KR20100105388A - Method for fabricating light emitting diode divice and light emitting diode package and light emitting diode module and lamp device having the same - Google Patents

Method for fabricating light emitting diode divice and light emitting diode package and light emitting diode module and lamp device having the same Download PDF

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Publication number
KR20100105388A
KR20100105388A KR1020100020856A KR20100020856A KR20100105388A KR 20100105388 A KR20100105388 A KR 20100105388A KR 1020100020856 A KR1020100020856 A KR 1020100020856A KR 20100020856 A KR20100020856 A KR 20100020856A KR 20100105388 A KR20100105388 A KR 20100105388A
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KR
South Korea
Prior art keywords
emitting diode
light emitting
lower mold
chip
package
Prior art date
Application number
KR1020100020856A
Other languages
Korean (ko)
Inventor
허윤수
Original Assignee
(주)알텍테크놀로지스
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Priority to PCT/KR2010/001636 priority Critical patent/WO2010107239A2/en
Publication of KR20100105388A publication Critical patent/KR20100105388A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

PURPOSE: A method for fabricating a light emitting diode device and a light emitting diode package and a light emitting diode module and a lamp device having the same are provided to form a non-doomed shape molding unit or lens unit by using a molding having a certain shape. CONSTITUTION: A light-emitting diode package comprises a chip assembly and a molding unit(120). At least one light emitting diode chip is mounted in the chip assembly. The molding unit seals up the light emitting diode chip. At least one groove(121) is formed on the surface of the molding unit to disperse the light.

Description

Method for manufacturing light emitting diode device, light emitting diode package and light emitting diode module, and lighting fixture having same.

The present invention relates to a method of manufacturing a light emitting diode device, a light emitting diode package, a light emitting diode module, and a lighting fixture having the same. More specifically, a molding part or a lens part covering a light emitting diode chip is formed using a vacuum sealing method. The present invention relates to a method of manufacturing a light emitting diode device having a variety of light distribution structures by fabricating a dome shape, a light emitting diode package, a light emitting diode module, and a lighting fixture having the same.

In general, a light emitting diode (LED) is a kind of pn junction diode, and when a voltage is applied in a forward direction, a semiconductor using an electroluminescence effect is a phenomenon in which a mono-chromatic light is emitted. Element.

That is, when the forward voltage is applied, the electrons of the n-layer and the holes of the p-layer are combined to emit energy corresponding to the energy difference between the conduction band and the valence band, which is light. If it is emitted in the form of LED will be.

On the other hand, LED packaging is divided into a lamp type (Lamp type) and a surface-mounting device (SMD) packaging.

1 and 2 are views illustrating a general light emitting diode package. As shown in FIGS. 1 and 2, a general surface mount type LED package 10 may be formed on a base plate 12 and the base plate 12. At least two electrodes 13 and 14 spaced apart from each other are provided. The light emitting diode chip 11 is electrically connected to the electrodes 13 and 14 by a wire 15. In addition, a molding part 16 encapsulating the light emitting diode chip 11 and the wire 15 is formed. In this case, the molding part is generally formed in a dome shape. In this case, a casing 17 surrounding the molding part may be further provided.

3 is a perspective view showing a general light emitting diode module, and as shown in FIG. 3, the light emitting diode package 10 is installed to be electrically connected to a circuit formed on the printed circuit board 21 by soldering. . This is called the light emitting diode module 20. In this case, a lens 22 may be attached to the LED module 20 to adjust a directing angle of light emitted from the LED package 10 in a specific direction.

In this state, when the switch is operated in the "ON" state, the light emitting diode chip 11 emits light while current is applied from the anode to the cathode, and the light emitted from the light emitting diode chip 11 causes the lens 22 to operate. It is to illuminate the surroundings in a way that is irradiated outward.

Such a light emitting diode module can be used for a relatively long time compared to a conventional lighting lamp such as a fluorescent lamp or a halogen / incandescent lamp, has a very low power consumption, a very bright brightness, instantaneous lighting without safety, and excellent safety. In addition, since it can be produced in various colors, its application range is very wide, and it is becoming a light bulb to replace a conventional light bulb.

