assembly personnel to plug the electrical connector, the notch profile of the guiding groove 160 is optionally arranged in a non-rotationally symmetrical pattern and/or each first plug member 131 in the plug seat is arranged in a non-rotationally symmetrical manner at the bottom of the guiding groove 160. For example, the notch profile of the guide groove 160 is provided in a trapezoid, and each of the first connectors 131 in the socket is arranged in a trapezoid, as shown in fig. 9 and 10. The condition that the notch profile of the guiding groove 160 is not a rotationally symmetrical pattern is described as the condition one, and the condition that the first connectors 131 in the socket are arranged in a non-rotationally symmetrical manner is described as the condition two, then the selectable insertion posture of the electrical connector can be uniquely determined as long as at least one of the condition one and the condition two is satisfied, and the situation that the electrical connector is inserted according to the wrong posture by an assembler is avoided, so in other examples of the embodiment, the notch profile of the guiding groove 160 is not limited to a trapezoid, for example, the notch profile is in a shape of a "D", or the first connectors 131 in the socket are not limited to an arrangement in a trapezoid, for example, the first connectors 131 are also not limited to an arrangement in a triangle with a non-equilateral triangle.
In some examples of the present embodiment, at least two sockets are provided on the barrel housing 11, each socket has a guiding groove 160 uniquely corresponding to the socket on the fixing base 16, and if the profiles of the notches of the guiding grooves 160 corresponding to different sockets are the same and the number and arrangement of the first connectors 131 in the sockets are the same, it may happen that an assembler erroneously matches the electrical connector with the socket, for example, inserts the electrical connector corresponding to the second socket into the guiding groove 160 corresponding to the first socket. To prevent this, in some examples of the present embodiment, the notch profile of the guide groove 160 corresponding to any two sockets on the cartridge housing 11 differs in at least one of shape and size; and/or, the first connectors 131 in any two connectors are different in at least one of number and arrangement. For example, fig. 9 shows a fixing seat 16 on one side of the barrel housing 11, and two guide grooves 160 are provided on the fixing seat 16, wherein one of the two guide grooves 160 has a trapezoid with a chamfer, and the other has an inverted "D" shape; although the two guiding grooves 160 each have 9 first connectors 131, and the first connectors 131 in each connector are arranged in a trapezoid, one of them is an upright trapezoid, and the other is an inverted trapezoid. In fig. 10, the fixing seat 16 is shown provided at the other side of the cartridge housing 11, and although the notch profile of the guide groove 160 shown in fig. 10 is also trapezoid with a chamfer, the size thereof is significantly larger than that of the corresponding guide groove 160 in fig. 9. Therefore, although the cartridge housing 11 is provided with a plurality of sockets, an assembler can insert the correct electrical connector into the corresponding guide groove 160 in a correct posture at a time, thereby reducing the assembly difficulty and effectively improving the assembly efficiency.
To ensure the tightness of the mating of the electrical connector with the socket, in some examples of this embodiment, the fixing base 16 is further provided with a fixing hole 161, as shown in fig. 9 and 10, the fixing hole 161 being configured to mate with an external fixing member to fix the electrical connector on the fixing base 16. Typically, the fixing hole 161 is a threaded hole, and the external fixing member is a screw, and the screw rod of the screw sequentially passes through the mounting hole on the electrical connector and the fixing hole 161 on the fixing base 16, and is screwed into the fixing base 16. Through the cooperation of outside mounting and fixed orifices 161, the electric connector is locked on fixing base 16, the condition that the electric connector drops voluntarily can not appear basically, has promoted electric connector and socket complex reliability.
In some examples of the present embodiment, the dimension of the first plug member 131 protruding outside the bottom of the guiding groove 160 (i.e. the distance between the outer connecting end of the first plug member 131 and the bottom of the guiding groove 160) is smaller than or equal to the depth of the guiding groove 160, please refer to fig. 4 and 7. Because the dimension of the first plug member 131 protruding out of the bottom of the guiding groove 160 is smaller than or equal to the groove depth of the guiding groove 160, the first plug member 131 does not protrude from the notch of the guiding groove 160, the fixing seat 16 can protect the first plug member 131, so that an external object can only contact the first plug member 131 through the notch of the guiding groove 160, and the probability of damage of the first plug member 131 due to external impact and external extrusion is reduced.
