CN219144209U - Novel LED packaging structure - Google Patents

Abstract

The utility model discloses a novel LED packaging structure, which comprises: a substrate, a gold conductive layer, a chip, etc.; the gold conductive layer is arranged on the substrate to form a plurality of hollowed-out areas. The gold conductive layer is electrically connected with the positive electrode and the negative electrode of the chip through bonding wires; the chip is arranged in the hollowed-out area and fixedly connected with the substrate. By using the gold conductive layer, the absorption of color-changing light generated by oxidation or vulcanization of the traditional silver conductive layer can be avoided, so that the light efficiency of the LED can be improved. In addition, through setting up the fretwork area, reduce the bonding area of encapsulation layer and gold conducting layer for the encapsulation layer can be connected with the base plate more, improves the adhesion of encapsulation layer, thereby reduces and breaks away from the base plate and makes the cracked probability of bonding wire because of the encapsulation layer is not high with gold conducting layer's adhesion nature, and then improves the encapsulation reliability of LED.

Description

Novel LED packaging structure

Technical Field

The utility model relates to the technical field of LED light source packaging, in particular to a novel LED packaging structure.

Background

The surface metal of the conductive layer commonly used for the substrate of LED (Light Emitting Diode) is mainly silver, and the area of the conductive layer is increased as much as possible to improve the heat dissipation effect. The conductive and heat dissipation are realized, and the reflectivity of silver is higher, so that the LED light efficiency is improved. However, silver is liable to change color due to oxidation or vulcanization under long-term use, and light attenuation is generated.

If silver is changed into gold, the problem of discoloration can be avoided. However, since gold has a higher absorptivity to visible light than silver, the LED has a lower luminous efficiency, and in addition, since the bonding strength between the encapsulation layer and gold is low, the encapsulation layer and gold are easily separated, and the bonding wire is easily broken, resulting in a problem of reduced reliability.

Disclosure of Invention

The utility model aims to solve the technical problems that when silver or gold is adopted as the metal on the surface of the conductive layer of the LED substrate in the prior art, the light efficiency is low and even failure is easy to occur, so that the novel LED packaging structure is provided.

In order to solve the technical problems, the technical scheme of the utility model is as follows:

a novel LED package structure, comprising: a substrate, a gold conductive layer, and a chip; the gold conductive layer is arranged on the upper surface of the substrate, and is provided with a plurality of hollowed-out areas; the chip is arranged in the hollowed-out area and fixedly connected with the substrate, the area of the hollowed-out area is larger than the bottom area of the chip, and the positive electrode and the negative electrode of the chip are correspondingly connected with the gold conductive layer through bonding wires respectively to form a loop.

According to some embodiments of the utility model, the metal layer is formed on the metal layer, and the metal layer is formed on the metal layer by a metal layer forming process.

According to some embodiments of the utility model, the gold conductive layer comprises a positive circuit layer and a negative circuit layer which are both arranged on the substrate, the positive circuit layer and the negative circuit layer are not connected with each other, the positive circuit layer is electrically connected with the positive electrode bonding pad through a conductive through hole, and the positive circuit layer is electrically connected with the positive electrode of the chip through a bonding wire; the negative circuit layer is electrically connected with the negative electrode pad through a conductive through hole, the negative circuit layer is electrically connected with the negative electrode of the chip through a bonding wire, and the positive circuit layer and the negative circuit layer are enclosed to form a plurality of hollowed-out areas.

According to some embodiments of the utility model, the number of the chips is plural, and the plural chips are arranged in series and/or parallel.

According to some embodiments of the utility model, the number of the chips is identical to the number of the hollowed-out areas, and the hollowed-out areas are symmetrically distributed.

According to some embodiments of the utility model, the package further comprises an encapsulation layer disposed on the upper surface of the substrate, and the encapsulation layer is connected with the substrate to seal the gold conductive layer, the chip and the bonding wires.

According to some embodiments of the utility model, the encapsulation layer is made of transparent silicone or epoxy material.

