CN215577967U - Module type alloy sheet power resistor - Google Patents

Abstract

The application discloses module type alloy piece power resistor includes: resistance cards; when the module type alloy piece power resistor is installed on the installation surface in a working environment, the insulating bottom plate is used for isolating the resistor pieces from the installation surface. The module type alloy sheet power resistor can avoid the failure of the insulating part of the resistor caused by the partial discharge phenomenon.

Description

Module type alloy sheet power resistor

Technical Field

The application relates to the field of resistors, in particular to a module type alloy sheet power resistor.

Background

The partial discharge phenomenon mainly refers to the discharge of high-voltage electrical equipment in a local range under the action of a strong enough electric field, and the discharge is limited by only causing the insulation local short (circuit bridge) connection between conductors without forming a conductive channel. Due to the fact that the insulation body or the high-voltage conductor is provided with the needle-point-shaped protrusions, the electric field is not uniform, the dielectric medium is not uniform, air bubbles and impurities exist, and the like, the electric field strength of the local area of the insulation body reaches the breakdown field strength. Each time, the local discharge has some influence on an insulating medium, the slight local discharge has small influence on the insulation of the power equipment, and the reduction of the insulation strength is slow; and strong partial discharge causes a rapid decrease in the dielectric strength. This is an important factor in causing insulation damage of high-voltage electric power equipment. In some alloy resistors, the alloy is used as the material of the resistor, so that the resistor can bear large pulse load. However, since the resistor is in a strong electric field, partial discharge is easily generated between the alloy material in the resistor and the insulating portion of the resistor, and the resistor is subjected to partial discharge for a long time, which causes insulation failure and ultimately breakdown.

SUMMERY OF THE UTILITY MODEL

The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a module type alloy sheet power resistor which can avoid the failure of the insulation part of the resistor caused by the partial discharge phenomenon.

The module type alloy sheet power resistor according to the embodiment of the application comprises: resistance cards; the resistor disc is arranged on the insulating bottom plate and is abutted to the conductive material on one side face of the insulating bottom plate, and the insulating bottom plate is used for bearing the resistor disc.

The module type alloy sheet power resistor according to the embodiment of the application has at least the following beneficial effects: the resistance card and the conductive material are connected in parallel through the conductive material coated on the side face, close to the resistance card, of the insulating bottom plate, at the moment, the resistance card is abutted to the conductive material to form electric connection, all electrified parts of the resistance card are attached to the conductive material, partial discharge of the part with the uneven surface of the resistance card is avoided, the distance between the conductive material and the insulating bottom plate is smaller, and the partial discharge is generated between the conductive material and the insulating bottom plate. Meanwhile, as the conductive material is coated on the insulating bottom plate, the conductive material can be coated on the protruding points on the surface of the insulating bottom plate or fill the surface defects of the insulating bottom plate, so that the objective conditions generated by partial discharge are greatly reduced, and the purpose of avoiding the insulation failure of the resistor is achieved; and through the conductive material coated on the side surface of the insulating base plate far away from the resistor disc, the conductive material can be used for eliminating the projection or defect which can cause partial discharge on the insulating base plate, so that the partial discharge can only exist on the mounting surface of the conductive material and the resistor, and the purpose of protecting the insulating base plate can be achieved.

According to some embodiments of the application, the electrically conductive material is a high-resistance paste.

According to some embodiments of the application, the area of the conductive material is larger than the area of the resistive patch.

According to some embodiments of the application, the resistor disc is located between the insulating cover plate and the insulating bottom plate.

According to some embodiments of the application, insulating heat-conducting glue is filled between the insulating cover plate and the resistor disc and between the resistor disc and the insulating bottom plate.

According to some embodiments of the application, the resistor disc further comprises two pins, and the two pins are respectively and electrically connected with two ends of the resistor disc.

According to some embodiments of this application, still include the inner shell, the inner shell is equipped with first chamber of holding, and the inner shell is equipped with opening and pin hole, and the resistance card is located first intracavity of holding, and insulating bottom plate inlays and locates the opening and be used for the shutoff first chamber of holding, and the pin hole is worn to locate by the pin.

According to some embodiments of the application, still include the shell, the shell is equipped with the second and holds the chamber, and the inner shell inlays to be located the second and holds the intracavity, and inner shell and second hold and be provided with a plurality of buffering clearances between the chamber.

