CN213546311U

CN213546311U - Waterproof shell for protecting integrated circuit chip

Info

Publication number: CN213546311U
Application number: CN202120054528.2U
Authority: CN
Inventors: 刘泉
Original assignee: Shandong Aike Electronic Technology Co ltd
Current assignee: Shandong Aike Electronic Technology Co ltd
Priority date: 2021-01-11
Filing date: 2021-01-11
Publication date: 2021-06-25
Anticipated expiration: 2031-01-11

Abstract

The utility model relates to the technical field of integrated circuit chips, in particular to a waterproof shell for protecting an integrated circuit chip, which comprises an integrated circuit chip, wherein the waterproof shell is arranged above the integrated circuit chip, and the bottom end of the waterproof shell is arranged below the integrated circuit chip; four corners of the integrated circuit chip are respectively and fixedly connected with a sleeve, and four sides of the integrated circuit chip are respectively provided with a plurality of pins made of the same material; this waterproof case is used in integrated circuit chip protection, through the waterproof case that sets up in integrated circuit chip outside to and the sealed pad that bonds at the opening part, the water guide board etc. of the cyclic annular arch that sets up in the inverted-convex groove and thermovent outer end, can realize the waterproof effect to integrated circuit chip when carrying out the heat dissipation to integrated circuit chip, and then be favorable to protecting integrated circuit chip, prolong its life.

Description

Waterproof shell for protecting integrated circuit chip

Technical Field

The utility model relates to an integrated circuit chip technical field specifically is a waterproof housing is used in integrated circuit chip protection.

Background

The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring. After an integrated circuit chip is produced, the integrated circuit chip is packaged, but in order to perform heat dissipation treatment on the integrated circuit chip, a pore is left on the package, so that the waterproof performance is not good, the integrated circuit chip is affected, and the service life of the integrated circuit chip is shortened.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a waterproof case is used in integrated circuit chip protection to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a waterproof shell for protecting an integrated circuit chip comprises the integrated circuit chip, wherein the waterproof shell is arranged above the integrated circuit chip, and a bottom plate is arranged at the bottom end of the waterproof shell and below the integrated circuit chip; four corners of the integrated circuit chip are respectively and fixedly connected with a sleeve, and four sides of the integrated circuit chip are respectively provided with a plurality of pins made of the same material; the waterproof structure comprises a waterproof shell, a gasket, a plurality of water guide plates, a plurality of sealing gaskets, a plurality of water guide plates and a plurality of water guide plates, wherein the waterproof shell is provided with a plurality of square openings at the bottom ends of four sides, the sealing gaskets are fixedly bonded on the inner side walls of the openings, the upper surface of the waterproof shell is provided with four inverted convex grooves with the same aperture, and the positions of the side walls at the front side and the rear side of the waterproof shell and the positions of the top ends of the; the upper surface of bottom plate is equipped with four the same height branch, four the top of branch is equipped with the detachable block respectively, the positive convex groove has been seted up to one side that the block is close to branch.

Preferably, the side walls of the front side and the rear side of the waterproof shell and the positions close to the top end of the waterproof shell are respectively provided with a strip-shaped heat dissipation port, and the heat dissipation ports are located in the middle of the inner space of the water guide plate.

Preferably, the inner space of the inverted convex groove is fixedly connected with a circular bulge.

Preferably, the top ends of the four supporting rods and the outer side walls of the four supporting rods are respectively provided with a thread layer, the inner side walls of the regular convex grooves are provided with thread layers, and the cap is in threaded connection with the supporting rods.

Preferably, the distance between the four support rods is the same as the distance between the four inverted convex grooves.

Preferably, a through round hole is formed in the center of the sleeve, and the cross section of the support rod is the same as the aperture of the round hole.

Compared with the prior art, the beneficial effects of the utility model are that:

this waterproof case is used in integrated circuit chip protection, through the waterproof case that sets up in integrated circuit chip outside to and the sealed pad that bonds at the opening part, the water guide board etc. of the cyclic annular arch that sets up in the inverted-convex groove and thermovent outer end, can realize the waterproof effect to integrated circuit chip when carrying out the heat dissipation to integrated circuit chip, and then be favorable to protecting integrated circuit chip, prolong its life.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of a structure of an inter-integrated circuit chip according to the present invention;

fig. 3 is a schematic structural view of the waterproof case of the present invention;

FIG. 4 is an enlarged view of the structure at A in FIG. 3;

fig. 5 is a schematic structural diagram of the middle bottom plate of the present invention.

The various reference numbers in the figures mean:

1. an integrated circuit chip; 11. a sleeve; 12. a pin;

2. a waterproof housing; 200. a heat dissipation port; 21. an opening; 211. a gasket; 22. a reverse convex groove; 220. a protrusion; 23. a water guide plate;

3. a base plate; 31. a strut; 32. capping; 321. a positive convex groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-5, the present invention provides a technical solution:

a waterproof shell for protecting an integrated circuit chip comprises an integrated circuit chip 1, wherein a waterproof shell 2 is arranged above the integrated circuit chip 1, and a bottom plate 3 is arranged at the bottom end of the waterproof shell 2 and below the integrated circuit chip 1; four corners of the integrated circuit chip 1 are respectively and fixedly connected with a sleeve 11, and four sides of the integrated circuit chip 1 are respectively provided with a plurality of pins 12 made of the same material; a plurality of square openings 21 are respectively arranged on the four sides of the waterproof shell 2 and at the bottom end of the waterproof shell, a sealing gasket 211 is fixedly bonded on the inner side wall of each opening 21, four inverted convex grooves 22 with the same aperture are arranged on the upper surface of the waterproof shell 2, and water guide plates 23 with arc-shaped sections are respectively arranged on the side walls of the front side and the rear side of the waterproof shell 2 and at the top end of the side walls; the upper surface of the bottom plate 3 is provided with four supporting rods 31 with the same height, the top ends of the four supporting rods 31 are respectively provided with a detachable cap 32, and one side of the cap 32 close to the supporting rods 31 is provided with a positive convex groove 321.

