CN210925984U - Heat dissipation type semiconductor packaging piece - Google Patents
Heat dissipation type semiconductor packaging piece Download PDFInfo
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- CN210925984U CN210925984U CN201922442197.5U CN201922442197U CN210925984U CN 210925984 U CN210925984 U CN 210925984U CN 201922442197 U CN201922442197 U CN 201922442197U CN 210925984 U CN210925984 U CN 210925984U
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- chip
- mounting groove
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- chip bearing
- heat
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Abstract
The utility model belongs to the technical field of semiconductors, and particularly discloses a heat dissipation type semiconductor packaging piece, which comprises a substrate and a plastic cover plate; the chip bearing piece is arranged on the surface of the substrate, and a chip mounting groove is formed in the center of the surface of the chip bearing piece; a heat conducting plate is arranged in the chip mounting groove, and heat radiating holes are formed in the positions, corresponding to the heat conducting plate, of the chip bearing piece; a dustproof filter screen is arranged at the position of the substrate corresponding to the heat dissipation hole; bolts are arranged at the four corners of the chip bearing piece, and the chip bearing piece is fixedly connected with the substrate through the bolts; clamping plates are arranged on two sides of the chip mounting groove, first screw holes are formed in positions, corresponding to the two clamping plates, of two sides of the chip bearing part, second screw holes are formed in the sides, away from each other, of the two clamping plates, and the first screw holes and the second screw holes are fixedly connected through adjusting bolts; the chip bearing part is characterized in that mounting holes are formed in four corners of the surface of the substrate, a plastic cover plate is arranged above the chip bearing part, and fixing bolts are arranged at the four corners of the plastic cover plate.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically a heat dissipation type semiconductor package spare.
Background
With the demand for electronic products to be light, thin and compact, semiconductor packages such as Ball Grid Array (BGA) packages with reduced Integrated Circuit (IC) area, high density and multi-pin characteristics are becoming one of the mainstream in the packaging market. However, since the semiconductor package has high density of Electronic circuits (Electronic circuits) and Electronic Components (Electronic Components), the amount of heat generated during operation is high; moreover, the semiconductor package is formed by encapsulating the semiconductor chip with a package colloid having poor thermal conductivity, so that the performance of the semiconductor chip is often affected by the poor heat dissipation efficiency; and because the semiconductor packaging part in the prior art has no adjusting mechanism and can only be matched with a semiconductor chip with a fixed size for use, the application range is not large, and the practicability is not strong.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation type semiconductor package to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation type semiconductor package includes a substrate and a plastic cover; the chip bearing piece is arranged on the surface of the substrate, and a chip mounting groove is formed in the center of the surface of the chip bearing piece; a heat conducting plate is arranged in the chip mounting groove, and heat radiating holes are formed in the positions, corresponding to the heat conducting plate, of the chip bearing piece; a dustproof filter screen is arranged at the position of the substrate corresponding to the heat dissipation hole; bolts are arranged at the four corners of the chip bearing piece, and the chip bearing piece is fixedly connected with the substrate through the bolts; clamping plates are arranged on two sides of the chip mounting groove, first screw holes are formed in positions, corresponding to the two clamping plates, of two sides of the chip bearing part, second screw holes are formed in the sides, away from each other, of the two clamping plates, and the first screw holes and the second screw holes are fixedly connected through adjusting bolts; mounting holes are formed in the four corners of the surface of the substrate, a plastic cover plate is arranged above the chip bearing piece, fixing bolts are arranged at the four corners of the plastic cover plate, and the fixing bolts penetrate through the mounting holes to enable the plastic cover plate to be fixedly connected with the substrate; the chip bearing part surface is provided with limiting rods relative to the upper end and the lower end of the chip mounting groove, and the top ends of the limiting rods are clamped and fixed on the bottom surface of the plastic cover plate.
Preferably, the two sides of the bottom surface of the heat conducting plate are symmetrically provided with bulges, and grooves are arranged in the chip mounting grooves corresponding to the bulges; the height of the protrusion is greater than the depth of the groove; because the height of the bulge is greater than the depth of the groove, the bottom surface of the heat conducting plate is not in direct contact with the bottom surface of the chip mounting groove, so that the contact area between the heat conducting plate and the outside air is increased, and the heat dissipation effect of the heat conducting plate is further enhanced.
Preferably, the bottom end of the clamping plate is provided with a sliding block, the bottom surface of the chip mounting groove is provided with a sliding groove at a position corresponding to the sliding block, and the clamping plate is in sliding connection with the chip mounting groove through the matching of the sliding block and the sliding groove; through the sliding connection of splint and chip mounting groove, make splint have certain regulatory function, can the fixed not unidimensional chip of centre gripping.
Preferably, the opposite sides of the two clamping plates are provided with buffer pads, and the surfaces of the buffer pads and the two clamping plates are provided with a plurality of round holes; the cushion pad can prevent the chip and the clamping plate from being damaged due to friction; and the round holes can enhance the heat dissipation effect.