However, in the conventional light emitting diode module formed as described above, a lens made of poly methyl methacrylate (PMMA) material after mounting the light emitting diode package 10 and other components at a predetermined position on the printed circuit board 21 ( Since the 21 is installed in the light emitting diode package 10 by being installed or fixed by silicone resin, there is a high possibility that the light emitting diode package and the module may be damaged during the installation of the lens 21.

In particular, light sources such as halogen lamps, fluorescent lamps, incandescent lamps, etc., which are mainly used in the conventional lighting lamps, have a lot of power consumption, have limitations in color implementation, and have a short lifespan.

Accordingly, in recent years, a light emitting diode device is rapidly changing to a trend of replacing a light source used in the related art.

In particular, lighting lamps require various types of light distribution structures, but the conventional LED module displays the highest luminance value only in the vertical plane of the installation direction. There is a problem that the radiation angle control means is required, there is a problem that it is difficult to implement various types of light distribution (配 光).

According to the embodiment of the present invention, the molding part encapsulating the light emitting diode chip and the lens part encapsulating the light emitting diode package are formed in a non-dome shape instead of a traditional dome shape so that light is distributed in a direction determined according to the design. Provided are a light emitting diode package and a light emitting diode module having various light distribution structures, and lighting fixtures using the same.

Embodiments of the present invention provide a method of manufacturing a light emitting diode package and a light emitting diode module that can easily and quickly produce a light emitting diode package and a module having various light distribution using a vacuum sealing method.

A method of manufacturing a light emitting diode device according to an embodiment of the present invention includes the steps of: providing a chip assembly mounted with at least one LED chip; Inverting the chip assembly, mounting the upper mold to an upper mold, and placing the chip assembly in a first vacuum processor; Injecting a lower mold into the second vacuum processor and filling the molding resin into at least one resin filling portion formed in the lower mold; Injecting the lower mold into a first vacuum processor and placing the lower mold below the upper mold; Coupling the upper mold and the lower mold such that the molding resin encapsulates the light emitting diode chip of the chip assembly; Curing the molding resin to form a non-dom shaped molding in the chip assembly; Separating the chip assembly from the upper mold and the lower mold. In particular, after the step of separating the chip assembly includes a dicing step of cutting the chip assembly into at least one unit package.

In addition, a method of manufacturing a light emitting diode device according to another embodiment of the present invention includes providing a substrate assembly on which at least one light emitting diode package is mounted; Inverting and mounting the substrate assembly to an upper mold and feeding the first vacuum processor into the first vacuum processor; Injecting a lower mold into the second vacuum processor and filling the molding resin into at least one resin filling portion formed in the lower mold; Injecting the lower mold into a first vacuum processor and placing the lower mold below the upper mold; Coupling the upper mold and the lower mold such that the molding resin encapsulates the LED package of the substrate assembly; Curing the molding resin to form a non-dome lens portion in the substrate assembly; Separating the package assembly from the upper mold and the lower mold.

In the filling of the molding resin into the resin filling portion of the lower mold, the resin filling portion formed in the lower mold is characterized in that it has a non-dome shape in which the groove is formed.

The filling of the molding resin into the resin filling part of the lower mold is characterized in that the molding resin is filled by a printing method or a dispenser method.

The molding resin is characterized in that the light transmissive silicone resin or epoxy resin.

A light emitting diode package according to an embodiment of the present invention includes a chip assembly mounted with at least one light emitting diode chip; The light emitting diode chip is encapsulated, and grooves having a predetermined width are formed along a center line in a radial direction to disperse light on the surface, and the first transmission surface and the second transmission surface having different inclinations are formed on left and right sides of the groove portion. It is formed symmetrically with respect to the center portion, the front and rear ends of the groove portion includes a molding portion in which the third transmission surface having a predetermined width and inclination is formed to be inclined. In particular, the first transmission surface has a semi-circular or semi-elliptic shape, and the second transmission surface has a shape in which the width of the center is narrow and wider as the distance from the center to both sides is wider.

According to another embodiment of the present invention, a light emitting diode package includes: a chip assembly having at least one light emitting diode chip mounted thereon; The light emitting diode chip is encapsulated, and a plurality of groove portions formed in a radial direction so as to disperse light are provided at predetermined intervals to form a wave pattern.

