CN209471971U - A kind of plastic package diode radiator structure - Google Patents
A kind of plastic package diode radiator structure Download PDFInfo
- Publication number
- CN209471971U CN209471971U CN201920522752.2U CN201920522752U CN209471971U CN 209471971 U CN209471971 U CN 209471971U CN 201920522752 U CN201920522752 U CN 201920522752U CN 209471971 U CN209471971 U CN 209471971U
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- cover
- diode
- plastic packaging
- fixedly connected
- electrode slice
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Abstract
The utility model discloses a kind of plastic package diode radiator structures; including diode body; diode body includes plastic packaging-cover and pin; the both ends of plastic packaging-cover are fixedly connected to the identical dissipating cover of diameter; the middle part of two dissipating covers is interspersed to be connected with pin; the both ends of electrode slice are fixedly connected to silicon chip; two silicon chips are fixedly connected with wired seat far from one end of electrode slice; one end of two line seats is fixedly connected with one end of pin respectively; the utility model is effectively protected silicon chip and electrode slice by protective cover;The cooling fin being arranged by the outside of plastic packaging-cover, when diode operation, cooling fin disperses heat, avoids the performance for influencing diode;It due to dustproof sheet and radiator-grid that the inside of two dissipating covers is fixedly connected, radiates at work convenient for plastic package diode, and protects internal structure, have moisture-proof and dust-proof function.
Description
Technical field
The utility model relates to a kind of radiator structure, in particular to a kind of plastic package diode radiator structure.
Background technique
Diode is a kind of electronic device that can unidirectionally conduct electric current, is equipped with PN junction inside diode, the two of PN junction
End is equipped with lead terminal, if having the unilateral conductivity of electric current according to the direction of applied voltage.
Now, widely applied diode, the shape molding of diode mostly use molded packages, plastic package diode due to
It is at low cost, it is easy to be mass produced, but injection pressure impact when molded packages is big, can damage chip, lead to diode leakage
Stream increases and software feature, yields are affected, and reduces the reliability of diode;The electric current that most of diode has
We are normally referred to as rectification function to directionality, and single diode can generate heat during rectification, and especially high current exists
Power consumption is larger in rectification, and the calorific value of diode is caused also to increase, and influences the performance of diode;In addition, existing band heat dissipation knot
The plastic package diode heat dissipation effect of structure is bad, does not realize simultaneously with anti-dust performance, and production cost is big.Therefore, traditional plastic packaging
There is also problems for diode.
Utility model content
The purpose of this utility model is to provide a kind of plastic package diode radiator structures, to solve to mention in above-mentioned background technique
Plastic package diode out is easy to be mass produced due at low cost, but injection pressure impact when molded packages is big, can damage core
Piece causes diode leakage current increase and software feature, yields to be affected, reduces the reliability of diode;It is most of
We are normally referred to as rectification function to the current direction that diode has, and single diode can generate heat during rectification
Amount, especially high current power consumption in rectification is larger, and the calorific value of diode is caused also to increase, and influences the performance of diode;Separately
Outside, the existing plastic package diode heat dissipation effect with radiator structure is bad, does not realize simultaneously with anti-dust performance, and production cost is big
The problem of.
To achieve the above object, the utility model provides the following technical solutions: a kind of plastic package diode radiator structure, including
Diode body, the diode body include plastic packaging-cover and pin, and the both ends of the plastic packaging-cover are fixedly connected to diameter phase
Same dissipating cover, the middle part of two dissipating covers is interspersed to be connected with pin, and the centre inside the plastic packaging-cover is embedded with electricity
Pole piece, the both ends of the electrode slice are fixedly connected to silicon chip, and two one end of the silicon chip far from electrode slice are fixed
Wired seat is connected, one end of two line seats is fixedly connected with one end of pin respectively.
As a kind of optimal technical scheme of the utility model, the two sides of the electrode slice are connected with protective cover,
Filled layer is fixed between two protective covers and plastic packaging-cover, the plastic packaging-cover forms non-cavity structure.
As a kind of optimal technical scheme of the utility model, the diameter of two dissipating covers is respectively less than the straight of plastic packaging-cover
Diameter, the outer cover of the plastic packaging-cover are equipped with cooling fin, the outer profile of cooling fin structure cylindrical, and the cooling fin is
6063 aluminum radiating fins.