In some examples of this embodiment, cartridge housing 11 and base plate 12 are of a kovar, such as 4J29 kovar or 4J42 kovar. In some examples of the present embodiment, a nickel (Ni) layer may be further electroplated on the surface of the kovar alloy, for example, in some examples of the present embodiment, the thickness of the Ni layer electroplated on the surface of the kovar alloy is 1.3-11.43 um. By electroplating the Ni layer, the hardness, wear resistance, and corrosion resistance of the package case 10 can be increased. In addition, the first plug 131 may include Ni and gold (Au), such as the first plug in some examplesA plug 131 includes a Ni layer with a thickness of 1.3-8.9 μm and an Au layer with a thickness exceeding 1.3 μm. The shell insulator 151 and the board insulator 152 can be made of BH-G/K glass. Under the condition that the direct current voltage is 500V and the relative humidity is not more than 50%, the insulation resistance between the single first plug-in piece 131 and the cylinder shell 11 is not less than 1 multiplied by 10 10 Omega. Meanwhile, the whole packaging shell 10 meets the requirement of 24h for salt mist; after the cylinder shell 11 is matched with the end cover by taking helium as a standard, the air leakage rate of the packaging shell 10 is not more than 1 multiplied by 10 -3 pa·cm3/s。
In some examples of the present embodiment, the mounting seat 17 is fixed to the outer wall of the cartridge housing 11, and as shown in fig. 6, 9 and 10, the mounting seat 17 may be integrally formed with the cartridge housing 11, or it may be fixed to the outer wall of the cartridge housing 11 by welding or the like. The mounting 17 has a flange hole 170 provided therein, and the flange hole 170 is adapted to cooperate with an external fixing member, such as a screw or a bolt, for fixing the cartridge housing 11 to an external circuit board.
The present embodiment also provides a packaged electronic device 20, such as an infrared detector, as shown in fig. 11, where the packaged electronic device 20 includes a plurality of circuit elements 30, two end caps 40, and a package housing 10 provided in any of the foregoing examples, a part of the plurality of circuit elements 30 is disposed in the first chamber 111, another part of the plurality of circuit elements 30 is disposed in the second chamber 112, and the circuit elements 30 are electrically connected to the inner connection ends of the electrical connectors 13; two end caps 40 are respectively provided to both end surfaces of the cartridge housing 11 to seal the first chamber 111 and the second chamber 112. The end cap 40 is schematically shown in fig. 12 in a stepped shape, in which a thicker portion of the end cap 40 corresponds to an opening in the end face of the cartridge housing 11, and a thinner portion is configured to be fixed to the cartridge housing 11.
In preparing the packaged electronic device 20, an assembler mounts the circuit element 30 into the package housing 10, and in some examples, the assembler may separately dispose the analog circuit element and the digital circuit element in different receiving chambers, such as all analog circuit elements disposed in the first chamber 111 and all digital circuit elements disposed in the second chamber 112, which may reduce electromagnetic interference between the analog circuit and the digital circuit of the packaged electronic device 20.
In some examples, an assembler may select a placement area for the circuit element 30 based on the height of the circuit element 30, such as in fig. 11, where a first circuit element a and a second circuit element b are disposed in the first chamber 111, where the height of the second circuit element b is greater than the height of the first circuit element a, so the second circuit element b is disposed in the second area 122 of the base plate 12 and the first circuit element a is disposed in the first area 121 of the base plate 12. The third circuit element c and the fourth circuit element d are arranged in the second chamber 112, wherein the third circuit element c is higher than the fourth circuit element d, and thus the third circuit element c is arranged in the first region 121 of the base plate 12 and the fourth circuit element d is arranged in the second region 122 of the base plate 12. In fig. 11, when the circuit element 30 is disposed, the principle of division of "disposing a tall circuit element 30 in a region of a large space height in the accommodation space and disposing a short circuit element 30 in a region of a small space height in the accommodation space" is followed. As can be seen from fig. 11, based on the packaged electronic device 20 packaged by the package housing 10, the space utilization rate of the circuit element 30 to the package housing 10 is high, and the integration level of the packaged electronic device 20 is significantly improved.
