CN213187006U - Heat radiator for electronic product - Google Patents
Heat radiator for electronic product Download PDFInfo
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- CN213187006U CN213187006U CN202021956185.0U CN202021956185U CN213187006U CN 213187006 U CN213187006 U CN 213187006U CN 202021956185 U CN202021956185 U CN 202021956185U CN 213187006 U CN213187006 U CN 213187006U
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Abstract
The utility model discloses a heat abstractor for electronic product, the memory bank including stromatolite encapsulation, heat abstractor for electronic product is still including being located the memory bank of stromatolite encapsulation and stretching out heat transfer device wherein, and heat transfer device includes first house steward, second house steward and heat transfer unit group, and the heat transfer unit group includes from the top down third heat transfer layer, 2 nd heat transfer layer, 3 rd heat transfer layer, third heat transfer layer …, 2n-1 heat transfer layer and 2n heat transfer layer of arranging in order, and n is the natural number. The utility model discloses keep the memory bank of stromatolite encapsulation to work under suitable temperature.
Description
Technical Field
The utility model relates to an integrated field, in particular to heat abstractor for electronic product.
Background
In the big data era, electronic units are widely applied, a large number of electronic units (especially chips such as memory chips and the like) are required in many application occasions, in order to save space, the chips are often packaged together (Package), and the chips used by manufacturers are often packaged into an integrated final product, but the existing packaging mode has the following defects:
the electronic units such as storage chips and the like which can be packaged in the same space are small in number because of unreasonable arrangement.
Secondly, the chips interfere with each other, and the using effect is influenced.
Inconvenient installation and follow-up maintenance
And fourthly, under the condition of severe environment, the work is not carried out or the work efficiency is poor due to overheating or overcooling.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor for electronic product, this heat abstractor for electronic product can dispel the heat to the electronic component in the memory of stromatolite encapsulation as required by the environment through defeated heat transfer medium outward, keeps the memory of stromatolite encapsulation to work under suitable temperature.
The technical scheme is as follows: a heat dissipation device for electronic products comprises a storage body which is packaged in a laminated mode, and further comprises a heat exchange device which is located in the storage body which is packaged in the laminated mode and extends out of the storage body, wherein the heat exchange device comprises a first header pipe, a second header pipe and a heat exchange unit group, the heat exchange unit group comprises a 1 st heat exchange layer, a 2 nd heat exchange layer, a 3 rd heat exchange layer, a second heat exchange layer …, a 2n-1 th heat exchange layer and a 2n heat exchange layer which are sequentially arranged from top to bottom, n is a natural number, the 1 st heat exchange layer, the 3 rd heat exchange layer …, the 2n-1 th heat exchange layer form a first heat exchange layer group, the 2 nd heat exchange layer, the 4 th heat exchange layer … and the 2n th heat exchange layer form a second heat exchange layer, an A heat exchange unit and a B unit are arranged in the first heat exchange layer along the Y-axis direction, the A heat exchange unit and the B heat exchange unit are symmetrically arranged, and the second heat exchange layer is arranged in the second heat exchange layer, each heat exchange layer is provided with a heat exchange unit C and a heat exchange unit D along the X-axis direction, the heat exchange units C and the heat exchange units D are symmetrically arranged, and the heat exchange unit A, the heat exchange unit B, the heat exchange unit C and the heat exchange unit D are respectively connected with the first header pipe and the second header pipe.
Through the setting of heat transfer device, at the during operation, can protect the electronic component in the memory of stromatolite encapsulation through carrying heat transfer medium, prevent that electronic component is out of work or damage.
Preferably, the stack-packaged memory body comprises a 1 st packaging layer, a 2 nd packaging layer, a 3 rd packaging layer, a 4 th packaging layer …, a 2n-1 th packaging layer and a 2n th packaging layer which are sequentially arranged from top to bottom, wherein n is a natural number, the 1 st packaging layer, the 3 rd packaging layer …, the 2n-1 th packaging layer form a first group of packaging layers, the 2 nd packaging layer, the 4 th packaging layer … and the 2n th packaging layer form a second group of packaging layers, each packaging layer in the first group of packaging layers is provided with an A box body for storing chips and a B box body for storing chips along a Y-axis direction, the A box body for storing chips and the B box body for storing chips are symmetrically arranged, a first interval is formed between the A box body for storing chips and the B box body for storing chips, and in the second group of packaging layers, each packaging layer is provided with a C box body for storing chips and a D box body for storing chips along an X-axis direction, the C box body used for storing the chip and the D box body used for storing the chip are symmetrically arranged, a second interval is formed between the C box body used for storing the chip and the D box body used for storing the chip, and a channel connected with the outside is formed at the intersection of the first interval and the second interval.