The chip assembly includes a base plate; At least two electrodes spaced apart from each other on the base plate, characterized in that the light emitting diode chip is electrically connected to the electrode.

According to an embodiment of the present invention, a light emitting diode module includes: a substrate assembly having at least one light emitting diode package mounted thereon; At least one recess is formed to encapsulate the light emitting diode package and to disperse light on the surface, and at least one of the edges of the recess includes a lens portion having an opening having a lower height than other edges of the recess.

The substrate assembly may include a printed circuit board formed on a predetermined electrode pattern, and the light emitting diode package may be electrically connected to the electrode pattern.

According to an embodiment of the present invention, the molding part encapsulating the light emitting diode chip and the lens part encapsulating the light emitting diode package are manufactured in a non-dome shape instead of a traditional dome shape to form various light distribution structures. Therefore, the light generated from the light emitting diode chip can be distributed and irradiated in a direction determined according to the design.

Accordingly, it is possible to provide various types of light emitting diode modules and lighting fixtures having a light distribution structure desired by the consumer.

In addition, since the non-dom shaped molding part or the lens part is formed by a vacuum sealing method using a mold having a predetermined shape, a process of removing bubbles contained in the molding resin forming the molding part and the lens part separately and a process of mounting the lens are provided. As there is no application, it is possible to manufacture LED packages and modules easily and quickly, thereby reducing the production cost and improving the production yield.

1 is a cross-sectional view showing a typical light emitting diode package,
2 is a perspective view showing a typical light emitting diode package,
3 is a perspective view showing a general light emitting diode module,
4 is a cross-sectional view showing a light emitting diode package according to an embodiment of the present invention.
5 is a perspective view showing a light emitting diode package according to an embodiment of the present invention;
6 is a perspective view showing a light emitting diode package according to another embodiment of the present invention,
7 is a perspective view showing a light emitting diode module according to an embodiment of the present invention;
8A to 8H are views illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention.
9A to 9D are views illustrating a method of manufacturing a light emitting diode module according to an embodiment of the present invention.
10A is an experimental result of finding a light directivity angle for a conventional LED package,
10B is an experimental result of finding a light directivity angle for the LED package according to the embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

In the description of the present invention, the light emitting diode device is used to include both the light emitting diode package and the light emitting diode module.

Figure 4 is a cross-sectional view showing a light emitting diode package according to an embodiment of the present invention, Figure 5 is a perspective view showing a light emitting diode package according to an embodiment of the present invention, Figure 6 is a light emitting according to another embodiment of the present invention A perspective view showing a diode package.

As shown in FIGS. 4 and 5, a light emitting diode package according to an embodiment of the present invention includes a chip assembly 110 on which at least one light emitting diode chip 111 is mounted; And a molding part 120 encapsulating the light emitting diode chip 111 and having at least one groove part 121 for dispersing light on a surface thereof.

The chip assembly 110 includes a base plate 113 and the other of the first electrode 115 and the base plate 113 formed at one end of the base plate 113 so as to be spaced apart from each other in the base plate 113. A second electrode 117 is formed spaced apart from the first electrode 115 at a predetermined interval.

The first electrode 115 has an upper surface 115a formed on an upper portion of the base plate 113, that is, a portion where the LED chip 111 is mounted, and a lower portion formed on the lower portion of the base plate 113. Face 115b. In addition, the second electrode 117 is also formed on an upper surface 117a formed at an upper portion of the base plate 113, that is, a portion where the LED chip 111 is mounted, and a lower portion of the base plate 113. It includes a lower surface 117b. In this case, the upper surfaces 115a and 117a and the lower surfaces 115b and 117b of the first electrode 115 and the second electrode 117 are connected to the via hole 115c formed through the base plate 113. Connection via 117c). In addition, the upper surface 115a of the first electrode 115 and the upper surface 117a of the second electrode 117 may have high reflection efficiency in order to increase the reflection efficiency of the light irradiated from the light emitting diode chip 111. Materials may include silver (Ag), for example. In addition, the lower surface 115b of the first electrode 115 and the lower surface 117b of the second electrode 117 are soldered portions, and in order to improve solderability, gold (Au) or tin ( Sn) can be formed. The first electrode 115 and the second electrode 117 are not limited to the above-described configuration, and the upper surfaces 115a and 117a and the lower surface 115b, of the first electrode 115 and the second electrode 117 are not limited thereto. 117b) can be connected and implemented in any way. For example, the upper surfaces 115a and 117a and the lower surfaces 115b and 117b of the first electrode 115 and the second electrode 117 do not form via holes in the base plate 113, but the base plate 113. The connection portion may be formed along the outer circumferential surface thereof.