It is equal close to the side of plastic packaging-cover inside two dissipating covers as a kind of optimal technical scheme of the utility model
It is fixedly connected with dustproof sheet, the other side inside two dissipating covers is fixedly connected to radiator-grid.
As a kind of optimal technical scheme of the utility model, the filled layer is epoxy resin, the filled layer and is dissipated
Backing fits closely.
Compared with prior art, the utility model has the beneficial effects that a kind of plastic package diode heat dissipation knot of the utility model
Structure, since the centre inside plastic packaging-cover is embedded with electrode slice, the protective cover being cooperatively connected by the two sides of electrode slice, effectively
Silicon chip and electrode slice are protected, the reliability of plastic package diode is increased;Since power consumption is larger in rectification for high current, cause
The calorific value of diode also increases, the cooling fin being arranged by the outside of plastic packaging-cover, and cooling fin is 6063 aluminum radiating fins, when
When diode operation, cooling fin disperses heat, avoids the performance for influencing diode;Since two dissipating covers are close to the one of plastic packaging-cover
Side is fixedly connected to dustproof sheet, and the other side of two dissipating covers is fixedly connected with radiator-grid, exists convenient for plastic package diode
It radiates when work, and protects internal structure, have moisture-proof and dust-proof function, considerably increase plastic package diode work
Reliability.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model;
Fig. 2 is the internal plane structural schematic diagram of the utility model;
Fig. 3 is the positive structure schematic of the utility model.
In figure: 1, diode body;2, plastic packaging-cover;3, pin;4, dissipating cover;5, line seat;6, silicon chip;7, electrode slice;
8, protective cover;9, filled layer;10, cooling fin;11, dustproof sheet;12, radiator-grid.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please referring to Fig. 1-3, the utility model provides a kind of plastic package diode radiator structure, including diode body 1, and two
Pole pipe main body 1 includes plastic packaging-cover 2 and pin 3, and the both ends of plastic packaging-cover 2 are fixedly connected to the identical dissipating cover 4 of diameter, and two dissipate
The middle part of hot lid 4 is interspersed to be connected with pin 3, and the centre inside plastic packaging-cover 2 is embedded with electrode slice 7, and the both ends of electrode slice 7 are solid
Surely it is connected with silicon chip 6, two silicon chips 6 are fixedly connected with wired seat 5, one end of two line seats 5 far from one end of electrode slice 7
It is fixedly connected respectively with one end of pin 3.
Preferably, the two sides of electrode slice 7 are connected with protective cover 8, fixed between two protective covers 8 and plastic packaging-cover 2
Equipped with filled layer 9, plastic packaging-cover 2 forms non-cavity structure, and the setting of protective cover 8 is effectively protected silicon chip 6 and electrode slice 7,
Increase the reliability of plastic package diode.
Preferably, the outer cover of plastic packaging-cover 2 is equipped with cooling fin 10, the outer profile of cooling fin 10 structure cylindrical, heat dissipation
Piece 10 is 6063 aluminum radiating fins, and when diode operation, high current power consumption in rectification is larger, disperses heat by cooling fin 10
Amount, since 6063 aluminiums are cheap and heat dissipation effect is preferable, it is ensured that the performance and service life of diode.
Preferably, the diameter of two dissipating covers 4 is respectively less than the diameter of plastic packaging-cover 2, and two 4 inside of dissipating cover are close to plastic packaging-cover
2 side is fixedly connected to dustproof sheet 11, and the other side inside two dissipating covers 4 is fixedly connected to radiator-grid 12, is convenient for
Plastic package diode radiates at work, and protects internal structure, has moisture-proof and dust-proof function, considerably increases plastic packaging
The reliability of diode operation.
Preferably, filled layer 9 is epoxy resin, and filled layer 9 fits closely with cooling fin 10, epoxy resin for more typically at
This lower megohmite insulant, saves production cost, and avoids influencing the working performance of plastic package diode.
When specifically used, a kind of plastic package diode radiator structure of the utility model, the inside installation of plastic package diode main body 1
In structure, it is fixedly connected respectively with one end of line seat 5 by one end due to two pins 3, the other end of line seat 5 is respectively welded
There is silicon chip 6, be welded with electrode slice 7 between two silicon chips 6, when plastic package diode main body 1 is worked, electric current passes through
Electric current is transmitted to line seat 5 by positive pin 3, then electric current is sent to silicon chip 6 by line seat 5, will be electric finally by electrode slice 7
It is streamed to the silicon chip 6 positioned at cathode side, until electric current is transmitted to negative pin 3, completes the work of plastic package diode,
The protective cover 8 that period is cooperatively connected due to the two sides of electrode slice 7, is effectively protected silicon chip 6 and electrode slice 7, avoids interior
The damage of portion's structure, in addition, since the outer cover of plastic packaging-cover 2 is equipped with cooling fin 10, and the inside of two dissipating covers 4 is fixedly mounted
There are dustproof sheet 11 and radiator-grid 12, increase the heat dissipation performance, dust tightness and moisture resistance of plastic package diode, it is ensured that two pole of plastic packaging
The working performance and service life of pipe.
