CN114190018B - Integrated circuit chip with self-protection structure - Google Patents
Integrated circuit chip with self-protection structure Download PDFInfo
- Publication number
- CN114190018B CN114190018B CN202111412310.0A CN202111412310A CN114190018B CN 114190018 B CN114190018 B CN 114190018B CN 202111412310 A CN202111412310 A CN 202111412310A CN 114190018 B CN114190018 B CN 114190018B
- Authority
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- China
- Prior art keywords
- circuit board
- integrated circuit
- heat exchange
- shell
- protective shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000001681 protective effect Effects 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 29
- 238000001816 cooling Methods 0.000 abstract description 10
- 238000010030 laminating Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 10
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Abstract
The invention discloses an integrated circuit chip with a self-protection structure, which belongs to the technical field of integrated circuit chips and comprises a circuit board, wherein a protective shell is arranged in the middle of the top surface of the circuit board, an integrated circuit board chip is arranged in the protective shell, a heat exchange component is arranged above the protective shell, an exhaust component is arranged above the heat exchange component, and the protective shell is fixedly clamped on the top surface of the circuit board through a clamping and mounting component; through setting up the heat exchange component, when the inside integrated circuit board chip of protecting crust uses for a long time, heat transmission arrives the surface of protecting crust, because the bottom surface of heat transfer board and the top surface laminating of protecting crust, therefore the heat can pour into on the heat transfer board, realize the little partner of heat transfer to the inside integrated circuit board chip of protecting crust, carry out heat transfer cooling to the inside integrated circuit board chip of protecting crust to the inside integrated circuit board chip that uses for a long time of protecting crust carries out effective cooling refrigerated purpose.
Description
Technical Field
The present invention relates to the field of integrated circuit chip technology, and more particularly, to an integrated circuit chip with a self-protection structure.
Background
With the rapid development of science and technology and the increasing application requirements of digital circuits, integrated circuit manufacturers actively adopt new technologies, improved design schemes and production processes, and make continuous efforts along the directions of improving speed, reducing power consumption and reducing size, so that new products with various models are continuously introduced, but the existing integrated circuit chips still have some problems when in use.
If the existing integrated circuit chip generates a large amount of heat during use, especially after long-time use, the existing integrated circuit chip is directly installed and has no protection function, so that the heat of the integrated circuit chip cannot be discharged after long-time use, and the integrated circuit chip cannot be subjected to effective heat exchange, and finally the integrated circuit chip is damaged.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide an integrated circuit chip with a self-protection structure, which has the characteristic that the integrated circuit chip can simultaneously cool down and cool down the heat exchange component when the heat exchange component exchanges heat with the integrated circuit board chip inside the protective shell.
In order to achieve the above purpose, the present invention provides the following technical solutions:
The integrated circuit chip with the self-protection structure comprises a circuit board, wherein a protection shell is arranged in the middle of the top surface of the circuit board, an integrated circuit board chip is arranged in the protection shell, a heat exchange component is arranged above the protection shell, an exhaust component is arranged above the heat exchange component, and the protection shell is fixedly clamped on the top surface of the circuit board through a clamping and mounting component; the heat exchange assembly comprises a heat exchange plate, wherein a plurality of heat extraction grooves are formed in the surfaces of the upper side and the lower side of the heat exchange plate, the heat extraction grooves are formed in an equidistant mode, a square through hole is formed in one side surface of the heat exchange plate in a penetrating mode, a copper plate is fixedly clamped in the square through hole, extension plates are fixedly connected to the two ends of the copper plate, the inner wall of the extension plates is attached to the outer wall of a protective shell, clamping grooves are formed in the surfaces of the two sides of the protective shell, and the bottom surface of the heat exchange plate is fixedly connected with the top surface of the protective shell;
Through adopting above-mentioned technical scheme, through setting up the heat transfer subassembly, because the heat transfer subassembly hugs closely the protecting crust setting, after the inside integrated circuit board chip of protecting crust uses for a long time, alright carry out effectual heat transfer to the protecting crust through the heat transfer subassembly to realize carrying out effectual cooling heat dissipation to the inside integrated circuit board chip of protecting crust.