The light emitting diode chip 111 is provided on an upper surface 115a of the first electrode 115 or an upper surface of the base plate 113, and an upper surface of the first electrode 115 through the wire 119. And a top surface 117a of the second electrode 117. Meanwhile, the LED chip 111 is mounted on the top surface 115a of the first electrode 115 and connected to the top surface 117a of the second electrode 117 through the wire 119. Can be.

The molding part 120 is a means for encapsulating and protecting the LED chip 111 and the wire 119, and is formed on an upper surface of the base plate 113. In this case, at least one recess 121 is formed on the surface of the molding part 120 to adjust or disperse the directivity angle of the light emitted from the LED chip 111. The surface shape of the molding part 120 including the groove part 121 and the groove part 121 may be variously designed and implemented to adjust or disperse the directivity angle of light. For example, in the present embodiment, the groove portion 121 having a predetermined width is formed along the center line of the molding part 120 in the radial direction, and the first transmission surface 122 having different inclinations on the left and right sides of the groove portion 121. ) And the second transmission surface 123 are formed to be symmetrical with respect to the groove portion 121, and the third transmission surface 124 having a predetermined width and inclination is formed at both front and rear ends of the groove portion 121. It is formed to be inclined. In this case, the first transmission surface 122 has a substantially semi-circle or semi-ellipse shape, and the second transmission surface 123 has a shape in which the width of the center is narrow and wider as it moves toward both sides from the center. In particular, it is preferable that the first transmission surface 122 and the second transmission surface 123 have opposite slopes.

In addition, as shown in FIG. 6, the molding part 130 may be provided with a plurality of recesses 131 formed in a radial direction at a predetermined interval in another embodiment to form a wave pattern.

As such, the shape of the molding parts 120 and 130 is formed in a non-dome shape rather than a conventional dome shape, and precisely, a non-dome shape having recesses 121 and 131, so that light generated from the LED chip 111 is not concentrated in one direction. Instead, it can be dispersed to form various light distribution structures desired by the consumer.

In this case, the molding resin forming the molding parts 120 and 130 may have a relatively high hardness and be formed of a transparent silicone resin or an epoxy resin. However, the present invention is not limited thereto, and any material may be used as long as the resin is transparent enough to transmit light according to the use of the LED package 100 and may be formed on the base plate 113 in a vacuum sealing manner. In addition, various kinds of phosphors (not shown) may be mixed in order to convert various wavelengths of light emitted from the light emitting diode chip 111 to realize various colors.

A casing 118 may be further formed around the molding parts 120 and 130 to guide the formation of the molding parts 120 and 130.

The casing 118 is formed on the upper surface of the base plate 113 and has a shape surrounding the outer shell of the molding parts 120 and 130 so that the molding parts 120 and 130 can maintain a non-dome shape smoothly. Of course, the casing 118 is not limited thereto, and may be variously changed according to the shapes of the molding parts 120 and 130.

Next, a light emitting diode module according to an embodiment of the present invention will be described with reference to FIG. 7.

As shown in FIG. 7, the LED module 200 according to the exemplary embodiment of the present invention encapsulates the substrate assembly 210 on which the at least one LED package 100 is mounted, and the LED package 100. The lens unit 220 includes at least one recess 221 for dispersing light on the surface.

The light emitting diode package 100 may use the above-described light emitting diode package 100 as it is. Accordingly, duplicate description will be omitted. However, the shape of the molding part 120 of the LED package 100 is not limited to the non-dome shape having the recess 221 shown in the above-described embodiment, and may have a conventional dome shape.

The substrate assembly 210 includes a printed circuit board 211 in which a predetermined electrode pattern for electrically connecting the LED package 100 is formed. Thus, the LED package 100 is mounted on the printed circuit board 211 and is connected to receive power from the outside.