According to some embodiments of the application, the first containing cavity is filled with insulating heat-conducting glue.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a module-type alloy sheet power resistor according to an embodiment of the present disclosure;

FIG. 2 is an exploded view of the modular alloy sheet power resistor shown in FIG. 1;

FIG. 3 is an exploded view from another perspective of the modular alloy sheet power resistor shown in FIG. 1;

fig. 4 is a schematic view of a module type alloy sheet power resistor shown in fig. 1 from yet another perspective.

Reference numerals:

the resistor disc 100, the insulating base plate 200, the conductive material 210, the insulating cover plate 300, the pin 400, the inner shell 500, the outer shell 600 and the buffer gap 610.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.

In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and larger, smaller, larger, etc. are understood as excluding the present number, and larger, smaller, inner, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.

Referring to fig. 1 and 2, a module type alloy sheet power resistor according to an embodiment of the present application includes: a resistor sheet 100; the insulating bottom plate 200, the opposite both sides of insulating bottom plate 200 are all coated with conducting material 210, and resistance card 100 is located on insulating bottom plate 200, and resistance card 100 and the conducting material 210 of one of them side of insulating bottom plate 200 butt, and insulating bottom plate 200 is used for bearing resistance card 100.

The module type alloy sheet power resistor comprises a resistor sheet 100 and an insulating bottom plate 200. The resistor sheet 100 is placed on the insulating substrate 200, and when the module type alloy sheet power resistor is used, the module type alloy sheet power resistor needs to be mounted on an object surface in an external environment, wherein the object surface is a mounting surface. At this moment, the insulating bottom plate 200 abuts against the mounting surface, the insulating bottom plate 200 plays a role in separating the resistor disc 100 from the mounting surface, heat generated when the resistor disc 100 bears pulse load is conducted to the mounting surface through the insulating bottom plate 200, and the large area of the insulating bottom plate 200 can provide good heat dissipation capacity for the resistor disc 100, so that the resistor disc can bear large load, and the heat can be dissipated timely to avoid burning of the resistor.

The module type alloy sheet power resistor according to the embodiment of the application has at least the following beneficial effects: by the conductive material 210 coated on the side of the insulating base plate 200 close to the resistive sheet 100, a parallel connection is formed between the resistive sheet 100 and this conductive material 210, and at this time a partial discharge is generated between this conductive material 210 and the insulating base plate 200 due to the electrical connection between the resistive sheet 100 and this conductive material 210, and the distance between this conductive material 210 and the insulating base plate 200 is smaller. Meanwhile, as the conductive material 210 is coated on the insulating base plate 200, the conductive material 210 can coat protruding points on the surface of the insulating base plate 200 or fill surface defects of the insulating base plate 200, and simultaneously, the defects on the resistance card 100 are eliminated, so that objective conditions generated by partial discharge are greatly reduced, and the purpose of avoiding insulation failure of the resistor is achieved; also, since the resistor is in a working environment with an extremely high electric field, the insulating base plate 200 and the mounting surface of the resistor are also in this environment, and there is also a gap, such as a protrusion or a defect, between the insulating base plate 200 and the mounting surface of the resistor, there is also an objective condition for partial discharge between the insulating base plate 200 and the mounting surface of the resistor. Through the conductive material 210 coated on the side of the insulating base plate 200 far from the resistor disc 100, the conductive material 210 can be used to eliminate the protrusion or defect on the insulating base plate 200, which can cause partial discharge, so that the partial discharge can only exist on the mounting surface of the conductive material 210 and the resistor, and the purpose of protecting the insulating base plate 200 can be achieved.

According to some embodiments of the present application, the conductive material 210 is a high-resistance paste. The conductive material 210 formed by the high resistance paste has a resistance much greater than that of the resistive sheet 100. Since the conductive material on the side of the insulating substrate 200 close to the resistor disc 100 is connected in parallel with the resistor disc 100, that is, the high-resistance paste is connected in parallel with the resistor disc 100, according to the calculation formula of the resistance values of the two resistors connected in parallel, the resistance value of the resistor connected in parallel is close to the resistance value of the resistor with a small resistance value of the two resistors. The use of a high resistance paste as the conductive material 210 has the advantage of reducing partial discharge while causing little change in the resistance of the resistor.

Referring to fig. 2, according to some embodiments of the present application, the area of the conductive material 210 is greater than the area of the resistive sheet 100. The conductive material 210 has an area larger than that of the resistor sheet 100, so that the resistor sheet 100 can be completely isolated from the insulating base plate 200 by the conductive material 210, and a gap capable of generating partial discharge between the resistor sheet 100 and the insulating base plate 200 is avoided.

