CN211958245U - Laser array unit and packaging assembly - Google Patents
Laser array unit and packaging assembly Download PDFInfo
- Publication number
- CN211958245U CN211958245U CN202020452454.3U CN202020452454U CN211958245U CN 211958245 U CN211958245 U CN 211958245U CN 202020452454 U CN202020452454 U CN 202020452454U CN 211958245 U CN211958245 U CN 211958245U
- Authority
- CN
- China
- Prior art keywords
- laser array
- power supply
- printed circuit
- circuit board
- array unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The application discloses laser array unit and encapsulation subassembly. The laser array unit includes: the laser array is provided with a power supply pin, and the printed circuit board is fixed on the power supply pin; and the power supply socket is fixed on the printed circuit board and is positioned on one side of the laser array, and the power supply pins are connected to the power supply socket through the printed circuit board. Through the mode, the laser array unit is simple and reliable in structure, simple in manufacturing process, less in material consumption and capable of saving production cost.
Description
Technical Field
The present disclosure relates to semiconductor packaging technologies, and particularly to a laser array unit and a package assembly.
Background
With the development of electronic products, the requirements for semiconductor laser array packaging are higher and higher, and the functions of the electronic products are directly affected by the effect of the laser array packaging.
The inventor of the present application found in long-term research and development that a laser array has multiple pairs of positive and negative power supply pins, multiple pairs of pin soldering positions need to be arranged on a corresponding printed circuit board, and the installation and arrangement mode of a power supply socket needs to be considered. In addition, the entire laser array needs to be mounted on a heat sink to dissipate heat from the laser array, and therefore, the mounting between the laser array, the printed circuit board, and the heat sink also needs to be considered.
Because the laser array is as the unit commonly used in the projecting apparatus, and a projecting apparatus needs to use laser array quantity few to several, tens of at most, laser array among the prior art mainly installs on the circuit board through the fixed bolster, and laser array both ends all are provided with the power supply socket, lead to laser array packaging body's structure complicated, and the material is more, consequently need develop a simple, reliable and with low costs laser array and printed circuit board mounting means, can guarantee the use quality like this, can guarantee simple process again, low cost and facilitate the use.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application mainly solved provides a laser instrument array unit and encapsulation subassembly, and simple structure is reliable, and the material is less, can simplify production technology, reduction in production cost.
In order to solve the technical problem, the application adopts a technical scheme that: there is provided a laser array unit including: the laser array is provided with a power supply pin; the power supply pin is fixed on the printed circuit board; and the power supply socket is fixed on the printed circuit board and is positioned on one side of the laser array, and the power supply pins are connected to the power supply socket through the printed circuit board.
Wherein, the printed circuit is provided with an opening, and the laser array is embedded at the opening.
Wherein, the laser array unit still includes temperature sensor, and temperature sensor includes: a terminal socket: fixed on the printed circuit board; and the probe is connected with the terminal socket through a lead, is fixed on the laser array and is used for sensing the temperature of the laser array.
The printed circuit board is U-shaped and comprises a bottom plate, a first side plate and a second side plate, the first side plate and the second side plate are connected with the bottom plate, an opening is formed by the bottom plate, the first side plate and the second side plate, and the power supply socket is arranged on the bottom plate.
The terminal socket is fixed on one side of the first side plate, which is far away from the bottom plate, and the probe is fixed on one side of the laser array, which is far away from the power supply socket.
The power supply pins comprise positive power supply pins and negative power supply pins which are arranged oppositely, first welding parts corresponding to the negative power supply pins are arranged on the first side plate, second welding parts corresponding to the positive power supply pins are arranged on the second side plate, the negative power supply pins are welded on the first welding parts, and the positive power supply pins are welded on the second welding parts.
The laser array unit further comprises a shell, the shell is covered on the printed circuit board, the laser array is located in the shell, and the power supply socket is located outside the shell.
The laser array unit further comprises a sealing gasket, and the sealing gasket is sleeved on the periphery of the power supply socket.
The laser array unit further comprises a radiator, and the laser array and the printed circuit board are fixed on the radiator through screws.