It will be appreciated by those skilled in the art that in other examples of the present embodiment, although the package housing 10 is used for the packaged electronic device 20 as described above, the circuit element 30 may not be disposed exactly according to the partitioning principle corresponding to fig. 11, for example, only in one of the accommodating chambers, and the other accommodating chamber does not follow the partitioning principle, even in both accommodating chambers. In one example, the first circuit element a disposed in the first region 121 and the second circuit element b disposed in the second region 122 in the first chamber 111 are substantially the same in height, as shown in fig. 13; in another example, the first chamber 111 has a height of the first circuit element a in the first region 121 that is smaller than a height of the second circuit element b in the second region 122.
However, as will be appreciated by those skilled in the art, the circuit elements 30 are disposed in the first and second chambers 111 and 112 according to the aforementioned partitioning principle, so that the internal space of the package housing 10 can be more effectively utilized, and the height and volume of the packaged electronic device 20 can be reduced.
The embodiment also provides an electronic device, which includes a motherboard and at least one of the aforementioned packaged electronic devices 20, where the packaged electronic device 20 is electrically connected to the motherboard. The electronic equipment comprises, but is not limited to, mobile terminals such as mobile phones, tablet computers, notebook computers, intelligent wearable equipment and the like, and can also be Internet of things equipment such as intelligent televisions, intelligent refrigerators, sweeping robots, security monitoring equipment, vehicle-mounted terminals and the like.
The foregoing embodiments are only used for describing the technical solution of the present application in detail, but the descriptions of the foregoing embodiments are only used for helping to understand the method and the core idea of the present application, and should not be construed as limiting the present application. Variations or alternatives that are readily contemplated by those skilled in the art within the scope of the present disclosure are intended to be encompassed within the scope of the present disclosure.
Claims (10)
1. A packaging shell, characterized by comprising a barrel-type shell which is hollow in the interior and is provided with two end faces which are open, wherein the end faces are perpendicular to the axis of the barrel-type shell; the cartridge housing is configured to house a circuit element, and an electrical connector is provided on the cartridge housing in a penetrating manner, the electrical connector having an inner connection end positioned in the cartridge housing and an outer connection end positioned outside the cartridge housing, the inner connection end being configured to be electrically connected to the circuit element, the outer connection end being configured to be electrically connected to an external circuit;
the packaging shell further comprises a bottom plate arranged in the barrel type shell, and the bottom plate divides the inner space of the barrel type shell into a first cavity and a second cavity which are distributed along the axis and are independent from each other; the bottom plate comprises a first area and a second area, the positions of the first chamber and the second area are outwards protruded towards the direction of the second chamber, and the positions of the second chamber and the first area are outwards protruded towards the direction of the first chamber.
2. The package of claim 1, wherein the cartridge housing has a socket, the electrical connector is a first connector disposed on the socket, the socket is configured to mate with an electrical connector having a plurality of second connectors, one of the first connector and the second connector is a conductive pin, and the other is a conductive cartridge into which the conductive pin is inserted; the cylinder type shell is provided with first through holes corresponding to the first plug connectors one by one, the first plug connectors are arranged on the cylinder type shell in a penetrating way through the first through holes, part of the inner connecting ends of the first plug connectors extend into the first cavity and are configured to be electrically connected with the circuit elements arranged in the first cavity, and the other part of the inner connecting ends of the first plug connectors extend into the second cavity and are configured to be electrically connected with the circuit elements arranged in the second cavity;
the cylinder type shell body and the bottom plate are made of metal materials, the bottom plate is electrically insulated from the first plug connector through an insulating layer, the plug connector further comprises shell insulators corresponding to the first plug connector one to one, the shell insulators wrap the parts corresponding to the first plug connector and the first through holes, the first plug connector and the cylinder type shell body are arranged at intervals, a glue cavity is formed in the shell insulators, glue liquid is sealed in the glue cavity, and the glue liquid is configured to flow out from a crack after the shell insulators are broken.