Further, the bottom surface both ends of heat exchange plate all fixedly connected with connecting plate, the bottom surface of connecting plate all fixedly connected with joint board, joint board joint is in the inside of joint groove.
Through adopting above-mentioned technical scheme, through setting up joint groove and joint board, the inside that accessible joint board joint to the connecting plate carries out effectual fixed mounting to heat exchange assembly.
Further, exhaust subassembly includes the laminating board, laminating board fixed connection is at the top surface of heat transfer board, two mounting holes have been run through respectively to the top surface of laminating board, two the inside of mounting hole has all fixedly cup jointed fixed sleeve, fixed telescopic inside is provided with the exhaust fan.
Through adopting above-mentioned technical scheme, through setting up exhaust subassembly, through starting the exhaust fan, carry out effectual blowing to the hot air around the heat exchange subassembly to the whole cooling of heat exchange subassembly has guaranteed the sustainable purpose of carrying out the heat transfer to the protecting crust of heat exchange subassembly.
Further, the outer surface of the fixed sleeve is movably sleeved with a sleeve, and a dustproof net is fixedly arranged in the sleeve.
Through adopting above-mentioned technical scheme, through setting up fixed sleeve, when using, prevent that the dust from entering into heat exchange assembly's inside through the rotation of exhaust fan to influence heat exchange assembly's heat transfer effect.
Further, the protecting crust comprises a waterproof crust, a dustproof crust is connected to one side surface of the waterproof crust, a buffer crust is connected to one side surface of the dustproof crust, and a protective shell is fixedly connected to one side surface of the buffer crust.
Through adopting above-mentioned technical scheme, through setting up the protecting crust, can effectually carry out effectual protection to integrated circuit board chip, and make the inside integrated circuit board chip of protecting crust have good waterproof performance.
Further, the electric connection wires are fixedly connected to the peripheral surfaces of the integrated circuit board chip, a plurality of round through holes are formed in the peripheral surfaces of the protective shell, the positions of the round through holes are corresponding to the electric connection wires, the electric connection wires extend to the outer side of the protective shell through the round through holes, and the electric connection wires are copper-aluminum mixed wires.
Through adopting above-mentioned technical scheme, be aluminium iron mixed silk through the electric connection silk, the fusing point of aluminium is low, and when the circuit board took place the short circuit, the electric connection silk can automatic fusing, prevents that integrated circuit board chip from burning out, reduces the loss.
Further, the clamping installation assembly comprises a clamping frame, the clamping frame is fixedly connected to the middle of the top surface of the circuit board, threaded holes are formed in the peripheral surface of the clamping frame, and bolts are movably sleeved in the threaded holes.
Through adopting above-mentioned technical scheme, through setting up integrated circuit board chip, can convenient and fast and stable with the fixed joint of protecting crust at the top surface of circuit board.
In summary, the invention has the following beneficial effects:
1. Through setting up the heat exchange component, when the inside integrated circuit board chip of protecting crust uses for a long time, heat transmission arrives the surface of protecting crust, because the bottom surface of heat transfer board and the top surface laminating of protecting crust, therefore the heat can pour into on the heat transfer board, realize the little partner of heat transfer to the inside integrated circuit board chip of protecting crust, carry out heat transfer cooling to the inside integrated circuit board chip of protecting crust, thereby realized carrying out effective cooling refrigerated purpose to the inside integrated circuit board chip that uses of protecting crust for a long time, the inside integrated circuit board chip of protecting crust uses the unable discharge of heat for a long time so the problem of damage has been avoided.