In order to solve the above technical problem, another technical solution adopted by the present application is: there is provided a package assembly including a heat sink and the laser array units of the above embodiments, the laser array units being arranged in pairs on the heat sink, the pairs of laser array units being arranged side by side and in opposite directions such that power supply sockets of the laser array units are arranged around the laser array.
The beneficial effects of the embodiment of the application are that: different from the prior art, the laser array unit of this embodiment includes laser array, printed circuit board and power supply socket, and wherein the laser array is fixed in on the printed circuit board through the power supply pin, and the power supply pin is connected to the power supply socket of laser array one side through printed circuit board, and this kind of connected mode is simple reliable, can simplify production technology, and the holistic materials of laser array unit is less to need not other mounting, can practice thrift manufacturing cost.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a laser array unit provided in the present application;
FIG. 2 is an exploded view of a laser array unit provided herein;
FIG. 3 is an exploded view of the laser array unit of FIG. 1;
FIG. 4 is a schematic view of an assembled structure of an embodiment of a package assembly provided herein;
fig. 5 is a schematic diagram of an overall structure of an embodiment of a package assembly provided herein.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
With the continuous development of integrated circuit technology, electronic products are developing towards intellectualization and high reliability, and the requirements for the package assembly of the semiconductor laser array are also increasing, so that the package of the laser array becomes a new hot spot. The application provides a laser array unit and encapsulation subassembly, this laser array unit overall structure is simple reliable, and production simple process uses few materials, low cost to make things convenient for the circular telegram plug on the plug printed circuit board, in order to make things convenient for people to use.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an embodiment of a laser array unit provided in the present application, and fig. 2 is an exploded view of the laser array unit in fig. 1. In the present embodiment, the laser array unit 10 includes a laser array 2, a printed circuit board 1, and a power supply socket 3.
Be provided with power supply pin 21 on the laser array 2, power supply pin 21 is fixed in on printed circuit board 1, and laser array 2 is fixed in on printed circuit board 1 through power supply pin 21 promptly to need not to use other fixed bolster structures, the material is few, can practice thrift manufacturing cost. The power supply socket 3 is fixed on the printed circuit board 1 and located at one side of the laser array 2, and the power supply pins 21 can be connected to the power supply socket 3 through the printed circuit board 1 to simplify the structure of the laser array unit 10. The laser array unit 10 of the embodiment has the advantages of simple and reliable structure, simple manufacturing process, less material consumption and capability of saving the production cost.
Further, as shown in fig. 3, in order to reduce the volume of the laser array unit 10 and facilitate heat dissipation, an opening 14 may be provided on the printed circuit board 1, and the laser array 2 is embedded at the opening 14. The opening 14 may be located in the middle of the printed circuit board 1, or in the edge of the printed circuit board 1, and when the opening 14 is located in the edge of the printed circuit board 1, the printed circuit board 1 may be U-shaped. The printed circuit board 1 and its opening 14 may be of the same shape, e.g. both rectangular. In other embodiments, the shape of the printed circuit board 1 and the shape of its opening 14 may also be different. In order to improve the reliability of the laser array unit, the shape of the opening 14 may be adapted to the shape of the laser array 2, so that the laser array 2 is more firmly fixed.
In this embodiment, the power supply pin 21 can be directly soldered on the printed circuit board 1, so that the package of the laser array 2 is more reliable. Specifically, the power supply pins 21 include a positive power supply pin (not shown) and a negative power supply pin (not shown), the positive power supply pin and the negative power supply pin are arranged in pairs, and the positive power supply pin and the negative power supply pin can be respectively arranged at two opposite ends of the laser array 2. The printed circuit board 1 is provided with a first welding part 111 corresponding to the negative power supply pin and a second welding part 121 corresponding to the positive power supply pin, the negative power supply pin can be welded on the first welding part 111, and the positive power supply pin can be welded on the second welding part 121, so that the laser array 2 is more stable and reliable in fixation. In other alternative embodiments, the power supply pins 21 can also be directly glued or snapped onto the printed circuit board 1.
The power supply socket 3 is fixed on the printed circuit board 1 and is located at one side of the laser array 2. The supply pin 21 is connected to the supply socket 3 via the printed circuit board 1 to supply power to the laser array 2 via the supply socket 3. In order to make reasonable use of the space of the printed circuit board 1, the power supply socket 3 is arranged side by side with a spacing from the laser array 2.
