CN219659984U

CN219659984U - PCB and electronic equipment

Info

Publication number: CN219659984U
Application number: CN202320520563.8U
Authority: CN
Inventors: 何作通; 杨建华
Original assignee: Salcomp Shenzhen Co ltd
Current assignee: Salcomp Shenzhen Co ltd
Priority date: 2023-02-07
Filing date: 2023-03-10
Publication date: 2023-09-08
Anticipated expiration: 2033-03-10

Abstract

The utility model discloses a PCB and electronic equipment with the same, wherein the PCB comprises a board body and a protection structure; the plate body is provided with a discharge needle; the protection architecture is located on the plate body, is formed with in the protection architecture and holds the chamber, and the protection architecture includes border portion, and border portion is around forming the opening that the intercommunication held the chamber, and the discharge needle passes the opening in order to stretch into and hold the intracavity, and the plate body is connected with border portion to the jam opening. A receiving cavity is formed in the protective structure, and the discharge needle passes through the opening to extend into the receiving cavity. The discharge needle stretches into the accommodating cavity, so that the discharge needle can be protected by the protection structure, when the heat dissipation layer is covered on the PCB, the heat dissipation layer and the discharge needle can be isolated by the protection structure, the discharge needle can discharge in the accommodating cavity, and then the influence of the heat dissipation layer on the discharge needle is reduced.

Description

PCB and electronic equipment

Technical Field

The utility model relates to the technical field of PCB (printed circuit board), in particular to a PCB and electronic equipment.

Background

In the operation of electronic equipment, a large amount of heat is generated by the PCB in the electronic equipment, and the service life of the PCB is affected by the heat. In the related art, a heat dissipation layer is covered on the surface of the PCB to improve the heat dissipation efficiency of the PCB. However, the heat dissipation layer covered on the surface of the PCB can also cover the discharge needles on the PCB, thereby affecting the normal operation of the discharge needles.

Disclosure of Invention

The utility model aims to at least solve one of the technical problems in the prior art, and in a first aspect, the utility model provides a PCB, and after a heat dissipation layer is covered on the PCB, a discharge needle on the PCB can still work normally. The second aspect of the present utility model also provides an electronic device comprising the PCB board of the first aspect of the present utility model.

According to the PCB provided by the embodiment of the first aspect of the utility model, the PCB comprises a board body and a protection structure; the plate body is provided with a discharge needle; the protection architecture is located on the plate body, is formed with in the protection architecture and holds the chamber, and the protection architecture includes border portion, and border portion is around forming the opening that the intercommunication held the chamber, and the discharge needle passes the opening in order to stretch into and hold the intracavity, and the plate body is connected with border portion to the jam opening.

The PCB provided by the utility model has at least the following beneficial effects: a receiving cavity is formed in the protective structure, and the discharge needle passes through the opening to extend into the receiving cavity. The discharge needle stretches into the accommodating cavity, so that the discharge needle can be protected by the protection structure, when the heat dissipation layer is covered on the PCB, the heat dissipation layer and the discharge needle can be isolated by the protection structure, the discharge needle can discharge in the accommodating cavity, and then the influence of the heat dissipation layer on the discharge needle is reduced.

According to the PCB provided by the embodiment of the first aspect of the utility model, the edge part is connected with the board body in an adhesion way.

According to the PCB provided by the embodiment of the first aspect of the utility model, the board body is provided with the mounting groove, the mounting groove is arranged around the discharge needle, the edge part is inserted into the mounting groove, and glue is filled between the edge part and the groove wall of the mounting groove.

According to the PCB board of the embodiment of the first aspect of the utility model, the protection structure comprises a bottom plate and a plurality of side plates, the side plates are connected with the bottom plate, the side plates are arranged along the edge of the bottom plate, the bottom plate and the plurality of side plates surround to form a containing cavity, and one end of the side plate far away from the bottom plate forms an edge part.