The utility model discloses an foretell setting, under same space size, the electronic unit of sealing up for safekeeping is more, does not disturb each other moreover between the electronic unit, and installation and follow-up maintenance are very convenient.
Preferably, the storage body packaged by the lamination further comprises a packaging shell, the first group of packaging layers and the second group of packaging layers are located in the packaging shell, the packaging shell comprises a first cover plate, a first bottom plate, a first left plate, a first right plate, a first front plate and a first rear plate, the first cover plate, the first bottom plate, the first left plate, the first right plate, the first front plate and the first rear plate are detachably connected into a whole, a first groove is formed in the first cover plate and is communicated with an externally connected channel, a second groove corresponding to a box body A used for storing chips and a box body B used for storing chips is formed in the first front plate and the first rear plate, and a third groove corresponding to a box body C used for storing chips and a box body D used for storing chips is formed in the first left plate and the first right plate.
Preferably, the box a for storing the chips is connected with a slidable component a, the box B for storing the chips is connected with a slidable component B, the first left plate and the first right plate are respectively connected with a slidable component a corresponding to the slidable component a and a slidable component B corresponding to the slidable component B, the box C for storing the chips is connected with a slidable component C, the box D for storing the chips is connected with a slidable component D, and the first front plate and the first rear plate are respectively connected with a slidable component C corresponding to the slidable component C and a slidable component B corresponding to the slidable component D.
Preferably, each of the cases for storing chips is provided with a toggle hook, the toggle hook is composed of a flat connecting part, a bent part and a flat hook part, the bent part is respectively connected with the flat connecting part and the flat hook part, and the flat connecting part is connected with each of the cases for storing chips.
Preferably, each of the cases for storing chips is provided with a toggle hook, the toggle hook is composed of a flat connecting part, a bent part and a flat hook part, the bent part is respectively connected with the flat connecting part and the flat hook part, and the flat connecting part is connected with each of the cases for storing chips.
Preferably, a functional layer is adhered to a surface of the second base plate.
Preferably, the functional layer comprises an insulating layer.
Preferably, the functional layer further includes an antistatic layer, and the antistatic layer is located below the insulating layer.
Preferably, the functional layer further comprises a rubber shock absorption layer, and the anti-static layer is located between the insulating layer and the rubber shock absorption layer.
Preferably, the second cover plate is a TPE elastic insulator cover plate, and a through hole is reserved in the second cover plate.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the utility model discloses because the setting staggered arrangement of first group's encapsulated layer and second group's encapsulated layer forms first interval, second interval, and first interval and second interval form with external connection's passageway, make full use of whole encapsulation space, consequently, in same space range, the utility model discloses can encapsulate the electronic component that the quantity is more, and jam-proof, installation and maintenance are all very convenient.