Further, the laser array unit 10 may further include a temperature sensor 4 for detecting the temperature of the laser array 2 in real time. Specifically, the temperature sensor 4 includes a terminal socket 41 and a probe 42, and the terminal socket 41 and the probe 42 are connected by a wire (not shown). The terminal socket 41 is fixed on the printed circuit board 1, and the probe 42 is fixed on the laser array 2 and used for sensing the temperature of the laser array 2. Alternatively, the terminal socket 41 may be soldered to the printed circuit board 1, and the probe 42 is fixed to the laser array 2 by screws and directly contacts the laser array 2 to more accurately sense the temperature of the laser array 2. The Temperature sensor 4 may use a thermistor having a Negative Temperature Coefficient (NTC). The application provides a mode reliability of this kind of temperature-sensing protection is good, and is not fragile in the mode of traditional thermistor with the cotton heat transfer temperature measurement of electrically conductive bubble relatively, simple to operate.
In a preferred embodiment, the printed circuit board 1 may be of a U-shaped configuration, as shown in fig. 3. Specifically, the printed circuit board 1 includes a bottom plate 13 and a first side plate 11 and a second side plate 12 connected to the bottom plate 13, the first side plate 11 and the second side plate 12 are disposed opposite to each other, and the first side plate 11, the second side plate 12 and the bottom plate 13 form an opening 14, in this embodiment, the laser array 2 is embedded in the opening 14, so that the laser array 2 is more conveniently mounted. The first side plate 11 is provided with a first welding portion 111, the second side plate 12 is provided with a second welding portion 121, the negative power supply pin of the laser array 2 can be welded on the first welding portion 111, and the positive power supply pin of the laser array 2 can be welded on the second welding portion 112. By the mode, the laser array 2 can be conveniently installed, the stress of the laser array 2 is uniform, and the fixing stability of the laser array 2 is improved.
Further, as shown in fig. 1 and 2, the power supply socket 3 may be disposed on the bottom plate 13, and the positive power supply pin and the negative power supply pin of the laser array 2 are respectively connected to the power supply socket 3 through the printed circuit board 1, which can make the connection between the power supply pin 21 and the power supply socket 3 simpler and reduce the volume of the laser array unit.
Furthermore, in the present embodiment, the terminal socket 41 of the temperature sensor 4 may be disposed on a side of the first side plate 11 away from the bottom plate 13, and the probe 42 of the temperature sensor 4 is disposed on a side of the laser array 2 away from the power supply socket 3, so as to improve the accuracy of temperature sensing. And the space of the printed circuit board 1 can be reasonably utilized.
In the preferred embodiment, the printed circuit board 1 is of a U-shaped structure, and the laser array 2 is embedded in the opening 14 of the U-shaped printed circuit board 1, so that the assembly and the production are convenient; the power supply socket 3 is located on the bottom plate 13, the terminal socket 41 of the temperature sensor 4 is fixed on one side of the first side plate 11 away from the bottom plate, and the probe 42 is fixed on one side of the laser array 2 away from the power supply socket 3.
Further, the laser array unit 10 may further include a housing (not shown), the housing is covered on the printed circuit board 1, the laser array 2 and the temperature sensor 4 may be both located in the housing, and the laser array 2 and the temperature sensor 4 are subjected to dust prevention and water prevention by the housing in this embodiment. The housing may be fixed to the printed circuit board 1 by screws to improve the reliability of the fixing and facilitate the detachment. In another embodiment, the housing may also be directly glued to the printed circuit board 1 to simplify the production process.
The housing covers the laser array 2 and exposes the power supply socket 3, i.e. the power supply socket 3 is on the outside of the housing to facilitate plugging and unplugging. The laser array unit 10 further includes a sealing gasket 5, and the sealing gasket 5 is sleeved on the periphery of the power supply socket 3 to better protect the power supply socket 3. The power supply socket 3 and the housing are sealed by the gasket 5, and the reliability of the laser array unit 10 is improved. The power supply socket 3 is upward in plugging and unplugging direction and exposed outside, so that plugging and unplugging are facilitated. Therefore, the laser array unit 10 of the present application is simple and reliable in structure and convenient to use.
