CN216597565U

CN216597565U - Power diode packaging part

Info

Publication number: CN216597565U
Application number: CN202220062766.2U
Authority: CN
Inventors: 周钰
Original assignee: Jinzhai Zhouyu Electronic Technology Co ltd
Current assignee: Jinzhai Zhouyu Electronic Technology Co ltd
Priority date: 2022-01-11
Filing date: 2022-01-11
Publication date: 2022-05-24
Anticipated expiration: 2032-01-11

Abstract

The utility model discloses a power diode packaging part belongs to electron device packaging technical field, and current power diode packaging part leakproofness is not good, is unfavorable for dispelling the heat, and is impaired because of the collision when using easily, which comprises a housin, the one side of casing is provided with first lead wire, the another side of casing is provided with the second lead wire, be provided with the wafer between first lead wire and the second lead wire, the wafer is located the inside of casing, the intrados fixedly connected with insulating layer of casing, the extrados of casing is provided with the heat dissipation scale, the equal fixedly connected with connecting cover of both sides face of casing, the connecting cover is the one side fixedly connected with sleeve of casing dorsad, telescopic inside can be dismantled and be provided with the sealing washer. The utility model discloses in, the leakproofness is good, does benefit to and dispels the heat to casing inner zone, and can protect the casing, avoids the casing impaired because of the collision.

Description

Power diode packaging part

Technical Field

The utility model relates to an electron device encapsulation technical field specifically is a power diode packaging part.

Background

With the development of science and technology, various electronic products can be seen everywhere in our lives, and the products bring great convenience to our lives, works and studies. Among them, a diode is one of the most common electronic components. The diode package is to lead the circuit pin on the silicon chip to the external joint by wire for connecting with other devices, and the sealing property is controlled during the package, so as to prevent the electric performance from being reduced due to the corrosion of the chip circuit by the impurities in the air. However, the conventional power diode package has poor sealing performance, is not favorable for heat dissipation, and is easily damaged by collision during use, so that a power diode package is proposed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power diode packaging part to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a power diode packaging piece comprises a shell, wherein a first lead is arranged on one surface of the shell, a second lead is arranged on the other surface of the shell, a wafer is arranged between the first lead and the second lead, and the wafer is positioned in the shell;

the interior cambered surface fixedly connected with insulating layer of casing, the extrados of casing is provided with the heat dissipation scale, the equal fixedly connected with connecting cover of both sides face of casing, the connecting cover one side fixedly connected with sleeve of casing dorsad, telescopic inside can be dismantled and be provided with the sealing washer.

As a preferred technical scheme of the utility model, the first connecting plate of one end fixedly connected with of first lead wire, the one end fixedly connected with second connecting plate of second lead wire, the both sides face of wafer all is provided with the soldering lug, first connecting plate and second connecting plate all are connected with the wafer through the soldering lug.

As an optimal technical scheme of the utility model, the quantity of heat dissipation scale has a plurality of and is the array distribution, the lateral wall of heat dissipation scale is provided with sealed glue and arranges the junction of heat dissipation scale and casing in.

As an optimized technical scheme of the utility model, the outer cambered surface fixedly connected with elastic ring of casing, elastic ring is located one side of heat dissipation scale.

As an optimized technical scheme of the utility model, telescopic side is run through and is provided with the nozzle, the sealing washer cooperatees with the nozzle.

As a preferred technical scheme of the utility model, telescopic extrados runs through and is provided with the injecting glue mouth, the one end of injecting glue mouth extends to in the barrel, the inside of injecting glue mouth can be dismantled and be provided with the end cap.

As an optimal technical scheme of the utility model, the diameter of first lead wire and second lead wire is the same, the side of sealing washer is run through and is provided with the notch, the notch is with the sealed cooperation of first lead wire and second lead wire homogeneous phase.

As an optimized technical scheme of the utility model, the casing is made by the plastics material.

Compared with the prior art, the beneficial effects of the utility model reside in that:

1. the utility model discloses, the cambered surface through the casing runs through and is provided with the heat dissipation scale, can dispel the heat to the internal region of casing through the heat dissipation scale to avoid the component to be impaired because of the high temperature, and the junction of heat dissipation scale and casing is provided with sealed glue, thus strengthen the leakproofness, avoid moisture to enter into the casing through the junction, and then avoid electrical components to be impaired;

2. the utility model discloses, can protect the casing through the elastic ring that sets up, avoid the casing impaired because of the collision, can seal the junction of first lead wire and second lead wire through the sealing washer, and through injecting glue in to the injecting glue mouth to can make sealing washer and sleeve bond fixedly, avoid when using for a long time, take place to slide because of the sealing washer and reduce the leakproofness.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention,

FIG. 2 is a schematic view of the internal structure of the housing of the present invention,

figure 3 is a schematic view of the shell structure of the present invention,

fig. 4 is an exploded view of the housing of the present invention.

