CN101600325A

CN101600325A - Combined heat dissipation device for electronic equipment with airtight housing

Info

Publication number: CN101600325A
Application number: CNA2009100876842A
Authority: CN
Inventors: 王敬文; 薛百华; 陈凡民; 郑国庆; 吴立群
Original assignee: Kyland Technology Co Ltd
Current assignee: Kyland Technology Co Ltd
Priority date: 2009-07-02
Filing date: 2009-07-02
Publication date: 2009-12-09
Anticipated expiration: 2029-07-02
Also published as: CN101600325B

Abstract

The invention discloses a combined heat dissipation device of a fan and a heat pipe of an airtight housing electronic equipment, aiming at solving the contradiction that the airtight housing electronic equipment requires both high protection level and good heat dissipation. The gist of the technical solution is that the combined heat dissipation device structure of the airtight shell electronic equipment is composed of a fan, a shell with heat sinks, a heat conduction film, a PCB fixing bracket, a heat conduction pipe, and a chip heat conduction plate. The heat pipe connects the heat conduction plate of the chip and the PCB fixing bracket. The vertical section shape of the side plate of the PCB fixing bracket is wedge-shaped, and the wedge-shaped surface is in close contact with the inner wall of the casing. There is a compressible heat conduction film between them to ensure that the PCB fixing bracket is in close contact with the inner wall of the case; the side of the case shell is a sheet-like heat dissipation structure; the end of the heat sink is fixed with a fan to form an air duct for air-cooling and convection heat dissipation for the heat sink. The invention is suitable for the heat dissipation of the electronic equipment in the airtight case.

Description

A kind of combination heat abstractor of closed shell electronic equipment

Technical field

The present invention relates to the combination heat dissipation technology field of electronic equipment, more particularly, relate to the combination heat abstractor of a kind of closed shell electronic equipment blower fan and heat pipe etc.

Background technology

Electronic equipments such as industrial, military exchange, server, rack are limited by adverse circumstances, often need housing to adopt closed structure; In the equipment operation, devices such as exchange chip, power module can produce heat, and the device interior ambient temperature is raise, and influence the useful life and the performance of electronic devices and components.Traditional implementation method is that the heat of chip is transmitted to the engine housing radiated rib by inner heat-transfer device and dispels the heat; Radiating effect is limited, and pcb board is changed, safeguards inconvenient.Chinese patent grant number CN2599502Y, January 14 2004 Granted publication day, the utility model name is called the airtight radiator of heat pipe-type, this granted patent discloses by improving the layout general layout of radiator, rely on the separate part effect to improve heat exchange, the radiating efficiency of airtight electrical control cubicles, its weak point is the maintainability that does not relate to by radiating element, can not control by the radiating effect of radiating element.

Summary of the invention

The objective of the invention is to overcome deficiency of the prior art, provide the combination heat abstractor of a kind of closed shell electronic equipment blower fan and heat pipe etc. and inside to be changed easy to maintenance by radiating element.

Technical scheme of the present invention is that the combination construction for heat radiating device of this kind closed shell electronic equipment is made up of fan 1, flange-cooled housing 2, heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6.Heat pipe 5 connects chip heat-conducting plate 6 and PCB fixed support 4, and PCB fixed support 4 closely contacts with casing inner wall, and compressible heat conducting film 3 is arranged between machine PCB fixed support 4 and the casing inner wall contact-making surface, guarantees that PCB fixed support 4 closely contacts with casing inner wall; The housing shell side is the sheet radiator structure; The fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.

PCB fixed support 4 is metal or other heat-conductings;

Flange-cooled housing 2 is metal or other heat-conductings;

Heat pipe 5 needs closely fixing at chip heat-conducting plate 6 ends and PCB fixed support 4 ends;

Heat pipe 5 preferably adopts heat-conducting at the immobilization material of chip heat-conducting plate 6 ends and PCB fixed support 4 ends.

Fan 1 speed Based Intelligent Control, fan 1 working condition is controlled by the casing internal circuit, the internal temperature height, rotating speed raises, and temperature is low, and rotating speed reduces.Fan control cable 9 is connected with internal control circuit through the hull outside connector.

The radiating subassembly of internal mode blocking is made up of heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6, can plug on the guide rail in casing.

The invention has the beneficial effects as follows: solved the closed shell electronic equipment and not only required high-protection level, but also required the contradiction of good heat radiating.Modular structure is not influencing under the radiating effect condition, and the functional module integral replacing is convenient.

Description of drawings

Fig. 1 makes up the construction for heat radiating device front view;

Fig. 2 makes up the construction for heat radiating device vertical view;

Fig. 3 can plug the radiating module vertical view;

Fig. 4 can plug the installation diagram of radiating module and complete machine.

Embodiment

The invention will be further described below in conjunction with accompanying drawing.