Drawings
Fig. 1 is a schematic view of the overall structure of embodiment 1 of the present invention;
FIG. 2 is a schematic view of the overall structure of a heat exchange device in embodiment 1 of the present invention;
FIG. 3 is a schematic structural view of a heat exchange unit A or a heat exchange unit B in embodiment 1 of the present invention;
FIG. 4 is a schematic structural view of a heat exchange unit C or a heat exchange unit D in embodiment 1 of the present invention;
fig. 5 is a schematic view of the overall structure of embodiment 2 of the present invention;
fig. 6 is a schematic view of the overall structure of embodiment 3 of the present invention;
fig. 7 is a schematic structural diagram of a box a for storing chips and a box B for storing chips according to embodiment 3 of the present invention;
fig. 8 is a schematic structural view of a first left plate/a first right plate according to embodiment 3 of the present invention;
FIG. 9 is a schematic view of a C box for chip storage and a D box for chip storage according to the present invention;
fig. 10 is a schematic structural view of a first front plate/first rear plate according to embodiment 3 of the present invention;
fig. 11 is a schematic structural diagram of a box for storing chips according to embodiment 4 of the present invention;
fig. 12 is a schematic structural view of a toggle hook according to embodiment 4 of the present invention;
fig. 13 is a schematic view of the case for storing chips according to embodiment 4 of the present invention after the second cover plate is removed;
fig. 14 is a schematic structural view of a functional layer according to embodiment 4 of the present invention;
fig. 15 is a schematic view of a second cover plate structure of the present invention.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and the terms are only for convenience of description of the present invention and simplifying the description, but do not indicate or imply that the device or element to which the term refers must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be further noted that, unless otherwise explicitly specified or limited, the terms "disposed," "opened," "mounted," "connected," and "connected" are to be construed broadly, e.g., as either a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1 to 4, a heat dissipating device for electronic products includes a stacked and packaged storage body 51 and a heat exchanging device 52 disposed in and extending out of the stacked and packaged storage body 51, wherein the heat exchanging device 52 includes a first header 53, a second header 54, and a heat exchanging unit group 55, and the heat exchanging unit group 55 includes a 1 st heat exchanging layer, a 2 nd heat exchanging layer, a 3 rd heat exchanging layer, a second heat exchanging layer …, a 2n-1 th heat exchanging layer, and a 2n heat exchanging layer, where n is a natural number, sequentially arranged from top to bottom, wherein the 1 st heat exchanging layer, the 3 rd heat exchanging layer …, the 2n-1 th heat exchanging layer form a first heat exchanging layer, the 2 nd heat exchanging layer, the 4 th heat exchanging layer …, the 2n heat exchanging layer form a second heat exchanging layer, and in the first heat exchanging layer, each heat exchanging layer is provided with an a heat exchanging unit 56 and a heat exchanging unit 57 in a Y-axis direction, and the heat exchanging units 56 and the B heat exchanging units 57 are symmetrically arranged, in the second group of heat exchange layers, each heat exchange layer is provided with a heat exchange unit C58 and a heat exchange unit D59 along the X-axis direction, the heat exchange units C58 and the heat exchange units D59 are symmetrically arranged, and the heat exchange unit A56, the heat exchange unit B57, the heat exchange unit C58 and the heat exchange unit D59 are respectively connected with the first main pipe 53 and the second main pipe 54.
Through the arrangement of the heat exchanging device 52, in operation, the electronic components in the storage body 51 packaged by lamination can be protected by conveying the heat exchanging medium, so that the electronic components are prevented from being out of operation or damaged.
During assembly, the first inlet/outlet 60 and the second inlet/outlet of the heat exchange units a 56, B57, C58 and D59 are connected to the first header pipe 53 and the second header pipe 54, respectively.
Example 2
Based on the above-mentioned embodiment 1, as shown in fig. 5, the stack-packaged memory body 51 includes the 1 st encapsulating layer 1, the 2 nd encapsulating layer 2, the 3 rd encapsulating layer, the 4 th encapsulating layer …, the 2n-1 st encapsulating layer and the 2n th encapsulating layer, which are sequentially arranged from top to bottom, where n is a natural number, the 1 st encapsulating layer 1, the 3 rd encapsulating layer …, and the 2n-1 st encapsulating layer form a first group of encapsulating layers, and the 2 nd encapsulating layer 2, the 4 th encapsulating layer … and the 2n th encapsulating layer form a second group of encapsulating layers, each encapsulating layer in the first group of encapsulating layers is provided with the a case 3 for chip storage and the B case 4 for chip storage along the Y-axis direction, the a case 3 for chip storage and the B case 4 for chip storage are symmetrically arranged, a first space 7 is formed between the a case 3 for chip storage and the B case 4 for chip storage, and the second group of encapsulating layers, each packaging layer is provided with a C box body 5 used for storing chips and a D box body 6 used for storing the chips along the X-axis direction, the C box body 5 used for storing the chips and the D box body 6 used for storing the chips are symmetrically arranged, a second interval 8 is formed between the C box body 5 used for storing the chips and the D box body 6 used for storing the chips, a channel 9 connected with the outside is formed at the intersection of the first interval 7 and the second interval 8, and the channel 9 connected with the outside is used for a connecting line for welding electronic components in the first group of packaging layers and the second group of packaging layers to pass through.
