CN220189557U - Carrier for MEMS chip processing - Google Patents
Carrier for MEMS chip processing Download PDFInfo
- Publication number
- CN220189557U CN220189557U CN202321796287.4U CN202321796287U CN220189557U CN 220189557 U CN220189557 U CN 220189557U CN 202321796287 U CN202321796287 U CN 202321796287U CN 220189557 U CN220189557 U CN 220189557U
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- CN
- China
- Prior art keywords
- chip
- packaging table
- fixedly connected
- cover plate
- rectangular frame
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 75
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 239000002390 adhesive tape Substances 0.000 claims abstract description 24
- 238000001179 sorption measurement Methods 0.000 claims description 24
- 238000003466 welding Methods 0.000 abstract description 28
- 238000000034 method Methods 0.000 abstract description 15
- 239000000110 cooling liquid Substances 0.000 abstract description 11
- 238000005538 encapsulation Methods 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of MEMS chip processing, in particular to a carrier for MEMS chip processing, which comprises a base, an air cylinder, a packaging table, a vertical plate and a clamping device, wherein the clamping device comprises a cooling box, a cover plate, a high-temperature adhesive tape, a fixing component and an auxiliary component, the cooling box is detachably connected with the packaging table, the cover plate is detachably connected with the packaging table, the high-temperature adhesive tape is fixedly connected with the packaging table, the fixing component is arranged on the cover plate, the auxiliary component is arranged on the vertical plate, a chip is placed on the packaging table in the process of welding the MEMS chip, the chip is clamped and fixed through the high-temperature adhesive tape, so that four corners of the chip are positioned, the high temperature of the surface of the chip is absorbed by the cooling liquid in the cooling box when the chip is welded, and the high-temperature adhesive tape prevents the chip from being bent by the high temperature, thereby preventing the chip from being deviated in the welding process, and reducing the reject ratio of the chip.
Description
Technical Field
The utility model relates to the technical field of MEMS chip processing, in particular to a carrier for MEMS chip processing.
Background
When processing MEMS chip, can use the carrier to bear the weight of the chip, then encapsulate the chip, current welding machine is when encapsulating the chip, generally dispels the heat through natural cooling to it, leads to the radiating rate slow, has reduced the quality of chip encapsulation.
Prior art CN218730866U discloses a chip packaging hardware for chip processing, the on-line screen storage device comprises a base, base top one side is fixed with the riser, the riser top is fixed with the roof, the roof bottom is provided with the welding machine, the base top side sets up the encapsulation platform, encapsulation platform bottom is equipped with the ventilation chamber, ventilation chamber one side is equipped with the air-cooler, encapsulation platform inner wall both sides are equipped with a plurality of electric push rods, be fixed with the clamp plate on the electric push rod, during the use, at first the chip is inside the encapsulation platform, the cold wind of air-cooler carries out quick heat dissipation cooling through ventilation chamber and louvre after the welding is accomplished, improve the quality of chip encapsulation, go up and down the encapsulation platform, the rotation of cooperation carousel and the slip of electric slider, enlarge the bonding tool's of welding machine coverage, improve work efficiency.
However, by adopting the mode, in the welding process of the MEMS chip, the chip is easy to generate certain bending at high temperature, and the chip can be offset due to the blowing of the bottom air cooler when the chip is clamped, so that the reject ratio of the chip is increased.
Disclosure of Invention
The utility model aims to provide a carrier for processing an MEMS chip, which can prevent the chip from being bent at high temperature when the chip is clamped in the process of welding the MEMS chip, thereby preventing the chip from being deviated in the welding process and reducing the reject ratio of the chip.
