CN216213525U

CN216213525U - LED packaging structure and LED display device

Info

Publication number: CN216213525U
Application number: CN202122386206.0U
Authority: CN
Inventors: 吴学坚; 徐钊; 程寅山; 周波; 郑世鹏; 郑朝曦
Original assignee: Shenzhen Youming Photoelectric Co ltd
Current assignee: Shenzhen Youming Photoelectric Co ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-04-05
Anticipated expiration: 2031-09-29

Abstract

The utility model provides an LED packaging structure and an LED display device, wherein the LED packaging structure comprises: the bracket comprises a light-transmitting body and fluorescent powder doped in the light-transmitting body; the LED chip is arranged on the bracket; the lens comprises a lens body and fluorescent powder doped in the lens body, wherein the lens body is connected with the bracket and covers the LED chip; the LED display device comprises a plurality of LED packaging structures, wherein the LED packaging structures are connected with one another; by adopting the technical scheme, the bracket is made of the light-transmitting material, and the fluorescent powder is doped in the bracket, so that the bracket can be excited to emit light rays with different colors.

Description

LED packaging structure and LED display device

Technical Field

The utility model relates to the technical field of LED display, in particular to an LED packaging structure and an LED display device.

Background

With the development of science and technology, LED display devices have been widely used in various illumination fields by virtue of their advantages of high luminous efficiency, low power consumption, no need of high voltage, high safety, etc. The service life of the LED display device is directly related to the working temperature of the node, only about 50% of electric energy is converted into light energy in the working process of the LED display device at present, and the rest of electric energy is almost converted into heat energy, so that the temperature of the LED display device is increased, and the reliability of the LED display device is reduced by half when the temperature is increased by 10 ℃. Heat dissipation is a big problem. Poor heat dissipation can directly lead to reduced performance and stability of the LED display device, while poor heat dissipation can produce severe light degradation that affects the life of the lamp.

Reducing the thermal resistance of packaging and assembly can effectively improve the performance and reliability of the device. In the existing packaging technology, a chip is fixed on a bracket or a substrate, which can increase the thermal resistance from the chip to a circuit board, and if the bracket or the substrate can be removed, fewer process steps and fewer materials can be used, so that the cost is reduced, the thermal resistance is reduced, and the thickness of a system is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED packaging structure and an LED display device, and aims to solve the technical problem that the LED display device in the prior art is poor in heat dissipation performance due to high thermal resistance.

In order to achieve the above object, the present invention adopts a technical solution that is an LED package structure, including:

the bracket comprises a light-transmitting body and fluorescent powder doped in the light-transmitting body;

the LED chip is arranged on the bracket;

the lens comprises a lens body and fluorescent powder doped in the lens body, wherein the lens body is connected with the support and covers the LED chip.

By adopting the technical scheme, the bracket is made of the light-transmitting material, and the fluorescent powder is doped in the bracket, so that the bracket can be excited to emit light rays with different colors.

It should be further explained that the stent may be formed by injection molding or etching with a mold after being doped with phosphor powder, or by injection molding or etching after being doped with phosphor powder, or by doping inorganic light-transmitting material such as soda lime glass, silicate glass, sapphire glass, or the like with phosphor powder. The LED package structure of the present embodiment can be manufactured into an LED emitting white light, and the existing white light LED has two manufacturing methods, one is a white light LED packaged by using three primary color LED chips of red, green and blue, and the other is a white light LED packaged by using a single LED chip in combination with phosphor. The latter approach has advantages in terms of production cost, heat dissipation and control circuitry, and is most commonly used in the industry. Thus, phosphors are one of the key materials for semiconductor lighting. At present, the fluorescent powder for the LED mainly has three major systems, namely aluminate, silicate and nitride (oxide).

In one embodiment, the top of the LED chip is provided with an electrical connection point, and the electrical connection point is electrically connected with the bracket through a connection wire.

By adopting the technical scheme, the LED chip is arranged on the bracket in a normal mounting mode, and the driving current and the heat productivity of the packaged LED chip are relatively small.

In one embodiment, the bottom of the LED chip is provided with a connecting contact which is electrically connected with the electric connector of the bracket.

By adopting the technical scheme, the LED chip is arranged on the support in an inverted mode, the connecting contact of the LED chip is positioned at the bottom of the LED chip, namely the electrode is arranged downwards, and in the welding process with the support, the bonding welding process in the normal assembling process is not needed, so that the packaging efficiency of the LED chip is greatly improved.

In one embodiment, the bracket is provided with a containing groove, and the LED chip is arranged on a bottom groove wall of the containing groove.

Through adopting above-mentioned technical scheme for inside the storage tank can be located to the LED chip, improved the protectiveness of LED chip, also make the light that the LED chip sent simultaneously can pass the cell wall entering support of storage tank in, and then arouse phosphor powder.

In one embodiment, the depth of the accommodating groove is greater than the height of the LED chip.

Through adopting above-mentioned technical scheme for in the light that the LED chip sent towards the side direction all can pierce through the cell wall entering support of storage tank, and then arouse phosphor powder, the degree of depth of storage tank is greater than the height of LED chip simultaneously, makes the storage tank notch part of support highly be greater than the height of LED chip on the top of support, also is favorable to the setting of lens, and lens only need cover locate the support top can.