In order to be able to reduce the temperature of the laser array 2 and the printed circuit board 1, the laser array unit 10 further includes a heat sink (not shown). The laser array 2 and the printed circuit board 1 are connected to a heat sink for heat dissipation. Specifically, the laser array 2 and the printed circuit board 1 can be fixed on the heat dissipation surface of the heat sink through screws, and the fixing mode is simple and reliable and is convenient to disassemble and maintain. Preferably, the laser array 2 and the printed circuit board 1 may be fixed to the heat sink by 6 screws to improve reliability of the fixing.
As shown in fig. 4 and 5, in another embodiment, the present application further provides a package assembly, in this embodiment, the package assembly includes a heat sink 6 and a laser array unit 10 disposed on the heat sink 6, the laser array unit 10 may be the laser array unit in the above embodiment, and in this embodiment, the laser array unit 10 is fixed on the heat sink 6. The laser array units 10 can be easily expanded in a modularized manner on the heat sink 6, and the number and arrangement of the laser array units 10 on the heat sink 6 can be set according to actual requirements. Preferably, in order to ensure the compactness of space usage, the laser array units 10 may be arranged in pairs on the heat sink 6, for example, the laser array units 10 arranged in pairs may be distributed side by side along the first direction L1 and arranged in opposite directions, respectively, so that the power supply sockets 3 of the laser array units 10 are arranged around the laser array 2, i.e. the power supply sockets 3 are located outside the laser array 2, in such a way that the power supply sockets 3 of the laser array units 10 are located outside, thereby facilitating plugging and unplugging. The package assembly may include 4 pairs of laser array units, the 4 pairs of laser array units being arranged in a second direction L2, wherein the first direction L1 and the second direction L2 are perpendicular, the first direction L1 may be a width direction of the heat sink 6, and the second direction L2 may be a length direction of the heat sink 6.
In order to simplify the package structure, the housing 7 of the package may be a single body and cover the printed circuit board 1, and cover all the laser arrays 2 for waterproofing and dust-proofing. Only the power supply socket 3 is exposed, namely the plugging direction of the power supply socket 3 is outward and exposed outside, so that plugging and unplugging are facilitated. In this embodiment, the gasket 5 may also seal the power supply socket 3 on the heat sink 6 as a whole. In this way, the power supply socket 3 is upward in the plugging direction and exposed outside, so that plugging and unplugging are facilitated, and the sealing performance of the laser array unit 10 is good.
In other embodiments, the number of laser array units 10 in the package assembly may be expanded in pairs, for example, the package assembly may include 3 pairs of laser array units 10 or 5 pairs of laser array units 10. The laser array unit 10 in the package assembly can be easily expanded modularly, and the number of the expanded laser array units 10 in pairs as shown in fig. 4 and 5 can ensure the compactness of space usage.
Be different from prior art's condition, in the laser array unit 10 that this embodiment provided, laser array 2 can be through power supply pin 21 lug weld on printed circuit board 1, power supply pin 21 is connected to power supply socket 3, temperature sensor 4's simple to operate and not fragile, laser array 2 can effectively be sheltered from to the casing, the protection to laser array 2 has been strengthened, and power supply socket 3 exposes in the outside, conveniently plug, this embodiment encapsulation subassembly simple structure, the equipment is convenient, and has higher reliability. And the laser array unit 10 in the packaging assembly of the embodiment can be easily expanded, so that the adaptability of the packaging assembly is improved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A laser array unit, comprising:
the laser device comprises a laser device array, wherein a power supply pin is arranged on the laser device array;
the power supply pin is fixed on the printed circuit board;
and the power supply socket is fixed on the printed circuit board and positioned on one side of the laser array, and the power supply pins are connected to the power supply socket through the printed circuit board.
2. The laser array unit of claim 1, wherein the printed circuit has an opening disposed therein, and the laser array is embedded in the opening.