3. The package according to claim 2, wherein the inner wall of the conductive socket is provided with a plurality of limiting convex rings, the outer wall of the conductive pin is provided with limiting concave rings corresponding to the limiting convex rings one by one, and the limiting convex rings are configured to be matched with the corresponding limiting concave rings.
4. The packaging shell according to claim 2, wherein a fixing seat is fixed on the outer wall of the barrel type shell, a guiding groove is formed by inwards recessing a region corresponding to the plug seat in the direction of the barrel type shell, the outer connecting end of the first plug connector extends out of the groove bottom of the guiding groove, and the distance between the outer connecting end and the groove bottom is smaller than or equal to the groove depth of the guiding groove; the notch profile of the guide groove is matched with the plugging surface profile of the electric connector, and the plugging surface profile is the profile of the setting plane of the second plug connector on the electric connector; the fixing base is also provided with a fixing hole, and the fixing hole is configured to be matched with an external fixing piece to fasten the electric connector on the fixing base.
5. The package according to claim 4, wherein at least two of said sockets are provided on said cartridge housing, each of said sockets having said guide groove uniquely corresponding thereto, said notch profile of any two of said guide grooves differing in at least one of shape and size.
6. The package according to claim 2, wherein the end face of the cartridge housing is a rounded rectangle, the first connectors on the same side of the rounded rectangle are arranged in two connector rows parallel to the end face, and the two connector rows correspond to the first chamber and the second chamber, respectively.
7. The package according to claim 2, wherein a second through hole is provided in the bottom plate, an inter-chamber conductive member is provided in the second through hole, two ends of the inter-chamber conductive member are respectively located in the first chamber and the second chamber, and the inter-chamber conductive member is configured to electrically connect the circuit element located in the first chamber with the circuit element located in the second chamber; the inter-chamber conductive member is spaced from the base plate by an on-board insulator wrapped around the inter-chamber conductive member.
8. The package according to any one of claims 1 to 7, wherein the thickness of the base plate is uniform throughout.
9. A packaged electronic device comprising a plurality of circuit elements, two end caps and a package according to any one of claims 1 to 8, a portion of said circuit elements being disposed in said first chamber and another portion being disposed in said second chamber, and said circuit elements being electrically connected to said inner connecting ends of said electrical connectors; the two end covers are respectively covered on the two end faces of the cylinder type shell.
10. The packaged electronic device of claim 9 wherein in the first chamber, a height of the circuit element disposed in the first region is less than a height of the circuit element disposed in the second region; in the second chamber, the height of the circuit element provided in the first region is greater than the height of the circuit element provided in the second region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311597146.4A CN117316878B (en) | 2023-11-28 | 2023-11-28 | Packaging shell and packaging electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311597146.4A CN117316878B (en) | 2023-11-28 | 2023-11-28 | Packaging shell and packaging electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117316878A true CN117316878A (en) | 2023-12-29 |
| CN117316878B CN117316878B (en) | 2024-02-13 |
Family
ID=89297591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311597146.4A Active CN117316878B (en) | 2023-11-28 | 2023-11-28 | Packaging shell and packaging electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117316878B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH653837A5 (en) * | 1980-06-10 | 1986-01-15 | Rose Elektrotech Gmbh | Electronic circuit housing |