In one embodiment, the LED package structure further includes a light-transmitting structure disposed between the support and the lens for packaging the LED chip.

Through adopting above-mentioned technical scheme, light-transmitting structure is used for sealed and fixed LED chip, avoids LED chip direct and air and moisture contact, causes the ageing or the inefficacy of LED chip, also fixes the LED chip on the support simultaneously, has improved the stability and the durability of LED chip.

In one embodiment, the lens is shaped as a hemisphere or hemisphere-like body.

By adopting the technical scheme, the light rays emitted by the LED chip are emitted towards different directions through the scattering of the lens, and the emission angle of the light rays of the LED chip is increased by the lens of the hemisphere or the similar hemisphere, so that the light-emitting angle of the LED chip is enlarged.

In one embodiment, the side of the bracket is provided with a pad.

By adopting the technical scheme, the bonding pads on the support are used for being electrically connected with the bonding pads of the adjacent support, namely, the two adjacent LED packaging structures are mutually connected in series or in parallel through the bonding pads, and the bonding pads are positioned on the side part of the support, so that the two adjacent LED packaging structures can be conveniently welded.

In one embodiment, the bottom of the bracket is provided with a pad.

Through adopting above-mentioned technical scheme, the pad on the support is used for being connected with the base plate electricity, and can set up a plurality of LED packaging structure on the base plate, and a plurality of supports set up on same base plate promptly, and the pad is located the bottom of support, is convenient for with the electricity of base plate be connected.

The embodiment also provides an LED display device, which includes a plurality of the above LED package structures, and the plurality of LED package structures are connected to each other.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a first cross-sectional view of an LED package structure provided in an embodiment of the present invention;

fig. 2 is a second cross-sectional view of an LED package structure according to an embodiment of the present invention.

The figures are numbered:

100-LED package structure;

1-a scaffold; 2-LED chip; 3-a lens; 4-fluorescent powder; 5-connecting a wire; 6-a light-transmitting structure; 7-a pad;

11-a light transmissive body; 21-electrical connection points; 22-connecting contacts; 31-a light transmissive body;

10-a receiving groove.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings, which are used for convenience in describing the utility model, and are not intended to indicate that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the utility model.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features.

In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:

as shown in fig. 1 and fig. 2, an LED package structure 100 according to an embodiment of the present invention includes: the LED lamp comprises a support 1, an LED chip 2 and a lens 3;

the bracket 1 comprises a light-transmitting body 11 and fluorescent powder 4 doped in the light-transmitting body 11;

the LED chip 2 is arranged on the bracket 1;

the lens 3 includes a lens body 31 and phosphor 4 doped in the lens body 31, and the lens body 31 is connected to the support 1 and covers the LED chip 2.

The operating principle of the LED package structure 100 of the present embodiment is as follows:

the LED chip 2 is arranged on the support 1, and emits light outwards during operation, and the light is emitted from the center of the LED chip 2 towards the periphery, because the lens 3 and the support 1 have light-transmitting characteristics, the light of the LED chip 2 passes through the lens 3 and the support 1 to be emitted to the outside of the LED packaging structure 100, and meanwhile, the light of the LED chip 2 excites the fluorescent powder 4 doped in the lens body 31 and the support 1 to emit light with different colors.

By adopting the technical scheme, the bracket 1 is made of the light-transmitting material, and the fluorescent powder 4 is doped in the bracket to enable the bracket to be excited to emit light rays with different colors, because the bracket 1 is not mainly used as a supporting surface and a protective shell of the LED chip 2, but is used as a protective shell which is coated on a light-emitting unit of the LED chip 2 and has a light-emitting surface, the cost and the thermal resistance of the LED packaging structure 100 are reduced, and the heat radiation performance is improved.

It should be further explained that the light-transmitting body 11 and the lens body 31 can be made of organic light-transmitting materials such as Polycarbonate (PC), polypropylene (PP), polymethyl methacrylate (PMMA), organic silica gel, etc., and the light-transmitting materials are doped with the fluorescent powder 4 and then formed by injection molding or etching, or inorganic light-transmitting materials such as soda-lime glass, silicate glass, sapphire glass, etc. are doped with the fluorescent material and then formed by molding or etching; the LED package structure 100 of the present embodiment can be manufactured as an LED emitting white light, and the existing white light LED has two manufacturing methods, one is a white light LED packaged by using three primary color LED chips of red, green and blue, and the other is a white light LED packaged by using a single LED chip in combination with phosphor. The latter approach has advantages in terms of production cost, heat dissipation and control circuitry, and is most commonly used in the industry. Thus, phosphors are one of the key materials for semiconductor lighting. At present, the fluorescent powder for the LED mainly has three major systems, namely aluminate, silicate and nitride (oxide).

In one embodiment, the top of the LED chip 2 is provided with an electrical connection point 21, and the electrical connection point 21 is electrically connected to the support 1 through a connection wire 5.