3. The laser array unit of claim 2, further comprising a temperature sensor, the temperature sensor comprising:
a terminal socket fixed on the printed circuit board;
and the probe is connected with the terminal socket through a wire, is fixed on the laser array and is used for sensing the temperature of the laser array.
4. The laser array unit of claim 3, wherein the printed circuit board is U-shaped, comprising a base plate and first and second side plates connecting the base plate, the first side plate and the second side plate forming the opening, the power supply socket being disposed on the base plate.
5. The laser array unit of claim 4, wherein the terminal socket is secured to a side of the first side plate remote from the base plate, and the probe is secured to a side of the laser array remote from the power supply socket.
6. The laser array unit of claim 3, wherein the power pins comprise a positive power pin and a negative power pin, the positive power pin and the negative power pin are oppositely disposed, the first side plate is provided with a first welding portion corresponding to the negative power pin, the second side plate is provided with a second welding portion corresponding to the positive power pin, the negative power pin is welded to the first welding portion, and the positive power pin is welded to the second welding portion.
7. The laser array unit of claim 1, further comprising a housing that covers the printed circuit board, wherein the laser array is located within the housing, and wherein the power supply socket is located outside the housing.
8. The laser array unit of claim 7, further comprising a gasket disposed around the periphery of the power supply socket.
9. The laser array unit of claim 2, further comprising a heat sink, wherein the laser array and the printed circuit board are secured to the heat sink by screws.
10. A package comprising a heat sink and the laser array unit of any of claims 1-6, the laser array unit being disposed in pairs on the heat sink, the pairs of laser array units being disposed side-by-side and in opposite directions such that power supply sockets of the laser array units are disposed around the laser array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020452454.3U CN211958245U (en) | 2020-03-31 | 2020-03-31 | Laser array unit and packaging assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020452454.3U CN211958245U (en) | 2020-03-31 | 2020-03-31 | Laser array unit and packaging assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211958245U true CN211958245U (en) | 2020-11-17 |
Family
ID=73168182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020452454.3U Active CN211958245U (en) | 2020-03-31 | 2020-03-31 | Laser array unit and packaging assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211958245U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024078036A1 (en) * | 2022-10-13 | 2024-04-18 | 青岛海信激光显示股份有限公司 | Light source component and projector |
-
2020
- 2020-03-31 CN CN202020452454.3U patent/CN211958245U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024078036A1 (en) * | 2022-10-13 | 2024-04-18 | 青岛海信激光显示股份有限公司 | Light source component and projector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6496846B2 (en) | Battery module having temperature monitoring assembly | |
| US8287185B2 (en) | Cell temperature sensing apparatus for a battery module | |
| US5747876A (en) | Semiconductor device and semiconductor module | |
| JP2018066723A (en) | Temperature measuring assembly and electrical device | |
| US20180045576A1 (en) | Temperature measuring apparatus, electrical assembly and battery pack | |
| CN211958245U (en) | Laser array unit and packaging assembly | |
| CN107607215A (en) | Temperature survey component, temperature measuring equipment and electric appliance component | |
| TWI708419B (en) | Battery connection module | |
| CN209910581U (en) | Identification device for house safety static strain | |
| CN212909433U (en) | Photovoltaic junction box | |
| CN213239250U (en) | Water temperature sensor | |
| CN112033561A (en) | Temperature sensing element, temperature measurement component and battery pack | |
| CN111706841A (en) | Lighting lamp | |
| CN219372727U (en) | Assembled power module structure | |
| CN210293263U (en) | AGV sensor | |
| CN111341740A (en) | Novel power management chip packaging system | |
| CN213401562U (en) | Connector with temperature control function | |
| CN213336240U (en) | All-in-one environment monitoring equipment | |
| JPH10229149A (en) | Semiconductor device | |
| CN212963757U (en) | Temperature sensing element, temperature measurement component and battery pack | |
| CN214149417U (en) | Temperature and humidity sensor convenient to install and replace | |
| CN212511046U (en) | Lighting lamp | |
| CN214625021U (en) | Shell sealing mechanism and electronic equipment | |
| CN213103055U (en) | Module-spliced phased array transducer | |
| CN219624932U (en) | Temperature acquisition module, integrated acquisition assembly of electric core signal and battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |