CN114496947B - Rectifier diode and manufacturing method thereof - Google Patents
Rectifier diode and manufacturing method thereof Download PDFInfo
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- CN114496947B CN114496947B CN202210009762.2A CN202210009762A CN114496947B CN 114496947 B CN114496947 B CN 114496947B CN 202210009762 A CN202210009762 A CN 202210009762A CN 114496947 B CN114496947 B CN 114496947B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 69
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 210000002421 cell wall Anatomy 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 9
- 230000037431 insertion Effects 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 5
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of semiconductor devices, and particularly relates to a rectifier diode and a manufacturing method thereof. According to the invention, the heat dissipation device is arranged, when the heat dissipation plate is connected with the connecting plate, the arc-shaped plate on the heat dissipation plate is inserted into the arc-shaped groove, and the heat dissipation plate is rotated, so that the insertion block and the arc-shaped strip can be respectively inserted into the slot and the strip-shaped groove on the connecting plate, and the contact area between the connecting plate and the heat dissipation plate is increased.
Description
Technical Field
The invention belongs to the technical field of semiconductor devices, and particularly relates to a rectifier diode and a manufacturing method thereof.
Background
A rectifier diode is a semiconductor device for converting alternating current to direct current and generally comprises a PN junction having two terminals, a positive terminal and a negative terminal. The most important characteristic of a diode is one-way conductivity, and in a circuit, current can only flow into the anode and the cathode of the diode, so that alternating current is converted into pulsating direct current.
When the rectifier diode is in actual use, the working environment of the rectifier diode is complex, the diode can be always in a high-voltage high-current running state in the working process of some generator sets, the existing diode structure is simple, and a good heat dissipation structure is not provided, so that when the diode is in the high-voltage and high-current condition for a long time, the working temperature of the diode can be too high, and the diode is damaged.
Therefore, it is desirable to provide a rectifying diode and a method for manufacturing the same to solve the above problems.
Disclosure of Invention
In view of the above problems, the present invention provides a rectifying diode and a method for manufacturing the same to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the rectifier diode comprises a diode body, wherein two ends of the diode body are respectively connected with a positive terminal and a negative terminal, the two terminals are respectively sleeved with a connecting device, the connecting devices are connected with the diode body through epoxy resin, and a heat radiating device is arranged on one side, away from the diode body, of each connecting device.
Furthermore, the connecting device comprises a circular connecting plate, an insulating pipe is inserted in the center of the connecting plate in a penetrating mode, the insulating pipe is sleeved on the corresponding terminal, one end, close to the diode body, of the insulating pipe is fixedly connected with an annular insulating plate, the annular insulating plate corresponds to the position, a groove matched with the annular insulating plate is formed in the connecting plate, the annular insulating plate is located in the groove, a plurality of connecting blocks are fixedly connected to one side, close to the diode body, of the connecting plate, two arc-shaped grooves are formed in one side, away from the diode body, of the connecting plate, the two arc-shaped grooves are rotationally symmetrical about the center of the connecting plate, and slots are formed in the groove walls of the arc-shaped grooves and one side, perpendicular to the terminal, of the connecting plate.
Further, heat abstractor includes the heating panel, the heating panel slides and cup joints on the insulating tube, one side that the heating panel is close to the connecting plate has linked firmly two arc pieces, two the arc piece has linked firmly the inserted block with the one side that the slot is relative, the top slope of inserted block has linked firmly a plurality of shell fragments, and the incline direction of shell fragment is the same with the rotation direction of heating panel.
Furthermore, an annular groove is formed in the edge, close to one side of the diode body, of the connecting plate, and a plurality of connecting holes are uniformly formed in the groove wall of the annular groove.
Furthermore, the arc-shaped block is opposite to the arc-shaped groove in position, and the sum of the lengths of the arc-shaped block and the inserting block is smaller than the length of the arc-shaped groove.
Furthermore, the inserted block corresponds the position link firmly a plurality of arc strips with the common centre of a circle of heating panel on the heating panel, the arc strip corresponds the position a plurality of bar grooves have been seted up on the connecting plate, and a plurality of bar grooves respectively with a plurality of arc strip phase-matchs.
Furthermore, a plurality of radiating strip holes are formed in one side, far away from the connecting plate, of the radiating plate, and the radiating strip holes are distributed annularly.