2. Through setting up exhaust subassembly, after the heat exchange of heat exchange assembly to the inside integrated circuit board chip of protecting crust accomplishes, start through the exhaust fan, then cool off heat exchange assembly dispels the heat, cool off heat exchange assembly's heat through the rotation of exhaust fan for heat exchange assembly is better to the heat transfer effect of the inside integrated circuit board chip of protecting crust, thereby realized carrying out cooling's purpose to heat exchange assembly simultaneously when heat exchange assembly carries out the heat transfer to the inside integrated circuit board chip of protecting crust, avoided heat exchange assembly heat can't discharge the problem of being not ideal to the inside integrated circuit board chip heat transfer effect of protecting crust after the heat transfer.
3. After the electric connection wire is electrically connected with the circuit board, if the circuit board is short-circuited, the high temperature with the high temperature can be generated, and the electric connection wire is the copper-aluminum mixed wire and has a low melting point, so that the electric connection wire can be automatically fused under the high temperature to prevent the chip of the integrated circuit board from being damaged, thereby realizing the purpose that the chip of the integrated circuit board has a certain self-protection function, and avoiding the problem that the chip of the integrated circuit board is more lost due to the short circuit along with the circuit board.
Drawings
FIG. 1 is a schematic view of the overall isometric structure of the present invention;
FIG. 2 is a schematic diagram of an integrated circuit chip according to the present invention;
FIG. 3 is a schematic view of a heat exchange assembly according to the present invention;
FIG. 4 is a schematic view of the structure of the exhaust assembly according to the present invention;
FIG. 5 is a schematic cross-sectional view of a protective shell according to the present invention.
In the figure:
1. A circuit board; 2. a protective shell; 201. a waterproof case; 202. a dust-proof case; 203. a buffer case; 204. a protective shell; 3. a heat exchange assembly; 301. a heat exchange plate; 302. a heat extraction tank; 303. square through holes; 304. copper plate; 305. an extension plate; 4. an exhaust assembly; 401. bonding plates; 402. a mounting hole; 403. a fixed sleeve; 404. an exhaust fan; 405. a sleeve joint cylinder; 406. a dust screen; 5. clamping the mounting assembly; 501. a clamping frame; 502. a threaded hole; 503. a bolt; 6. an integrated circuit board chip; 7. an electrical connection wire; 8. a circular through hole; 9. a clamping groove; 10. a connecting plate; 11. and a clamping plate.
Detailed Description
Examples:
the invention is described in further detail below with reference to fig. 1-5.
Referring to fig. 1-5, the present invention provides a technical solution: 1-5, an integrated circuit chip with a self-protection structure comprises a circuit board 1, wherein a protective shell 2 is arranged in the middle of the top surface of the circuit board 1, an integrated circuit board chip 6 is arranged in the protective shell 2, a heat exchange component 3 is arranged above the protective shell 2, an exhaust component 4 is arranged above the heat exchange component 3, and the protective shell 2 is fixedly clamped on the top surface of the circuit board 1 through a clamping and mounting component 5; the heat exchange assembly 3 comprises a heat exchange plate 301, wherein a plurality of heat extraction grooves 302 are formed in the surfaces of the upper side and the lower side of the heat exchange plate 301, the heat extraction grooves 302 are formed in an equidistant mode, a square through hole 303 is formed in a penetrating mode in one side surface of the heat exchange plate 301, a copper plate 304 is fixedly clamped in the square through hole 303, extension plates 305 are fixedly connected to the two ends of the copper plate 304, the inner wall of the extension plates 305 is attached to the outer wall of the protective shell 2, clamping grooves 9 are formed in the surfaces of the two sides of the protective shell 2, and the bottom surface of the heat exchange plate 301 is fixedly connected with the top surface of the protective shell 2; the two ends of the bottom surface of the heat exchange plate 301 are fixedly connected with connecting plates 10, the bottom surfaces of the connecting plates 10 are fixedly connected with clamping plates 11, and the clamping plates 11 are clamped in the clamping