The lens unit 220 has a means for adjusting or dispersing a directing angle of light generated in the light emitting diode package 100, and further includes a means for encapsulating and protecting the light emitting diode package 100. In this case, at least one recess 221 is formed on the surface of the lens unit 220 to adjust or disperse a directing angle of light emitted from the LED package 100. For example, it has a circular recess 221 and a protrusion 223 is formed at the center of the recess 221, and at least one point of the edge of the recess 221 is higher than another edge of the recess 221. Lower openings 225 are formed. Thus, the directivity of the light emitted from the light emitting diode package 100 is effectively dispersed. Of course, the shape of the lens unit is not limited thereto, and the lens unit 220 has a surface shape of the lens unit including the recess 221 and the recess 221 like the molding unit 120 of the above-described embodiment. Various designs and implementations may be implemented such that the orientation angle is adjusted or distributed. In addition, the molding resin for forming the lens unit 220 may be formed of a relatively high hardness, transparent or semi-transparent silicone resin or epoxy resin. However, the present invention is not limited thereto, and any material may be used as long as the resin is transparent enough to transmit light according to the use of the light emitting diode module 200 and may be formed on the printed circuit board 211 in a vacuum sealing manner. . In addition, various kinds of phosphors (not shown) may be mixed in order to convert various wavelengths of light emitted from the light emitting diode package 100 to implement various colors.

Next, a method of manufacturing a light emitting diode package according to an embodiment of the present invention will be described with reference to FIGS. 8A to 8H.

8A to 8I are views illustrating a method of manufacturing a light emitting diode package according to an embodiment of the present invention, and as shown in the drawing, a method of manufacturing a light emitting diode package according to an embodiment of the present invention is as follows. .

First, an apparatus for manufacturing a light emitting diode package according to an embodiment of the present invention by a vacuum sealing method will be described. In this embodiment, a method of supplying a molding resin by a printing method of the vacuum sealing method will be described as an example.

The vacuum seal facility includes at least two vacuum processors 300,400. Thus, in the first vacuum processor 300, the upper mold 500 to which the chip assembly 110 is fixed and the lower mold 600 filled with the molding resin 120a are combined, and in the second vacuum processor 400, the lower mold 600 is combined. A process of filling the mold 600 with the molding resin 120a is performed. Accordingly, the lower mold 600 is formed with a resin filling part 610 having a non-dome shape in which the recess 121 is filled with the molding resin 120a. In addition, a squeegee for constantly injecting the mask 410 and the molding resin 120a having a predetermined pattern corresponding to the resin filling part 610 into the second vacuum processor 400 in the pattern of the mask 410. 420 is provided. In addition, the first vacuum processor 300 is provided with an arm 310 for mounting and transferring the upper mold 500 for fixing the chip assembly 110. The first vacuum processor 300 and the second vacuum processor 400 are means such as a housing that separates the outside from the inside, and any means may be used as long as the means can form the inside in a vacuum environment.

In order to manufacture a light emitting diode package using the above-mentioned vacuum sealing facility, first, a chip assembly 110 is prepared. The chip assembly 110 is provided by mounting at least one LED chip on a base plate. The chip assembly thus prepared is fixed to the upper mold 500 as shown in FIG. 8A and then mounted to the arm 310 of the first vacuum processor 300.

As shown in FIG. 8B, the lower mold 600 is introduced into the second vacuum processor 400, and then the molding resin 120a is filled in the resin filling part 610 of the lower mold 600. In this embodiment, the molding resin 120a is filled using a printing method. Accordingly, the mask 410 is approached to the upper portion of the lower mold 600, and the resin filling part 610 of the lower mold 600 is formed by using the squeegee 420 on the upper surface of the mask 410. Fill in. Of course, the method of filling the molding resin 120a in the resin filling part 610 is not limited to the printing method, and the molding resin 120a may be filled in the resin filling part 610 in the second vacuum processor 400. Various methods may be applied. For example, a dispenser method for filling molding resin into a resin filling part using a dispenser may be used.