Referring to fig. 2, according to some embodiments of the present application, an insulating cover plate 300 is further included, and the resistor disc 100 is located between the insulating cover plate 300 and the insulating base plate 200. The insulating cover plate 300 is provided on the resistive sheet 100, and can protect the resistive sheet 100. Meanwhile, the insulating cover 300 and the insulating base plate 200 completely clamp the resistor disc 100, so that the resistor disc 100 is completely attached to the insulating cover 300 and the insulating base plate 200, the heat conduction efficiency of the resistor disc 100, the insulating cover 300 and the insulating base plate 200 is improved, and the resistor has better heat dissipation performance. According to some embodiments of the present application, insulating thermal paste is filled between the insulating cover plate 300 and the resistor sheet 100, and between the resistor sheet 100 and the insulating base plate 200. The gaps among the insulating cover plate 300, the resistor disc 100 and the insulating base plate 200 are filled with insulating heat-conducting glue, so that the generation condition of partial discharge can be eliminated, the phenomenon of breakdown in the resistor can be avoided, and the purpose of protecting the internal structure of the resistor is further achieved.

Referring to fig. 3, according to some embodiments of the present application, the resistor sheet 100 further includes two pins 400, and the two pins 400 are electrically connected to two ends of the resistor sheet 100. The pin 400 is arranged, and the pin 400 is electrically connected with two ends of the resistor disc 100, which may be two points which are farthest away from each other on the resistor disc 100, so that the resistance value of the resistor is maximized, and the resistor can bear larger pulse load.

Referring to fig. 2 and 3, according to some embodiments of the present application, the resistor chip further includes an inner case 500, the inner case 500 is provided with a first accommodating cavity, the inner case 500 is provided with an opening and a pin hole, the resistor chip 100 is disposed in the first accommodating cavity, the insulating base plate 200 is embedded in the opening to block the first accommodating cavity, and the pin 400 is inserted into the pin hole. The advantage of providing the inner case 500 is that it enables the resistive chip 100 to be located inside the first receiving cavity, and at the same time, the insulating bottom plate 200 can be used to seal the opening of the inner case 500, so that the resistive chip 100 is in a sealed environment. In this way, the resistive sheet 100 can have dust-proof and water-proof performance. Referring to fig. 2 and 3, according to some embodiments of the present application, the case 600 is further included, the case 600 is provided with a second receiving cavity, and the inner case 500 is embedded in the second receiving cavity.

Further, an elastic sheet bent upward is further disposed in the outer casing 600, and the elastic sheet is located between the inner casing 500 and the outer casing 600. The arrangement of the elastic sheet can ensure that the resistor mechanism is uniformly attached to the heat dissipation surface in the use process, so that the resistor is fast in heat dissipation and not easy to damage.

According to some embodiments of the application, the first containing cavity is filled with insulating heat-conducting glue. The advantage of filling insulating heat-conducting glue in the first accommodating cavity is that the resistor disc 100 can be located in a better sealed space, and is prevented from being influenced by the outside.

Referring to fig. 1 to 4, a module type alloy power resistor according to an embodiment of the present application is described in detail as a specific embodiment. It is to be understood that the following description is only exemplary, and not a specific limitation of the application.

The module type alloy power resistor includes a resistor disc 100, an insulating base plate 200, an insulating cover plate 300, pins 400, an inner case 500, and an outer case 600. The insulating bottom plate 200 ring and the insulating cover plate 300 are made of ceramic materials, so that the insulating property of the resistor is improved. The resistor disc 100 is arranged between the insulating bottom plate 200 and the insulating cover plate 300, the side, close to the resistor disc 100, of the insulating bottom plate 200 is coated with the conductive material 210, the side, far away from the resistor disc 100, of the insulating bottom plate 200 is also coated with the conductive material 210, and the conductive material 210 is high-resistance paste. Insulating heat-conducting glue is filled among the resistor disc 100, the insulating cover plate 300 and the insulating base plate 200 to eliminate gaps among the resistor disc 100, the insulating cover plate 300 and the insulating base plate 200, and further improve the insulating property inside the resistor. The pins 400 electrically connected to the resistive sheet 100 are disposed at two ends of the resistive sheet 100 which are farthest away from each other, so that the current can pass through the resistive sheet 100 farthest away from each other, the resistance of the resistive sheet 100 can be maximized, and the load which can be borne by the resistive sheet 100 can be larger. The inner shell 500 is provided with a first accommodating cavity, the inner shell 500 is provided with an opening, the resistor disc 100 and the insulating cover plate 300 are arranged in the first accommodating cavity, and the insulating bottom plate 200 is embedded in the opening of the inner shell 500, so that the first accommodating cavity forms a sealed space. Insulating heat-conducting glue is also filled in the first chamber that holds, makes the first sealing performance who holds the intracavity better, and then makes the resistor have waterproof and dirt-proof ability. The outer case 600 is disposed at the outermost side, a second receiving chamber is disposed on the outer case 600, and the inner case 500 is involved in the second receiving chamber. Be provided with a plurality of dashpots on the inside wall in second holds the chamber, when inner shell 500 involves in the second and holds the intracavity, the dashpot forms inner shell 500 and the second and holds the buffering clearance 610 between the chamber, and when the resistor received external impact, buffering clearance 610 can consume the energy of external impact, and then plays the effect of protection resistance inner structure.