In order to achieve the above object, the utility model provides a carrier for processing an MEMS chip, comprising a base, an air cylinder, a packaging table, a vertical plate, and a clamping device, wherein the vertical plate is fixedly connected with the base and is positioned at one side of the base;
the clamping device comprises a cooling box, a cover plate, a high-temperature adhesive tape, a fixing component and an auxiliary component, wherein the cooling box is detachably connected with the packaging table and is positioned on one side of the packaging table, the cover plate is detachably connected with the packaging table and is positioned on one side of the packaging table, the high-temperature adhesive tape is fixedly connected with the packaging table and is positioned on one side of the packaging table, the fixing component is arranged on the cover plate, and the auxiliary component is arranged on the vertical plate.
The fixing assembly comprises a rectangular frame and an adsorption member, wherein the rectangular frame is fixedly connected with the cover plate and is in sliding connection with the packaging table; the adsorption members are respectively arranged on the rectangular frame and the packaging table.
The adsorption member comprises a first adsorption piece and a second adsorption piece, and the first adsorption piece is fixedly connected with the rectangular frame and is positioned at one side of the rectangular frame; the second adsorption piece is fixedly connected with the packaging table and is positioned at one side of the packaging table.
The packaging table is provided with a profiling area and a placing groove, and an opening of the profiling area faces upwards; the cooling box is located in the placing groove.
The auxiliary assembly comprises an air cooler and a pulling block, wherein the air cooler is fixedly connected with the vertical plate and is positioned on one side of the vertical plate, which is close to the packaging table; the pulling block is fixedly connected with the cover plate and is positioned on one side, away from the rectangular frame, of the cover plate.
The utility model relates to a carrier for processing an MEMS chip, which comprises a base, an air cylinder, a packaging table, a vertical plate and a clamping device, wherein the clamping device comprises a cooling box, a cover plate, a high-temperature adhesive tape, a fixing component and an auxiliary component, the chip is placed on the packaging table in the process of welding the MEMS chip, the chip is clamped and fixed through the high-temperature adhesive tape, four corners of the chip are positioned, and cooling liquid is added into the cooling box, so that when the chip is welded, the high temperature on the surface of the chip is absorbed by the cooling liquid in the cooling box, and the high-temperature adhesive tape prevents the chip from being bent by the high temperature, so that the chip is prevented from being deviated in the welding process, and the reject ratio of the chip is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic overall structure of a MEMS chip processing carrier according to a first embodiment of the present utility model.
Fig. 2 is a schematic structural view of a clamping device according to a first embodiment of the present utility model.
Fig. 3 is a right cross-sectional view of the package table of the first embodiment of the present utility model.
Fig. 4 is a schematic overall structure of a MEMS chip processing carrier according to a second embodiment of the present utility model.
In the figure: 101-base, 102-cylinder, 103-packaging table, 104-riser, 105-cooling box, 106-apron, 107-high temperature sticky tape, 108-rectangle frame, 109-first adsorption piece, 110-second adsorption piece, 111-profile modeling district, 112-standing groove, 201-air cooler, 202-pulling piece.
Detailed Description
The following detailed description of embodiments of the utility model, examples of which are illustrated in the accompanying drawings and, by way of example, are intended to be illustrative, and not to be construed as limiting, of the utility model.
The first embodiment of the utility model is as follows:
referring to fig. 1 to 3, fig. 1 is a schematic view of an overall structure of a MEMS chip processing carrier, fig. 2 is a schematic view of a clamping device, and fig. 3 is a right cross-sectional view of a packaging table. The utility model provides a carrier for processing an MEMS chip, which comprises: the packaging machine comprises a base 101, an air cylinder 102, a packaging table 103, a vertical plate 104 and a clamping device, wherein the clamping device comprises a cooling box 105, a cover plate 106, a high-temperature adhesive tape 107, a fixing assembly and an auxiliary assembly, the fixing assembly comprises a rectangular frame 108 and an adsorption member, the adsorption member comprises a first adsorption member 109 and a second adsorption member 110, and the packaging table 103 is provided with a profiling area 111 and a placing groove 112. Through the scheme, the problem that the chip is easy to generate certain curvature at high temperature in the welding process of the MEMS chip is solved, the chip is offset due to the blowing of the bottom air cooler 201 when the chip is clamped, so that the reject ratio of the chip is increased, and the scheme can be used for preventing the chip from being bent at high temperature when the chip is clamped in the welding process of the MEMS chip, so that the chip is prevented from being offset in the welding process, the reject ratio of the chip is reduced, and the scheme can be also used for playing the effect of fast heat dissipation and temperature reduction when the chip is welded.