Because the setting staggered arrangement of first group's encapsulated layer and second group encapsulated layer forms first interval 7, second interval 8, and first interval 7 and second interval 8 form with external connection's passageway 9, make full use of whole encapsulation space, consequently, in same space range, the utility model discloses can encapsulate the electronic component that a large amount is more.
Example 3
Based on the above embodiment 2, as shown in fig. 6-10, the stacked and packaged memory 51 of the present invention further includes a package housing, the first and second sets of packaging layers are located in the package housing, the package housing includes a first cover plate 10, a first bottom plate 11, a first left plate 12, a first right plate 13, a first front plate 14 and a first back plate 15, the first cover plate 10, the first bottom plate 11, the first left plate 12, the first right plate 13, the first front plate 14 and the first back plate 15 are detachably connected into a whole, the first cover plate 10 is opened with a first groove 18, the first groove 18 is communicated with the externally connected channel 9, the first front plate 14 and the first back plate 15 are opened with a second groove 16 corresponding to the a box 3 for storing chips and the B box 4 for storing chips, the first left plate 12 and the first right plate 13 are opened with a third groove 17 corresponding to the C5 for storing chips and the D box 6 for storing chips, the second groove 16 is used for the A box 3 for storing chips and the B box 4 for storing chips to enter and exit the package shell, and the third groove 17 is used for the C box 5 for storing chips and the D box 6 for storing chips to enter and exit the package shell.
Since the first groove 18 is communicated with the externally connected channel 9, the connecting wires soldered to the electronic components in the first and second groups of encapsulation layers can be led out from the first groove 18 through the externally connected channel 9.
Because the first cover plate 10, the first bottom plate 11, the first left plate 12, the first right plate 13, the first front plate 14 and the first back plate 15 are detachably connected into a whole, when maintenance is needed, the packaging shell can be detached and maintained as required.
It should be further noted that, in the present invention, the detachable connection can be a detachable connection such as a screw bolt connection, or a connection manner such as a plug connection, which is not particularly limited.
It should be further noted that, in the utility model, be connected with a slidable part 21 on the a box 3 for the chip is stored, be connected with B slidable part 22 on the B box 4 for the chip is stored, be connected with respectively on first left board 12 and the first right board 13 and correspond a slidable part 19 with a slidable part 21 complex and correspond B slidable part 20 with B slidable part 22 complex, be connected with C slidable part 23 on the C box 5 for the chip is stored, be connected with D slidable part 24 on the D box 6 for the chip is stored, be connected with respectively on first front bezel 14 and the first back plate 15 and correspond C slidable part 25 with C slidable part 23 complex and correspond B slidable part 26 with D slidable part 24 complex.
By the cooperation of the a box 3 for chip storage, the B box 4 for chip storage, the C box 5 for chip storage, the D box 6 for chip storage, the a slidable member 21, the B slidable member 22, the corresponding a slidable member 19, the corresponding B slidable member 20, the C slidable member 23, the D slidable member 24, the corresponding C slidable member 25, and the corresponding B slidable member 26, the mounting and the subsequent maintenance are easier, the effective space is further saved locally, and the entire package is more compact.
It should be understood that the a slidable member 21, the B slidable member 22, the corresponding a slidable member 19, and the corresponding B slidable member 20 may be in a slide-and-slide fitting relationship, or may be in a rail-and-pulley fitting manner. The C slidable member 23, the D slidable member 24, the corresponding C slidable member 25, and the corresponding B slidable member 26 may be in a relationship in which a slide bar is engaged with a slide rail, or may be in an engagement manner of a rail or a pulley.
Example 4
Based on the above embodiment 3, as shown in fig. 11 to 15, each of the a box 3 for storing chips, the B box 4 for storing chips, the C box 5 for storing chips, and the D box 6 for storing chips includes a second cover plate 27, a second bottom plate 28, a second left plate 29, a second right plate 30, a second front plate 31, and a second rear plate 32, the second bottom plate 28 is detachably connected to the second left plate 29, the second right plate 30, the second front plate 31, and the second rear plate 32, and the second cover plate 27 is hermetically embedded in a cavity defined by the second bottom plate 28 and the second left plate 29, the second right plate 30, the second front plate 31, and the second rear plate 32 and can move up and down in the cavity.