In the figure: 1. a housing; 2. a first lead; 3. a first connecting plate; 4. a second lead; 5. a second connecting plate; 6. a wafer; 7. soldering lugs; 8. an elastic ring; 9. heat dissipation scales; 10. an insulating layer; 11. a connecting cover; 12. a sleeve; 13. a cylinder mouth; 14. a glue injection port; 15. a plug; 16. a seal ring; 17. a notch.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b): as shown in fig. 1-4, the utility model provides a power diode package, including a housing 1, the housing 1 is made of plastic material, one side of the housing 1 is provided with a first lead 2, the other side of the housing 1 is provided with a second lead 4, a wafer 6 is arranged between the first lead 2 and the second lead 4, the wafer 6 is located inside the housing 1, one end of the first lead 2 is fixedly connected with a first connecting plate 3, one end of the second lead 4 is fixedly connected with a second connecting plate 5, both side surfaces of the wafer 6 are provided with soldering lugs 7, and the first connecting plate 3 and the second connecting plate 5 are connected with the wafer 6 through the soldering lugs 7;

the inner arc surface of the shell 1 is fixedly connected with an insulating layer 10, an electrical element can be protected through the insulating layer 10, the outer arc surface of the shell 1 is provided with heat dissipation scales 9, the heat dissipation scales 9 are distributed in a plurality of arrays, the internal area of the shell 1 can be dissipated through the heat dissipation scales 9, so that the element is prevented from being damaged due to overhigh temperature, the side walls of the heat dissipation scales 9 are provided with sealant, the sealant is arranged at the connecting positions of the heat dissipation scales 9 and the shell 1, the sealing performance is enhanced, moisture is prevented from entering the shell 1 through the connecting positions, the electrical element is prevented from being damaged, the outer arc surface of the shell 1 is fixedly connected with an elastic ring 8, the elastic ring 8 is positioned on one side of the heat dissipation scales 9, the arranged elastic ring 8 can protect the shell 1, and the shell 1 is prevented from being damaged due to collision;

the equal fixedly connected with of both sides face of casing 1 connects lid 11, connect lid 11 one side fixedly connected with sleeve 12 of casing 1 dorsad, sleeve 12's inside can be dismantled and be provided with sealing washer 16, first lead wire 2 is the same with the diameter of second lead wire 4, the side of sealing washer 16 runs through and is provided with notch 17, notch 17 and first lead wire 2 and the sealed cooperation of second lead wire 4 homogeneous phase, sleeve 12's side runs through and is provided with nozzle 13, sealing washer 16 cooperatees with nozzle 13, sleeve 12's extrados runs through and is provided with injecting glue mouth 14, the one end of injecting glue mouth 14 extends to in the nozzle 13, injecting glue mouth 14's inside can be dismantled and be provided with end cap 15, end cap 15 is used for avoiding the dust to fall into in injecting glue mouth 14.

The working principle is as follows: the utility model discloses when using, at casing 1 intrados fixedly connected with insulating layer 10, can protect electrical components through insulating layer 10, it is provided with heat dissipation scale 9 to run through at the extrados of casing 1, can dispel the heat to casing 1 internal region through heat dissipation scale 9, thereby avoid the component to be impaired because of the high temperature, and the junction of heat dissipation scale 9 and casing 1 is provided with sealed glue, thereby strengthen the leakproofness, avoid moisture to enter casing 1 through the junction, and then avoid electrical components to be impaired, simultaneously, the elasticity ring 8 that sets up can protect casing 1, avoid casing 1 to be impaired because of the collision;

the sealing ring 16 is arranged in the sleeve 12, the joint of the first lead 2 and the second lead 4 can be sealed through the sealing ring 16, and after the sealing ring 16 is installed, glue is injected into the glue injection port 14, so that the sealing ring 16 and the sleeve 12 can be bonded and fixed, and the problem that the sealing performance is reduced due to the fact that the sealing ring 16 slides when the sealing ring is used for a long time is avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A power diode package comprising a housing (1), characterized in that: a first lead (2) is arranged on one surface of the shell (1), a second lead (4) is arranged on the other surface of the shell (1), a wafer (6) is arranged between the first lead (2) and the second lead (4), and the wafer (6) is positioned in the shell (1);

the interior cambered surface fixedly connected with insulating layer (10) of casing (1), the extrados of casing (1) is provided with heat dissipation scale (9), the equal fixedly connected with of both sides face of casing (1) connects lid (11), connect lid (11) one side fixedly connected with sleeve (12) of casing (1) dorsad, the inside of sleeve (12) can be dismantled and be provided with sealing washer (16).

2. The power diode package of claim 1, wherein: the one end fixedly connected with first connecting plate (3) of first lead wire (2), the one end fixedly connected with second connecting plate (5) of second lead wire (4), the both sides face of wafer (6) all is provided with soldering lug (7), first connecting plate (3) and second connecting plate (5) all are connected with wafer (6) through soldering lug (7).

3. The power diode package of claim 1, wherein: the quantity of heat dissipation scale (9) has a plurality of and is the array distribution, the lateral wall of heat dissipation scale (9) is provided with sealed glue and arranges the junction of heat dissipation scale (9) and casing (1) in.

4. The power diode package of claim 1, wherein: the outer arc surface of casing (1) fixedly connected with elastic ring (8), elastic ring (8) are located the one side of heat dissipation scale (9).

5. The power diode package of claim 1, wherein: the side of the sleeve (12) is provided with a cylinder opening (13) in a penetrating way, and the sealing ring (16) is matched with the cylinder opening (13).

6. The power diode package of claim 5, wherein: the outer cambered surface of sleeve (12) runs through and is provided with injecting glue mouth (14), the one end of injecting glue mouth (14) extends to in bung hole (13), the inside of injecting glue mouth (14) can be dismantled and be provided with end cap (15).

7. The power diode package of claim 1, wherein: the diameter of first lead wire (2) and second lead wire (4) is the same, the side of sealing washer (16) is run through and is provided with notch (17), notch (17) and first lead wire (2) and second lead wire (4) homogeneous phase sealing fit.

8. The power diode package of claim 1, wherein: the shell (1) is made of plastic materials.