In the description of the present invention, it should be understood that the orientation or positional relationship of instruction is based on shown in attached drawing
Orientation or positional relationship, be merely for convenience of describing the present invention and simplifying the description, rather than indication or suggestion is signified
Device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as practical new to this
The limitation of type.
In the present invention unless specifically defined or limited otherwise, for example, it may be being fixedly connected, be also possible to
It is detachably connected, or integral;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements or the interaction relationship of two elements, unless otherwise clear
Restriction can understand above-mentioned term in the utility model as the case may be for the ordinary skill in the art
In concrete meaning.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of plastic package diode radiator structure, including diode body (1), which is characterized in that diode body (1) packet
Including plastic packaging-cover (2) and pin (3), the both ends of the plastic packaging-cover (2) are fixedly connected to the identical dissipating cover of diameter (4), and two
The middle part of the dissipating cover (4) is interspersed to be connected with pin (3), and the internal centre of the plastic packaging-cover (2) is embedded with electrode slice
(7), the both ends of the electrode slice (7) are fixedly connected to silicon chip (6), and two silicon chips (6) are far from electrode slice (7)
One end is fixedly connected with wired seat (5), and one end of two line seats (5) is fixedly connected with one end of pin (3) respectively.
2. a kind of plastic package diode radiator structure according to claim 1, which is characterized in that the two of the electrode slice (7)
Side is connected with protective cover (8), is fixed with filled layer (9), institute between two protective covers (8) and plastic packaging-cover (2)
It states plastic packaging-cover (2) and forms non-cavity structure.
3. a kind of plastic package diode radiator structure according to claim 1, which is characterized in that outside the plastic packaging-cover (2)
Portion is arranged with cooling fin (10), the outer profile structure cylindrical of the cooling fin (10), and the cooling fin (10) is 6063 aluminium
Material cooling fin.
4. a kind of plastic package diode radiator structure according to claim 1, which is characterized in that two dissipating covers (4)
Diameter be respectively less than the diameters of plastic packaging-cover (2), the internal side close to plastic packaging-cover (2) of two dissipating covers (4) is fixed to be connected
It is connected to dustproof sheet (11), two internal other sides of the dissipating cover (4) are fixedly connected to radiator-grid (12).
5. a kind of plastic package diode radiator structure according to claim 2, which is characterized in that the filled layer (9) is ring
Oxygen resin, the filled layer (9) fit closely with cooling fin (10).
Priority Applications (1)
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CN201920522752.2U CN209471971U (en) | 2019-04-17 | 2019-04-17 | A kind of plastic package diode radiator structure |
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CN201920522752.2U CN209471971U (en) | 2019-04-17 | 2019-04-17 | A kind of plastic package diode radiator structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110600441A (en) * | 2019-10-11 | 2019-12-20 | 上海整流器厂有限公司 | High-voltage dustproof rectifier diode packaging structure and method for subway power supply |
CN114496947A (en) * | 2022-01-06 | 2022-05-13 | 泗阳群鑫电子有限公司 | Rectifier diode and manufacturing method thereof |
-
2019
- 2019-04-17 CN CN201920522752.2U patent/CN209471971U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110600441A (en) * | 2019-10-11 | 2019-12-20 | 上海整流器厂有限公司 | High-voltage dustproof rectifier diode packaging structure and method for subway power supply |
CN110600441B (en) * | 2019-10-11 | 2024-05-24 | 上海整流器厂有限公司 | High-voltage dustproof rectifier diode packaging structure and method for subway power supply |
CN114496947A (en) * | 2022-01-06 | 2022-05-13 | 泗阳群鑫电子有限公司 | Rectifier diode and manufacturing method thereof |
CN114496947B (en) * | 2022-01-06 | 2023-02-10 | 泗阳群鑫电子有限公司 | Rectifier diode and manufacturing method thereof |
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