Then, as shown in FIG. 8C, the lower mold 600 is maintained in the second vacuum processor 400 for a predetermined time while the second vacuum processor 400 is decompressed to a vacuum state. Then, bubbles included in the molding resin 120a are discharged from the inside of the molding resin 120a by the pressure difference between the inside of the second vacuum processor 400 and the molding resin 120a. Therefore, a separate process for removing bubbles from the molding resin 120a may be omitted.

When the molding resin 120a is filled in the resin filling part 610 of the lower mold 600, the lower mold 600 is transferred to the first vacuum processor 300 as shown in FIG. 8D.

As shown in FIG. 8E, the lower mold 600 is placed in the first vacuum processor 300 to be positioned below the upper mold 500.

Then, the arm 310 is lowered to couple the upper mold 500 to which the chip assembly 110 is fixed to the lower mold 600. Then, the LED chip 111 of the chip assembly 110 is encapsulated by the molding resin 120a filled in the resin filling part 610 of the lower mold 600.

In addition, a predetermined time, preferably a time that the molding resin 120a is sufficiently cured in a state in which the lower mold 600 and the upper mold 500 are combined, forms a non-dom shaped molding part on the chip assembly 110. Form 120. In this case, the shape of the molding part 120 to be formed is determined by the shape of the resin filling part 610 formed in the lower mold 600. Hardening of the molding part 120 may be performed at room temperature, but is not limited thereto. The lower mold 600 and the upper mold 500 may be formed in a separate dryer 700 heated to a predetermined temperature as illustrated in FIG. 8F. In a combined state, the molding part 120 may be preferably cured.

When the curing of the molding part 120 is sufficiently made, as shown in FIG. 8G, the chip assembly 110 in which the molding part 120 is formed is separated from the upper mold 500 and the lower mold 600.

In addition, the chip assembly 110 in which the molding part 120 is formed may further include a dicing step of cutting the at least one unit light emitting diode package 100 as shown in FIG. 8H.

As described above, the molding part 120 having a specific shape may be easily and quickly manufactured by a vacuum sealing method and a mold press method.

Next, a method of manufacturing a light emitting diode module according to an embodiment of the present invention will be described with reference to the drawings.

9A to 9D are views illustrating a method of manufacturing a light emitting diode module according to an embodiment of the present invention.

The manufacturing method of the LED module is similarly applied to the vacuum sealing method and the mold press method used in the above-described method of manufacturing the LED package. Accordingly, duplicate description will be omitted or simplified. However, the shape of the molding part 120 of the LED package 100 is not limited to the non-dome shape having the recess 121 shown in the above-described embodiment, and may have a conventional dome shape.

In the method of manufacturing a light emitting diode module according to an embodiment of the present invention, first, as shown in FIG. 9A, a substrate assembly 210 on which at least one light emitting diode package 100 is mounted is prepared, and then the substrate assembly 210 is provided. ) Is mounted on the upper mold 500 and mounted on the arm 310 provided in the first vacuum processor 300. In this case, the LED package 100 mounted on the substrate assembly 210 uses a domed molding part 120 formed therein. Of course, the present invention is not limited thereto, and the molding part 120 formed in various ways may be applied according to a user's intention.

Then, the lower mold 600 is introduced into the second vacuum processor 400, and the molding resin 220a is filled in at least one resin filling part 610 formed in the lower mold 600. In this case, the filling of the molding resin 220a may be a printing method or a dispenser method.

Next, as shown in FIG. 9B, the lower mold 600 is placed in the first vacuum processor 300 to be positioned below the upper mold 500, and the molding resin 220a may be disposed on the substrate assembly ( The upper mold 500 and the lower mold 600 are combined to encapsulate the LED package 100 of 210. Then, the LED package 100 of the substrate assembly 210 is sealed by the molding resin 220a filled in the resin filling part 610 of the lower mold 600.

In addition, a predetermined time, preferably a time when the molding resin 220a is sufficiently cured while the lower mold 600 and the upper mold 500 are combined, passes through the non-dome lens part of the substrate assembly 210. To form 220. The shape of the lens unit 220 formed at this time is determined by the shape of the resin filling unit 610 formed in the lower mold 600. Hardening of the lens unit 220 may be performed at room temperature, but is not limited thereto. The lower mold 600 and the upper mold 500 may be formed in a separate dryer 700 heated to a predetermined temperature as shown in FIG. 9C. In the combined state, the lens unit 220 may be preferably cured.