According to some embodiments of the utility model, the substrate is made of an inorganic nonmetallic insulating material.

The technical scheme of the utility model has the following advantages:

1. according to the novel LED packaging structure, the gold conductive layer is arranged on the substrate, the gold conductive layer forms the plurality of hollowed areas, the chip is arranged in the hollowed areas and fixedly connected with the substrate, and the light absorption is reduced by reducing the area of the gold conductive layer, so that the effect of improving the light efficiency is achieved.

2. According to the novel LED packaging structure provided by the utility model, the plurality of hollowed-out areas are arranged, so that the bonding area of the packaging layer and the gold conductive layer is reduced, the packaging layer can be connected with the substrate more, the bonding force of the packaging layer is improved, the probability that the packaging layer breaks away from the substrate due to low bonding property of the packaging layer and the gold conductive layer is reduced, and the packaging reliability of the LED can be improved.

3. According to the novel LED packaging structure provided by the utility model, the plurality of chips are respectively distributed in the plurality of hollowed-out areas, so that the driving current of a single chip is reduced on the basis of ensuring the same luminous flux or radiation flux, the junction temperature of the chip is reduced, and the light efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a gold conductive layer arrangement provided in some embodiments of the utility model;

FIG. 2 is a schematic illustration of an arrangement of positive and negative electrode pads provided in some embodiments of the utility model;

fig. 3 is a schematic diagram of a chip layout provided in some embodiments of the utility model.

Reference numerals illustrate: 1. a substrate; 2. a gold conductive layer; 3. a chip; 4. a positive electrode pad; 5. a negative electrode pad; 11. a conductive via; 21. a positive circuit layer; 22. a negative circuit layer; 23. and (5) a hollowed-out area.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

Referring to fig. 1 to 3, the present utility model proposes a novel LED package structure, comprising: a substrate 1, a gold conductive layer 2 and a chip 3; the gold conductive layer 2 is arranged on the substrate 1, and the gold conductive layer 2 is provided with a plurality of hollowed-out areas 23; the chip 3 is arranged in the hollowed-out area 23 and fixedly connected with the substrate 1, the area of the hollowed-out area 23 is larger than the bottom area of the chip 3, and the positive electrode and the negative electrode of the chip 3 are correspondingly connected with the gold conductive layer 2 through bonding wires to form a loop.

Specifically, by arranging the gold conductive layer 2 on the substrate 1, the gold conductive layer 2 encloses and forms a plurality of hollow areas 23, the chip 3 is arranged in the hollow areas 23 and fixedly connected with the substrate 1, and by arranging the hollow areas 23, the area of the gold conductive layer 2 is reduced, and further the absorption of light is reduced, so that the light efficiency of the LED is improved.

Through setting up a plurality of fretwork areas 23 to reduce the bonding area of encapsulation layer and golden conducting layer 2, improve the adhesion of encapsulation layer, reduce the cracked probability of bonding wire because of encapsulation layer separation base plate, can improve the encapsulation reliability of LED.

It can be understood that the gold conductive layer 2 is arranged on the substrate 1, so that the defect that the silver conductive layer generates light attenuation due to oxidation or vulcanization discoloration in the prior art can be avoided, specifically, when the silver conductive layer is adopted on the substrate 1, the light attenuation of the LED lamp beads is reduced to 13% under the condition of 85 ℃ and 85% RH, and when the gold conductive layer 2 is adopted on the substrate 1 under the same condition based on other packaging conditions, the light attenuation can be reduced to 5% under the same aging condition. On this basis, through setting up a plurality of fretwork region 23 on gold conducting layer 2, lay chip 3 in fretwork region 23, through reducing gold conducting layer 2's area, reduce the absorption to light, and then improve the reliability.

Referring to fig. 2, in some embodiments of the present utility model, the novel LED package structure further includes an anode pad 4 and a cathode pad 5, where the anode pad 4 and the cathode pad 5 are disposed on the lower surface of the substrate 1, the gold conductive layer 2 is disposed on the upper surface of the substrate 1, a plurality of conductive through holes 11 are disposed on the substrate 1, and a plurality of conductive through holes 11 adapted to conduct the gold conductive layer 2, the anode pad 4 and the cathode pad 5 are disposed in the substrate 1.