Fig. 1 makes up the construction for heat radiating device front view, Fig. 2 makes up the construction for heat radiating device vertical view, has indicated the combination heat abstractor to be made up of fan 1, flange-cooled housing 2, heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6.More than 6 parts be divided into inside chip heat-conductive assembly part and outside heat abstractor part.Inside chip heat-conductive assembly part is made up of heat pipe 5, chip heat-conducting plate 6, PCB fixed support 4, heat conducting film 3, and heat pipe 5 is fixed with die terminals heat pipe fixed head 7, radiating end heat pipe fixed head 8 respectively on chip heat-conducting plate 6 and PCB fixed support 4.Outside heat abstractor part is made up of fan 1, flange-cooled housing 2.PCB fixed support 4, die terminals heat pipe fixed head 7, radiating end heat pipe fixed head 8, flange-cooled housing 2 are made by aluminum alloy materials.

Heat conduction path: the heat the during operation of PCB chip at first conducts to chip heat-conducting plate 6, conducts to aluminium alloy PCB fixed support 4 through heat pipe 5, die terminals heat pipe fixed head 7 (the auxiliary heat pipe that compresses) then, conducts to flange-cooled housing 2 through heat conducting film 3.PCB fixed support 4 side plate vertical cross-sections are shaped as wedge shape, lozenges closely contacts with casing inner wall, the casing inboard is the inclined-plane of equal angular with PCB fixed support 4 side plate mating surfaces, and compressible heat conducting film 3 (about 1MM is thick) is arranged between contact-making surface, guarantees that guide rail closely contacts with casing inner wall.The housing shell side is the sheet radiator structure, and the fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.

Fan 1 speed Based Intelligent Control: fan 1 working condition is controlled by the casing internal circuit, fan 1 rotating speed needs the working condition of radiating element (exchange chip, CPU, power module etc.) to control according to internal circuit, detect internal temperature at the inner mounting temperature sensor of casing, the internal temperature height, rotating speed raises, temperature is low, and rotating speed reduces.Fan control cable 9 is connected with internal control circuit through the hull outside water-proof connector.

Fig. 3 can plug the installation diagram that radiating module vertical view, Fig. 4 can plug radiating module and complete machine, indicated formations such as inside chip heat-conductive assembly part (forming) and PCB can plug radiating module by heat pipe 5, chip heat-conducting plate 6, PCB fixed support 4, heat conducting film 3, can in casing, plug on the guide rail, and by panel place locking, but when project installation, functional mapping, later maintenance integral replacing.Inside and outside radiator structure is independent of each other; Panel has hermetically-sealed construction, and after panel and casing were fixing, the housing degree of protection reached IP67.Internal heat dissipating device modularization is convenient to safeguard.

The above only is process of the present invention and method embodiment, in order to restriction the present invention, all any modifications of being made, is not equal to replacement, improvement etc. within spirit of the present invention and essence, all should be included within the protection range of the present invention.

Claims

1. A combined cooling device for airtight housing electronic equipment, characterized in that it consists of a fan (1), a housing (2) with cooling fins, a thermally conductive film (3), a PCB fixing bracket (4), and a heat pipe ( 5), the chip heat conduction plate (6) is composed; the heat conduction pipe (5) connects the chip heat conduction plate (6) and the PCB fixing bracket (4), the PCB fixing bracket (4) is in close contact with the inner wall of the casing, and the PCB fixing bracket (4) There is a compressible heat conduction film (3) between the contact surface with the inner wall of the casing to ensure that the PCB fixing bracket (4) is in close contact with the inner wall of the casing; the shell side of the casing is a sheet-like heat dissipation structure; Road, air-cooled convection heat dissipation for the heat sink.

2. The method according to claim 1, characterized in that the PCB fixing bracket (4) is made of metal or other heat-conducting materials.

3. The method according to claim 1, characterized in that the housing (2) with heat sinks is made of metal or other heat-conducting materials.

4. The method according to claim 1, characterized in that the heat pipe (5) needs to be tightly fixed at the end of the chip heat conduction plate (6) and the end of the PCB fixing bracket (4).

5. The method according to claim 4, characterized in that the fixing material of the heat pipe (5) at the end of the chip heat conduction plate (6) and the end of the PCB fixing bracket (4) is preferably heat conduction material.

6. The method according to claim 1, characterized in that the speed of the fan (1) is intelligently controlled, and the working condition of the fan (1) is controlled by the internal circuit of the casing. When the internal temperature is high, the rotation speed increases, and when the temperature is low, the rotation speed decreases.

7. The method according to claim 1 or 6, characterized in that the fan control cable (9) is connected to the internal control circuit through a connector outside the casing.

8. The method according to claim 1, characterized in that the internal modular heat dissipation component is composed of heat conduction film (3), PCB fixing bracket (4), heat conduction pipe (5), and chip heat conduction plate (6), which can be Plug and unplug on the guide rail inside the case.