Further, the annular groove of accomodating has been seted up to the side of heating panel, accomodate the inslot and be equipped with multiunit radiator unit, and a plurality of radiator unit evenly distributed are accomodating the inslot, radiator unit includes two L shape fin, L shape fin links firmly with accomodating the groove, and two L shape fin mutually support and form a rhombus, two the free end of L shape fin links firmly same arc, and the arc is insulating material and makes.
Furthermore, the L-shaped radiating fins have elasticity, and the free ends of the L-shaped radiating fins are protruded out of the edges of the radiating plate.
The present invention also provides a method of manufacturing a rectifying diode using any one of the above, the method comprising the steps of,
the method comprises the following steps: firstly, uniformly coating epoxy resin on one end of a diode body;
step two: then sheathing an insulating pipe on a terminal at one end of the diode body coated with the epoxy resin;
step three: then, sleeving one end of the connecting plate, which is provided with a connecting block, on the insulating tube, and pressing the connecting plate and the diode body together;
step four: then coating a certain amount of epoxy resin in the arc-shaped groove of the connecting plate, and then inserting one end of the heat dissipation plate, which is provided with the arc-shaped block, into the arc-shaped groove on the connecting plate and rotating;
step five: and after the epoxy resin is dried, performing the same operation on the other end of the diode body according to the operation.
The invention has the technical effects and advantages that:
1. according to the invention, the heat dissipation device is arranged, when the heat dissipation plate is connected with the connecting plate, the heat dissipation plate is sleeved on the terminal, one end, provided with the arc-shaped block, of the heat dissipation plate is opposite to the connecting plate, then the arc-shaped plate on the heat dissipation plate is inserted into the arc-shaped groove and the heat dissipation plate is rotated, so that the insertion block can be inserted into the insertion groove on the connecting plate, in the process, the arc-shaped strip is inserted into the strip-shaped groove on the connecting plate under the driving of the heat dissipation plate, the contact area between the connecting plate and the heat dissipation plate is increased, and the heat transfer efficiency between the connecting plate and the heat dissipation plate is further improved;
2. when the diode body is installed, the arc-shaped plate can be kept in contact with the circuit board, in the working process of the diode body, heat generated by the diode body can be transmitted to the heat dissipation plate through the connecting plate, and heat on the heat dissipation plate can be transmitted to the L-shaped heat dissipation fins and the arc-shaped plate, so that the heat dissipation area of the heat dissipation plate is increased, and further the heat dissipation effect of the heat dissipation plate is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic overall perspective view of the present invention;
FIG. 2 is a schematic view of a first three-dimensional structure of the heat dissipation device of the present invention;
FIG. 3 is a schematic diagram of a second perspective structure of the heat dissipation device of the present invention;
FIG. 4 is a first perspective view of the connecting device of the present invention;
FIG. 5 is a second perspective view of the connection device of the present invention;
fig. 6 is a flow chart of a method of manufacturing a rectifying diode according to the present invention.
In the figure: 1. a diode body; 2. a terminal; 3. a connecting device; 31. a connecting plate; 32. an insulating tube; 33. an annular insulating plate; 34. connecting blocks; 35. an arc-shaped slot; 36. a slot; 4. a heat sink; 41. a heat dissipation plate; 42. an arc-shaped block; 43. inserting a block; 44. a spring plate; 5. an annular groove; 6. connecting holes; 7. an arc-shaped strip; 8. a strip-shaped groove; 9. heat dissipation bar holes; 10. a heat dissipating component; 101. an L-shaped heat sink; 102. an arc-shaped plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a rectifier diode and a manufacturing method thereof as shown in figures 1-5, the rectifier diode comprises a diode body 1, two ends of the diode body 1 are respectively connected with two terminals 2 of a positive pole and a negative pole, the two terminals 2 are respectively sleeved with a connecting device 3, the connecting device 3 is connected with the diode body 1 through epoxy resin, and one side of the connecting device 3, which is far away from the diode body 1, is provided with a heat dissipation device 4;
during manufacturing, the two connecting devices 3 are respectively adhered to the two ends of the diode body 1 through epoxy resin, and after the epoxy resin is dried and cured, the heat dissipation device 4 is connected with the connecting devices 3; when the diode body 1 is used, heat generated by the diode body 1 can be transmitted to the heat dissipation device 4 through the connecting device 3 and dissipated by the heat dissipation device 4, so that overhigh temperature of the diode body 1 can be avoided, and normal use of the diode body 1 is ensured.