By adopting the technical scheme, the LED chip 2 is arranged on the bracket 1 in a normal installation mode, and the LED chip 2 is packaged to have smaller driving current and smaller heat productivity.

As shown in fig. 2, in one embodiment, the bottom of the LED chip 2 is provided with connection contacts 22, and the connection contacts 22 are electrically connected with the electrical connections of the support 1.

By adopting the technical scheme, the LED chip 2 is installed on the support 1 in an inverted mode, the connecting contact 22 of the LED chip 2 is positioned at the bottom of the LED chip 2, namely, the electrode is arranged downwards, and in the welding process with the support 1, the bonding welding process in the normal installation process is not needed, so that the packaging efficiency of the LED chip 2 is greatly improved.

In one embodiment, the bracket 1 is provided with a containing groove 10, and the LED chip 2 is disposed on a bottom groove wall of the containing groove 10.

Through adopting above-mentioned technical scheme for inside the storage tank 10 can be located to LED chip 2, improved LED chip 2's protectiveness, also make the light that LED chip 2 sent simultaneously can pass the cell wall entering support 1 of storage tank 10 in, and then arouse phosphor powder 4.

In one embodiment, the depth of the accommodating groove 10 is greater than the height of the LED chip 2.

Through adopting above-mentioned technical scheme for the light that LED chip 2 sent towards the side direction all can pierce through the cell wall entering support 1 of storage tank 10, and then arouse phosphor powder 4, the degree of depth of storage tank 10 is greater than LED chip 2's height simultaneously, make the storage tank 10 notch part of support 1 highly be greater than LED chip 2's height on the top of support 1 promptly, also be favorable to lens 3's setting, lens 3 only need cover locate support 1 top can.

In one embodiment, the LED package structure 100 further includes a light-transmitting structure 6 disposed between the support 1 and the lens 3 for packaging the LED chip 2.

Specifically, the light-transmitting structure 6 is filled in the accommodating groove 10.

Through adopting above-mentioned technical scheme, light-transmitting structure 6 is used for sealed and fixed LED chip 2, avoids LED chip 2 direct and air and moisture contact, causes LED chip 2 ageing or inefficacy, also fixes LED chip 2 on support 1 simultaneously, has improved LED chip 2's stability and durability.

In one embodiment, the lens 3 is shaped as a hemisphere or hemisphere-like body.

By adopting the technical scheme, the light rays emitted by the LED chip 2 are scattered by the lens 3 and emitted towards different directions, and the lens 3 of the hemisphere or the similar hemisphere increases the light emitting angle of the LED chip 2 and enlarges the light emitting angle of the LED chip 2.

Referring again to fig. 1, in one embodiment, the side of the frame 1 is provided with a bonding pad 7.

Specifically, the bracket 1 of the present embodiment may be selected as a PCB, the component is fixed on the PCB by soldering through a lead hole on the PCB, and the pad 7 is connected by a printed wire to realize electrical connection of the component in the circuit. The lead holes and the surrounding copper foil are referred to as pads 7.

By adopting the technical scheme, the bonding pads 7 on the bracket 1 are used for being electrically connected with the bonding pads 7 of the adjacent bracket 1, namely, the two adjacent LED packaging structures 100 are mutually connected in series or in parallel through the bonding pads 7, and the bonding pads 7 are positioned on the side part of the bracket 1, so that the two adjacent LED packaging structures 100 can be conveniently welded.

Referring again to fig. 2, in one embodiment, the bottom of the frame 1 is provided with a bonding pad 7.

By adopting the above technical scheme, the bonding pad 7 on the support 1 is used for being electrically connected with the substrate, and the substrate can be provided with a plurality of LED package structures 100, i.e. a plurality of supports 1 are arranged on the same substrate, and the bonding pad 7 is located at the bottom of the support 1, so as to be conveniently electrically connected with the substrate.

The present embodiment further provides an LED display device, which includes a plurality of LED package structures 100 as described above, wherein the LED package structures 100 are connected to each other.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. An LED package structure, comprising:

the LED chip is arranged on the bracket;

2. The LED package structure of claim 1, wherein the top of the LED chip is provided with an electrical connection point, and the electrical connection point is electrically connected to the support through a connection wire.

3. The LED package structure of claim 1, wherein a bottom of said LED chip is provided with connection contacts, said connection contacts being electrically connected with electrical connections of said support.

4. The LED package structure of claim 1, wherein the frame has a receiving groove, and the LED chip is disposed on a bottom wall of the receiving groove.

5. The LED package structure of claim 4, wherein the depth of the receiving groove is greater than the height of the LED chip.

6. The LED package structure of claim 1, further comprising a light transmissive structure for encapsulating the LED chip, the light transmissive structure disposed between the support and the lens.

7. The LED package structure of claim 1, wherein the lens is shaped as a hemisphere or a hemisphere-like body.

8. The LED package structure according to any one of claims 1 to 7, wherein a side of the support is provided with a pad.

9. The LED package structure of any of claims 1 to 7, wherein a bottom of the support is provided with a pad.

10. An LED display device, comprising a plurality of LED package structures according to any one of claims 1 to 9, wherein the LED package structures are connected to each other.