In some embodiments of the present utility model, the gold conductive layer 2 includes a positive circuit layer 21 and a negative circuit layer 22 both disposed on the substrate 1, the positive circuit layer 21 and the negative circuit layer 22 are not connected to each other, the positive circuit layer 21 is electrically connected to the positive electrode pad 4 through the conductive via 11, the positive circuit layer 21 is electrically connected to the positive electrode of the chip 3 through a bonding wire, the negative circuit layer 22 is electrically connected to the negative electrode pad 5 through the conductive via 11, the negative circuit layer 22 is electrically connected to the negative electrode of the chip 3 through a bonding wire, and the positive circuit layer 21 and the negative circuit layer 22 enclose a plurality of hollowed-out areas 23.

Specifically, the positive circuit layer 21 and the negative circuit layer 22 are not connected with each other, so that after the positive circuit layer 21 and the negative circuit layer 22 are respectively connected with the positive electrode pad 4 and the negative electrode pad 5 on the lower surface of the substrate 1, that is, the positive circuit layer 21 is electrically connected with the positive electrode pad 4, the negative circuit layer 22 is electrically connected with the negative electrode pad 5, the positive circuit layer 21 and the negative circuit layer 22 enclose to form a plurality of hollowed-out areas 23, the chip 3 is placed in the hollowed-out areas 23, the positive electrode and the negative electrode of the chip 3 are correspondingly connected with the positive circuit layer 21 and the negative circuit layer 22 through bonding wires, that is, the positive electrode of the chip 3 is electrically connected with the positive circuit layer 21 through bonding wires, and the negative electrode of the chip 3 is electrically connected with the negative circuit layer 22 through bonding wires, so as to form a current loop.

Referring to fig. 3, in some embodiments of the present utility model, the number of chips 3 is plural, and the plural chips 3 are arranged in series and/or parallel.

Specifically, the plurality of chips 3 are respectively arranged in the plurality of hollowed-out areas 23, so that the driving current of the single chip 3 is reduced on the basis of ensuring the same luminous flux or radiation flux, and the junction temperature of the chip 3 is reduced, and the light efficiency is improved. Specifically, the larger the number of chips 3 provided in the LED, the smaller the required supply current, and the smaller the number of chips 3, the larger the required supply current, when the luminous flux or the radiant flux is fixed. The smaller the current, the lower the junction temperature of the chip 3, which is beneficial to improving the light efficiency and prolonging the service life. In the utility model, the number of the arranged chips 3 is four, and in order to ensure the uniformity of the light source, the number of the four chips 3 is symmetrically distributed at the middle point of the substrate 1, and compared with one chip 3, when the number of the chips 3 is four, the light efficiency can be improved by more than 50 percent. It will be appreciated that the specific number of chips is not a limitation of the utility model. When a plurality of chips 3 are arranged, the chips 3 are connected in series, so that the closing and starting of the chips 3 can be controlled simultaneously, and the control operation of the LEDs is facilitated; the chips 3 are connected in parallel, so that when a single chip 3 is disconnected, the influence on the normal luminescence of the rest chips 3 can be avoided, and the reliability is improved.

In some embodiments of the present utility model, the number of chips 3 is identical to the number of hollowed-out areas 23, and the hollowed-out areas 23 are symmetrically distributed.

Specifically, the chips 3 are disposed in the hollow areas 23, the area of the gold conductive layer 2 is reduced by the arrangement of the hollow areas 23, so that light absorption is reduced, light efficiency is improved, and the number of the hollow areas 23 is equal to the number of the chips 3, so that each chip 3 can be disposed in a single hollow area 23. In some embodiments of the present utility model, the number of the hollowed-out areas 23 is four, and the four hollowed-out areas 23 are distributed in a grid shape, and at this time, the number of the chips 3 is four and arranged in the center of the hollowed-out areas 23. It should be understood that the number and shape of the hollowed-out areas 23 are not limiting of the utility model.