grooves 9; the periphery surface of the integrated circuit board chip 6 is fixedly connected with electric connecting wires 7, the periphery surface of the protective shell 2 is provided with a plurality of circular through holes 8, the positions of the circular through holes 8 are corresponding to the electric connecting wires 7, the electric connecting wires 7 extend to the outer side of the protective shell 2 through the circular through holes 8, and the electric connecting wires 7 are copper-aluminum mixed wires; the clamping and mounting assembly 5 comprises a clamping frame 501, the clamping frame 501 is fixedly connected to the middle of the top surface of the circuit board 1, threaded holes 502 are formed in the peripheral surface of the clamping frame 501, and bolts 503 are movably sleeved in the threaded holes 502;
In this embodiment, through setting up heat exchange component 3, after the inside integrated circuit board chip 6 of protection shell 2 uses the heat generation for a long time, the heat can be transmitted to the surface of protection shell 2, then because heat exchange plate 301 is hugged closely with the top surface of protection shell 2, so can absorb the heat of protection shell 2, thereby carry out the heat transfer to the inside integrated circuit board chip 6 of protection shell 2, reduce the temperature of the inside integrated circuit board chip 6 of protection shell 2, and through setting up copper 304 and extension board 305, the both sides surface contact of extension board 305 and protection shell 2, simultaneously follow heat exchange plate 301 and carry out the heat transfer to protection shell 2 together, further increase the effect of heat transfer, make the cooling heat transfer effect to the inside integrated circuit board chip 6 of protection shell 2 better, through setting up, joint groove 9 and connecting plate 10, when installing heat exchange component 3, only need with connecting plate 10 along the inside of joint groove 9 can accomplish the fixed mounting of heat exchange component 3, through setting up centre gripping installation component 5, when carrying out fixed mounting to protection shell 2, firstly with a plurality of screw holes follow inside of screw hole 503 out the inside of protection shell 2, then screw in the inside of protection shell 2 from the inside 502 of a plurality of screw 502, the inside of the frame 502 is screwed into the inside of protection shell 503, the frame is accomplished gradually, the inside the installation is completed, and the inside of the protection shell is screwed 502 is screwed into the inside the frame 502, and the inside the frame 502.
As shown in fig. 4, the exhaust assembly 4 includes a bonding plate 401, the bonding plate 401 is fixedly connected to the top surface of the heat exchange plate 301, two mounting holes 402 are respectively formed in the top surface of the bonding plate 401 in a penetrating manner, fixing sleeves 403 are fixedly sleeved in the two mounting holes 402, and an exhaust fan 404 is arranged in the fixing sleeves 403; the outer surface of the fixed sleeve 403 is movably sleeved with a sleeve 405, and a dustproof net 406 is fixedly arranged in the sleeve 405;
In this embodiment, through setting up exhaust subassembly 4, after the heat transfer of heat transfer subassembly 3 to the inside integrated circuit board chip 6 of protecting crust 2 is accomplished, through the start-up of exhaust fan 404, then dispel the heat cooling to heat transfer subassembly 3, cool off the heat of heat transfer subassembly 3 through the rotation of exhaust fan 404 for heat transfer subassembly 3 is better to the heat transfer effect of the inside integrated circuit board chip 6 of protecting crust 2.
As shown in fig. 5, the protection shell 2 includes a waterproof shell 201, a dustproof shell 202 is connected to one side surface of the waterproof shell 201, a buffer shell 203 is connected to one side surface of the dustproof shell 202, and a protection shell 204 is fixedly connected to one side surface of the buffer shell 203;
In this embodiment, through setting up waterproof shell 201, can play good water-proof effects to integrated circuit board chip 6, waterproof shell 201 is waterproof plastic case, through setting up dustproof shell 202, the shell carries out effectual dustproof effects to integrated circuit board chip 6, through setting up buffer shell 203 and protective housing 204, multiplicable protective effect to integrated circuit board chip 6, takes place to drop and the problem of damage when avoiding integrated circuit board chip 6 to reinstallate.