Aiming at the specific implementation mode, the vertical plate 104 is fixedly connected with the base 101 and is positioned on one side of the base 101, the air cylinder 102 is fixedly connected with the base 101 and is positioned on one side of the base 101, the packaging table 103 is fixedly connected with the air cylinder 102 and is positioned on one side of the air cylinder 102 away from the base 101, the bottom end of the base 101 is fixedly connected with the vertical plate 104, the top end of the vertical plate 104 is fixedly provided with a top plate, a welding machine is arranged at the bottom of the top plate and is used for carrying out welding operation on chips in the packaging process, the top side of the base 101 is provided with the packaging table 103, the packaging table 103 is used for placing the chips and is convenient for carrying out packaging operation on the chips, a ventilation cavity and a heat dissipation hole are formed in the bottom of the packaging table 103, the bottom of the packaging table 103 is fixedly provided with the air cylinder 102, the air cylinder 102 has elasticity and can drive the packaging table 103 to lift, the welding operation of the welding machine is facilitated, the bottom end of the air cylinder 102 is fixedly connected with the top surface of the base 101, a rotary table is connected with a rotary table in a covering range, the rotary table is rotationally driven by the top plate, and the rotary table is matched with an electric sliding table 103 to expand the electric welding table in the sliding position of the electric welding machine, and the rotary table can be matched with the rotary table, and the rotary table can be used for expanding the sealing efficiency of the welding machine.
Wherein the cooling box 105 is detachably connected with the packaging table 103 and is positioned at one side of the packaging table 103, the cover plate 106 is detachably connected with the packaging table 103 and is positioned at one side of the packaging table 103, the high-temperature adhesive tape 107 is fixedly connected with the packaging table 103 and is positioned at one side of the packaging table 103, the fixing component is arranged on the cover plate 106, the auxiliary component is arranged on the vertical plate 104, the opening of the profiling area 111 faces upwards, the cooling box 105 is positioned in the placing groove 112, the placing groove 112 is provided with a front opening at the bottom of the packaging table 103, the placing groove 112 is communicated with the heat dissipation hole of the packaging table 103, the cooling box 105 is placed in the placing groove 112, cooling liquid is placed in the cooling box 105, so that the cooling liquid in the cooling box 105 can absorb external heat, the high temperature adhesive tape 107 is fixed on the upper surface of the packaging table 103, the high temperature adhesive tapes 107 are symmetrically arranged, the number of the high temperature adhesive tapes 107 is at least four, the high temperature adhesive tapes 107 have the characteristic of high temperature resistance, the high temperature adhesive tapes 107 are positioned at four corners of the upper surface of the packaging table 103, the packaging table 103 has the profiling area 111, the size of the profiling area 111 is matched with the size of the MEMS chip, so that the chip can be placed in the profiling area 111, then the chip is fixed through the high temperature adhesive tapes 107, the chip is kept in a stable state on the packaging table 103, the high temperature adhesive tapes 107 fix the four corners of the chip, the chip is prevented from being deformed due to high temperature during welding, the cover plate 106 is arranged at the front side of the packaging table 103 through the fixing component, the cover plate 106 covers the front side opening of the placing groove 112, the cooling box 105 is enabled to absorb heat to the chip right above, the auxiliary assembly is arranged on the vertical plate 104, the auxiliary assembly can be used for generating wind power above the chip so as to cool the upper surface of the chip, the chip is placed on the packaging table 103 in the welding process of the MEMS chip, the chip is clamped and fixed through the high-temperature adhesive tape 107, four corners of the chip are located, cooling liquid is added into the cooling box 105, when the chip is welded, the high temperature of the chip surface is absorbed by the cooling liquid in the cooling box 105, and the high-temperature adhesive tape 107 prevents the chip from being bent due to the high temperature, so that the chip is prevented from being offset in the welding process, and the reject ratio of the chip is reduced.