Preferably, an adjusting spring is wound on the outer side of the screw part of the adjusting bolt; the fixed effect of splint can be strengthened to the regulating spring.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a heat-conducting plate, louvre and dustproof filter screen's cooperation, can give off the heat that the chip produced to the outside air in, thereby realize the heat dissipation function, and be provided with the arch in the heat-conducting plate bottom surface, the chip mounting groove corresponds the position and is provided with the recess, the protruding highly is greater than the depth of groove, thereby make heat-conducting plate bottom surface and chip mounting groove bottom surface not direct contact, increased the area of contact of heat-conducting plate with the outside air, and then strengthened the radiating effect of heat-conducting plate.
2. The utility model arranges the clamping plate and the adjusting bolt on the two sides of the chip mounting groove; the two clamping plates can clamp and fix the chip placed in the chip mounting groove, and the adjusting spring wound at the screw position of the adjusting bolt can enhance the clamping effect of the clamping plates; meanwhile, the two clamping plates have a certain adjusting function through the adjusting bolts, so that chips with different sizes can be fixed in the chip mounting groove, the application range of the packaging part is enlarged, and the practicability is enhanced.
Drawings
Fig. 1 is a schematic overall structure diagram of the present invention;
fig. 2 is a schematic view of the overall structure of the present invention.
In the figure: 1. a substrate; 2. a chip carrier; 3. a chip mounting groove; 4. a heat conducting plate; 5. heat dissipation holes; 6. a dustproof filter screen; 7. a splint; 8. adjusting the bolt; 9. a plastic cover sheet; 10. adjusting the spring; 11. a limiting rod; 12. a slider; 13. a chute; 14. a protrusion; 15. and (4) a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, the present invention provides a technical solution: a heat dissipation type semiconductor package includes a substrate 1 and a plastic cover 9; the surface of the substrate 1 is provided with a chip carrier 2, and the center of the surface of the chip carrier 2 is provided with a chip mounting groove 3; a heat conducting plate 4 is arranged in the chip mounting groove 3, and heat radiating holes 5 are formed in the positions, corresponding to the heat conducting plate 4, of the chip bearing pieces 2; a dustproof filter screen 6 is arranged at the position of the substrate 1 corresponding to the heat dissipation hole 5; bolts are arranged at the four corners of the chip bearing piece 2, and the chip bearing piece 2 is fixedly connected with the substrate 1 through the bolts; clamping plates 7 are arranged on two sides of the chip mounting groove 3, first screw holes are formed in positions, corresponding to the two clamping plates 7, of two sides of the chip bearing part 2, second screw holes are formed in sides, away from each other, of the two clamping plates 7, and the first screw holes and the second screw holes are fixedly connected through adjusting bolts 8; mounting holes are formed in four corners of the surface of the substrate 1, a plastic cover plate 9 is arranged above the chip carrier 2, fixing bolts are arranged at the four corners of the plastic cover plate 9, and the fixing bolts penetrate through the mounting holes to enable the plastic cover plate 9 to be fixedly connected with the substrate 1; the surface of the chip bearing part 2 is provided with limiting rods 11 relative to the upper end and the lower end of the chip mounting groove 3, and the top ends of the limiting rods 11 are clamped and fixed on the bottom surface of the plastic cover plate 9.
Furthermore, bulges 14 are symmetrically arranged on two sides of the bottom surface of the heat conducting plate 4, and grooves 15 are arranged in the chip mounting groove 3 corresponding to the bulges 14; the height of the projection 14 is greater than the depth of the groove 15; because the height of the bulge 14 is greater than the depth of the groove 15, the bottom surface of the heat conducting plate 4 is not in direct contact with the bottom surface of the chip mounting groove 3, so that the contact area between the heat conducting plate 4 and the outside air is increased, and the heat dissipation effect of the heat conducting plate 4 is further enhanced.
Further, a sliding block 12 is arranged at the bottom end of the clamping plate 7, a sliding groove 13 is arranged on the bottom surface of the chip mounting groove 3 corresponding to the sliding block 12, and the clamping plate 7 is in sliding connection with the chip mounting groove 3 through the matching of the sliding block 12 and the sliding groove 13; through the sliding connection of splint 7 and chip mounting groove 3, make splint 7 have certain regulatory function, can the fixed not unidimensional chip of centre gripping.
Furthermore, a buffer pad is arranged on the opposite side of the two clamping plates 7, and a plurality of round holes are formed on the surfaces of the buffer pad and the two clamping plates 7; the cushion pad can prevent the chip from being damaged due to friction with the clamping plate 7; and the round holes can enhance the heat dissipation effect.
Further, an adjusting spring 10 is wound on the outer side of the screw rod part of the adjusting bolt 8; the adjusting spring 10 can enhance the fixing effect of the clamping plate 7.