It is further required to explain, the utility model discloses in, be provided with on the second front bezel 31 and dial hook 33, dial hook 33 is by flat connecting portion 34, curved part 36 and flat hook 35 are constituteed, curved part 36 links to each other with flat connecting portion 34 and flat hook 35 respectively, flat connecting portion 34 is connected on second front bezel 31, in using, stretch into flat connecting portion 34 with plectrum (not drawn in the figure), flat hook 35 is hard in the space that curved part 36 and flat hook 35 formed, just can be very conveniently with the box that is used for the chip to store being pulled out, and flat hook 35 and plectrum cooperation, make hard for face and face atress, can sparingly hard on the one hand, on the other hand stir conveniently.
It should be further noted that, in the present invention, the functional layer 37 is adhered on the surface of the second bottom plate 28.
It should be further noted that, in the present invention, the functional layer 37 includes the insulating layer 40, and the arrangement of the insulating layer 40 reduces the ability of the electronic component to interfere with the surrounding environment.
It should be further noted that, in the present invention, the functional layer 37 further includes an anti-static layer 39, and the anti-static layer 39 is located below the insulating layer 40.
It is to be understood that the anti-static layer 39 is an anti-static layer made of an existing anti-static material.
It should be further noted that, in the present invention, the functional layer 37 further includes a rubber shock absorbing layer 38, and the rubber shock absorbing layer 38 is located below the anti-static layer 39, so as to prevent the external factors such as earthquake from interfering with the electronic components.
It should be further noted that, in the present invention, the second cover plate 27 is a TPE elastic insulator cover plate, and the second cover plate is provided with a through hole 41, and the through hole 41 is used for passing through the connecting wire for welding the electronic component.
During assembly, the first bottom plate 11, the first left plate 12 with the installed a slidable part 21 and B slidable part 22, the first right plate 13 with the installed a slidable part 21 and B slidable part 22, the first front plate 14 with the installed C slidable part 23 and D slidable part 24, and the first back plate 15 with the installed C slidable part 23 and D slidable part 24 are assembled, the a box 3 for chip storage, the B box 4 for chip storage, the C box 5 for chip storage, and the D box 6 for chip storage are installed layer by layer from bottom to top, and finally the first cover plate 10 is installed to complete the assembly.
When needing to be maintained, if a certain local element is maintained, only the corresponding box body needs to be taken out and opened, each box body is very convenient to take and place, and when needing to be overhauled, the first cover plate 10 is uncovered for overhauling.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat sink for electronic products, comprising a stack-packaged memory, characterized in that: the heat dissipation device for the electronic product further comprises a heat exchange device which is positioned in the storage body which is packaged in a laminated mode and extends out of the storage body, the heat exchange device comprises a first header pipe, a second header pipe and a heat exchange unit group, the heat exchange unit group comprises a 1 st heat exchange layer, a 2 nd heat exchange layer, a 3 rd heat exchange layer, a … th heat exchange layer, a 2n-1 th heat exchange layer and a 2n th heat exchange layer which are sequentially arranged from top to bottom, wherein n is a natural number, the 1 st heat exchange layer, the 3 rd heat exchange layer …, the 2n-1 th heat exchange layer form a first heat exchange layer, the 2 nd heat exchange layer and the 4 th heat exchange layer … th heat exchange layer form a second heat exchange layer, each heat exchange layer in the first heat exchange layer is provided with an A heat exchange unit and a B heat exchange unit in the Y-axis direction, the A heat exchange units and the B heat exchange units are symmetrically arranged, and each heat exchange layer in the second heat exchange layer is provided with a C heat exchange unit and a D in the X-axis, the heat exchange unit A, the heat exchange unit B, the heat exchange unit C and the heat exchange unit D are respectively connected with the first header pipe and the second header pipe.