In this embodiment, the side walls of the front and rear sides of the waterproof housing 2 and the positions close to the top end thereof are respectively provided with the strip-shaped heat dissipation openings 200, and the heat dissipation openings 200 are located at the middle positions of the inner space of the water guide plate 23, so that the integrated circuit chip 1 is cooled while water is prevented from entering the waterproof housing 2 through the arc-shaped water guide plate 23 arranged at the heat dissipation openings 200.

In addition, the inner space of the inverse convex groove 22 is fixedly connected with the circular-ring-shaped bulge 220, and the arranged bulge 220 can effectively prevent water from entering the waterproof shell 2 from the gap between the inverse convex groove 22 and the cover cap 32.

Further, the top of four branches 31 and be located and be equipped with the screw thread layer on its lateral wall respectively, be equipped with the screw thread layer on the inside wall of positive convex groove 321, and threaded connection between block 32 and the branch 31, through threaded connection's mode, can avoid water to get into from the bottom of waterproof shell 2 with bottom plate 3 fixed mounting in the bottom of waterproof shell 2.

Specifically, the distance between the four support rods 31 is the same as the distance between the four inverse convex grooves 22, so that the four support rods 31 are respectively matched with the four inverse convex grooves 22 in an inserting manner.

It is worth noting that the central position of the sleeve 11 is provided with an upper through round hole and a lower through round hole, the cross-sectional dimension of the support rod 31 is the same as the aperture dimension of the round hole, when the support rod 31 is matched with the sleeve 11 in an inserting manner, the outer side wall of the support rod 31 is attached to the inner side wall of the sleeve 11, so that the integrated circuit chip 1 is limited, and the integrated circuit chip is prevented from displacement.

When the waterproof housing for protecting the integrated circuit chip is installed, the waterproof housing 2 is firstly placed above the integrated circuit chip 1, each pin 12 is positioned in the opening 21, then the supporting rod 31 on the bottom plate 3 is aligned to the sleeve 11, the supporting rod 31 is in inserted fit with the sleeve 11, meanwhile, the top end of the supporting rod 31 penetrates through the inverted convex groove 22, at the moment, the cap 32 is in threaded connection with the top end of the supporting rod 31, and the waterproof housing can be used after being installed; when using, the heat dissipation processing is carried out to the heat that integrated circuit chip 1 work produced to thermovent 200 on the usable waterproof case 2, and through sealed pad 211, the protruding 220 and the water guide plate 23 etc. that set up on the inverted-convex groove 22 that bond on opening 21, can prevent effectively that water from entering into waterproof case 2 inside, influence integrated circuit chip 1 work, and then be favorable to protecting integrated circuit chip 1, prolong its life.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A waterproof housing for protecting an integrated circuit chip, comprising an integrated circuit chip (1), characterized in that: a waterproof shell (2) is arranged above the integrated circuit chip (1), and a bottom plate (3) is arranged at the bottom end of the waterproof shell (2) and below the integrated circuit chip (1); four corners of the integrated circuit chip (1) are respectively and fixedly connected with sleeves (11), and four sides of the integrated circuit chip (1) are respectively provided with a plurality of pins (12) made of the same material; a plurality of square openings (21) are respectively formed in the positions, located at the bottom ends, of the four sides of the waterproof shell (2), sealing gaskets (211) are fixedly bonded on the inner side walls of the openings (21), four inverted convex grooves (22) with the same aperture are formed in the upper surface of the waterproof shell (2), and water guide plates (23) with arc-shaped sections are respectively arranged on the positions, located at the top ends, of the side walls of the front side and the back side of the waterproof shell (2); the upper surface of bottom plate (3) is equipped with four spinal branch (31) of the same height, four the top of branch (31) is equipped with detachable block (32) respectively, positive convex groove (321) have been seted up to one side that block (32) are close to branch (31).

2. The waterproof housing for protecting an integrated circuit chip as recited in claim 1, wherein: the side walls of the front side and the rear side of the waterproof shell (2) are respectively provided with a strip-shaped heat dissipation opening (200) at the position close to the top end of the side walls, and the heat dissipation openings (200) are located in the middle of the inner space of the water guide plate (23).

3. The waterproof housing for protecting an integrated circuit chip as recited in claim 1, wherein: the inner space of the inverted convex groove (22) is fixedly connected with a circular bulge (220).

4. The waterproof housing for protecting an integrated circuit chip as recited in claim 1, wherein: the top ends of the four supporting rods (31) are respectively provided with a thread layer on the outer side wall, the inner side wall of the regular convex groove (321) is provided with a thread layer, and the cover cap (32) is in threaded connection with the supporting rods (31).

5. The waterproof housing for protecting an integrated circuit chip as recited in claim 1, wherein: the space between the four support rods (31) is the same as the space between the four inverse convex grooves (22).

6. The waterproof housing for protecting an integrated circuit chip as recited in claim 1, wherein: the central position of sleeve (11) is equipped with the through round hole from top to bottom, just the cross-sectional dimension of branch (31) is the same with the aperture size of round hole.