Working principle: when the heat exchange component 3 is installed, the heat exchange plate 301 is tightly attached to the top surface of the protective shell 2 only by inserting the connecting plate 10 into the clamping groove 9, after the heat exchange component 3 is installed, after the integrated circuit board chip 6 in the protective shell 2 generates heat for a long time, the heat can be transmitted to the surface of the protective shell 2, then the heat exchange plate 301 is tightly attached to the top surface of the protective shell 2, so that the heat of the protective shell 2 can be absorbed, and the heat exchange can be performed on the integrated circuit board chip 6 in the protective shell 2, the temperature of the integrated circuit board chip 6 inside the protective shell 2 is reduced, the copper plate 304 is arranged to be in contact with the extension plates 305, the extension plates 305 are in contact with the two side surfaces of the protective shell 2, and meanwhile, the heat exchange plate 301 is used for carrying out heat exchange on the protective shell 2, the heat exchange effect is further increased, then after the heat exchange of the heat exchange component 3 on the integrated circuit board chip 6 inside the protective shell 2 is completed, the heat exchange component 3 is subjected to heat dissipation and cooling through the starting of the exhaust fan 404, the heat of the heat exchange component 3 is cooled through the rotation of the exhaust fan 404, so that the heat exchange effect of the heat exchange component 3 on the integrated circuit board chip 6 inside the protective shell 2 is better, after the electric connection wire 7 is electrically connected with the circuit board 1, if the circuit board 1 is short-circuited, high temperature with extremely high temperature is generated, because the electric connection wire 7 is a copper-aluminum mixed wire and the melting point is low, the electrical connection wires 7 are automatically fused at high temperature to prevent the integrated circuit board chip 6 from being damaged.
The present embodiment is only for explanation of the present invention and is not to be construed as limiting the present invention, and modifications to the present embodiment, which may not creatively contribute to the present invention as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present invention.
Claims (3)
1. An integrated circuit chip with self-protection structure, comprising a circuit board (1), characterized in that: the circuit board is characterized in that a protective shell (2) is arranged in the middle of the top surface of the circuit board (1), an integrated circuit board chip (6) is arranged in the protective shell (2), a heat exchange component (3) is arranged above the protective shell (2), an exhaust component (4) is arranged above the heat exchange component (3), and the protective shell (2) is fixedly clamped on the top surface of the circuit board (1) through a clamping and mounting component (5);
The heat exchange assembly (3) comprises a heat exchange plate (301), a plurality of heat extraction grooves (302) are formed in the surfaces of the upper side and the lower side of the heat exchange plate (301), a plurality of heat extraction grooves (302) are formed in an equidistant mode, square through holes (303) are formed in the penetrating mode in one side surface of the heat exchange plate (301), copper plates (304) are fixedly clamped in the square through holes (303), extension plates (305) are fixedly connected to the two ends of the copper plates (304), the inner walls of the extension plates (305) are attached to the outer wall of a protective shell (2), clamping grooves (9) are formed in the surfaces of the two sides of the protective shell (2), and the bottom surface of the heat exchange plate (301) is fixedly connected with the top surface of the protective shell (2);
The two ends of the bottom surface of the heat exchange plate (301) are fixedly connected with connecting plates (10), the bottom surfaces of the connecting plates (10) are fixedly connected with clamping plates (11), and the clamping plates (11) are clamped in the clamping grooves (9);
The exhaust assembly (4) comprises a bonding plate (401), the bonding plate (401) is fixedly connected to the top surface of the heat exchange plate (301), two mounting holes (402) are respectively formed in the top surface of the bonding plate (401) in a penetrating mode, fixing sleeves (403) are fixedly sleeved in the two mounting holes (402), and exhaust fans (404) are arranged in the fixing sleeves (403);
The outer surface of the fixed sleeve (403) is movably sleeved with a sleeve (405), and a dust screen (406) is fixedly arranged in the sleeve (405);
The protection shell (2) comprises a waterproof shell (201), a dustproof shell (202) is connected to one side surface of the waterproof shell (201), a buffer shell (203) is connected to one side surface of the dustproof shell (202), and a protection shell (204) is fixedly connected to one side surface of the buffer shell (203).
2. An integrated circuit chip with self-protection structure according to claim 1, wherein: the integrated circuit board chip (6) all fixedly connected with electricity connecting wire (7) on the surface all around, a plurality of circular through-holes (8) have all been seted up on the surface all around of protecting crust (2), and is a plurality of the position that circular through-hole (8) were seted up corresponds with electric connecting wire (7), electric connecting wire (7) extend to the outside of protecting crust (2) through circular through-hole (8), electric connecting wire (7) are copper aluminium mixed silk.
3. An integrated circuit chip with self-protection structure according to claim 1, wherein: the clamping installation assembly (5) comprises a clamping frame (501), the clamping frame (501) is fixedly connected to the middle of the top surface of the circuit board (1), threaded holes (502) are formed in the peripheral surface of the clamping frame (501), and bolts (503) are movably sleeved in the threaded holes (502).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111412310.0A CN114190018B (en) | 2021-11-25 | 2021-11-25 | Integrated circuit chip with self-protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111412310.0A CN114190018B (en) | 2021-11-25 | 2021-11-25 | Integrated circuit chip with self-protection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114190018A CN114190018A (en) | 2022-03-15 |
| CN114190018B true CN114190018B (en) | 2024-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111412310.0A Active CN114190018B (en) | 2021-11-25 | 2021-11-25 | Integrated circuit chip with self-protection structure |
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| CN (1) | CN114190018B (en) |
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| CN200987252Y (en) * | 2006-11-17 | 2007-12-05 | 东莞市通旺达五金制品有限公司 | Pipe-type radiator |
| CN206742224U (en) * | 2017-03-22 | 2017-12-12 | 东莞市鑫东欣实业有限公司 | A kind of heat-conducting silica gel sheet for DVR master chips |
| CN208314716U (en) * | 2018-07-05 | 2019-01-01 | 湖南涉外经济学院 | A kind of heat sink for computer |
| CN210641137U (en) * | 2019-07-22 | 2020-05-29 | 广州市晶硅光电科技有限公司 | Integrated circuit chip with self-protection mechanism |
| CN110737313A (en) * | 2019-09-18 | 2020-01-31 | 四川豪威尔信息科技有限公司 | buffer in ultra-low power consumption integrated circuit |
| CN210823665U (en) * | 2019-11-14 | 2020-06-23 | 青海高等职业技术学院(海东市中等职业技术学校) | Insulating protection device for electronic device |
| CN210955084U (en) * | 2020-03-02 | 2020-07-07 | 重庆三峡学院 | Embedded single-board computer chip protection structure |
| CN214099619U (en) * | 2020-12-16 | 2021-08-31 | 西安巨舟电子设备有限公司 | Packaging hardware is used in electronic equipment production |
| CN112631385A (en) * | 2020-12-18 | 2021-04-09 | 深圳忆数存储技术有限公司 | Computer storage hard disk with good heat dissipation effect and use method thereof |
| CN213546311U (en) * | 2021-01-11 | 2021-06-25 | 山东爱克斯电子科技有限公司 | Waterproof shell for protecting integrated circuit chip |
| CN214155222U (en) * | 2021-01-19 | 2021-09-07 | 苏州合恩机电有限公司 | Heat dissipation device for low-voltage cabinet circuit board |
| CN214592135U (en) * | 2021-04-15 | 2021-11-02 | 南京特创电子科技有限公司 | Multilayer printed circuit board capable of quickly radiating heat |
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