CN218849434U

CN218849434U - ESD encapsulation press mold stabilising arrangement

Info

Publication number: CN218849434U
Application number: CN202223235744.0U
Authority: CN
Inventors: 秦志方; 薛嘉文
Original assignee: Meitai High Tech Shanghai Microelectronics Co ltd
Current assignee: Meitai High Tech Shanghai Microelectronics Co ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-04-11
Anticipated expiration: 2032-12-05

Abstract

The utility model discloses a ESD encapsulation press mold stabilising arrangement, comprising a base plate, there are lower mould storehouse and last mould storehouse bottom plate top through guide pillar swing joint, it is provided with the clamp plate to go up mould storehouse downside, the rectangle distributes and has the shaping chamber of part in the heat-conducting plate at last mould storehouse top, it is equipped with the protection casing to correspond the card in the passageway of lower mould storehouse both sides, the protection casing lateral wall is provided with heat radiation fins perpendicularly, the radiating groove has been seted up to the heat radiation fins side, be provided with the fan to the lower mould storehouse side. The utility model has the advantages of being scientific and reasonable in structural design, can avoid going up the mould storehouse and remove the in-process skew of appearance, effectively guaranteed the compound die precision, reduced the butt joint error, improved processingquality, effectively improved the cooling efficiency in lower mould storehouse to prevent that the thermal resistance that the heat specifically leads to from increasing and causing the work piece to receive the influence.

Description

ESD encapsulation press mold stabilising arrangement

Technical Field

The utility model relates to an ESD encapsulation equipment technical field specifically is an ESD encapsulation press mold stabilising arrangement.

Background

ESD means static electricity discharge, and therefore, equipment for electrostatic protection is commonly referred to as ESD in the international practice. The traditional packaging process of the ESD semiconductor device is respectively processes of die bonding, wire bonding, packaging, pin folding (pin cutting), blanking, testing and packaging, the whole manufacturing process flow is long, a design purpose is achieved by mechanical stamping in the packaging and film pressing process, and the stability of equipment and the poor quality are easily caused by misoperation of personnel. After the stamping mechanism works for a long time, heat is easy to accumulate inside, and if the packaging and extruding operation is continued, the heat resistance is easy to increase, so that the packaging effect is influenced, and meanwhile, the product quality is possibly reduced. Therefore, we propose an ESD package lamination film stabilizing device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a ESD encapsulation press mold stabilising arrangement to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a ESD encapsulation press mold stabilising arrangement, includes the bottom plate, there are lower mould storehouse and last mould storehouse bottom plate top through guide pillar swing joint, it is provided with the clamp plate to go up mould storehouse downside, the rectangle distributes and has the shaping chamber of part in the heat-conducting plate at last mould storehouse top, it is equipped with the protection casing to correspond the card in the passageway of lower mould storehouse both sides, the protection casing lateral wall is provided with heat radiation fins perpendicularly, the radiating groove has been seted up to heat radiation fins side, lower mould storehouse side is provided with the fan.

Preferably, the lower side of the upper die bin is provided with a hydraulic cylinder, and the bottom end of the hydraulic cylinder is connected to the surface of the bottom plate.

Preferably, a flow guide pipe is arranged on the outer side of the lower die bin, and a valve is arranged on the flow guide pipe.

Preferably, a fixing block with a through hole in the middle is arranged on the inner side of the protective cover and connected with the lower die bin through a bolt.

Preferably, the air outlet of the fan is communicated with the channel in the lower die bin through a pipeline.

Preferably, a filter screen is arranged in the heat dissipation groove.

Preferably, the other ends of the radiating fins are inserted into the inner cavity of the lower die bin and are abutted against the inner wall of the heat conducting plate.

Compared with the prior art, the beneficial effects of the utility model are that: this kind of ESD encapsulation press mold stabilising arrangement, structural design is simple reasonable, has stronger practicality, it reciprocates as actuating mechanism drives the mould storehouse through setting up the pneumatic cylinder, in this process because the effect of guide pillar can play stable guide effect, thereby can avoid going up the mould storehouse and remove the in-process skew that appears, the compound die precision has effectively been guaranteed, the butt joint error has been reduced, the processingquality is improved, through set up a plurality of groups heat radiation fins on the safety cover, in operation, heat radiation fins and heat-conducting plate contact and play the heat conduction effect, can draw the inside heat in lower mould storehouse, simultaneously can accelerate the inside air flow rate in lower mould storehouse under the effect of fan, the cooling efficiency in lower mould storehouse has effectively been improved, thereby prevent that the specific thermal resistance that leads to of heat from increasing and causing the work piece to receive the influence.

Drawings

Fig. 1 is the schematic view of the lower silo structure of the utility model.

Fig. 2 is a schematic side view of the present invention.

Fig. 3 is a schematic view of the protective cover structure of the present invention.

In the figure: the device comprises a

base plate

1, 11 guide pillars, 12 lower die bins, 13 upper die bins, 14 pressing plates, 15 hydraulic cylinders, 16 heat conducting plates, 17 forming cavities, 18 flow guide pipes, 19 protective covers, 2 fixing blocks, 21 through holes, 22 bolts, 23 heat dissipation fins, 24 heat dissipation grooves and 25 fans.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a ESD encapsulation press mold stabilising arrangement, includes bottom plate 1, there are lower mould storehouse 12 and last mould storehouse 13 at 1 top of bottom plate through 11 swing joint of guide pillar, reciprocate as actuating mechanism drives through setting up pneumatic cylinder 15 and go up mould storehouse 13, because the effect of guide pillar 11 can play stable guide effect at this in-process to can avoid last mould storehouse 13 to remove the in-process skew of appearing, effectively guarantee the compound die precision, reduce the butt joint error, improve processingquality.

The lower side of an upper mold bin 13 is provided with a pressing plate 14, a forming cavity 17 with parts is distributed in a rectangular mode in a heat conducting plate 16 at the top of the upper mold bin 13, protective covers 19 are correspondingly clamped in channels on two sides of a lower mold bin 12, heat radiating fins 23 are vertically arranged on the side walls of the protective covers 19, heat radiating grooves 24 are formed in the side faces of the heat radiating fins 23, a fan 25 is arranged on the side face of the lower mold bin 12, a plurality of groups of heat radiating fins 23 are arranged on the protective covers 19, when the heat radiating fins 23 are in work, the heat radiating fins 23 are in contact with the heat conducting plate 16 to achieve a heat conducting effect, the heat inside the lower mold bin 12 can be led out, meanwhile, the air flowing speed inside the lower mold bin 12 can be accelerated under the action of the fan 25, the cooling efficiency of the lower mold bin 12 is effectively improved, therefore, the influence on an electronic workpiece caused by thermal resistance increase caused by heat accumulation is prevented, after long-time work, bolts 22 are taken down, then the protective covers 19 are transversely pulled out, and dust inside the dust is cleaned.

Further, a hydraulic cylinder 15 is arranged on the lower side of the upper die bin 13, and the bottom end of the hydraulic cylinder 15 is connected to the surface of the bottom plate 1.

Further, the honeycomb duct 18 is arranged outside the lower die bin 12, the valve is arranged on the honeycomb duct 18, and the honeycomb duct 18 can be matched with liquid cooling equipment for use, so that the water-cooling heat dissipation requirement is realized in the environment needing high-efficiency heat dissipation, and the heat dissipation effect is further improved.

Furthermore, a fixing block 2 with a through hole 21 formed in the middle is arranged on the inner side of the protective cover 19, and the fixing block 2 is connected with the lower die bin 12 through a bolt 23.

Further, an air outlet of the fan 25 is communicated with a channel in the lower die bin 12 through a pipeline, and the fan 25 is connected with a power supply and a switch through a wire.

Further, be provided with the filter screen in the radiating groove 24, it is concrete, filter screen detachably pegs graft in radiating groove 24, and the air current is in through radiating groove 24 exhaust, and the dust impurity in the air current stays in radiating groove 24, can clear up the dust fast after dismantling protection casing 19.

Furthermore, the other end of the heat dissipation fin 23 is inserted into the inner cavity of the lower mold chamber 12 and abuts against the inner wall of the heat conduction plate 16, and the heat conduction plate 16 and the heat dissipation fin 23 are both made of metal materials with good heat conductivity.

The working principle is as follows:

this kind of ESD encapsulation press mold stabilising arrangement, electronic component places in independent shaping chamber 17, when the encapsulation operation, it moves down to start mould storehouse 13 in the drive of pneumatic cylinder 15, the precision that mould storehouse 13 removed is guaranteed through the guide effect of guide pillar 11 in this process, make clamp plate 14 and shaping chamber 17 accurate butt joint, thereby encapsulate the operation to the device through independent clamp plate 14 that sets up, effectively reduce the operation tolerance, and the product quality is improved, in operation, the heat in lower mould storehouse 12 is discharged through the conduction effect of heat-conducting plate 16 and cooling fin 23, after the long-time work of device, start fan 25, lead-in lower mould storehouse 12 inner chamber with external air current through fan 25, the heat of gathering in lower mould storehouse 12 is discharged with higher speed through-hole 21 along with the air current, thereby realize keeping the purpose of lower mould storehouse 12 internal environment temperature.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An ESD encapsulation lamination stabilising arrangement, includes bottom plate (1), its characterized in that: the improved die is characterized in that the top of the bottom plate (1) is movably connected with a lower die bin (12) and an upper die bin (13) through a guide post (11), a pressing plate (14) is arranged on the lower side of the upper die bin (13), a forming cavity (17) of a part is distributed in a heat conducting plate (16) on the top of the upper die bin (13) in a rectangular mode, a protective cover (19) is correspondingly clamped in channels on two sides of the lower die bin (12), heat dissipation fins (23) are vertically arranged on the side wall of the protective cover (19), heat dissipation grooves (24) are formed in the side face of each heat dissipation fin (23), and a fan (25) is arranged on the side face of the lower die bin (12).

2. The ESD package lamination stabilizing device according to claim 1, wherein: go up mould storehouse (13) downside and be provided with pneumatic cylinder (15), the bottom of pneumatic cylinder (15) is connected on bottom plate (1) surface.

3. The ESD package lamination stabilizing device according to claim 1, wherein: and a flow guide pipe (18) is arranged on the outer side of the lower die bin (12), and a valve is arranged on the flow guide pipe (18).

4. The ESD package lamination stabilizing device according to claim 1, wherein: the inner side of the protective cover (19) is provided with a fixed block (2) with a through hole (21) in the middle, and the fixed block (2) is connected with the lower die bin (12) through a bolt (22).

5. The ESD package lamination stabilizing device according to claim 1, wherein: and the air outlet of the fan (25) is communicated with the inner channel of the lower die bin (12) through a pipeline.

6. The ESD package lamination stabilizing device of claim 1, wherein: a filter screen is arranged in the heat dissipation groove (24).

7. The ESD package lamination stabilizing device of claim 1, wherein: the other end of the radiating fin (23) is inserted into the inner cavity of the lower die bin (12) and is abutted against the inner wall of the heat conducting plate (16).