| DE102008022977A1 (en) * | 2008-05-09 | 2009-04-09 | Siemens Medical Instruments Pte. Ltd. | Encapsulated circuit manufacturing method for hearing aid, involves not encapsulating printed circuit board region by encapsulation and by rotatary attachment of upper surface to self-adhesive encapsulation, where surface is encapsulated |
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN202487732U (en) * | 2012-04-01 | 2012-10-10 | 金慰（宁波）电子有限公司 | Anti-electromagnetic-interference digital high-voltage isolator |
| CN203288586U (en) * | 2013-05-06 | 2013-11-13 | 北京七星华创电子股份有限公司 | Double-layer shallow cavity type circuit package casing |
| CN106449527A (en) * | 2016-08-23 | 2017-02-22 | 太仓市威士达电子有限公司 | Metal casing for integrated circuit packaging |
| CN107611114A (en) * | 2017-07-31 | 2018-01-19 | 华为技术有限公司 | A kind of embedded substrate |
| CN207460648U (en) * | 2017-11-06 | 2018-06-05 | 北京七星华创微电子有限责任公司 | A kind of case of electronic device and electronic device |
| CN208833252U (en) * | 2018-08-30 | 2019-05-07 | 珠海欧比特宇航科技股份有限公司 | Module based on a kind of solar angle by three-dimensional encapsulation |
| CN217388192U (en) * | 2021-12-03 | 2022-09-06 | 巴宇峰 | Oppression injecting glue glan head |
-
2023
- 2023-11-28 CN CN202311597146.4A patent/CN117316878B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH653837A5 (en) * | 1980-06-10 | 1986-01-15 | Rose Elektrotech Gmbh | Electronic circuit housing |
| DE102008022977A1 (en) * | 2008-05-09 | 2009-04-09 | Siemens Medical Instruments Pte. Ltd. | Encapsulated circuit manufacturing method for hearing aid, involves not encapsulating printed circuit board region by encapsulation and by rotatary attachment of upper surface to self-adhesive encapsulation, where surface is encapsulated |
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN202487732U (en) * | 2012-04-01 | 2012-10-10 | 金慰（宁波）电子有限公司 | Anti-electromagnetic-interference digital high-voltage isolator |
| CN203288586U (en) * | 2013-05-06 | 2013-11-13 | 北京七星华创电子股份有限公司 | Double-layer shallow cavity type circuit package casing |
| CN106449527A (en) * | 2016-08-23 | 2017-02-22 | 太仓市威士达电子有限公司 | Metal casing for integrated circuit packaging |
| CN107611114A (en) * | 2017-07-31 | 2018-01-19 | 华为技术有限公司 | A kind of embedded substrate |
| CN207460648U (en) * | 2017-11-06 | 2018-06-05 | 北京七星华创微电子有限责任公司 | A kind of case of electronic device and electronic device |
| CN208833252U (en) * | 2018-08-30 | 2019-05-07 | 珠海欧比特宇航科技股份有限公司 | Module based on a kind of solar angle by three-dimensional encapsulation |
| CN217388192U (en) * | 2021-12-03 | 2022-09-06 | 巴宇峰 | Oppression injecting glue glan head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117316878B (en) | 2024-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2863083B2 (en) | Waterproof stopper for connector | |
| CN103959555B (en) | Capacitive character blindmate module interconnects | |
| US6109979A (en) | Explosion proof feedthrough connector | |
| US8939734B2 (en) | Molded plug for a compressor | |
| US20080267617A1 (en) | Electrical connector and camera device having the same | |
| EP3392984B1 (en) | Press-fit circuit board connector | |
| JP2002050808A (en) | Hall element unit, capacitor unit, and method for manufacturing hall element and capacitor units | |
| CN108963512B (en) | Connector module and manufacturing method thereof | |
| US10651605B2 (en) | Electrical connector having an improved isolative block | |
| US11349262B2 (en) | Electrical connector assembly with high speed high density symmetrical contact arrangement | |
| US20130175085A1 (en) | Connector | |
| TWI556518B (en) | Electrical connector system | |
| EP3582335B1 (en) | Connection module, and method for manufacturing connection module | |
| CN117316878B (en) | Packaging shell and packaging electronic device | |
| EP2420043B1 (en) | A portable assembly having a subscriber identification module | |
| KR19990017391U (en) | Cathode ray tube socket | |
| CN117276953A (en) | Electronic component | |
| TWM468796U (en) | Connector | |
| JP6514909B2 (en) | Waterproof connector | |
| CN112448209B (en) | Shielded connector | |
| CN115602447A (en) | Electronic component | |
| CN114744435B (en) | Electric connector combination and manufacturing method thereof | |
| US4997392A (en) | Waterproof external connector | |
| CN104518320B (en) | Electrical device connector | |
| US20140305695A1 (en) | Flat Connector and Bulkhead Mounting Structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |