CN212677619U

CN212677619U - LCC cooling device

Info

Publication number: CN212677619U
Application number: CN202021913971.2U
Authority: CN
Inventors: 陈智娇; 张�杰
Original assignee: Suzhou Hanglin Machinery Manufacturing Co ltd
Current assignee: Suzhou Hanglin Machinery Manufacturing Co ltd
Priority date: 2020-09-04
Filing date: 2020-09-04
Publication date: 2021-03-09
Anticipated expiration: 2030-09-04

Abstract

The utility model discloses a LCC cooling device, which comprises a shell, a top plate is fixedly arranged on the shell, a first through hole is arranged on the top plate, a fan is fixedly arranged in the first through hole, a temperature sensor and a controller are respectively and fixedly arranged at the lower end of the top plate, the controller is respectively and electrically connected with the fan and the temperature sensor through wires, a chip is welded at the bottom of the shell, the two ends of the chip are respectively and electrically connected with the inner part of the shell through metal wires, a box body is fixedly arranged in the shell, cooling liquid is arranged in the box body, a second through hole is arranged at one side of the box body, a heat conducting rod is fixedly connected with the side part of the chip, one end of the heat conducting rod penetrates through the second through hole and is hermetically arranged in the box body, the utility model adopts two heat dissipation modes to simultaneously carry out heat dissipation and cooling on the, the heat dissipation effect of the equipment is greatly improved, and the service life of the equipment is prolonged.

Description

LCC cooling device

Technical Field

The utility model relates to a cooling arrangement technical field specifically is a LCC cooling device.

Background

Along with the development of science and technology, the information processing technology is more advanced, the memory of the former computer is not only small, but also large in size and occupies a large space, the size of a chip is smaller and smaller in recent years, the function is more and more powerful, the chip is mostly installed at present by adopting LCC packaging, the LCC packaging is designed aiming at the pin-free chip packaging, the packaging adopts surface mounting type packaging, pins of the chip are inwards bent at the edge of the chip step by step and are tightly attached to the chip, and the installation size is reduced.

However, in the prior art, the chip generates heat during operation, and the effect of heat dissipation treatment on the LCC is not good at present, so that the chip operates in a high-temperature environment, the service life of the chip is shortened, and equipment paralysis may be caused in a serious case, and therefore, an LCC cooling device needs to be provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LCC cooling device adopts two kinds of radiating modes to dispel the heat the cooling to LCC simultaneously, has improved the radiating effect of equipment greatly, has prolonged the life of equipment to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LCC cooling device, includes the shell, fixed mounting has the roof on the shell, first through-hole has been seted up on the roof, fixed mounting has the fan in the first through-hole, the lower extreme of roof fixed mounting has temperature-sensing ware and controller respectively, the controller passes through wire electric connection with fan and temperature-sensing ware respectively, the bottom welding of shell has the chip, the inside electric connection of wire and shell is passed through respectively at the both ends of chip, the inside fixed mounting of shell has the box, the inside of box is provided with the coolant liquid, the second through-hole has been seted up to one side of box, the lateral part fixedly connected with heat conduction stick of chip, the one end of heat conduction stick runs through second through-hole seal mounting in the inside of box, the louvre has been seted up to the lateral wall of shell.

Preferably, the box body is provided with two groups, and the two groups of box bodies are respectively positioned on two sides of the chip.

Preferably, the top of the box body is communicated with a liquid inlet, and a sealing cover is hermetically arranged on the liquid inlet.

Preferably, the surface of the box body is provided with an insulating coating, and the heat conducting rod is an L-shaped heat conducting rod.

Preferably, at least six groups of heat dissipation holes are formed, and the six groups of heat dissipation holes are arranged in an array.

Preferably, the heat dissipation holes are obliquely arranged.

Compared with the prior art, the beneficial effects of the utility model are that:

through the fan, the louvre, the design of heat conduction stick and coolant liquid, when the inside high temperature of shell, the controller is given with this signal to the temperature-sensing ware, controller control fan starts, blow toward the inside of shell, and the heat flows from the louvre, owing to be provided with the multiunit louvre, the radiating effect has been increased, the heat transfer that the chip produced is to the heat conduction stick, because the inside of box is provided with the coolant liquid, the one end of heat conduction stick is located the inside coolant liquid of box, the coolant liquid can absorb the heat on the heat conduction stick, further reduce the heat of chip, the utility model discloses a two kinds of radiating modes are dispelled the heat the cooling to LCC simultaneously, have improved the radiating effect of equipment greatly, have prolonged the life of equipment.

Drawings

Fig. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a schematic structural view of the case, the heat conducting rod and the chip of the present invention;

fig. 3 is a schematic structural view of the housing and the heat dissipation holes of the present invention.

In the figure: 1. a housing; 2. heat dissipation holes; 3. an insulating coating; 4. a top plate; 5. a fan; 6. a first through hole; 7. a temperature sensor; 8. a controller; 9. a metal wire; 10. a heat conducting rod; 11. a chip; 12. a box body; 13. cooling liquid; 14. a second through hole; 15. a liquid inlet; 16. and (7) sealing the cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an LCC cooling device comprises a shell 1, wherein a top plate 4 is fixedly installed on the shell 1, a first through hole 6 is formed in the top plate 4, a fan 5 is fixedly installed in the first through hole 6, the fan 5 blows air to the inside of the shell 1, a temperature sensor 7 and a controller 8 are respectively and fixedly installed at the lower end of the top plate 4, the controller 8 is respectively and electrically connected with the fan 5 and the temperature sensor 7 through leads, when the temperature sensor 7 detects that the temperature in the shell 1 is overhigh, a signal is transmitted to the controller 8, the controller 8 controls the fan 5 to be started, air is blown to the inside of the shell 1, and heat flows out of a heat dissipation hole 2;

the bottom of the shell 1 is welded with a chip 11, two ends of the chip 11 are electrically connected with the inner wall of the shell 1 through metal wires 9 respectively, box bodies 12 are fixedly mounted inside the shell 1, the box bodies 12 are provided with two groups, the two groups of box bodies 12 are respectively positioned on two sides of the chip 11, the number of cooling mechanisms is increased, the cooling effect is improved, the top of each box body 12 is communicated with a liquid inlet 15, cooling liquid 13 is convenient to fill, a sealing cover 16 is hermetically mounted on each liquid inlet 15, the cooling liquid 13 is prevented from leaking, an insulating coating 3 is arranged on the surface of each box body 12, and the insulating coating 3 is arranged to be a ceramic coating to;

the inside of box 12 is provided with coolant liquid 13, second through-hole 14 has been seted up to one side of box 12, chip 11's lateral part fixedly connected with heat conduction stick 10, heat conduction stick 10 sets up the heat conduction stick into L shape, be convenient for heat conduction stick 10 contacts coolant liquid 13, the one end of heat conduction stick 10 runs through the inside of second through-hole 14 seal installation in box 12, and heat conduction stick 10 and the contact of coolant liquid 13, louvre 2 has been seted up to the lateral wall of shell 1, six groups have been seted up at least to louvre 2, and six groups of louvre 2 are the array setting, be convenient for the heat dissipation, louvre 2 sets up the louvre that sets up to the slope, prevent that the.

The working principle is as follows: when the device is used, when the temperature in the shell 1 is too high, the temperature sensor 7 transmits the signal to the controller 8, the controller 8 controls the fan 5 to start, air is blown into the shell 1, and heat flows out of the heat dissipation holes 2, the heat dissipation effect is improved due to the arrangement of the plurality of groups of heat dissipation holes 2, and the heat dissipation holes 2 are obliquely arranged, so that external dust can be reduced from entering the shell 1;

when fan 5 is in operation, the heat transfer that chip 11 produced is to heat conduction stick 10, because the inside of box 12 is provided with coolant liquid 13, the one end of heat conduction stick 10 is located the inside coolant liquid 13 of box 12, and coolant liquid 13 can absorb the heat on the heat conduction stick 10, further reduces the heat of chip 11, and is better to the refrigerated effect of equipment.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An LCC cooling device comprising a housing (1), characterized in that: the heat-conducting type solar water heater is characterized in that a top plate (4) is fixedly installed on the shell (1), a first through hole (6) is formed in the top plate (4), a fan (5) is fixedly installed in the first through hole (6), a temperature sensor (7) and a controller (8) are fixedly installed at the lower end of the top plate (4) respectively, the controller (8) is electrically connected with the fan (5) and the temperature sensor (7) through wires respectively, a chip (11) is welded at the bottom of the shell (1), two ends of the chip (11) are electrically connected with the inner wall of the shell (1) through metal wires (9), a box body (12) is fixedly installed inside the shell (1), cooling liquid (13) is arranged inside the box body (12), a second through hole (14) is formed in one side of the box body (12), and a heat-conducting rod (10) is fixedly connected to the side portion of the chip (11), one end of the heat conducting rod (10) penetrates through the second through hole (14) and is hermetically installed in the box body (12), and the side wall of the shell (1) is provided with a heat radiating hole (2).

2. An LCC cooling apparatus according to claim 1, wherein: the two sets of the box bodies (12) are arranged, and the two sets of the box bodies (12) are respectively positioned on two sides of the chip (11).

3. An LCC cooling apparatus according to claim 1, wherein: the top of the box body (12) is communicated with a liquid inlet (15), and a sealing cover (16) is hermetically arranged on the liquid inlet (15).

4. An LCC cooling apparatus according to claim 1, wherein: the surface of the box body (12) is provided with an insulating coating (3), and the heat conducting rod (10) is an L-shaped heat conducting rod.

5. An LCC cooling apparatus according to claim 1, wherein: at least six groups of heat dissipation holes (2) are formed, and the six groups of heat dissipation holes (2) are arranged in an array.

6. An LCC cooling apparatus according to claim 1, wherein: the heat dissipation holes (2) are obliquely arranged.