CN210925984U - A heat-dissipating semiconductor package - Google Patents

Abstract

The utility model belongs to the technical field of semiconductors, and specifically discloses a heat dissipation type semiconductor package, comprising a substrate and a plastic cover; a chip carrier is arranged on the surface of the substrate, and a chip mounting groove is arranged at the center of the surface of the chip carrier; A heat-conducting plate is arranged in the chip mounting groove, and a heat-dissipating hole is arranged at a position corresponding to the heat-conducting plate of the chip carrier; a dust-proof filter is arranged at a position corresponding to the heat-dissipating hole of the substrate; bolts are arranged at the four corners of the chip carrier, The chip carrier is fixedly connected to the substrate by bolts; the chip mounting grooves are provided with splints on both sides, the two sides of the chip carrier are provided with first screw holes at the positions of the two splints, and the two splints are provided with second screw holes on one side away from each other The first screw hole and the second screw hole are fixedly connected by adjusting bolts; the four corners of the substrate surface are provided with mounting holes, the chip carrier is provided with a plastic cover, and the four corners of the plastic cover are provided with fixing bolts.

Description

A heat-dissipating semiconductor package

technical field

The utility model relates to the technical field of semiconductors, in particular to a heat dissipation type semiconductor package.

Background technique

With the requirements for the miniaturization of electronic products, such as Ball Grid Array (BGA, Ball Grid Array), which can reduce the area of integrated circuits (IC) and have high density and multi-pin characteristics, semiconductor packages have become increasingly popular in the packaging market. One of the mainstream. However, since the semiconductor package has higher density of electronic circuits and electronic components, the heat generated during operation is relatively high; moreover, the semiconductor package has poor thermal conductivity. Therefore, the performance of the semiconductor chip is often affected by the poor heat dissipation efficiency; and the semiconductor package in the prior art can only be used with a semiconductor chip of a fixed size because there is no adjustment mechanism. The scope of application is not large and the practicability is not strong.

Utility model content

The purpose of the present invention is to provide a heat dissipation type semiconductor package to solve the problems raised in the above-mentioned background art.

In order to achieve the above purpose, the present invention provides the following technical solutions: a heat dissipation type semiconductor package, comprising a substrate and a plastic cover; a chip carrier is provided on the surface of the substrate, and a chip mounting groove is provided at the center of the surface of the chip carrier A heat-conducting plate is arranged in the chip mounting groove, and a heat-dissipating hole is arranged at the position corresponding to the heat-conducting plate of the chip carrier; a dust-proof filter screen is arranged at the position corresponding to the heat-dissipating hole of the substrate; Bolts, the chip carrier is fixedly connected to the substrate through bolts; the chip mounting groove is provided with splints on both sides, the two sides of the chip carrier are provided with first screw holes at the positions of the two splints, and the two splints are provided with a second screw on one side away from each other. screw holes, the first screw hole and the second screw hole are fixedly connected by adjusting bolts; the four corners of the substrate surface are provided with mounting holes, the chip carrier is provided with a plastic cover, and the four corners of the plastic cover are provided with fixing bolts , the fixing bolts penetrate the mounting holes to make the plastic cover sheet and the base plate fixedly connected; the surface of the chip carrier is provided with limit rods relative to the upper and lower ends of the chip mounting groove, and the top of the limit rods is clamped and fixed on the bottom surface of the plastic cover sheet.

Preferably, protrusions are arranged symmetrically on both sides of the bottom surface of the heat-conducting plate, and grooves are provided in the chip mounting groove corresponding to the positions of the protrusions; the height of the protrusions is greater than the depth of the grooves; since the height of the protrusions is greater than the depth of the grooves, The bottom surface of the heat-conducting plate is not in direct contact with the bottom surface of the chip mounting groove, thereby increasing the contact area between the heat-conducting plate and the outside air, thereby enhancing the heat dissipation effect of the heat-conducting plate.

Preferably, the bottom end of the splint is provided with a slider, the bottom surface of the chip mounting groove is provided with a chute at the position of the slider, and the splint is slidably connected to the chip mounting groove through the cooperation of the slider and the chute; The sliding connection enables the splint to have a certain adjustment function and can clamp and fix chips of different sizes.

Preferably, a buffer pad is provided on the opposite side of the two splints, and the buffer pad and the surfaces of the two splints are provided with a number of circular holes; the buffer pad can prevent damage caused by friction between the chip and the splint; and the provided circular holes can enhance heat dissipation Effect.

Preferably, an adjustment spring is wound around the outside of the screw portion of the adjustment bolt; the adjustment spring can enhance the fixing effect of the splint.