2. The heat sink for electronic products according to claim 1, wherein: the laminated packaging memory body comprises a 1 st packaging layer, a 2 nd packaging layer, a 3 rd packaging layer, a 4 th packaging layer …, a 2n-1 th packaging layer and a 2n th packaging layer which are sequentially arranged from top to bottom, wherein n is a natural number, the 1 st packaging layer, the 3 rd packaging layer …, the 2n-1 th packaging layer form a first group of packaging layers, the 2 nd packaging layer, the 4 th packaging layer … and the 2n th packaging layer form a second group of packaging layers, each packaging layer in the first group of packaging layers is provided with an A box body for storing chips and a B box body for storing chips along the Y-axis direction, the A box body for storing chips and the B box body for storing chips are symmetrically arranged, a first interval is formed between the A box body for storing chips and the B box body for storing chips, and each packaging layer in the second group of packaging layers is provided with a C box body for storing chips and a D box body for storing chips along the X-axis direction, the C box body used for storing the chip and the D box body used for storing the chip are symmetrically arranged, a second interval is formed between the C box body used for storing the chip and the D box body used for storing the chip, and a channel connected with the outside is formed at the intersection of the first interval and the second interval.
3. The heat sink for electronic products according to claim 2, wherein: the laminated packaging storage body further comprises a packaging shell, the first group of packaging layers and the second group of packaging layers are located in the packaging shell, the packaging shell comprises a first cover plate, a first bottom plate, a first left plate, a first right plate, a first front plate and a first rear plate, the first cover plate, the first bottom plate, the first left plate, the first right plate, the first front plate and the first rear plate are detachably connected into a whole, a first groove is formed in the first cover plate and communicated with an externally connected channel, a second groove corresponding to a box A used for storing chips and a box B used for storing chips is formed in the first front plate and the first rear plate, and a third groove corresponding to a box C used for storing chips and a box D used for storing chips is formed in the first left plate and the first right plate.
4. The heat sink for electronic products according to claim 3, wherein: a be connected with A slidable part on the A box for the chip is stored, be connected with B slidable part on the B box for the chip is stored, be connected with respectively on first left board and the first right board with A slidable part complex correspond A slidable part and with B slidable part complex correspond B slidable part, be connected with C slidable part on the C box for the chip is stored, be connected with D slidable part on the D box for the chip is stored, be connected with respectively on first front bezel and the first back plate with C slidable part complex correspond C slidable part and with D slidable part complex correspond B slidable part.
5. The heat sink for electronic products according to claim 4, wherein: a box for chip storage, a B box for chip storage, a C box for chip storage, a D box for chip storage, each box for chip storage includes the second apron, the second bottom plate, the second left board, the second right board, the second front bezel and the second back plate, the second bottom plate can be dismantled even and form the cavity as an organic whole with the second left board, the second right board, the second front bezel and the second back plate respectively, the second apron leakproofness imbeds in this cavity to can reciprocate in the cavity.
6. The heat sink for electronic products according to claim 5, wherein: each box body for storing the chips is provided with a poking hook, each poking hook consists of a flat connecting part, a bent part and a flat hook part, the bent parts are respectively connected with the flat connecting parts and the flat hook parts, and the flat connecting parts are connected to each box body for storing the chips.
7. The heat sink for electronic products according to claim 6, wherein: and a functional layer is adhered to the surface of the second base plate.
8. The heat sink for electronic products according to claim 7, wherein: the functional layer comprises an insulating layer and an anti-static layer, and the anti-static layer is located below the insulating layer.
9. The heat sink for electronic products according to claim 8, wherein: the functional layer further comprises a rubber shock absorption layer, and the anti-static layer is located between the insulating layer and the rubber shock absorption layer.
10. The heat dissipating device for electronic products according to any one of claims 5 to 9, wherein: the second cover plate is a TPE elastic insulator cover plate, and a through hole is reserved in the second cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021956185.0U CN213187006U (en) | 2020-09-09 | 2020-09-09 | Heat radiator for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021956185.0U CN213187006U (en) | 2020-09-09 | 2020-09-09 | Heat radiator for electronic product |
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| Publication Number | Publication Date |
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| CN213187006U true CN213187006U (en) | 2021-05-11 |
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| CN202021956185.0U Active CN213187006U (en) | 2020-09-09 | 2020-09-09 | Heat radiator for electronic product |
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| CN (1) | CN213187006U (en) |
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