As shown in fig. 1, 4 and 5, the connecting device 3 includes a circular connecting plate 31, an insulating tube 32 is inserted through a center of the connecting plate 31, the insulating tube 32 is sleeved on the corresponding terminal 2, one end of the insulating tube 32 close to the diode body 1 is fixedly connected with an annular insulating plate 33, a groove matched with the annular insulating plate 33 is formed in the connecting plate 31 at a position corresponding to the annular insulating plate 33, the annular insulating plate 33 is located in the groove, one side of the connecting plate 31 close to the diode body 1 is fixedly connected with a plurality of connecting blocks 34, one side of the connecting plate 31 away from the diode body 1 is provided with two arc-shaped grooves 35, the two arc-shaped grooves 35 are rotationally symmetrical with respect to the center of the connecting plate 31, a slot 36 is formed in a groove wall of one side of the two arc-shaped grooves 35 perpendicular to the terminal 2, an annular groove 5 is formed in an edge of one side of the connecting plate 31 close to the diode body 1, and a plurality of connecting holes 6 are uniformly formed in a groove wall of the annular groove 5;
when the connecting plate 31 is connected with a diode, epoxy resin is uniformly coated at one end of the diode body 1, then the insulating tube 32 is inserted on the connecting plate 31, the annular insulating plate 33 on the insulating tube 32 can be clamped into the corresponding groove, then the insulating tube 32 and the connecting plate 31 are sleeved on the terminal 2 at one end of the diode body 1 coated with the epoxy resin, the connecting block 34 on the connecting plate 31 can be opposite to the diode body 1, and then the connecting plate 31 and the diode body 1 are pressed together, in the process, part of the epoxy resin coated on the diode body 1 enters the annular groove 5 under the extrusion of the connecting plate 31, so that the epoxy resin is prevented from flowing to the side part of the connecting plate 31 due to the extrusion, the attractiveness of the connecting plate 31 and the diode body 1 after connection is ensured, the epoxy resin entering the annular groove 5 can also enter the connecting hole 6, the effect of increasing the adhesive area is achieved by matching with the connecting block 34, the connecting plate 31 can be kept in tight connection with the diode body 1, and heat generated by the diode body 1 can be conveniently transferred to the heat dissipation device 4 through the connecting plate 31; finally, another connecting plate 31 is connected to the other end of the diode body 1 according to the above operation.
As shown in fig. 1-3, the heat dissipation device 4 includes a heat dissipation plate 41, the heat dissipation plate 41 is slidably sleeved on the insulating tube 32, one side of the heat dissipation plate 41 close to the connection plate 31 is fixedly connected with two arc-shaped blocks 42, one side of the two arc-shaped blocks 42 opposite to the slot 36 is fixedly connected with an insertion block 43, the top of the insertion block 43 is obliquely and fixedly connected with a plurality of elastic pieces 44, the oblique direction of the elastic pieces 44 is the same as the rotation direction of the heat dissipation plate 41, one side of the heat dissipation plate 41 away from the connection plate 31 is provided with a plurality of heat dissipation strip holes 9, the plurality of heat dissipation strip holes 9 are annularly distributed, the arc-shaped blocks 42 are opposite to the arc-shaped groove 35, the sum of the lengths of the arc-shaped blocks 42 and the insertion block 43 is smaller than the length of the arc-shaped groove 35, the heat dissipation plate 41 at a position corresponding to the insertion block 43 is fixedly connected with a plurality of arc-shaped strips 7 having a common center with the heat dissipation plate 41, the connection plate 31 at a position corresponding to the arc-shaped strips 7 is provided with a plurality of strip-shaped grooves 8, and the strip-shaped grooves 8 are respectively matched with the arc-shaped strips 7;
after the connecting plate 31 is connected with the diode body 1, a certain amount of epoxy resin is coated in the arc-shaped groove 35 of the connecting plate 31, then the heat dissipation plate 41 is sleeved on the terminal 2, one end of the heat dissipation plate 41 with the arc-shaped block 42 is opposite to the connecting plate 31, then the arc-shaped plate 102 on the heat dissipation plate 41 is inserted into the arc-shaped groove 35 on the connecting plate 31, then the heat dissipation plate 41 is rotated, the insertion block 43 is inserted into the insertion groove 36 on the connecting plate 31 under the driving of the heat dissipation plate 41, meanwhile, the arc-shaped strip 7 is inserted into the strip-shaped groove 8 on the connecting plate 31 under the driving of the heat dissipation plate 41, so that the contact area between the connecting plate 31 and the heat dissipation plate 41 is increased, and the heat transfer efficiency between the connecting plate 31 and the heat dissipation plate 41 is further improved;
in the process that the inserting block 43 is inserted into the slot 36, when the elastic sheet 44 is in contact with the slot wall of the slot 36, the elastic sheet 44 gradually deflects towards the direction of the connecting plate 31, and after the inserting block 43 is completely inserted into the slot 36, the elastic sheet 44 is tightly attached to the slot wall of the slot 36 due to the self elasticity, so that the connecting plate 31 is tightly connected with the heat dissipation plate 41 by matching with the epoxy resin in the arc-shaped slot 35;