According to the PCB provided by the embodiment of the first aspect of the utility model, the side plates are connected with the bottom plate in a blocking manner, and the adjacent side plates are connected in a blocking manner.

An electronic device provided according to an embodiment of a second aspect of the present utility model includes a PCB board according to an embodiment of the first aspect of the present utility model.

According to the electronic equipment provided by the embodiment of the second aspect of the utility model, the electronic equipment further comprises a heat dissipation layer, and the heat dissipation layer wraps the PCB.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described below with reference to the drawings and examples;

fig. 1 is a schematic structural diagram of a PCB board according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model.

Reference numerals:

a board body 100; a discharge needle 110; glue 120;

a protective structure 200; a housing chamber 201; a base plate 210; a side plate 220; edge 221;

a housing 300; a heat sink layer 310.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

The PCB board and the electronic device according to the present utility model are described in detail with reference to fig. 1 to 2.

Referring to fig. 1, a PCB board according to an embodiment of the present utility model includes a board body 100 and a protection structure 200.

The plate body 100 is provided with a discharge needle 110; the protection structure 200 is disposed on the plate body 100, the holding cavity 201 is formed in the protection structure 200, the protection structure 200 includes a rim portion 221, the rim portion 221 surrounds an opening communicating with the holding cavity 201, the discharge needle 110 passes through the opening to extend into the holding cavity 201, and the plate body 100 is connected with the rim portion 221 to block the opening.

For example, as shown in fig. 1, a discharge needle 110 is provided on a board body 100; the protective structure 200 is formed therein with a receiving cavity 201, a rim portion 221 is positioned at a lower end of the protective structure 200, the rim portion 221 surrounds the receiving cavity 201 to be opened, the rim portion 221 is connected with the plate body 100 such that the discharge needles 110 can be inserted into the receiving cavity 201 through the opening. It can be understood that the board body 100 is provided with circuits, when the PCB works, the circuits generate heat, the heat can cause the temperature of the PCB to be too high, and the PCB is damaged, when the PCB is installed in an electronic device, the surface of the PCB is often covered with a layer of heat dissipation layer 310, so as to improve the heat dissipation efficiency of the PCB, but the heat dissipation layer 310 covered on the surface of the PCB can wrap the discharge needle 110 on the board body 100, so that the discharge needle 110 does not have enough space to discharge, and the normal work of the discharge needle 110 is affected. In the utility model, by arranging the protection structure 200, the storage cavity 201 is arranged in the protection structure 200, and then the discharge needle 110 can discharge in the storage cavity 201, and after the surface of the PCB is covered with the heat dissipation layer 310, the protection structure 200 can isolate the discharge needle 110 from the heat dissipation layer 310, so as to reduce the influence of the heat dissipation layer 310 on the discharge needle 110.

Further, the edge 221 is adhesively connected to the board 100. For example, the edge 221 and the board 100 may be adhesively connected by glue 120. The edge 221 and the plate body 100 are connected through the glue 120, and the operation is simple and convenient.

In some embodiments of the present utility model, the plate body 100 is provided with a mounting groove, the mounting groove is disposed around the discharge needle 110, the edge portion 221 is inserted into the mounting groove, and the glue 120 is filled between the edge portion 221 and the groove wall of the mounting groove. For example, as shown in fig. 1, a mounting groove is provided around the board body 100, the edge 221 is inserted into the mounting groove, and the glue 120 is filled between the edge 221 and the groove wall of the mounting groove. The setting of mounting groove can improve the degree of accuracy of protection architecture 200 installation on plate body 100, simultaneously, in the border portion 221 inserted the mounting groove, fill between the cell wall of border portion 221 and mounting groove has glue 120, can improve the adhesion area between border portion 221 and the mounting groove, and then improves the firm degree of protection architecture 200 installation on plate body 100.