In some embodiments of the present utility model, the package layer is disposed on the upper surface of the substrate 1, and the package layer is connected to the substrate 1 to seal the gold conductive layer 2, the chip 3 and the bonding wires.

In some embodiments of the present utility model, the encapsulating layer is made of transparent silica gel or epoxy.

Specifically, the encapsulation layer can prevent oxidation and corrosion of air, water vapor or other pollutants to the circuit of the chip 3, so as to reduce the electrical performance and protect the surface of the chip 3, the gold conductive layer 2, the bonding wires and the like. In some embodiments of the present utility model, the material of the encapsulation layer is a high light transmittance optical material such as transparent silica gel, and the silica gel material and the gold conductive layer 2 are not high in adhesive bonding strength, so that the separation of the silica gel and the gold conductive layer 2 easily occurs to cause the phenomenon of breaking the bonding wires. In the utility model, the gold conductive layer 2 is hollowed out to form the hollowed-out area 23, so that the area of the gold conductive layer 2 is reduced, the bonding area of the packaging layer and the substrate 1 is increased, the bonding strength of the packaging layer is increased, the packaging layer is prevented from being separated, and the reliability is improved.

In some embodiments of the utility model, the substrate 1 is made of an inorganic nonmetallic insulating material.

Specifically, the substrate 1 is made of ceramic.

It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.

Claims (8)

1. The utility model provides a novel LED packaging structure which characterized in that includes:

a substrate (1);

the gold conductive layer (2), the gold conductive layer (2) is arranged on the upper surface of the substrate (1), and the gold conductive layer (2) is provided with a plurality of hollowed-out areas (23);

the chip (3), chip (3) are disposed in fretwork area (23) and with base plate (1) fixed connection, the area of fretwork area (23) is greater than the bottom area of chip (3), the positive and negative electrode of chip (3) respectively through the bonding wire with golden conducting layer (2) are connected in order to form the return circuit.

2. The novel LED packaging structure according to claim 1, further comprising an anode bonding pad (4) and a cathode bonding pad (5) which are both arranged on the lower surface of the substrate (1), wherein a plurality of conductive through holes (11) which are suitable for conducting the gold conductive layer (2), the anode bonding pad (4) and the cathode bonding pad (5) are arranged in the substrate (1).

3. The novel LED package structure according to claim 2, wherein the gold conductive layer (2) comprises a positive circuit layer (21) and a negative circuit layer (22) which are both arranged on the substrate (1), the positive circuit layer (21) and the negative circuit layer (22) are not connected with each other, the positive circuit layer (21) is electrically connected with the positive electrode pad (4) through the conductive through hole (11), the positive circuit layer (21) is electrically connected with the chip positive electrode through a bonding wire, the negative circuit layer (22) is electrically connected with the negative electrode pad (5) through the conductive through hole (11), the negative circuit layer (22) is electrically connected with the chip negative electrode through a bonding wire, and the positive circuit layer (21) and the negative circuit layer (22) enclose to form a plurality of hollowed-out areas (23).

4. A novel LED package structure according to claim 3, characterized in that the number of chips (3) is plural, and that a plurality of chips (3) are arranged in series and/or parallel.

5. The novel LED packaging structure according to claim 4, wherein the number of the chips (3) is identical to the number of the hollowed-out areas (23), and the hollowed-out areas (23) are symmetrically distributed.

6. The novel LED packaging structure according to claim 1, further comprising a packaging layer, wherein the packaging layer is arranged on the upper surface of the substrate (1), and the packaging layer is connected with the substrate (1) to seal the gold conductive layer (2), the chip (3) and the bonding wires.

7. The novel LED package structure of claim 6, wherein said encapsulation layer is made of transparent silicone or epoxy.

8. The novel LED package structure according to claim 1, characterized in that the substrate (1) is made of an inorganic non-metallic insulating material.

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