Compared with the prior art, the beneficial effects of the present utility model are:

1. The utility model can dissipate the heat generated by the chip to the outside air through the cooperation of the heat-conducting plate, the heat-dissipating hole and the dust-proof filter screen, thereby realizing the heat-dissipating function. There are grooves at the positions, and the height of the protrusions is greater than the depth of the grooves, so that the bottom surface of the heat conduction plate is not in direct contact with the bottom surface of the chip mounting groove, which increases the contact area between the heat conduction plate and the outside air, thereby enhancing the heat dissipation effect of the heat conduction plate.

2. In the present invention, a splint and an adjustment bolt are arranged on both sides of the chip mounting groove; the two clamps can clamp and fix the chip placed inside the chip mounting groove, and the adjusting spring wound on the screw position of the adjusting bolt can strengthen the clamping plate. Clamping effect; at the same time, the adjusting bolt also makes the two clamping plates have a certain adjustment function, so that the chip mounting groove can fix chips of different sizes, thereby expanding the application range of the package and enhancing the practicability.

Description of drawings

Fig. 1 is the overall structural representation of the utility model;

FIG. 2 is a schematic diagram of the overall structure of the utility model.

In the figure: 1. Substrate; 2. Chip carrier; 3. Chip mounting slot; 4. Thermal plate; 5. Heat dissipation hole; 6. Dust filter; 7. Plywood; 8. Adjusting bolt; 9. Plastic cover ; 10, adjusting spring; 11, limit rod; 12, slider; 13, chute; 14, protrusion; 15, groove.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the accompanying drawings, only It is for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present invention, it should also be noted that, unless otherwise expressly specified and limited, the terms "arrangement", "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

1-2, the present invention provides a technical solution: a heat dissipation type semiconductor package, comprising a substrate 1 and a plastic cover 9; the surface of the substrate 1 is provided with a chip carrier 2, and the surface of the chip carrier 2 is provided A chip mounting slot 3 is provided at the central position; a thermal conduction plate 4 is arranged in the chip mounting slot 3, and a heat dissipation hole 5 is disposed at the position corresponding to the heat conduction plate 4 of the chip carrier 2; the substrate 1 is disposed at the position corresponding to the heat dissipation hole 5 There is a dust filter 6; the four corners of the chip carrier 2 are provided with bolts, and the chip carrier 2 is fixedly connected to the substrate 1 through bolts; A first screw hole is provided at the position corresponding to the two clamping plates 7 on the side, and a second screw hole is provided on one side of the two clamping plates 7 away from each other, and the first screw hole and the second screw hole are fixedly connected by adjusting bolts 8; the base plate 1 The four corners of the surface are provided with mounting holes, the top of the chip carrier 2 is provided with a plastic cover sheet 9, the four corners of the plastic cover sheet 9 are provided with fixing bolts, and the fixing bolts pass through the mounting holes so that the plastic cover sheet 9 is fixedly connected with the substrate 1; the chip Limiting rods 11 are provided on the surface of the carrier 2 relative to the upper and lower ends of the chip mounting groove 3 , and the top of the limiting rods 11 is snapped and fixed on the bottom surface of the plastic cover sheet 9 .

Further, protrusions 14 are symmetrically provided on both sides of the bottom surface of the heat conducting plate 4, and grooves 15 are provided in the chip mounting groove 3 at positions corresponding to the protrusions 14; the height of the protrusions 14 is greater than the depth of the grooves 15; The height of the heat-conducting plate 4 is greater than the depth of the groove 15, so that the bottom surface of the heat-conducting plate 4 is not in direct contact with the bottom surface of the chip mounting groove 3, thereby increasing the contact area between the heat-conducting plate 4 and the outside air, thereby enhancing the heat dissipation effect of the heat-conducting plate 4.

Further, the bottom end of the splint 7 is provided with a slider 12, the bottom surface of the chip mounting slot 3 is provided with a slide slot 13 at the position corresponding to the slider 12, and the splint 7 slides with the chip mounting slot 3 through the cooperation of the slider 12 and the slide slot 13. Connection: Through the sliding connection between the splint 7 and the chip mounting slot 3, the splint 7 has a certain adjustment function, and can clamp and fix chips of different sizes.

Further, the opposite sides of the two clamping plates 7 are provided with buffer pads, and the buffer pads and the surfaces of the two clamping plates 7 are provided with a number of circular holes; the buffer pads can prevent the chip and the clamping plate 7 from being damaged due to friction; and several circular holes are provided. Can enhance the cooling effect.

Further, an adjusting spring 10 is wound around the outside of the screw portion of the adjusting bolt 8 ; the adjusting spring 10 can enhance the fixing effect of the splint 7 .