in the working process of the diode body 1, the heat generated by the diode body 1 can be transmitted to the heat dissipation plate 41 through the connecting plate 31, and the heat on the heat dissipation plate 41 can be dissipated to the outside through the heat dissipation strip holes 9 and the surface of the heat dissipation plate 41, so that the purpose of heat dissipation of the diode body 1 is achieved, and the normal working temperature of the diode body 1 is guaranteed.
As shown in fig. 1-3, an annular receiving groove is formed in a side surface of the heat dissipation plate 41, a plurality of groups of heat dissipation assemblies 10 are arranged in the receiving groove, and the plurality of heat dissipation assemblies 10 are uniformly distributed in the receiving groove, each heat dissipation assembly 10 includes two L-shaped heat dissipation plates 101, the L-shaped heat dissipation plates 101 are fixedly connected with the receiving groove, the two L-shaped heat dissipation plates 101 are mutually matched to form a diamond, the free ends of the two L-shaped heat dissipation plates 101 are fixedly connected with the same arc-shaped plate 102, the arc-shaped plate 102 is made of an insulating material, the L-shaped heat dissipation plates 101 have elasticity, and the free ends of the L-shaped heat dissipation plates 101 are protruded out of the edge of the heat dissipation plate 41;
when welding diode body 1 on the circuit board, can make arc 102 and circuit board keep in touch, at the in-process of diode body 1 work, the heat that diode body 1 produced can be transmitted to heating panel 41 through connecting plate 31 on, and heat on heating panel 41 then can be transmitted to on L shape fin 101 and the arc 102, thereby the heat radiating area of heating panel 41 has been increased, and then the radiating effect of heating panel 41 has been improved, in addition because arc 102 and circuit board keep in touch, when the circuit board takes place the vibration, two L shape fins 101 on same radiator unit 10 can take place elastic deformation to the direction of keeping away from each other, and then play the effect of slowing down the vibration, avoid diode body 1 to damage because of the vibration.
With reference to fig. 1-5 of the specification, the present invention also provides a method for manufacturing a rectifying diode using any one of the above methods, characterized in that: the method comprises the following steps of,
the method comprises the following steps: firstly, uniformly coating epoxy resin on one end of a diode body 1;
step two: then, the insulating tube 32 is sleeved on the terminal 2 at one end of the diode body 1 coated with the epoxy resin;
step three: then, one end of the connecting plate 31 with the connecting block 34 is sleeved on the insulating tube 32, and the connecting plate 31 and the diode body 1 are pressed together;
step four: then, coating a certain amount of epoxy resin in the arc-shaped groove 35 of the connecting plate 31, and then inserting and connecting one end of the heat dissipation plate 41 with the arc-shaped block 42 into the arc-shaped groove 35 on the connecting plate 31 and rotating;
step five: after the epoxy resin is dried, the same operation is performed on the other end of the diode body 1 according to the above operation.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A rectifier diode comprising a diode body (1), characterized in that: two ends of the diode body (1) are respectively connected with two terminals (2) of an anode and a cathode, the two terminals (2) are respectively sleeved with a connecting device (3), the connecting device (3) is connected with the diode body (1) through epoxy resin, and a heat radiating device (4) is arranged on one side, away from the diode body (1), of the connecting device (3);
the connecting device (3) comprises a circular connecting plate (31), an insulating tube (32) penetrates through and is inserted in the circle center of the connecting plate (31), the insulating tube (32) is sleeved on the corresponding terminal (2), one end, close to the diode body (1), of the insulating tube (32) is fixedly connected with an annular insulating plate (33), a groove matched with the annular insulating plate (33) is formed in the connecting plate (31) at the position, corresponding to the annular insulating plate (33), in the groove, the annular insulating plate (33) is located in the groove, one side, close to the diode body (1), of the connecting plate (31) is fixedly connected with a plurality of connecting blocks (34), two arc-shaped grooves (35) are formed in one side, away from the diode body (1), of the connecting plate (31), the two arc-shaped grooves (35) are rotationally symmetrical about the circle center of the connecting plate (31), and slots (36) are formed in one side, perpendicular to the terminal (2), of the two arc-shaped grooves (35);
heat abstractor (4) include heating panel (41), heating panel (41) slip cup joint on insulating tube (32), one side that heating panel (41) are close to connecting plate (31) has linked firmly two arc pieces (42), two arc piece (42) have linked firmly inserted block (43) with one side that slot (36) is relative, the top slope of inserted block (43) has linked firmly a plurality of shell fragments (44), and the incline direction of shell fragment (44) is the same with the rotation direction of heating panel (41).