Secondly, the rectangular frame 108 is fixedly connected with the cover plate 106 and is slidably connected with the packaging table 103; the adsorption members are respectively arranged on the rectangular frame 108 and the encapsulation platform 103, the rectangular frame 108 is welded on the cover plate 106, the cross section of the cover plate 106 is larger than that of the placing groove 112, the cross section of the rectangular frame 108 is matched with that of the placing groove 112, the rectangular frame 108 can be inserted into the placing groove 112, the rectangular frame 108 is abutted against the inner surface of the encapsulation platform 103, mutual friction force is generated, the cover plate 106 can be kept in a stable state on the front side of the encapsulation platform 103, the adsorption members are respectively arranged on the rectangular frame 108 and the encapsulation platform 103, and the adsorption members are arranged, so that the rectangular frame 108 and the encapsulation platform 103 generate mutual attractive force, and the cover plate 106 can be kept in a stable state on the encapsulation platform 103.
Meanwhile, the first adsorption element 109 is fixedly connected with the rectangular frame 108 and is located at one side of the rectangular frame 108; the second absorbing members 110 are fixedly connected with the packaging table 103 and are located at one side of the packaging table 103, the first absorbing members 109 are welded at one side of the rectangular frame 108 away from the cover plate 106, the first absorbing members 109 are made of a magnet material, the number of the second absorbing members 110 is two, the two second absorbing members 110 are welded at the upper side and the lower side of the inner cavity of the packaging table 103 respectively, the two second absorbing members 110 are respectively abutted with the upper end and the lower end of the first absorbing member 109, the second absorbing members 110 are made of a metal material, and the metal and the magnet can generate mutual attractive force under the action of a magnetic field, so that the first absorbing members 109 and the second absorbing members 110 can generate mutual attractive force after being abutted, and the rectangular frame 108 is kept in a stable state in the packaging table 103, and the cover plate 106 is kept in a stable state at the front side of the packaging table 103, and the cover plate 106 completely covers the placing grooves 112, so that the cooling box 105 can absorb heat when being welded.
When the carrier for processing the MEMS chip is used, the chip is placed on the packaging table 103 in the process of welding the MEMS chip, the chip is clamped and fixed through the high-temperature adhesive tape 107, so that four corners of the chip are positioned, and cooling liquid is added into the cooling box 105, so that when the chip is welded, the high temperature of the surface of the chip is absorbed by the cooling liquid in the cooling box 105, and the high-temperature adhesive tape 107 prevents the chip from being bent due to the high temperature, thereby preventing the chip from being deviated in the welding process, and reducing the reject ratio of the chip.
The second embodiment of the utility model is:
referring to fig. 4, fig. 4 is a schematic diagram showing the overall structure of a MEMS chip processing carrier according to a second embodiment, and the auxiliary assembly of the present embodiment includes an air cooler 201 and a pulling block 202.
For the present embodiment, the air cooler 201 is fixedly connected to the vertical plate 104, and is located on a side of the vertical plate 104, which is close to the packaging table 103; the pulling block 202 is fixedly connected with the cover plate 106 and is located on one side, far away from the rectangular frame 108, of the cover plate 106, the air cooler 201 is fixed on one side, facing the packaging table 103, of the vertical plate 104 through bolts, the air cooler 201 is connected with an external power supply through a power plug, when the air cooler 201 is started, the air cooler 201 can blow air towards the upper portion of the packaging table 103, so that the air flow rate of the upper surface of a chip can be accelerated, the effect of fast heat dissipation and temperature reduction is achieved through the effect of the cooling box 105, the pulling block 202 is welded on the center of the front side of the cover plate 106, the pulling block 202 provides a force application point for operators, the operators can conveniently open the cover plate 106 from the packaging table 103 through the pulling block 202, and cooling liquid is conveniently added into the cooling box 105, and therefore the heat at the bottom of the chip can be absorbed.