The working principle is as follows: when the chip clamping device is used, a chip is placed in a chip mounting groove 3 formed in the surface of a chip bearing piece 2, and is placed on the surface of a heat conduction plate 4 arranged in the chip mounting groove 3, a bonding layer is arranged on the surface of the heat conduction plate 4, the heat conduction plate 4 is in close contact with the chip through the bonding layer, then adjusting bolts 8 on two sides of the chip mounting groove 3 are rotated, clamping plates 7 on two sides can slide in sliding grooves 13 formed in the bottom surface of the chip mounting groove 3 through sliding blocks 12 through threaded connection between the adjusting bolts 8 and a first screw hole and a second screw hole, the clamping plates 7 on two sides can clamp and fix the chip, adjusting springs 10 wound on the outer sides of screw portions of the adjusting bolts 8 can enhance the fixing effect, and buffering cushions arranged on opposite sides of the two clamping plates 7; the adjusting bolt 8 also enables the two clamping plates 7 to have a certain adjusting function, so that chips with different sizes can be fixed in the chip mounting groove 3; the heat conducting plate 4 is fixed with the chip mounting groove 3 through the clamping of the bulge 14 and the groove 15, the heat radiating holes 5 are arranged at the positions of the chip bearing piece 2 corresponding to the heat radiating plates, the dustproof filter screen 6 is arranged at the positions of the substrate 1 corresponding to the heat radiating holes 5, the heat generated by the chip can be radiated into the external air through the heat conducting plate 4, the heat radiating holes 5 and the dustproof filter screen 6, and the bottom surface of the heat conducting plate 4 is not directly contacted with the bottom surface of the chip mounting groove 3 due to the height of the bulge 14 being greater than the depth of the groove 15, so that the contact area of the heat conducting plate 4 and the external air is increased; make plastics cover plate 9 and base plate 1 fixed connection through fixing bolt afterwards to encapsulate chip carrier 2 and adjusting bolt 8, not only can seal the chip and protect, can also prevent to cause the condition that splint 7 pine takes off because adjusting bolt 8's rotation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A heat dissipation type semiconductor package, characterized in that: comprises a base plate (1) and a plastic cover plate (9); a chip bearing piece (2) is arranged on the surface of the substrate (1), and a chip mounting groove (3) is formed in the center of the surface of the chip bearing piece (2); a heat-conducting plate (4) is arranged in the chip mounting groove (3), and heat dissipation holes (5) are formed in the positions, corresponding to the heat-conducting plate (4), of the chip bearing pieces (2); a dustproof filter screen (6) is arranged at the position of the substrate (1) corresponding to the heat dissipation hole (5); bolts are arranged at four corners of the chip bearing piece (2), and the chip bearing piece (2) is fixedly connected with the substrate (1) through the bolts; clamping plates (7) are arranged on two sides of the chip mounting groove (3), first screw holes are formed in positions, corresponding to the two clamping plates (7), of two sides of the chip bearing part (2), second screw holes are formed in sides, away from each other, of the two clamping plates (7), and the first screw holes are fixedly connected with the second screw holes through adjusting bolts (8); mounting holes are formed in four corners of the surface of the substrate (1), a plastic cover plate (9) is arranged above the chip bearing piece (2), fixing bolts are arranged at the four corners of the plastic cover plate (9), and the fixing bolts penetrate through the mounting holes to enable the plastic cover plate (9) to be fixedly connected with the substrate (1); limiting rods (11) are arranged on the surface of the chip bearing piece (2) relative to the upper end and the lower end of the chip mounting groove (3), and the top ends of the limiting rods (11) are clamped and fixed on the bottom surface of the plastic cover plate (9).
2. A heat dissipating semiconductor package in accordance with claim 1, wherein: bulges (14) are symmetrically arranged on two sides of the bottom surface of the heat conducting plate (4), and grooves (15) are arranged in the chip mounting groove (3) corresponding to the bulges (14); the height of the protrusion (14) is larger than the depth of the groove (15).
3. A heat dissipating semiconductor package in accordance with claim 1, wherein: the bottom end of the clamping plate (7) is provided with a sliding block (12), the bottom surface of the chip mounting groove (3) is provided with a sliding groove (13) corresponding to the position of the sliding block (12), and the clamping plate (7) is in sliding connection with the chip mounting groove (3) through the matching of the sliding block (12) and the sliding groove (13).
4. A heat dissipating semiconductor package in accordance with claim 1, wherein: the opposite sides of the two clamping plates (7) are provided with buffer pads, and the surfaces of the buffer pads and the two clamping plates (7) are provided with a plurality of round holes.
5. A heat dissipating semiconductor package in accordance with claim 1, wherein: and an adjusting spring (10) is wound on the outer side of the screw rod part of the adjusting bolt (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922442197.5U CN210925984U (en) | 2019-12-30 | 2019-12-30 | Heat dissipation type semiconductor packaging piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922442197.5U CN210925984U (en) | 2019-12-30 | 2019-12-30 | Heat dissipation type semiconductor packaging piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210925984U true CN210925984U (en) | 2020-07-03 |
Family
ID=71369051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922442197.5U Active CN210925984U (en) | 2019-12-30 | 2019-12-30 | Heat dissipation type semiconductor packaging piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210925984U (en) |
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2019
- 2019-12-30 CN CN201922442197.5U patent/CN210925984U/en active Active
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