In some embodiments of the present utility model, the protection structure 200 includes a bottom plate 210 and a plurality of side plates 220, the side plates 220 are connected to the bottom plate 210, and the side plates 220 are disposed along edges of the bottom plate 210, the bottom plate 210 and the plurality of side plates 220 surround to form the receiving cavity 201, and an end of the side plates 220 remote from the bottom plate 210 forms a rim 221. For example, as shown in fig. 1, the protection structure 200 may include a bottom plate 210 and four side plates 220, the bottom plate 210 may be quadrilateral, the four side plates 220 are disposed at the lower end of the bottom plate 210, the four side plates 220 are respectively connected with four edges of the bottom plate 210, two adjacent side plates 220 are connected with each other, the lower ends of the side plates 220 form edge portions 221, and the lower ends of the side plates 220 are connected with the plate body 100 in an adhesion manner. The protection structure 200 is formed by splicing a bottom plate 210 and a plurality of side plates 220, and has simple structure and easy realization.

Further, the side plates 220 are connected to the bottom plate 210 in a blocking manner, and the adjacent side plates 220 are connected in a blocking manner. For example, the side plates 220 and the bottom plate 210 can be connected by adhesion through glue 120, and two adjacent side plates 220 can be connected by adhesion through glue 120. The glue 120 is obtained in a simple manner, and the glue 120 is low in cost.

Referring to fig. 2, an electronic device according to an embodiment of the second aspect of the present utility model includes a PCB board according to an embodiment of the first aspect of the present utility model.

In some embodiments of the present utility model, a heat dissipation layer 310 is further included, and the heat dissipation layer 310 wraps the PCB board. For example, as shown in fig. 2, the electronic device includes a housing 300, a PCB board is disposed on the housing 300, and a heat dissipation layer 310 is covered on a surface of the PCB board. The heat dissipation layer 310 is arranged, so that heat in the PCB can be transferred to the outside through the heat dissipation layer 310; the arrangement of the protection structure 200 in the PCB board can isolate the heat dissipation layer 310 and the discharge needle 110 by the protection structure 200, and the discharge needle 110 can discharge in the accommodating cavity 201 of the protection structure 200, so that the influence of the heat dissipation layer 310 on the operation of the discharge needle 110 is reduced.

Specifically, the heat dissipation layer 310 may be a material with excellent thermal conductivity, such as a potting adhesive or a heat conductive adhesive.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A PCB board, comprising:

the discharge lamp comprises a plate body (100), wherein a discharge needle (110) is arranged on the plate body (100);

the protection structure (200) is arranged on the plate body (100), a containing cavity (201) is formed in the protection structure (200), the protection structure (200) comprises an edge portion (221), the edge portion (221) is communicated with an opening of the containing cavity (201) in a surrounding mode, and the discharge needle (110) penetrates through the opening to extend into the containing cavity (201), and the plate body (100) is connected with the edge portion (221) to block the opening.

2. A PCB board according to claim 1, characterized in that the edge portion (221) is adhesively connected to the board body (100).

3. A PCB board according to claim 2, characterized in that the board body (100) is provided with a mounting groove, the mounting groove is arranged around the discharge needle (110), the edge portion (221) is inserted into the mounting groove, and glue (120) is filled between the edge portion (221) and the groove wall of the mounting groove.

4. The PCB board of claim 1, wherein the protective structure (200) includes a bottom plate (210) and a plurality of side plates (220), the side plates (220) are connected to the bottom plate (210), and the side plates (220) are disposed along edges of the bottom plate (210), the bottom plate (210) and the plurality of side plates (220) surround the accommodating cavity (201), and an end of the side plates (220) away from the bottom plate (210) forms the edge portion (221).

5. The PCB of claim 4, wherein said side plates (220) are adhesively connected to said bottom plate (210), adjacent ones of said side plates (220) being adhesively connected to each other.

6. An electronic device comprising a PCB board as claimed in any one of claims 1 to 5.

7. The electronic device of claim 6, further comprising a heat dissipation layer (310), the heat dissipation layer (310) encapsulating the PCB.