When the curing of the lens unit 220 is sufficiently made, as shown in FIG. 9D, the substrate assembly 210 in which the lens unit 220 is formed is separated from the upper mold 500 and the lower mold 600 to form a light emitting diode module ( Complete 200).

Next, the light directing angle of the light emitting diode package according to the exemplary embodiment of the present invention is compared by comparing the light directing angle of the conventional LED package and the light emitting diode package according to the exemplary embodiment of the present invention.

FIG. 10A is an experimental result of finding a light directivity angle with respect to a conventional LED package, and FIG. 10B is a test result of finding a light directivity angle with respect to the LED package according to an embodiment of the present invention.

As can be seen in FIG. 10A, a light emitting diode package having a conventional domed molding part is uniformly irradiated with a constant light directing angle, and as shown in FIG. 10B, a non-dome type according to an embodiment of the present invention. It can be seen that the LED package having a molding part is irradiated with light as much as desired by the user by dispersing light and desired light direction. Therefore, it can be seen that the shape of the non-dome-shaped molding part can be modified to implement a desired light directing angle.

The light emitting diode package and the light emitting diode module manufactured as described above are manufactured in package and module units, respectively, and applied to various fields. For example, a light emitting diode package having a non-dom shaped molding part manufactured according to the present invention may be mounted on a printed circuit board to form a light emitting diode module. It is used as a light source. In addition, at least one light emitting diode module having a non-dome lens part manufactured according to the present invention is arranged and used as a light source of a lighting fixture.

Although the light emitting diode package and the light emitting diode module illustrated in the present invention have been described as an example of being manufactured by surface-mounted packaging, the present invention is not limited thereto. will be. For example, it may be applied to lamp type LED packaging.

Although described above with reference to the drawings and embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit of the invention described in the claims below. I can understand.

100: light emitting diode package 110: chip assembly
111: LED chip 113: base plate
115,117: electrode 118: casing
119: wire 120: molding part
121: groove 200: light emitting diode module
210: substrate assembly 211: printed circuit board
220: lens portion 221: groove portion

Claims (14)

Providing a chip assembly mounted with at least one light emitting diode chip;
Inverting the chip assembly, mounting the upper mold to an upper mold, and placing the chip assembly in a first vacuum processor;
Injecting a lower mold into the second vacuum processor and filling the molding resin into at least one resin filling portion formed in the lower mold;
Injecting the lower mold into a first vacuum processor and placing the lower mold below the upper mold;
Coupling the upper mold and the lower mold such that the molding resin encapsulates the light emitting diode chip of the chip assembly;
Curing the molding resin to form a non-dom shaped molding in the chip assembly;
And separating the chip assembly from the upper mold and the lower mold.
The method according to claim 1,
After removing the chip assembly
And dicing the chip assembly into at least one unit package.
Providing a substrate assembly on which at least one light emitting diode package is mounted;
Inverting and mounting the substrate assembly to an upper mold and feeding the first vacuum processor into the first vacuum processor;
Injecting a lower mold into the second vacuum processor and filling the molding resin into at least one resin filling portion formed in the lower mold;
Injecting the lower mold into a first vacuum processor and placing the lower mold below the upper mold;
Coupling the upper mold and the lower mold such that the molding resin encapsulates the LED package of the substrate assembly;
Curing the molding resin to form a non-dome lens portion in the substrate assembly;
And separating a package assembly from the upper mold and the lower mold.
The method according to claim 1 or 3,
In the filling of the molding resin to the resin filling portion of the lower mold,
The resin filling part formed in the lower mold has a non-dome-shaped shape in which the recess is formed.
The method according to claim 1 or 3,
Filling the molding resin to the resin filling portion of the lower mold
A method of manufacturing a light emitting diode device in which a molding resin is filled by a printing method or a dispenser method.
The method according to claim 1 or 3,
The molding resin is a light-transmitting silicone resin or an epoxy resin manufacturing method.
A chip assembly mounted with at least one light emitting diode chip;
The light emitting diode chip is encapsulated, and grooves having a predetermined width are formed along a center line in a radial direction to disperse light on the surface, and the first transmission surface and the second transmission surface having different inclinations are formed on left and right sides of the groove portion. A light emitting diode package including a molding part formed to be symmetrical with respect to each other, and having a third transmission surface having a predetermined width and inclination formed on both front and rear ends of the recessed portion.
The method according to claim 7,
The first transmission surface 122 has a semi-circle or semi-ellipse shape,
The second transmissive surface has a shape in which the width of the center is narrow and wider as the distance from the center to both sides is wider.
A chip assembly mounted with at least one light emitting diode chip;
The light emitting diode package encapsulating the light emitting diode chip, the surface of the light emitting diode package is provided with a plurality of grooves formed in a radial direction to disperse light at predetermined intervals to form a wave pattern.
The method of claim 7 or 9, wherein the chip assembly
A base plate;
At least two electrodes spaced apart from each other on the base plate,
A light emitting diode package in which the light emitting diode chip is electrically connected to the electrode.
A substrate assembly on which at least one light emitting diode package is mounted;
At least one recess is formed to encapsulate the light emitting diode package and to disperse light on the surface, and at least one point of the edge of the recess is a light emitting diode module including a lens portion having an opening having a lower height than other edges of the recess. .
The method of claim 11, wherein the substrate assembly is
A printed circuit board formed on a predetermined electrode pattern,
The light emitting diode module of the light emitting diode package is electrically connected to the electrode pattern.
Lighting fixture provided with at least one light emitting diode module mounted with the light emitting diode device manufactured by claim 1.
Lighting fixture provided with at least one light emitting diode device manufactured by claim 3.
KR1020100020856A 2009-03-18 2010-03-09 Method for fabricating light emitting diode divice and light emitting diode package and light emitting diode module and lamp device having the same KR20100105388A (en)