Working principle: When in use, the chip is placed in the chip mounting groove 3 set on the surface of the chip carrier 2, and placed on the surface of the thermal conductive plate 4 set in the chip mounting groove 3, and the surface of the thermal conductive plate 4 is provided with an adhesive layer. The adhesive layer is that the heat-conducting plate 4 is in close contact with the chip. After that, the adjusting bolts 8 on both sides of the chip mounting groove 3 are rotated, and the adjusting bolts 8 and the first screw hole and the second screw hole are screwed together to make the two sides of the The splint 7 can slide in the chute 13 provided on the bottom surface of the chip mounting groove 3 through the slider 12, so that the splint 7 on both sides can clamp and fix the chip, and the adjusting spring 10 wound on the outside of the screw part of the adjusting bolt 8 can strengthen the fixing effect. , the buffer pads provided on the opposite sides of the two plywood 7 can prevent damage caused by friction between the chip and the plywood 7; and the adjusting bolt 8 also makes the two plywood 7 have a certain adjustment function, so that the chip mounting groove 3 can be fixed in different sizes The heat conduction plate 4 and the chip mounting groove 3 are fixed by the engagement of the protrusion 14 and the groove 15, the chip carrier 2 is provided with a heat dissipation hole 5 at the position corresponding to the heat dissipation plate, and the substrate 1 corresponds to the position of the heat dissipation hole 5. A dust filter 6 is provided, and the heat generated by the chip can be dissipated to the outside air through the heat conduction plate 4, the heat dissipation hole 5 and the dust filter 6, and since the height of the protrusion 14 is greater than the depth of the groove 15, the heat conduction is reduced. The bottom surface of the board 4 is not in direct contact with the bottom surface of the chip mounting slot 3, thereby increasing the contact area between the thermal conduction plate 4 and the outside air, thereby enhancing the heat dissipation effect of the thermal conduction plate 4; after that, the plastic cover 9 and the substrate 1 are fixed by fixing bolts The chip carrier 2 and the adjusting bolt 8 are encapsulated by the connection, which can not only seal and protect the chip, but also prevent the clamping plate 7 from loosening due to the rotation of the adjusting bolt 8 .

Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention , alternatives and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (5)

1. A heat dissipation type semiconductor package, characterized in that: comprises a base plate (1) and a plastic cover plate (9); a chip bearing piece (2) is arranged on the surface of the substrate (1), and a chip mounting groove (3) is formed in the center of the surface of the chip bearing piece (2); a heat-conducting plate (4) is arranged in the chip mounting groove (3), and heat dissipation holes (5) are formed in the positions, corresponding to the heat-conducting plate (4), of the chip bearing pieces (2); a dustproof filter screen (6) is arranged at the position of the substrate (1) corresponding to the heat dissipation hole (5); bolts are arranged at four corners of the chip bearing piece (2), and the chip bearing piece (2) is fixedly connected with the substrate (1) through the bolts; clamping plates (7) are arranged on two sides of the chip mounting groove (3), first screw holes are formed in positions, corresponding to the two clamping plates (7), of two sides of the chip bearing part (2), second screw holes are formed in sides, away from each other, of the two clamping plates (7), and the first screw holes are fixedly connected with the second screw holes through adjusting bolts (8); mounting holes are formed in four corners of the surface of the substrate (1), a plastic cover plate (9) is arranged above the chip bearing piece (2), fixing bolts are arranged at the four corners of the plastic cover plate (9), and the fixing bolts penetrate through the mounting holes to enable the plastic cover plate (9) to be fixedly connected with the substrate (1); limiting rods (11) are arranged on the surface of the chip bearing piece (2) relative to the upper end and the lower end of the chip mounting groove (3), and the top ends of the limiting rods (11) are clamped and fixed on the bottom surface of the plastic cover plate (9).

2. A heat dissipating semiconductor package in accordance with claim 1, wherein: bulges (14) are symmetrically arranged on two sides of the bottom surface of the heat conducting plate (4), and grooves (15) are arranged in the chip mounting groove (3) corresponding to the bulges (14); the height of the protrusion (14) is larger than the depth of the groove (15).

3. A heat dissipating semiconductor package in accordance with claim 1, wherein: the bottom end of the clamping plate (7) is provided with a sliding block (12), the bottom surface of the chip mounting groove (3) is provided with a sliding groove (13) corresponding to the position of the sliding block (12), and the clamping plate (7) is in sliding connection with the chip mounting groove (3) through the matching of the sliding block (12) and the sliding groove (13).

4. A heat dissipating semiconductor package in accordance with claim 1, wherein: the opposite sides of the two clamping plates (7) are provided with buffer pads, and the surfaces of the buffer pads and the two clamping plates (7) are provided with a plurality of round holes.

5. A heat dissipating semiconductor package in accordance with claim 1, wherein: and an adjusting spring (10) is wound on the outer side of the screw rod part of the adjusting bolt (8).

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