2. A rectifying diode according to claim 1, wherein: annular groove (5) have been seted up in the edge that connecting plate (31) are close to diode body (1) one side, and evenly seted up a plurality of connecting holes (6) on the cell wall of annular groove (5).
3. A rectifying diode according to claim 1, wherein: the arc-shaped block (42) is opposite to the arc-shaped groove (35), and the sum of the lengths of the arc-shaped block (42) and the inserting block (43) is smaller than the length of the arc-shaped groove (35).
4. A rectifying diode according to claim 3, wherein: inserted block (43) correspond the position have linked firmly arc strip (7) a plurality of and the common centre of a circle of heating panel (41) on heating panel (41), arc strip (7) correspond the position seted up a plurality of bar grooves (8) on connecting plate (31), and a plurality of bar grooves (8) respectively with a plurality of arc strip (7) phase-matches.
5. A rectifying diode according to claim 4, wherein: a plurality of radiating strip holes (9) are formed in one side, far away from the connecting plate (31), of the radiating plate (41), and the radiating strip holes (9) are distributed annularly.
6. A rectifying diode according to claim 5, wherein: annular groove of accomodating has been seted up to the side of heating panel (41), accomodate the inslot and be equipped with multiunit radiator unit (10), and a plurality of radiator unit (10) evenly distributed accomodates the inslot, radiator unit (10) include two L shape fin (101), L shape fin (101) with accomodate the groove and link firmly, and two L shape fin (101) mutually support and form a rhombus, two the free end of L shape fin (101) links firmly same arc (102), and arc (102) make for insulating material.
7. A rectifying diode according to claim 6, wherein: the L-shaped radiating fins (101) have elasticity, and the free ends of the L-shaped radiating fins (101) protrude out of the edge of the radiating plate (41).
8. A method of manufacturing a rectifier diode according to any of claims 1 to 7, wherein: the method comprises the following steps of,
the method comprises the following steps: firstly, uniformly coating epoxy resin on one end of a diode body (1);
step two: then, an insulating tube (32) is sleeved on a terminal (2) at one end of the diode body (1) coated with epoxy resin;
step three: then, one end of the connecting plate (31) with a connecting block (34) is sleeved on the insulating pipe (32), and the connecting plate (31) and the diode body (1) are pressed together;
step four: then coating certain epoxy resin in the arc-shaped groove (35) of the connecting plate (31), and inserting one end of the heat dissipation plate (41) with the arc-shaped block (42) into the arc-shaped groove (35) on the connecting plate (31) and rotating;
step five: after the epoxy resin is dried, the same operation is performed on the other end of the diode body (1) according to the above operation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210009762.2A CN114496947B (en) | 2022-01-06 | 2022-01-06 | Rectifier diode and manufacturing method thereof |
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| CN202210009762.2A CN114496947B (en) | 2022-01-06 | 2022-01-06 | Rectifier diode and manufacturing method thereof |
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| CN114496947A CN114496947A (en) | 2022-05-13 |
| CN114496947B true CN114496947B (en) | 2023-02-10 |
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