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PCT/KR2010/001636 WO2010107239A2 (en) 2009-03-18 2010-03-17 Method for manufacturing a light-emitting diode device, light-emitting diode package, light-emitting diode module, and lighting device comprising same

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KR20090023129 2009-03-18

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WO2012118828A3 (en) * 2011-02-28 2013-02-07 Cooper Technologies Company Method and system for managing light from a light emitting diode
US8905597B2 (en) 2006-02-27 2014-12-09 Illumination Management Solutions, Inc. LED device for wide beam generation
US8926114B2 (en) 2010-04-30 2015-01-06 Samsung Electronics Co., Ltd. Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus
US9140430B2 (en) 2011-02-28 2015-09-22 Cooper Technologies Company Method and system for managing light from a light emitting diode
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US9388949B2 (en) 2006-02-27 2016-07-12 Illumination Management Solutions, Inc. LED device for wide beam generation
US9297520B2 (en) 2006-02-27 2016-03-29 Illumination Management Solutions, Inc. LED device for wide beam generation
US8905597B2 (en) 2006-02-27 2014-12-09 Illumination Management Solutions, Inc. LED device for wide beam generation
US9297517B2 (en) 2008-08-14 2016-03-29 Cooper Technologies Company LED devices for offset wide beam generation
US10222030B2 (en) 2008-08-14 2019-03-05 Cooper Technologies Company LED devices for offset wide beam generation
US10400996B2 (en) 2008-08-14 2019-09-03 Eaton Intelligent Power Limited LED devices for offset wide beam generation
US10976027B2 (en) 2008-08-14 2021-04-13 Signify Holding B.V. LED devices for offset wide beam generation
US8926114B2 (en) 2010-04-30 2015-01-06 Samsung Electronics Co., Ltd. Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus
US9052086B2 (en) 2011-02-28 2015-06-09 Cooper Technologies Company Method and system for managing light from a light emitting diode
US9140430B2 (en) 2011-02-28 2015-09-22 Cooper Technologies Company Method and system for managing light from a light emitting diode
US9435510B2 (en) 2011-02-28 2016-09-06 Cooper Technologies Company Method and system for managing light from a light emitting diode
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US9574746B2 (en) 2011-02-28 2017-02-21 Cooper Technologies Company Method and system for managing light from a light emitting diode
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US9200765B1 (en) 2012-11-20 2015-12-01 Cooper Technologies Company Method and system for redirecting light emitted from a light emitting diode

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