According to the module type alloy sheet power resistor, at least the following effects can be achieved by the arrangement: by the conductive material 210 coated on the side of the insulating base plate 200 close to the resistive sheet 100, a parallel connection is formed between the resistive sheet 100 and this conductive material 210, and at this time a partial discharge is generated between this conductive material 210 and the insulating base plate 200 due to the electrical connection between the resistive sheet 100 and this conductive material 210, and the distance between this conductive material 210 and the insulating base plate 200 is smaller. Meanwhile, as the conductive material 210 is coated on the insulating base plate 200, the conductive material 210 can coat protruding points on the surface of the insulating base plate 200 or fill surface defects of the insulating base plate 200, and simultaneously, the defects on the resistance card 100 are eliminated, so that objective conditions generated by partial discharge are greatly reduced, and the purpose of avoiding insulation failure of the resistor is achieved; furthermore, the conductive material 210 coated on the side of the insulating substrate 200 away from the resistor disc 100 can eliminate the protrusion or defect of the insulating substrate 200, which can cause partial discharge, by using the conductive material 210, so that the partial discharge can only exist on the mounting surface of the conductive material 210 and the resistor, thereby achieving the purpose of protecting the insulating substrate 200.

The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made without departing from the spirit of the present application within the knowledge of those skilled in the art.

Claims (9)

1. A modular alloy sheet power resistor, comprising:

a resistor sheet (100);

the resistor disc comprises an insulating bottom plate (200), conductive materials (210) are coated on two opposite side faces of the insulating bottom plate (200), the resistor disc (100) is arranged on the insulating bottom plate (200), the resistor disc (100) is abutted to the conductive materials (210) on one side face of the insulating bottom plate (200), and the insulating bottom plate (200) is used for bearing the resistor disc (100).

2. The modular alloy sheet power resistor of claim 1, wherein the conductive material (210) is a high resistance paste.

3. The modular alloy sheet power resistor of claim 1, wherein the area of the conductive material (210) is larger than the area of the resistive sheet (100).

4. The modular alloy sheet power resistor according to claim 1, further comprising an insulating cover plate (300), wherein the resistor sheet (100) is located between the insulating cover plate (300) and the insulating base plate (200).

5. The modular alloy sheet power resistor as claimed in claim 4, wherein insulating heat-conducting glue is filled between the insulating cover plate (300) and the resistor sheet (100) and between the resistor sheet (100) and the insulating bottom plate (200).

6. The modular alloy sheet power resistor as claimed in claim 1, further comprising two pins (400), wherein the two pins (400) are electrically connected to two ends of the resistor sheet (100).

7. The modular alloy sheet power resistor as claimed in claim 6, further comprising an inner housing (500), wherein the inner housing (500) is provided with a first accommodating cavity, the inner housing (500) is provided with an opening and a pin hole, the resistor sheet (100) is arranged in the first accommodating cavity, the insulating bottom plate (200) is embedded in the opening for blocking the first accommodating cavity, and the pin (400) is inserted in the pin hole.

8. The modular alloy sheet power resistor as claimed in claim 7, further comprising an outer shell (600), wherein the outer shell (600) is provided with a second accommodating cavity, the inner shell (500) is embedded in the second accommodating cavity, and a plurality of buffer gaps (610) are arranged between the inner shell (500) and the second accommodating cavity.

9. The modular alloy sheet power resistor as claimed in claim 7, wherein the first accommodating cavity is filled with an insulating heat-conducting glue.

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