When the MEMS chip processing carrier is used, the cover plate 106 can be quickly installed and detached from the packaging table 103 through the pulling block 202, so that cooling liquid is conveniently added into the cooling box 105, when the chip is placed in the profiling area 111 of the packaging table 103 for welding, the air cooler 201 is started, the air cooler 201 blows air towards the upper part of the packaging table 103, so that the air flow rate of the upper surface of the chip can be increased, and the effect of quick heat dissipation and cooling is achieved for the welding of the chip by matching with the effect of the cooling box 105.
The foregoing disclosure is only illustrative of one or more preferred embodiments of the present utility model, and it is not intended to limit the scope of the claims hereof, as persons of ordinary skill in the art will understand that all or part of the processes for practicing the embodiments described herein may be practiced with equivalent variations in the claims, which are within the scope of the utility model.
Claims (5)
1. The carrier for MEMS chip processing comprises a base, an air cylinder, a packaging table and a vertical plate, wherein the vertical plate is fixedly connected with the base and positioned on one side of the base, the air cylinder is fixedly connected with the base and positioned on one side of the base, the packaging table is fixedly connected with the air cylinder and positioned on one side of the air cylinder away from the base, the carrier is characterized in that,
the device also comprises a clamping device;
the clamping device comprises a cooling box, a cover plate, a high-temperature adhesive tape, a fixing component and an auxiliary component, wherein the cooling box is detachably connected with the packaging table and is positioned on one side of the packaging table, the cover plate is detachably connected with the packaging table and is positioned on one side of the packaging table, the high-temperature adhesive tape is fixedly connected with the packaging table and is positioned on one side of the packaging table, the fixing component is arranged on the cover plate, and the auxiliary component is arranged on the vertical plate.
2. The MEMS chip processing carrier of claim 1, wherein,
the fixing assembly comprises a rectangular frame and an adsorption member, and the rectangular frame is fixedly connected with the cover plate and is in sliding connection with the packaging table; the adsorption members are respectively arranged on the rectangular frame and the packaging table.
3. The MEMS chip processing carrier of claim 2, wherein,
the adsorption component comprises a first adsorption piece and a second adsorption piece, and the first adsorption piece is fixedly connected with the rectangular frame and is positioned at one side of the rectangular frame; the second adsorption piece is fixedly connected with the packaging table and is positioned at one side of the packaging table.
4. The MEMS chip processing carrier of claim 1, wherein,
the packaging table is provided with a profiling area and a placing groove, and an opening of the profiling area faces upwards; the cooling box is located in the placing groove.
5. The MEMS chip processing carrier of claim 3, wherein,
the auxiliary assembly comprises an air cooler and a pulling block, wherein the air cooler is fixedly connected with the vertical plate and is positioned at one side of the vertical plate, which is close to the packaging table; the pulling block is fixedly connected with the cover plate and is positioned on one side, away from the rectangular frame, of the cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321796287.4U CN220189557U (en) | 2023-07-10 | 2023-07-10 | Carrier for MEMS chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321796287.4U CN220189557U (en) | 2023-07-10 | 2023-07-10 | Carrier for MEMS chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220189557U true CN220189557U (en) | 2023-12-15 |
Family
ID=89106820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321796287.4U Active CN220189557U (en) | 2023-07-10 | 2023-07-10 | Carrier for MEMS chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220189557U (en) |
-
2023
- 2023-07-10 CN CN202321796287.4U patent/CN220189557U/en active Active
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